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WO2005036927A3 - Lowered pressure point for heat sink retention hardware - Google Patents

Lowered pressure point for heat sink retention hardware Download PDF

Info

Publication number
WO2005036927A3
WO2005036927A3 PCT/US2004/032664 US2004032664W WO2005036927A3 WO 2005036927 A3 WO2005036927 A3 WO 2005036927A3 US 2004032664 W US2004032664 W US 2004032664W WO 2005036927 A3 WO2005036927 A3 WO 2005036927A3
Authority
WO
WIPO (PCT)
Prior art keywords
heat sink
base plate
spring
electronic device
fastener
Prior art date
Application number
PCT/US2004/032664
Other languages
French (fr)
Other versions
WO2005036927A2 (en
Inventor
Bradley Robert Whitney
Sukhvinder S Kang
Original Assignee
Aavid Thermalloy Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aavid Thermalloy Llc filed Critical Aavid Thermalloy Llc
Publication of WO2005036927A2 publication Critical patent/WO2005036927A2/en
Publication of WO2005036927A3 publication Critical patent/WO2005036927A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat sink assembly (10) includes a heat sink with a base plate having a top surface with fins for dissipating heat and an opposed bottom surface for placing against an electronic device (4) mounted on a printed circuit board, and at least one connecting device (2) for loading the heat sink against the electronic device. The connector includes a mechanical fastener such as a push pin having an end which engages the circuit board, a compression spring (43) received against a shoulder on the fastener, and a cup member which is installed in an aperture in the base plate so that a floor of the cup member provides a bearing surface for the spring which is below the bottom surface of the base plate. An alternative connector utilizes a conical spring received through the base plate and receiving the fastener therein to load the spring in tension against the electronic device.
PCT/US2004/032664 2003-10-03 2004-09-30 Lowered pressure point for heat sink retention hardware WO2005036927A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50846003P 2003-10-03 2003-10-03
US60/508,460 2003-10-03

Publications (2)

Publication Number Publication Date
WO2005036927A2 WO2005036927A2 (en) 2005-04-21
WO2005036927A3 true WO2005036927A3 (en) 2006-01-05

Family

ID=34434914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/032664 WO2005036927A2 (en) 2003-10-03 2004-09-30 Lowered pressure point for heat sink retention hardware

Country Status (3)

Country Link
US (1) US20050072558A1 (en)
TW (1) TW200528013A (en)
WO (1) WO2005036927A2 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4212511B2 (en) * 2004-05-06 2009-01-21 富士通株式会社 Semiconductor device and method for assembling semiconductor device
TWM306680U (en) * 2006-06-05 2007-02-21 Hon Hai Prec Ind Co Ltd Thermal model
US20090086491A1 (en) 2007-09-28 2009-04-02 Ruud Lighting, Inc. Aerodynamic LED Floodlight Fixture
US7952262B2 (en) * 2006-09-30 2011-05-31 Ruud Lighting, Inc. Modular LED unit incorporating interconnected heat sinks configured to mount and hold adjacent LED modules
US9243794B2 (en) 2006-09-30 2016-01-26 Cree, Inc. LED light fixture with fluid flow to and from the heat sink
US7686469B2 (en) 2006-09-30 2010-03-30 Ruud Lighting, Inc. LED lighting fixture
US9028087B2 (en) 2006-09-30 2015-05-12 Cree, Inc. LED light fixture
US7474530B2 (en) * 2007-01-10 2009-01-06 Sun Microsystems, Inc. High-load even pressure heatsink loading for low-profile blade computer applications
US7495922B2 (en) * 2007-03-29 2009-02-24 Intel Corporation Spring loaded heat sink retention mechanism
USD573110S1 (en) * 2007-07-27 2008-07-15 Nidec Corporation Heat sink
US7701720B2 (en) * 2007-09-27 2010-04-20 International Business Machines Corporation Electronic assembly and techniques for installing a heatsink in an electronic assembly
TWM332752U (en) * 2007-10-25 2008-05-21 Cooler Master Co Ltd Elastic buckle device
US7606031B2 (en) * 2007-12-27 2009-10-20 Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. Heat dissipating device
KR101637616B1 (en) * 2008-03-20 2016-07-07 디에스엠 아이피 어셋츠 비.브이. Heatsinks of thermally conductive plastic materials
CN101621907B (en) * 2008-07-04 2012-03-21 富准精密工业(深圳)有限公司 Heat sink
US7835153B2 (en) * 2008-12-30 2010-11-16 Oracle America, Inc. Heat sink mount for providing non-rigid support of overhanging portions of heat sink
WO2013075759A1 (en) * 2011-11-25 2013-05-30 Huawei Technologies Co., Ltd. Heat sink device and method for producing a heat sink device
MY175891A (en) * 2012-01-20 2020-07-14 Pem Man Inc Dynamic mounting system
CN102791077B (en) * 2012-07-25 2015-02-04 华为技术有限公司 Power electronic device
JP6192091B2 (en) * 2013-03-21 2017-09-06 Ｎｅｃプラットフォームズ株式会社 Heat sink fixing structure
US9560792B2 (en) 2015-01-30 2017-01-31 Netgear, Inc. Apparatus and method for heat sink assembly
USD804434S1 (en) * 2016-06-15 2017-12-05 Adda Corp. Electronic component heatsink assembly
US10117356B2 (en) 2016-11-28 2018-10-30 Advanced Micro Devices, Inc. Heat sink connector pin and assembly
CN109887894B (en) * 2019-02-28 2020-11-20 北京比特大陆科技有限公司 Heat sink, circuit board and computing device
US10764990B1 (en) * 2019-04-23 2020-09-01 Adlink Technology Inc. Heat-dissipating module having an elastic mounting structure
US11121504B2 (en) * 2020-02-03 2021-09-14 Rockwell Collins, Inc. Circuit board separation mechanism
US11071195B1 (en) 2020-06-05 2021-07-20 Google Llc Heatsink and stiffener mount with integrated alignment
US11758690B2 (en) * 2021-06-18 2023-09-12 Nanning Fulian Fugui Precision Industrial Co., Ltd. Heat-dissipation device allowing easy detachment from heat-generating component
US11991864B2 (en) 2022-03-16 2024-05-21 Google Llc Load vectoring heat sink

