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WO2005038877A3 - MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD - Google Patents

MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD Download PDF

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Publication number
WO2005038877A3
WO2005038877A3 PCT/US2004/034175 US2004034175W WO2005038877A3 WO 2005038877 A3 WO2005038877 A3 WO 2005038877A3 US 2004034175 W US2004034175 W US 2004034175W WO 2005038877 A3 WO2005038877 A3 WO 2005038877A3
Authority
WO
WIPO (PCT)
Prior art keywords
macs
wafer surface
sub
wafer
removal
Prior art date
Application number
PCT/US2004/034175
Other languages
French (fr)
Other versions
WO2005038877A2 (en
Inventor
R Gregory Wolf
Michael Darwin
Original Assignee
Rudolph Technologies Inc
R Gregory Wolf
Michael Darwin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rudolph Technologies Inc, R Gregory Wolf, Michael Darwin filed Critical Rudolph Technologies Inc
Publication of WO2005038877A2 publication Critical patent/WO2005038877A2/en
Publication of WO2005038877A3 publication Critical patent/WO2005038877A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/0206—Cleaning during device manufacture during, before or after processing of insulating layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

A MACs mitigation system includes a MACs film removal sub-system (14) and a wafer surface sustaining sub­system (16) for sustaining or maintaining the cleaned surface (I 8A) of a wafer (18) in a substantially MACs-free condition for some predetermined period of time, such as the typical amount of time required after MACs film removal to perform a desired measurement on the wafer using a metrology tool (12). The MACs film removal sub-system can comprise a source (14A) of microwave energy that beneficially both heats and dissociates the chemical constituents of the MACs film. The wafer surface sustaining sub-system can be co-located with a measurement stage portion of the metrology tool, and preferably includes an atmosphere provided by a source (20) of clean gas.
PCT/US2004/034175 2003-10-14 2004-10-14 MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD WO2005038877A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51120903P 2003-10-14 2003-10-14
US60/511,209 2003-10-14

Publications (2)

Publication Number Publication Date
WO2005038877A2 WO2005038877A2 (en) 2005-04-28
WO2005038877A3 true WO2005038877A3 (en) 2009-04-09

Family

ID=34465197

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/034175 WO2005038877A2 (en) 2003-10-14 2004-10-14 MOLECULAR AIRBORNE CONTAMINANTS (MACs) REMOVAL AND WAFER SURFACE SUSTAINING SYSTEM AND METHOD

Country Status (2)

Country Link
US (1) US20050098264A1 (en)
WO (1) WO2005038877A2 (en)

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US8525139B2 (en) * 2009-10-27 2013-09-03 Lam Research Corporation Method and apparatus of halogen removal
US8232538B2 (en) * 2009-10-27 2012-07-31 Lam Research Corporation Method and apparatus of halogen removal using optimal ozone and UV exposure
US8818754B2 (en) * 2011-04-22 2014-08-26 Nanometrics Incorporated Thin films and surface topography measurement using reduced library
WO2014131016A1 (en) 2013-02-25 2014-08-28 Kla-Tencor Corporation Method and system for gas flow mitigation of molecular contamination of optics
PL3398709T3 (en) 2017-05-03 2021-06-28 Agathon AG, Maschinenfabrik Laser machining system with a thermo-concept
CN110220886A (en) * 2019-07-17 2019-09-10 南京信息工程大学 Coin discrimination system and application method based on laser induced breakdown spectroscopy

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Also Published As

Publication number Publication date
US20050098264A1 (en) 2005-05-12
WO2005038877A2 (en) 2005-04-28

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