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WO2006041091A1 - Procédé d’entretien d’un appareil d’exposition, appareil d’exposition, procédé de fabrication du dispositif et élément de récupération de liquide pour l’entretien d’un appareil d’exposition par immersion - Google Patents

Procédé d’entretien d’un appareil d’exposition, appareil d’exposition, procédé de fabrication du dispositif et élément de récupération de liquide pour l’entretien d’un appareil d’exposition par immersion Download PDF

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Publication number
WO2006041091A1
WO2006041091A1 PCT/JP2005/018789 JP2005018789W WO2006041091A1 WO 2006041091 A1 WO2006041091 A1 WO 2006041091A1 JP 2005018789 W JP2005018789 W JP 2005018789W WO 2006041091 A1 WO2006041091 A1 WO 2006041091A1
Authority
WO
WIPO (PCT)
Prior art keywords
liquid
substrate
exposure apparatus
substrate holder
liquid recovery
Prior art date
Application number
PCT/JP2005/018789
Other languages
English (en)
Japanese (ja)
Inventor
Hiroyuki Nagasaka
Yasushi Yoda
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2006540947A priority Critical patent/JPWO2006041091A1/ja
Publication of WO2006041091A1 publication Critical patent/WO2006041091A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply

Definitions

  • Exposure apparatus maintenance method exposure apparatus, device manufacturing method, immersion exposure apparatus maintenance liquid recovery member
  • the present invention relates to an exposure apparatus maintenance method, an exposure apparatus, a device manufacturing method, and a liquid recovery member for maintenance of an immersion exposure apparatus.
  • an exposure apparatus that projects and exposes a pattern formed on a mask onto a photosensitive substrate is used. It is done.
  • This exposure apparatus has a mask stage that holds a mask via a mask holder and a substrate stage that holds a substrate via a substrate holder, and projects a mask pattern while sequentially moving the mask stage and the substrate stage.
  • Projection exposure is performed on a substrate through an academic system.
  • miniaturization of patterns formed on a substrate is required in order to increase the density of devices. In order to meet this demand, it is desired to further increase the resolution of the exposure apparatus.
  • a liquid immersion space is formed by filling a space between the projection optical system and the substrate, and the liquid immersion is performed.
  • An immersion exposure apparatus has been devised that performs an exposure process through a region of liquid.
  • Patent Document 1 Pamphlet of International Publication No. 99 ⁇ 49504
  • liquid may remain on a substrate holder that holds a substrate. If the remaining liquid is left unattended, problems such as the substrate holder being unable to hold the substrate satisfactorily occur, and the substrate may not be exposed well. Also substrate It is not limited to the holder, and it may be placed in the vicinity of the optical path space of the exposure light! There is a possibility that the liquid may remain on various members. If the remaining liquid is left unattended, the member may be contaminated. It can happen.
  • the present invention has been made in view of such circumstances, and even when an immersion method is applied, an exposure apparatus maintenance method, an exposure apparatus, and a device manufacturing method that can maintain the exposure apparatus in a desired state. It is an object to provide a method and a liquid recovery member for maintenance of an immersion exposure apparatus.
  • the present invention employs the following configurations corresponding to the respective drawings shown in the embodiments.
  • the reference numerals in parentheses attached to each element are merely examples of the element and do not limit each element.
  • the substrate (P) held by the substrate holder (PH) is liquid (L
  • the exposure apparatus (EX) that places the predetermined member (60) capable of absorbing the liquid (LQ) on the substrate holder (PH) according to the maintenance method of the exposure apparatus (EX) that performs exposure via Q) A maintenance method is provided.
  • the first aspect of the present invention it is possible to satisfactorily collect and remove the remaining liquid by placing the predetermined member capable of absorbing the liquid on the substrate holder.
  • the liquid (LQ) is absorbed by the exposure apparatus that exposes the substrate (P) held by the substrate holder (PH) via the liquid (LQ).
  • An exposure apparatus (EX) provided with a transfer device (150) for transferring a possible predetermined member (60) to a substrate holder (PH) is provided.
  • the transport device that transports the predetermined member capable of absorbing liquid to the substrate holder since the transport device that transports the predetermined member capable of absorbing liquid to the substrate holder is provided, the predetermined member is placed on the substrate holder using the transport device. As a result, the remaining liquid can be recovered and removed satisfactorily.
  • a substrate can be exposed using an exposure apparatus in a desired state, and a device having desired performance can be manufactured.
  • the substrate holder (PH) is placed on the substrate holder (PH) that holds the substrate (P) exposed through the liquid (LQ).
  • a liquid recovery member (60) for maintenance of the immersion exposure apparatus (EX) that absorbs the liquid (LQ) remaining on the top is provided.
  • the liquid remaining on the substrate holder can be recovered and removed by placing the liquid recovery member on the substrate holder.
  • a substrate can be satisfactorily exposed with an exposure apparatus in a desired state, and a device having desired performance can be manufactured.
  • FIG. 1 is a schematic block diagram that shows a first embodiment of an exposure apparatus.
  • FIG. 2 is a side sectional view showing a liquid recovery member according to the first embodiment.
  • FIG. 3 is a perspective view showing a liquid recovery member according to the first embodiment.
  • FIG. 4A is a diagram for explaining a maintenance method according to the first embodiment.
  • FIG. 4B is a view for explaining the maintenance method according to the first embodiment.
  • FIG. 5 is a view showing a second embodiment of the exposure apparatus.
  • FIG. 6 is a side sectional view showing a liquid recovery member according to a third embodiment.
