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WO2006041659A3 - Low 1c screw dislocation density 3 inch silicon carbide wafer - Google Patents

Low 1c screw dislocation density 3 inch silicon carbide wafer Download PDF

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Publication number
WO2006041659A3
WO2006041659A3 PCT/US2005/034351 US2005034351W WO2006041659A3 WO 2006041659 A3 WO2006041659 A3 WO 2006041659A3 US 2005034351 W US2005034351 W US 2005034351W WO 2006041659 A3 WO2006041659 A3 WO 2006041659A3
Authority
WO
WIPO (PCT)
Prior art keywords
dislocation density
low
silicon carbide
screw dislocation
inch silicon
Prior art date
Application number
PCT/US2005/034351
Other languages
French (fr)
Other versions
WO2006041659A2 (en
Inventor
Adrian Powell
Mark Brady
Stephan G Mueller
Valeri F Tsvetkov
Robert Tyler Leonard
Original Assignee
Cree Inc
Adrian Powell
Mark Brady
Stephan G Mueller
Valeri F Tsvetkov
Robert Tyler Leonard
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=35925857&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2006041659(A3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Cree Inc, Adrian Powell, Mark Brady, Stephan G Mueller, Valeri F Tsvetkov, Robert Tyler Leonard filed Critical Cree Inc
Priority to JP2007534681A priority Critical patent/JP2008515748A/en
Priority to CN200580033838XA priority patent/CN101061262B/en
Priority to EP05798669.7A priority patent/EP1797225B2/en
Publication of WO2006041659A2 publication Critical patent/WO2006041659A2/en
Publication of WO2006041659A3 publication Critical patent/WO2006041659A3/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10—Inorganic compounds or compositions
    • C30B29/36—Carbides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/21—Circular sheet or circular blank

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Junction Field-Effect Transistors (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)

Abstract

A high quality single crystal wafer of SiC is disclosed having a diameter of at least about 3 inches and a 1c screw dislocation density of less than about 2000 cm-2.
PCT/US2005/034351 2004-10-04 2005-09-27 Low 1c screw dislocation density 3 inch silicon carbide wafer WO2006041659A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007534681A JP2008515748A (en) 2004-10-04 2005-09-27 Low 1c screw dislocation 3 inch silicon carbide wafer
CN200580033838XA CN101061262B (en) 2004-10-04 2005-09-27 Low 1c screw dislocation 3 inch silicon carbide wafer
EP05798669.7A EP1797225B2 (en) 2004-10-04 2005-09-27 Low 1c screw dislocation density 3 inch silicon carbide wafer

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/957,806 2004-10-04
US10/957,806 US7314520B2 (en) 2004-10-04 2004-10-04 Low 1c screw dislocation 3 inch silicon carbide wafer

Publications (2)

Publication Number Publication Date
WO2006041659A2 WO2006041659A2 (en) 2006-04-20
WO2006041659A3 true WO2006041659A3 (en) 2006-06-08

Family

ID=35925857

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/034351 WO2006041659A2 (en) 2004-10-04 2005-09-27 Low 1c screw dislocation density 3 inch silicon carbide wafer

Country Status (7)

Country Link
US (3) US7314520B2 (en)
EP (2) EP2584071B1 (en)
JP (3) JP2008515748A (en)
KR (1) KR20070054719A (en)
CN (1) CN101061262B (en)
TW (1) TWI313892B (en)
WO (1) WO2006041659A2 (en)

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US7314520B2 (en) 2008-01-01
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