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WO2005031375A1 - Procede et dispositif de mesure permettant de determiner la capacite d'un composant electrique capacitif connecte a un circuit integre - Google Patents

Procede et dispositif de mesure permettant de determiner la capacite d'un composant electrique capacitif connecte a un circuit integre Download PDF

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Publication number
WO2005031375A1
WO2005031375A1 PCT/NL2004/000661 NL2004000661W WO2005031375A1 WO 2005031375 A1 WO2005031375 A1 WO 2005031375A1 NL 2004000661 W NL2004000661 W NL 2004000661W WO 2005031375 A1 WO2005031375 A1 WO 2005031375A1
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WO
WIPO (PCT)
Prior art keywords
component
voltage
measured
capacitance
switches
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Application number
PCT/NL2004/000661
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English (en)
Inventor
Derk André KORT
Original Assignee
Jtag Technologies B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jtag Technologies B.V. filed Critical Jtag Technologies B.V.
Publication of WO2005031375A1 publication Critical patent/WO2005031375A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
    • G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
    • G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
    • G01R27/2605—Measuring capacitance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
    • G01R31/64—Testing of capacitors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318572—Input/Output interfaces

Definitions

  • Ffethod and measuring device for determining the capacitance of a capacitive electrical component connected to an integrated circuit.
  • the invention relates to a method and a measuring device for determining the capacitance of a capacitive electrical component connected to an integrated circuit, which circuit is provided with analog terminals which can be connected by means of switches to the component that is to be measured.
  • printed circuit boards comprising integrated semiconductor circuits and discrete electrical components, for example, are very difficult to test.
  • Digital circuits can be tested by using "boundary scan" techniques, which are known in practice, provided that the integrated circuits are arranged for that purpose. To enable such testing, digital components forming a chain through which digital signals can be passed under the control of a suitable control module are connected between the external and internal terminals of an integrated circuit. Specific functions that the circuit on the printed circuit board is to perform are simulated and tested by means of said signals.
  • IEEE Std. 1149.1 This testing technique is also known by the name of IEEE Std. 1149.1 in practice.
  • analog signals which may occur in mixed digital and analog integrated circuits, for example, i.e. integrated circuits comprising digital as well as analog components, the so-called “mixed signal circuits", e.g. for use in telecommunication systems
  • the well-known IEEE Standard 1149.1 has been extended with testing facilities for analog signals.
  • This new standard is known by the acronym IEEE 1149.4, or simply "dot 4".
  • This extension concerns the addition to the digital test facilities of an analog module provided with analog terminals, which can be connected to analog terminals of the integrated circuits via analog switches, i.e. semiconductor switches, and to power supply terminals for supplying a suitable supply voltage to the integrated circuit.
  • an analog test bus interface circuit which can be connected to the analog terminals via switches.
  • the whole is controlled by a test control circuit in the form of a so-called "test access port” (TAP) controller, as known per se from the IEEE Std. 1149.1.
  • TAP test access port
  • the connections between the analog terminals and the components of the integrated circuit, the so-called “core” can be broken and test signals can be supplied via the analog test bus interface circuit to the electrical component or components connected to the integrated circuit, and signal measurements can be carried out on the component or components in question.
  • a number of techniques for measuring the capacitance of capacitive electrical components are known in practice.
  • the capacitive component to be measured is connected, via the switches, into an RC low-pass filter configuration, to the input of which an adjustable frequency AC voltage is presented.
  • the -3dB point of the RC filter is found by varying the frequency of the AC voltage and measuring the effective value of the voltage across the unknown capacitive electrical component that is to be measured.
  • the accuracy of said measurement strongly depends on the accuracy of the available information regarding the contact resistance values of the various switches and the wiring, which partially determine the resistance of the RC filter, and on parasitic capacitances and the stray capacitance of the measuring environment, in this case the printed circuit board.
  • the measuring accuracy is less than 10%, which is unacceptable for practical applications.
  • Another technique that is known in practice is the so-called I-V method, in which the capacitive component to be measured is connected in series with a known resistive element via the switches and the test bus interface circuit. The voltage across the resistive element can be calculated from the applied voltage and the measured voltage across the capacitive component to be measured. In the case of a- purely capacitive component, the voltage across the resistive element and the voltage across the capacitive component include an angle of 90°.
  • the voltage across the resistive element can be calculated by means of a simple vector calculation, and because the resistance value in- question is known, the current through the capacitor can be determined therefrom. Since the frequency of the applied AC voltage is known, the voltage across the capacitor is measured and the current through the capacitor can be determined from the aforesaid vector calculation, it is possible to calculate the capacitance of the capacitive component from said data.