  • FIG. 7 is a diagram for explaining a maintenance method according to a fourth embodiment.
  • FIG. 8 is a flowchart showing an example of a microdevice manufacturing process.
  • FIG. 1 is a view showing a first embodiment of the exposure apparatus EX.
  • the exposure apparatus EX includes a mask stage MST that can move a mask holder MH that holds a mask M, a substrate stage PST that can move a substrate holder PH that holds a substrate P, and a mask on the mask stage MST.
  • the illumination optical system IL that illuminates the mask M held by the holder MH with the exposure light EL, and the pattern image of the mask M illuminated by the exposure light EL are held by the substrate holder PH on the substrate stage PST.
  • a projection optical system PL that projects onto the substrate P, and a control device CONT that controls the overall operation of the exposure apparatus EX.
  • the exposure apparatus EX is an immersion exposure apparatus to which an immersion method is applied in order to improve the resolution by substantially shortening the exposure wavelength and substantially increase the depth of focus. It has a liquid immersion mechanism 1 that can form a liquid LQ liquid immersion area AR2.
  • the liquid immersion mechanism 1 is provided above the substrate P (substrate stage PST), and is provided on the nozzle member 70 and an annular nozzle member 70 provided so as to surround the optical element LSI at the tip of the projection optical system PL.
  • a liquid supply mechanism 10 that supplies liquid LQ on the substrate P via the liquid supply port 12 and a liquid recovery mechanism 20 that recovers the liquid LQ on the substrate P via the liquid recovery port 22 provided in the nozzle member 70. And.
  • the exposure apparatus EX includes a transport device 150 that transports the liquid recovery member 60 capable of absorbing the liquid LQ to the substrate holder PH in order to recover the liquid LQ remaining on the substrate holder PH. .
  • the transport device 150 can carry (load) the liquid recovery member 60 onto the substrate holder PH.
  • the transfer device 150 can also carry out (unload) the liquid recovery member 60 held by the substrate holder PH from the substrate holder PH.
  • the transfer device 150 also has a function of loading (unloading) the substrate P into and from the substrate holder PH. The operation of loading and unloading the substrate P with respect to the substrate holder PH by the transfer device 150 and the operation of loading and unloading the liquid recovery member 60 with respect to the substrate holder PH are substantially the same.
  • the transport device 150 for example, a transport device for transporting a substrate to be exposed disclosed in International Publication No. 00Z02239 pamphlet (corresponding to US Patent Publication No. 2004Z0075822) can be applied.
  • National legislation designated or selected in this international application To the extent permitted by the above, the disclosures thereof are incorporated herein by reference.
  • the exposure apparatus EX of the present embodiment is a so-called scanner that transfers a pattern provided on the mask M onto the substrate P via the projection optical system PL while moving the mask M and the substrate P synchronously. is there.
  • the direction that coincides with the optical axis AX of the projection optical system PL is the Z-axis direction
  • the synchronous movement direction (scanning direction) in a plane perpendicular to the Z-axis direction is the X-axis direction, Z-axis direction, and X-axis.
  • the direction perpendicular to the direction (non-scanning direction) is the Y-axis direction.
  • the rotation (tilt) directions around the X axis, Y axis, and Z axis are the 0 X direction, 0 Y direction, and ⁇ Z direction, respectively.
  • the illumination optical system IL illuminates the mask M supported by the mask stage MST with the exposure light EL, and is an optical light source that equalizes the illuminance of the exposure light source and the light beam emitted from the exposure light source. It includes an integrator, a condenser lens that collects the exposure light EL from the optical integrator, a relay lens system, and a field stop that sets the illumination area on the mask M by the exposure light EL. A predetermined illumination area on the mask M is illuminated by the exposure light EL having a uniform illuminance distribution by the illumination optical system IL.
  • the exposure light EL emitted from the illumination optical system IL includes, for example, bright ultraviolet rays (g-line, h-line, i-line) emitted from a mercury lamp, and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm). ) And vacuum ultraviolet light (VUV light) such as ArF excimer laser light (wavelength 193 nm) and F laser light (wavelength 157 nm).
  • ArF excimer laser light is used.
  • the mask stage MST can move the mask holder MH that holds the mask M, and can move two-dimensionally in a plane perpendicular to the optical axis AX of the projection optical system PL, that is, in the XY plane. Can be rotated slightly.
  • a moving mirror 40 for the laser interferometer 41 for measuring the position of the mask stage MST is provided on the mask stage MST.
  • Mask stage The position and rotation angle of the mask M on the MST in the two-dimensional direction are measured in real time by the laser interferometer 41, and the controller CONT is a mask stage including a linear motor, etc.
  • Projection optical system PL projects the pattern of mask M onto substrate ⁇ at a predetermined projection magnification ⁇ , and includes a plurality of optical elements including an optical element LSI provided at the tip of substrate ⁇ side. These optical elements are supported by a lens barrel PK.
  • the projection optical system PL is a reduction system in which the projection magnification j8 is 1Z4, 1/5, or 1Z8, for example.
  • the projection optical system PL may be either an equal magnification system or an enlargement system.
  • the projection optical system PL may be any of a refraction system that does not include a reflection element, a reflection system that does not include a refraction element, and a catadioptric system that includes a refraction element and a reflection element.
  • the optical element LSI at the tip is exposed from the barrel PK.
  • the substrate stage PST can move a substrate holder PH that holds the substrate P.
  • the substrate stage PST is supported on the base BP.
  • the substrate stage PST is movable on the base BP, and moves the substrate P held by the substrate holder PH in the XY direction (direction substantially parallel to the image plane of the projection optical system PL) and the ⁇ Z direction (rotation). Direction).