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4111407A (en) * 1976-09-30 1978-09-05 Litton Industrial Products, Inc. Conical compression spring
US4952106A (en) * 1988-09-29 1990-08-28 Nifco, Inc. Fastener having separate portions for engaging two panels to be secured together
US6307748B1 (en) * 2000-04-20 2001-10-23 Foxconn Precision Components Co., Ltd. Heat sink clip assembly
US6468011B2 (en) * 2001-01-31 2002-10-22 Hewlett-Packard Company Precision fastener assembly having a pre-compressed captive spring
US6644886B2 (en) * 2000-09-13 2003-11-11 Schwarz Verbindungs-Systeme Gmbh Connection arrangement for the detachable connection of two components
US6667882B2 (en) * 2002-05-15 2003-12-23 Hewlett-Packard Development Company, L.P. Cooling assembly for a heat producing assembly
US6666640B1 (en) * 2002-07-09 2003-12-23 Hsieh Hsin-Mao Fastener for a heat-radiator on a chip
US6752577B2 (en) * 2002-02-27 2004-06-22 Shu-Chen Teng Heat sink fastener
US6829143B2 (en) * 2002-09-20 2004-12-07 Intel Corporation Heatsink retention apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6404632B1 (en) * 2001-05-04 2002-06-11 Hewlett-Packard Co. Mechanical configuration for retaining inboard mounting hardware on finned heat dissipating devices
US6859367B2 (en) * 2003-01-03 2005-02-22 Intel Corporation Heat sink attachment device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4111407A (en) * 1976-09-30 1978-09-05 Litton Industrial Products, Inc. Conical compression spring
US4952106A (en) * 1988-09-29 1990-08-28 Nifco, Inc. Fastener having separate portions for engaging two panels to be secured together
US6307748B1 (en) * 2000-04-20 2001-10-23 Foxconn Precision Components Co., Ltd. Heat sink clip assembly
US6644886B2 (en) * 2000-09-13 2003-11-11 Schwarz Verbindungs-Systeme Gmbh Connection arrangement for the detachable connection of two components
US6468011B2 (en) * 2001-01-31 2002-10-22 Hewlett-Packard Company Precision fastener assembly having a pre-compressed captive spring
US6752577B2 (en) * 2002-02-27 2004-06-22 Shu-Chen Teng Heat sink fastener
US6667882B2 (en) * 2002-05-15 2003-12-23 Hewlett-Packard Development Company, L.P. Cooling assembly for a heat producing assembly
US6666640B1 (en) * 2002-07-09 2003-12-23 Hsieh Hsin-Mao Fastener for a heat-radiator on a chip
US6829143B2 (en) * 2002-09-20 2004-12-07 Intel Corporation Heatsink retention apparatus

Also Published As

Publication number Publication date
WO2005036927A2 (en) 2005-04-21
US20050072558A1 (en) 2005-04-07
TW200528013A (en) 2005-08-16

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