  • This measuring method suffers from the fact that variations occur in the contact resistance values of the switches and the analog test bus, which variations seriously affect the accuracy of the measurement, in particular in the case of relatively small capacitance values.
  • the frequency of the applied AC voltage must be carefully selected on account of bandwidth limitations in the switches and in the integrated circuit itself.
  • this object is accomplished in that the switches are switched for exchanging electric charge via the analog terminals between the component to be measured and a capacitive electrical reference component having a known capacitance, until the voltage across the component to be measured and the voltage across the reference component are substantially equal, and subsequently measuring the voltage across the reference component, wherein the capacitance of the component to be measured is determined from the known capacitance of the reference component and the measured voltage across the reference component.
  • the invention is based on the perception that the influence of unknown resistive elements in the chain between the capacitive components, such as contact resistances of the switches, resistances of the terminals and the wiring, can be effectively eliminated by effecting a transfer of charge between the capacitive components in question until the voltages across the components have equal values.
  • values are equal or substantially equal, no current will flow through the resistive elements in question, or a current that is negligible to the extent that the voltage loss across said resistive elements is zero or negligibly small. Consequently, the resistances in question do not affect the eventual transfer of charge between the capacitive components, so that the voltage across the capacitive components in question is only a function of their capacitance.
  • the novel method according to the invention makes it possible to measure capacitances of capacitive electrical components in the order of 10 pF or higher with a ery high degree of accuracy (> 95%).
  • the method according to the invention is characterized by the steps of: a) charging the component to be measured from an electrical voltage source to a voltage that is substantially equal to as the voltage of the voltage source; b) transferring charge from the component to be measured to the reference component until the voltage across the component to be measured and the voltage across the reference component are substantially equal; c) measuring the voltage across the reference component; and d) calculating the capacitance of the component to be measured from the product of the known capacitance and the measured voltage divided by the difference between the voltage of the voltage source and the measured voltage.
  • the method according to the invention is characterized by the steps of : a) charging the reference component to a predetermined reference voltage from an electrical power supply source; b) transferring charge from the reference component to the component to be measured, until the voltage across the component to be measured and the voltage across the reference component are substantially equal ; c) measuring the voltage across the reference component; and d) calculating the capacitance of the component to be measured from the product of the known capacitance and the measured voltage divided by the difference between the reference voltage and the measured voltage.
  • This embodiment has the advantage that the reference component can be fed both from an electric voltage source and from an electric current source, as in the latter case the reference voltage across the capacitive reference component can be measured with a sufficient degree of accuracy by means of a suitable high-ohmic measuring circuit.
  • the reference component in question can also be charged until the voltage across the reference component is equal to the voltage of the electric voltage source, so that the influence of contact resistances on the amount of charge that is transferred can be effectively eliminated again.
  • the one component from which charge is transferred to the other component has a lower capacitance than the other component. In practice this means that in the preferred embodiment the reference component preferably has a higher capacitance than the component to be measured.
  • the reference component in which the reference component is charged first, the reference component will preferably have a lower capacitance than the component to be measured. If, in the case of a single transfer of charge from one component to the other, the proportion or ratio between the capacitance of the one component and that of the other component is too large, the voltage across the other component will be small, and this voltage will be difficult to measure.
  • the steps of charging the one component and transferring charge to the other component are repeated a number of times if the ratio between the capacitance of the one component, from which charge is transferred, wherein the capacitance of the other component is relatively small, and the capacitance of the component to be measured is calculated from the voltage that is measured after charge has been transferred a number of times and from the number of times that charge has been transferred. It will be understood that the larger the ratio between the capacitance of the one component and that of the other component, the larger the number of times that charge is transferred will be.
  • the period of time for transferring charge is determined from the RC time constants of the capacitive components in question and the contact resistance values of the switches, the terminals and the wiring in the charge transfer chain.
  • the RC time constants of the component are estimated from one or more tests measurements of the capacitance of the component to be measured if the contact resistance values are unknown. The RC time constants thus determined provide an adequate perception of the period of time that is required for transferring charge for the purpose of equalising the voltages across the components.
  • the switches must not be switched to a charge transfer position for such a long period of time that charge starts to leak from one component, or from both, which will introduce an inaccuracy into the measurement. Since the switches are controlled in the rhythm of a clock or timer that is connected to the IEEE Std. 1149.1 control circuit, the clock frequency thereof must be selected such that there will be sufficient time for the transfer of charge between the components in question.
  • the analog test bus interface circuit has a first ATI bus and a second AT2 bus
  • the reference component is connected to the AT2 bus.