  • the substrate stage PST can move the substrate P held by the substrate holder PH in the Z-axis direction (force direction) and in the ⁇ X and ⁇ Y directions (tilt direction).
  • the substrate stage PST can move the substrate P held by the substrate holder PH in the direction of 6 degrees of freedom of the X-axis, Y-axis, Z-axis, 0 X, 0 Y, and 0 ⁇ direction. .
  • a recess 50 is provided on the substrate stage PST, and the substrate holder ⁇ is disposed in the recess 50.
  • the upper surface 51 of the substrate stage PST other than the recess 50 is a flat surface that is substantially the same height (level) as the upper surface of the substrate holder held by the substrate holder ⁇ .
  • the substrate stage PST is provided with a movable mirror 42 for a laser interferometer 43 for measuring the position of the substrate stage PST.
  • the position and rotation angle of the substrate ⁇ ⁇ on the substrate stage PST are measured in real time by the laser interferometer 43.
  • the control device CONT Based on the measurement result of the laser interferometer 43, the control device CONT performs the substrate stage PST in the two-dimensional coordinate system defined by the laser interferometer 43 via the substrate stage drive mechanism including a linear motor. By driving, it is supported by the substrate stage PST to position the substrate in the vertical direction and the vertical direction.
  • An exposure apparatus ⁇ is disclosed in, for example, JP-A-8-3714.
  • a focus detection system that detects surface position information on the upper surface of the substrate P by projecting detection light from an oblique direction onto the upper surface of the substrate P as disclosed in Japanese Patent Publication No. 9 is provided.
  • the focus detection system can determine the position of the upper surface of the substrate P in the Z-axis direction with respect to the image plane of the projection optical system PL and the orientation of the substrate P in the ⁇ X and ⁇ Y directions (tilt direction).
  • the control device CONT drives the substrate stage PST via the substrate stage drive mechanism, whereby the position of the substrate P held by the substrate stage PST in the Z-axis direction (focus position), and ⁇ X, ⁇ Y The position in the direction is controlled, and the upper surface (exposure surface) of the substrate P is aligned with the image surface formed via the projection optical system PL and the liquid LQ.
  • the liquid supply mechanism 10 is for supplying a predetermined liquid LQ to a space on the image plane side of the projection optical system PL, and includes a liquid supply unit 11 capable of delivering the liquid LQ, and a liquid supply unit 11 And a supply pipe 13 for connecting one end thereof. The other end of the supply pipe 13 is connected to the nozzle member 70.
  • the liquid supply unit 11 includes a tank that stores the liquid LQ, a pressure pump, a filter unit, and the like.
  • the liquid supply unit 11 of the exposure apparatus EX is not necessarily equipped with all of the tank, the pressure pump, the filter unit, and the like, and facilities such as a factory where the exposure apparatus EX is installed may be substituted.
  • the liquid recovery mechanism 20 is for recovering the liquid LQ in the space on the image plane side of the projection optical system PL.
  • the liquid recovery mechanism 21 can recover the liquid LQ, and the liquid recovery unit 21 includes the liquid recovery unit 21. And a recovery pipe 23 for connecting one end. The other end of the recovery pipe 23 is connected to the nozzle member 70.
  • the liquid recovery unit 21 includes, for example, a vacuum system (a suction device) such as a vacuum pump, a gas-liquid separator that separates the recovered liquid LQ and gas, and a tank that stores the recovered liquid LQ. It is not necessary for the liquid recovery unit 21 of the exposure apparatus EX to include all of the vacuum system, gas-liquid separator, tank, etc. Equipment such as a factory where the exposure apparatus EX is installed may be substituted.
  • the nozzle member 70 is provided above the substrate P (substrate stage PST), and the lower surface 70A of the nozzle member 70 is provided at a position facing the upper surface of the substrate P (upper surface of the substrate holder PH). Yes.
  • the liquid supply port 12 is provided on the lower surface 70A of the nozzle member 70.
  • an internal flow path (supply flow path) that connects the supply pipe 13 and the liquid supply port 12 is provided inside the nozzle member 70.
  • the liquid recovery port 22 is also provided on the lower surface 70A of the nozzle member 70, and is located outside the liquid supply port 12 with respect to the optical axis AX of the projection optical system PL (optical element LSI). Is provided.
  • an internal flow path (recovery flow path) that connects the recovery pipe 23 and the liquid recovery port 22 is provided inside the nozzle member 70.
  • the operation of the liquid supply unit 11 is controlled by the control device CONT.
  • the control device CONT sends the liquid LQ from the liquid supply unit 11, and is provided above the substrate P via the supply pipe 13 and the internal flow path of the nozzle member 70.
  • the liquid LQ is supplied onto the substrate P from the liquid supply port 12
  • a liquid LQ of 200 mlZmin or more can be continuously supplied from the liquid supply port 12.
  • the liquid recovery operation of the liquid recovery unit 21 is controlled by the control device CONT.
  • the control device CONT can control the amount of liquid collected per unit time by the liquid collection unit 21.
  • the liquid LQ on the substrate P recovered from the liquid recovery port 22 provided above the substrate P is recovered by the liquid recovery unit 21 via the internal flow path of the nozzle member 70 and the recovery pipe 23.
  • the control device CONT uses the liquid LQ supplied from the liquid supply mechanism 10 on the substrate P including the projection area AR1 of the projection optical system PL. At least partially, an immersion area AR2 that is larger than the projection area AR1 and smaller than the substrate P is locally formed.
  • the exposure apparatus EX fills the liquid LQ between the optical element LSI at the image surface side tip of the projection optical system PL and the upper surface (exposure surface) of the substrate P to form an immersion area AR2.
  • the substrate P is exposed by projecting the pattern image of the mask M onto the substrate P held by the substrate holder PH via the liquid LQ between the projection optical system PL and the substrate P and the projection optical system PL. To do.
  • pure water is used as the liquid LQ that forms the immersion area AR2. Pure water can be transmitted even if the exposure light EL is ArF excimer laser light. Pure water can also transmit bright lines (g-line, h-line, i-line) and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm).
  • FIG. 2 is a side sectional view showing the liquid recovery member 60
  • FIG. 3 is a perspective view of the liquid recovery member 60. 2 and 3, the liquid recovery member 60 is placed on the substrate holder PH holding the substrate P to be exposed through the liquid LQ, and absorbs (recovers) the liquid LQ remaining on the substrate holder PH.
  • the base 61 has substantially the same size and shape as the substrate P, and has a substantially circular shape in plan view.
  • the substrate 61 is made of, for example, metal, and has a predetermined hardness, such as titanium, aluminum, and stainless steel, and is formed of a material that does not easily wrinkle with liquid (pure water) LQ.
  • the substrate 61 may be made of glass or plastic having a predetermined hardness.
  • the base material 61 may be formed of the same material as the substrate P. That is, when the substrate P includes a silicon wafer, the base material 61 may be formed of silicon.
  • the liquid absorbing member 62 is capable of absorbing the liquid LQ, and in the present embodiment, the liquid absorbing member 62 is capable of absorbing the liquid LQ by capillary action.
  • the liquid absorbing member 62 is configured to include a fiber material. Examples of fiber materials include clean paper and cloth used in semiconductor processes. Alternatively, examples of the liquid absorbing member 62 include a sponge made of a fibrous material having a strong force such as a synthetic resin. In this embodiment, “Altiwipe” manufactured by Enomoto Kogyo Co., Ltd. is used as the liquid absorbing member 62.
  • the liquid absorbing member 62 may be constituted by a porous member made of ceramics, for example.
  • the liquid absorbing member 62 has a substantially circular shape in plan view and is formed slightly larger than the base material 61.
  • the liquid absorbing member 62 is fixed to the lower surface 61A of the substrate 61.
  • the liquid absorbing member 62 is fixed by being adhered to the lower surface 61A of the substrate 61 with an adhesive.
  • the liquid absorbing member 62 fixed to the lower surface 61A of the base material 61 protrudes outside the edge portion 61E of the base material 61.
  • the force that the liquid absorbing member 62 is exaggerated is actually very thin.
  • the liquid recovery member 60 as a whole has substantially the same size and shape as the substrate P. Therefore, the transport device 150 can transport the liquid recovery member 60, and the liquid recovery member 60 can be placed on the substrate holder PH.
  • the substrate P held by the substrate holder PH is exposed via the liquid LQ.
  • the liquid LQ enters the gap between the substrate P and the upper surface of the substrate P held by the rudder PH, and the liquid LQ enters between the substrate P and the substrate holder PH. Then, liquid LQ may remain on the substrate holder PH. In addition, liquid LQ may remain on the upper surface 51 of the substrate stage PST.
  • FIG. 4A is a diagram showing a state in which the liquid LQ remains on the substrate holder PH and the upper surface 51 of the substrate stage PST.
  • the substrate P is unloaded from the substrate holder PH by the transfer device 150.
  • the support surface PHa of the substrate P of the substrate holder PH is used to support the peripheral wall or the substrate P for vacuum suction of the substrate P as disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-244177.
  • a plurality of pin-like support portions are formed, but are omitted in FIGS. 4A and 4B.
  • the control device CONT uses the transfer device 150 to place the liquid recovery member 60 capable of absorbing the liquid LQ on the substrate holder PH.
  • the transport device 150 causes the liquid absorbing member 62 to contact the substrate holder PH so that the liquid absorbing member 62 of the liquid recovery member 60 and the substrate holder PH are brought into contact with each other.
  • the liquid recovery member 60 is placed on the substrate holder PH in a state facing the PH support surface PHa.
  • FIG. 4B is a view showing the liquid recovery member 60 placed on the substrate holder PH.
  • the liquid LQ remaining on the substrate holder PH is collected by being absorbed by the liquid absorbing member 62 of the liquid collecting member 60.
  • the liquid absorbing member 62 protrudes outside the edge portion 61E of the base member 61, by placing the liquid recovery member 60 on the substrate holder PH, a part of the liquid absorbing member 62 (base member 61). The more protruding part) is provided around the substrate holder PH! /, And also contacts the upper surface 51 of the substrate stage PST. Therefore, the liquid recovery member 60 can also recover the liquid LQ remaining on the upper surface 51 of the substrate stage PST by the liquid absorbing member 62 contacting the upper surface 51.
  • the controller CONT uses the transfer device 150 to transfer the liquid recovery member from the substrate holder PH. Unload 60. This completes the maintenance work for recovering the liquid LQ remaining on the substrate holder PH.
  • Maintenance work for removing the liquid LQ remaining on the substrate holder PH is performed at a predetermined timing such as every predetermined time interval or every predetermined number of processed substrates.
  • the control device CONT loads the substrate P for exposure onto the substrate holder PH from which the liquid LQ has been removed.
  • the substrate P is exposed in a state where it is well held by the substrate holder PH from which the liquid LQ has been removed.