  • the invention also provides a measuring device for determining the capacitance of the capacitive electrical component connected to an integrated circuit, which circuit is provided with analog terminals which can be connected to the component to be measured by means of switches, characterized in that the measuring device is arranged for switching the switches for exchanging electric charge via the analog terminals between the component to be measured and a capacitive electrical reference component having a known capacitance, until the voltage across the component to be measured and the voltage across the reference component are substantially equal, and furthermore comprises means for measuring the voltage across the reference component and means for calculating the capacitance of the component to be measured from the known capacitance of the reference component and the measured voltage across the reference component.
  • the measuring device is arranged for controlling the switches of an IEEE Std.
  • the invention also provides control software for use in a measuring device arranged for controlling the switches of an IEEE Std. 1149.4 test circuit, which device is provided with a suitable control processor.
  • the invention also provides a printed circuit board provided with one or more integrated circuits and at least one reference capacitor having a known capacitance for use in the method and measuring device as described in the foregoing.
  • the invention in particular provides a printed circuit board provided with at least one integrated circuit comprising an IEEE Std. 1149.1 test circuit, in which the reference capacitor is directly connected to the test bus interface circuit.
  • Fig. 1 schematically shows an integrated circuit provided with a boundary-scan test circuit according to the IEEE Standard 1149.4.
  • Fig. 2 schematically shows part of the structure of an analog boundary-scan module of the circuit that is shown in Fig. 1.
  • Fig. 3 schematically shows an embodiment of a measurement of the capacitance of a capacitive electrical component connected to the integrated circuit of Fig. 1.
  • Fig. 4 shows a simplified diagram of the circuit that is shown in Fig. 3.
  • Fig. 5 schematically and graphically shows the repeated performance of the method according to the invention.
  • Fig. 6 schematically shows a printed circuit board and the measuring device according to the invention that is connected thereto.
  • the invention will be explained hereinafter on the basis of an application in an integrated circuit provided with a boundary-scan test circuit according to IEEE Std. 1149.4. Detailed information about this standard are to be found in "IEEE Standard for Mixed-Signal Test
  • numeral 1 indicates an integrated semiconductor circuit comprising a so-called core 2, in which the electrical components, such as transistors, resistors and the like that are needed to enable the integrated circuit 1 to perform its functions are present.
  • Numeral 3 indicates a number of digital input and output ports, which are connected to the corresponding input and output terminals of the core 2 via so-called “Digital Boundary Modules" (DBM) 4.
  • DBM Digital Boundary Modules
  • the integrated circuit 1 also comprises two analog input and output terminals 7, 8 in the illustrated embodiment, which are connected to the corresponding digital input and output terminals of the core 2 via Analog Boundary Modules (ABM) 5, 6, respectively.
  • ABMs 5, 6 are connected to an analog Test Bus Interface
  • test bus interface circuit 9 is accessible from outside the integrated circuit 1 via an Analog Test Access Port (ATAP) 11 comprising terminals ATI and AT2, respectively.
  • the DBMs 4, the ABMs 5, 6 and the test bus interface circuit 9 connect to Test Control Circuitry 12 via a so-called boundary- scan pad 13.
  • a so-called Test Access Port (TAP) 14 is provided for supplying suitable control signals to the test control circuitry 12, said port comprising terminals TD1, TDO, TMS and TCK, which are accessible from outside the integrated circuit 1.
  • the test control circuitry 12 inter alia comprises a TAP-controller, an instruction register and a decoder for supplying test signals to the core 2 of the integrated circuit 1 across the boundary-scan pad 13.
  • Fig. 2 is a schematic, more detailed view of a part of an ABM 5, 6, which shows only those components that are necessary for a clear understanding of the invention.
  • the ABMs 5, 6 comprise a number of switches, in particular semiconductor switches, that can be controlled by the test control circuitry 12, which switches are represented as mechanical switches in Fig. 2 for the sake of simplicity.
  • the switch SD functions to make and break the connection between the analog terminal 7 and the core 2.
  • the switches SB1 and SB1 function to connect the analog terminal 7 to the conductors AB1 and AB2, respectively, of the internal test bus 10.
  • the test bus interface circuit 9 is provided with switches S5 and S6, amongst other components, via which the terminals ATI and AT2 can be connected to the conductors AB1 and AB2 of the internal test bus 10. It is noted that the test bus interface circuit has several other switching possibilities, which are not relevant for a clear understanding of the invention, however.
  • the terminal 7 can be connected to a first power supply terminal V H of the integrated circuit 1, for example a positive supply voltage, via a switch SH, and to a second power supply terminal V L , for example the signal earth of the integrated circuit 1, via the switch SL.