  • the liquid recovery member 60 capable of absorbing the liquid LQ on the substrate holder PH
  • the liquid LQ remaining on the substrate holder PH can be recovered and removed satisfactorily. it can. Therefore, the exposure process can be performed with high accuracy while the substrate P is well held by the substrate holder PH from which the liquid LQ has been removed.
  • the liquid recovery member 60 it is possible to suppress the occurrence of an inconvenience such as contamination of the substrate P or scattering of the liquid LQ, and to expose the substrate P with high accuracy.
  • the liquid recovery member 60 is transported to the substrate holder PH using the existing transport device 150 that transports the substrate P to the substrate holder PH.
  • the liquid LQ can be recovered in a short time with a simple configuration without providing a dedicated liquid recovery device for recovering the liquid LQ. Therefore, it is possible not only to reduce the apparatus cost but also to suppress inconveniences such as a decrease in the operating rate of the exposure apparatus EX. Even if the liquid LQ adheres to the transfer device 150 due to the transfer of the substrate P after exposure, the liquid LQ attached to the transfer device 150 can be recovered (absorbed) by transferring the liquid recovery member 60. Can do.
  • the exposure apparatus EX includes a detection device 80 that detects whether or not the liquid LQ is present on the substrate holder PH.
  • the detection device 80 is provided at a position aligned with the projection optical system PL, and optically detects from above the substrate holder PH whether or not there is a liquid LQ on the substrate holder PH.
  • the control device CONT moves the substrate stage PST in the XY direction and moves the substrate holder PH below the detection device 80. To place.
  • the detector 80 includes an image sensor such as a CCD and controls the imaging results (detection results).
  • the control device CONT processes the detection result of the detection device 80 (image processing), and detects whether the liquid LQ is present on the substrate holder PH based on the processing result. For example, the support surface PHa of the substrate holder PH in a clean state in which the liquid LQ does not remain is imaged in advance by the detection device 80 and stored as a reference image. By comparing, it can be determined whether or not the support surface PHa of the substrate holder PH and the liquid LQ remain.
  • the control device CONT controls the transport device 150 based on the detection result of the detection device 80. That is, when the control device CONT determines that the liquid LQ is present on the substrate holder PH based on the detection result of the detection device 80, the control device CONT uses the transfer device 150 to place the liquid recovery member 60 on the substrate holder PH. Load and collect liquid LQ. On the other hand, if the control device CONT determines that there is no liquid LQ on the substrate holder PH based on the detection result of the detection device 80, the control device CONT performs the transport operation of the liquid recovery member 60 onto the substrate holder PH by the transport device 150. I don't know.
  • the timing of the detection operation by the detection device 80 can be performed at a predetermined timing such as every time when the substrate P is unloaded from the substrate holder PH, every predetermined time interval, every predetermined number of processed substrates. .
  • the detection device 80 may exclusively detect the liquid remaining on the substrate holder PH, or a mark detection system for aligning the substrate P may be used as the substrate. It may also be used to detect liquid remaining on the holder PH.
  • the force with which the liquid absorbing member 62 of the liquid recovery member 60 protrudes from the substrate 61 does not necessarily have to protrude.
  • the liquid absorbing member 62 having the same size and shape as the base material 61 should be used.
  • the liquid recovery member 60 includes the base member 61 and the liquid absorbing member 62 fixed to the base member 61, and includes two elements. Liquid recovery shown in Figure 6 It is composed of one element, like member 60,! /.
  • the liquid recovery member 60 ′ is composed of a porous member having approximately the same size and shape as the substrate P.
  • a porous member made of ceramics is used as the porous member.
  • the liquid recovery member 60 ′ may be formed of a porous member having a predetermined hardness.
  • the maintenance work using the liquid recovery member 60 may be performed in a state where the substrate stage PST is moved under the projection optical system PL.
  • the stage PST may be performed away from the projection optical system PL.
  • all the liquid LQ that forms the immersion area AR2 is recovered.
  • all of the liquid LQ forming the liquid immersion area AR2 may be recovered.
  • a member different from the substrate stage PST may be opposed to the projection optical PL, and the immersion area AR2 may be maintained on the separate member.
  • a characteristic part of the present embodiment is that the liquid LQ remaining in the nozzle member 70 is recovered using the liquid recovery member 60 ′ held by the substrate holder PH.
  • the nozzle member 70 has the liquid supply port 12 for supplying the liquid LQ and the liquid recovery port 22 for recovering the liquid LQ.
  • the liquid supply port 12 and the liquid recovery port 22 are provided on the lower surface 70A of the nozzle member 70 facing the substrate P (substrate holder PH).
  • the substrate P held by the substrate holder PH is exposed through the liquid LQ.
  • the controller CONT performs the liquid supply operation through the liquid supply port 12 of the nozzle member 70 and the liquid recovery operation through the liquid recovery port 22 in parallel.
  • the control device CONT stops the liquid supply operation via the liquid supply port 12, and substantially supplies the liquid LQ on the image plane side of the projection optical system PL via the liquid recovery port 22.
  • the liquid recovery operation through the liquid recovery port 22 is stopped.
  • a slight amount of liquid L may enter the lower surface 70A of the nozzle member 70, the liquid supply port 12, or the liquid recovery port 13. Q may remain.
  • the liquid LQ may also remain in the vicinity of the liquid recovery port 22 in the internal flow path (recovery flow path) of the member 70.
  • the control device CONT places the liquid recovery member 60 'on the substrate holder PH using the transfer device 150. At this time, the exposed substrate P is already unloaded from the substrate holder PH.
  • the control device CONT adjusts the relative positional relationship between the liquid recovery member 60 ′ placed on the substrate holder PH and the nozzle member 70, and connects the liquid recovery member 60 ′ and the lower surface 70A of the nozzle member 70. Make contact. Specifically, the control device CONT drives the substrate stage PST to bring the upper surface of the liquid recovery member 60 ′ placed on the substrate holder PH into contact with the lower surface 70A of the nozzle member 70. By doing so, the liquid LQ remaining in the nozzle member 70 is recovered by being absorbed by the liquid recovery member 60 ′.
  • the liquid recovery member 60 'and the lower surface 70A of the nozzle member 70 are not necessarily brought into contact with each other, and the lower surface 70A of the nozzle member 70 is approached at intervals of 0.1 to 1.0 mm. You can just let it.
  • a force that powers the substrate stage PST to relatively move the lower surface 70A of the nozzle member 70 and the liquid recovery member 60 ' is provided on the substrate stage PST.
  • the nozzle member 70 may be powered to bring the liquid recovery member 60 ′ and the lower surface 70A of the nozzle member 70 closer or in contact with each other.
  • a vacuum hole is provided in the vicinity of the liquid recovery member 60 'held by the substrate holder PH and at least one of the substrate holder PH and the substrate stage PST. It is also possible to recover the liquid absorbed by the liquid recovery member 60 'from its vacuum pore force.
  • the liquid recovery member 60 ′ can also recover the liquid LQ remaining in the first optical element LSI provided in the vicinity of the nozzle member.
  • the liquid LQ remaining on the substrate holder PH can also be collected using the liquid recovery member 60 ′.
  • the liquid recovery member 60 ' which is the porous member described in the third embodiment, is used.
  • the liquid recovery member 60' described in the first and second embodiments is used.
  • the transport device 150 transports the liquid recovery member 60 so that the lower surface 70A of the nozzle member 70 and the liquid absorbing member 62 of the liquid recovery member 60 face each other.
  • the liquid absorbing member 62 may be fixed on both surfaces of the substrate 61.
  • the nozzle member 70 of the present embodiment has both the liquid supply port 12 and the liquid recovery port 22, but the liquid supply port 12 and the liquid recovery port 22 are nozzle members having either one of them.
  • the liquid recovery member 60 '(60) can also be used when recovering the remaining liquid LQ. Further, neither the liquid supply port nor the liquid recovery port is formed on the lower surface 70A of the nozzle member 70. Even in this case, the liquid remaining on the lower surface 70A of the nozzle member 70 is removed from the liquid recovery member 60, ( 60) can be used for recovery (removal).
  • a detection device that detects whether or not the liquid LQ remains in the nozzle member 70 is provided, and based on the detection result, the liquid is applied to the nozzle member 70.
  • the liquid LQ remaining in the nozzle member 70 may be recovered using the liquid recovery member 60 '(60).
  • the control device CONT makes the liquid recovery member 60 '(60) placed on the substrate holder PH and the nozzle member 70 contact (or approach), but the liquid recovery member The liquid recovery member 60 ′ held by the transport device 150 and the nozzle member 70 may be brought into contact (or approached) without placing the member 60 ′ on the substrate holder PH.
  • the control device CONT can move the liquid recovery member 60 relative to the nozzle member 70 by controlling the position of the transport device 150.
  • the liquid recovery member 60 (60 ') has substantially the same size and shape as the substrate P, but is placed on the substrate holder PH. If it can be transported by the transport device 150, at least one of its size and shape is different from that of the substrate P. May be.
  • the transport device 150 transports the liquid recovery member 60 (60 ′). However, during maintenance of the exposure apparatus EX, the operator moves the liquid recovery member 60 (60 ′) to the substrate holder. Put it on the PH.
  • the liquid recovery member 60 (60 ') may be recovered by applying a reagent such as salty cobalt to a portion of the liquid recovery member 60 (60') that contacts the substrate holder PH or the upper surface 51 of the substrate stage PST. It can be confirmed whether the member 60 has collected the liquid LQ.
  • salt or cobalt may be soaked in the liquid absorbing member 62 made of fiber such as paper. Paper (fiber) impregnated with salty ⁇ cobalt is light blue in the dry state and pink when wet. Therefore, visually check whether the liquid recovery member 60 has absorbed the liquid LQ. Can do.
  • the transfer device 150 of the above-described embodiment can load and unload the substrate P with respect to the substrate holder PH, and can load and unload the liquid recovery member 60 (60 ′).
  • the transport device that loads and unloads the substrate P with respect to the substrate holder PH and the transport device that loads and unloads the liquid recovery member 60 with respect to the substrate holder PH may be different transport devices.
  • the transport device that can load the substrate P and the liquid collection member 60 on the substrate holder PH and the transport device that can unload the substrate P and the liquid recovery member 60 from the substrate holder PH are different transport devices. Constructed, ok.
  • each of the lower surface LSA of the optical element LSI of the projection optical system PL and the lower surface 70A of the nozzle member 70 is a flat surface, and these optical element LSIs of the projection optical system PL
  • the lower surface LSA of the nozzle member 70 and the lower surface 70A of the nozzle member 70 are substantially flush with each other. Further, as described above, the upper surface of the substrate P held by the substrate holder PH and the upper surface 51 of the substrate stage PST are flush with each other.
  • the immersion region AR2 between the lower surface 70A of the nozzle member 70 and the lower surface LSA of the optical element LSI, and the upper surface of the substrate P and the upper surface 51 of the substrate stage PST. Further, by providing the upper surface 51, even when the peripheral edge of the substrate P is subjected to immersion exposure, the liquid LQ is held on the image plane side of the projection optical system PL, and the immersion area AR2 is improved. Can be formed.
  • the liquid contact surface (including the lower surface LSA) that contacts the liquid LQ in the liquid immersion area AR2 in the optical element LS 1 is preferably lyophilic with respect to the liquid LQ.
  • the nozzle member 70 of these, the liquid contact surface (including the lower surface 70A) that contacts the liquid LQ in the immersion area AR2 is also preferably lyophilic with respect to the liquid LQ.
  • the liquid contact surface is coated with a lyophilic material such as 2 on the liquid contact surface.
  • the upper surface 51 of the substrate stage PST is preferably liquid repellent with respect to the liquid LQ.
  • a liquid-repellent material such as a fluorine-based resin material or an acrylic-based resin material is coated on the liquid contact surface. Liquid smoke treatment is applied.
  • a material provided in the optical element LSI, the nozzle member 70, the substrate stage PST, etc. a material insoluble in the liquid LQ is used.
  • liquid LQ has liquid repellency.
  • the substrate holder PH disposed in the recess 50 of the substrate stage PST may be formed integrally with the substrate stage PST, or formed separately from the substrate stage PST.
  • the substrate stage PST may be detachably disposed.
  • the upper surface (flat portion) 51 of the substrate stage PST can be formed of a separate member that can be attached to and detached from the upper surface of the force substrate stage PST formed integrally with the substrate stage PST.
  • the structure of the liquid immersion mechanism 1 such as the nozzle member 70 is not limited to the one described above.
  • European Patent Publication No. 1420298, International Publication No. 2004Z055803, International Publication No. 2004Z057589, International Publication No. 2004 / 057590 and International Publication No. 2005Z029559 can also be used.
  • the liquid LQ in the present embodiment is pure water. Pure water can be easily obtained in large quantities at semiconductor manufacturing factories and the like, and has the advantage of not adversely affecting the photosensitive material on the substrate P and optical elements (lenses). In addition, pure water has no adverse effects on the environment and the content of impurities is extremely low, so that it also cleans the upper surface of the substrate P and the surface of the optical element provided on the front end surface of the projection optical system PL. I can expect. From factories If the purity of the supplied pure water is low, make sure that the exposure equipment has an ultrapure water production device.
  • the refractive index n of pure water (water) with respect to the exposure light EL having a wavelength of about 193 nm is said to be approximately 1. 44, and ArF excimer laser light (wavelength 193 nm) is used as the light source of the exposure light EL.
  • ArF excimer laser light wavelength 193 nm
  • the wavelength is shortened to about 134 nm to obtain a high resolution.
  • the projection optical system PL can be used if it is sufficient to ensure the same depth of focus as in the air.
  • the numerical aperture can be increased further, and the resolution is improved in this respect as well.
  • an optical element (lens) LSI is attached to the tip of the projection optical system PL, and the optical characteristics of the projection optical system PL, such as aberrations (spherical aberration, coma, etc.) are fixed by this lens. Adjustments can be made.
  • the optical element attached to the tip of the projection optical system PL may be an optical plate used for adjusting the optical characteristics of the projection optical system PL. Or it may be a plane parallel plate that can transmit the exposure light EL.
  • the space between the projection optical system PL and the upper surface of the substrate P is filled with the liquid LQ.
  • a cover glass having parallel plane plate force is applied to the upper surface of the substrate P. It may be configured to fill the liquid LQ when installed.
  • the exposure apparatus that fills the optical path space on the light exit side of the optical element LSI of the projection optical system PL with the liquid LQ is described.
  • the other optical path space is filled with the liquid (water). It may be.
  • the optical path space on the light incident side of the first optical element LSI may be filled with liquid (pure water).
  • the liquid LQ of the present embodiment may be a liquid other than water, which is water.
  • the light source of the exposure light EL is an F laser
  • the F laser light does not transmit water. So
  • liquid LQ for example, perfluorinated polyether (PFPE) and F laser light can be transmitted.
  • PFPE perfluorinated polyether
  • F laser light can be transmitted.
  • the part in contact with the liquid LQ For example, small polarity including fluorine!
  • the film is made lyophilic by forming a thin film with a molecular structure.
  • the liquid LQ has a high refractive index as much as possible with respect to the exposure light EL, and is applied to the photosensitive material coated on the upper surface of the projection optical system PL or the substrate P (base material). It is also possible to use a stable material (for example, cedar oil). In this case, the surface treatment is performed according to the liquid LQ used.
  • the substrate P in each of the above embodiments is not limited to a semiconductor wafer for manufacturing a semiconductor device, but a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, a mask used in an exposure apparatus, or Reticle masters (synthetic quartz, silicon wafers) are applied.
  • the exposure apparatus EX in addition to a step-and-scan type scanning exposure apparatus (scanning stepper) that performs mask exposure by moving the mask M and the substrate P in synchronization with each other, a mask is used.
  • the present invention can also be applied to a step-and-repeat projection exposure apparatus (steno) in which the pattern of the mask M is collectively exposed while M and the substrate P are stationary, and the substrate P is sequentially moved stepwise.
  • a reduced image of the first pattern is projected with the first pattern and the substrate P substantially stationary, for example, a refraction-type optical system (for example, including a reflective element at a 1Z8 reduction magnification). It can also be applied to an exposure apparatus that uses a projection optical system) to perform batch exposure on the substrate P. In this case, after that, with the second pattern and the substrate P almost stationary, a reduced image of the second pattern is collectively exposed on the substrate P by partially overlapping the first pattern using the projection optical system. It can also be applied to a stitch type batch exposure apparatus.
  • the stitch type exposure apparatus can also be applied to a step 'and' stitch type exposure apparatus in which at least two patterns are partially overlapped and transferred on the substrate P, and the substrate P is sequentially moved.
  • the present invention can be applied to an exposure apparatus and an exposure method that do not use the force projection optical system PL, which has been described by taking an exposure apparatus including the projection optical system PL as an example.
  • the present invention can also be applied to a twin stage type exposure apparatus disclosed in Japanese Patent Laid-Open Nos. 10-163099, 10-214783, 2000-505958, and the like.
  • a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and a measurement stage on which various photoelectric sensors are mounted As disclosed in Japanese Patent Laid-Open No. 11-135400, a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and a measurement stage on which various photoelectric sensors are mounted.
  • the present invention can also be applied to an exposure apparatus.
  • an exposure apparatus that locally fills the liquid between the projection optical system PL and the substrate P is employed.
  • the present invention is disclosed in JP-A-6-124873.
  • the present invention can also be applied to an immersion exposure apparatus that exposes a substrate in a state where the entire substrate surface is immersed, as disclosed in JP-A-10-303114 and US Pat. No. 5,825,043. is there.
  • the type of exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern onto a substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, It can be widely applied to an exposure device for manufacturing an imaging device (CCD) or a reticle or mask.
  • CCD imaging device
  • each stage PST, MST may be a type that moves along a guide or may be a guideless type without a guide.
  • each stage PST, MST is such that a magnet mute with two-dimensionally arranged magnets is opposed to an armature unit with two-dimensionally arranged coils, and each stage PST, MST is driven by electromagnetic force.
  • either one of the magnet unit or armature unit is connected to the stage PST or MST, and the other of the magnet unit or armature unit is provided on the moving surface side of the stage PST or MST!
  • the exposure apparatus EX provides various subsystems including the respective constituent elements recited in the claims of the present application with predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling to keep. In order to ensure these various accuracies, before and after this assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, various electrical systems Adjustments are made to achieve electrical accuracy.
  • the assembly process to the exposure equipment includes mechanical connections, electrical circuit wiring connections, and pneumatic circuit piping connections between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. It is desirable to manufacture the exposure apparatus in a clean room where the temperature and cleanliness are controlled.
  • a microdevice such as a semiconductor device includes a step 201 for designing the function and performance of the microdevice, a step 202 for producing a mask (reticle) based on this design step, Step 203 for manufacturing a substrate as a base material, substrate processing step 204 for exposing a mask pattern onto the substrate by the exposure apparatus EX of the above-described embodiment, device assembly step (including dicing process, bonding process, and packaging process) 205 It is manufactured through inspection step 206 and the like.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

La présente invention concerne un procédé d’entretien d’un appareil d’exposition par lequel on évite qu’il reste un liquide. Un élément de récupération de liquide (60), qui peut aussi absorber un liquide (LQ), est installé sur un support de panneau (PH), afin de récupérer le liquide restant (LQ).
PCT/JP2005/018789 2004-10-12 2005-10-12 Procédé d’entretien d’un appareil d’exposition, appareil d’exposition, procédé de fabrication du dispositif et élément de récupération de liquide pour l’entretien d’un appareil d’exposition par immersion WO2006041091A1 (fr)

Priority Applications (1)

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WO2007136052A1 (fr) * 2006-05-22 2007-11-29 Nikon Corporation Procédé et appareil d'exposition, procédé de maintenance, et procédé de fabrication du dispositif associé
JP2012044186A (ja) * 2007-12-03 2012-03-01 Asml Netherlands Bv リソグラフィ装置

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JPH04154122A (ja) * 1990-10-18 1992-05-27 Toshiba Corp 基板処理装置及び同方法
WO2004053953A1 (fr) * 2002-12-10 2004-06-24 Nikon Corporation Appareil d'exposition et son procede de fabrication
JP2004259966A (ja) * 2003-02-26 2004-09-16 Nikon Corp 露光装置及びデバイス製造方法
JP2005277363A (ja) * 2003-05-23 2005-10-06 Nikon Corp 露光装置及びデバイス製造方法

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CN101872135B (zh) * 2002-12-10 2013-07-31 株式会社尼康 曝光设备和器件制造法
JP4529433B2 (ja) * 2002-12-10 2010-08-25 株式会社ニコン 露光装置及び露光方法、デバイス製造方法
JP2005191394A (ja) * 2003-12-26 2005-07-14 Canon Inc 露光方法及び装置
US7898642B2 (en) * 2004-04-14 2011-03-01 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method

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JPH04154122A (ja) * 1990-10-18 1992-05-27 Toshiba Corp 基板処理装置及び同方法
WO2004053953A1 (fr) * 2002-12-10 2004-06-24 Nikon Corporation Appareil d'exposition et son procede de fabrication
JP2004259966A (ja) * 2003-02-26 2004-09-16 Nikon Corp 露光装置及びデバイス製造方法
JP2005277363A (ja) * 2003-05-23 2005-10-06 Nikon Corp 露光装置及びデバイス製造方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007136052A1 (fr) * 2006-05-22 2007-11-29 Nikon Corporation Procédé et appareil d'exposition, procédé de maintenance, et procédé de fabrication du dispositif associé
JP2008004928A (ja) * 2006-05-22 2008-01-10 Nikon Corp 露光方法及び装置、メンテナンス方法、並びにデバイス製造方法
JP2012044186A (ja) * 2007-12-03 2012-03-01 Asml Netherlands Bv リソグラフィ装置

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