  • the switch SG provides a possibility for measuring voltage on the terminal 7 via a terminal V G .
  • Fig. 3 shows an electric diagram based on the circuitry of Fig.
  • a capacitive electrical reference component C R connects to the signal earth 15 of the circuit at the terminal AT2.
  • said reference component C R is a capacitor having a precisely defined capacitance value.
  • the capacitive component C x to be measured is connected to the positive supply voltage V H of the circuit via the terminal 7 by means of the switch SH 5 , i.e. the switch SH associated with the ABM 5.
  • the capacitive component C x is connected to the signal earth 15 via the switch SH 6 , i.e. the switch SH of the ABM 6.
  • the circuit 1 is connected to a supply voltage, the terminal V L of which is connected to the signal earth 15.
  • the capacitive component T x can be connected to the capacitive reference component C R via the switch SB2 5 , i.e. the switch SB2 of the ABM 6, and the switch S6 of the test bus interface circuit 9.
  • the other switches of the ABM 5, 6 and the test bus interface circuit 9 are in the non-conducting or open position for carrying out the method according to the invention.
  • the connection between the terminals 7, 8 and the core 2 is interrupted via the respective switches SD.
  • Fig. 4 shows a simplified diagram of the circuit of Fig. 3, which is used for explaining the preferred embodiment of the method according to the invention.
  • Numeral 16 indicates a voltage source having a voltage V H
  • numeral 17 indicates a measuring instrument for measuring the voltage across the capacitive reference component C R
  • the measuring instrument 17 for example a high-ohmic voltmeter
  • the capacitive component C x to be measured is charged to the voltage V H from the voltage source 16 by closing the switch SH 5 with the switch SB1 5 in the open position.
  • C x the capacitance of C x
  • the switch SH 5 is opened, i.e. the connection with the voltage source 16 is broken, and the switch SB1 6 is closed for transferring charge from the capacitive component C x to be measured to the capacitive reference component C R .
  • the transfer of charge from C x to C R will continue until the voltages across C R and C x have equal values. No current will flow through the switch SB1 6 , the wiring and the terminals at that point, so that the contact resistance in the switch and in the wiring will not affect the transfer of charge.
  • an amount of charge Q t is transferred from C x to C R , the following obtains with regard to the voltage V x across C x and the voltage V r across C R :
  • the capacitance C x of the capacitive component C x to be measured can be calculated from the measured voltage V r , the known voltage V H and the known capacitance C r of the reference component C R by means of equation (3).
  • first charging the component C x to be measured it is also possible to carry out the method according to the invention by first charging the reference component C R to a predetermined reference voltage.
  • the reference component C R can be charged by closing the switches SH 5 , SB2 6 and S6, with the switch SH 6 in the open (non-conducting) position, of course.
  • the unknown capacitance C x of the component C x to be measured can be calculated from:
  • the one capacitive component which receives charge from the other capacitive component, preferably has a capacitance value which is lower than the capacitance value of the other component. If charge is transferred from
  • C x must have a lower capacitance than C R .
  • C x when charge is transferred from C R to C x , C x will preferably have a higher capacitance than C R . If the ratio between the smallest and the largest capacitance value is very large, only a relatively low voltage will remain across the two capacitive components after the transfer of charge, which voltage will be difficult to measure, at least in an accurate manner. In such a situation the method according to the invention can be carried out a repeated number n of times. That is, the one component is charged from the power supply source and subsequently transfers charge to the other component. For the circuit as shown in Fig.
  • the point in time at which the transfer of charge., for example from C x to C R , is complete must be determined from the RC time constants of the respective capacitive components and the contact resistances of the switches, the terminals and the wiring in the charge transfer chain. If said time constants are unknown, an idea of the RC time constants can be formed by means of a number of test measurements, and the time for completing the transfer of charge can be roughly estimated therefrom.
  • the duration of a charge transfer is determined by the length of the boundary-scan chain and the TCK clock rate. It is best therefore, to gear the clock rate to the time required for transferring charge.
  • FIG. 6 schematically shows a measuring device 18 for carrying out the method according to the invention, which measuring device comprises a control processor 19 and a measuring instrument 17, for example a high-ohmic voltmeter or other suitable high-ohmic measuring instrument for measuring voltages, known to those skilled in the art.
  • the measuring instrument 18 is arranged for carrying out the method according to the invention with a circuit assembly consisting of a number of integrated circuits 1, one or more capacitive components C x , resistors R and, if necessary, inductances L, on the printed circuit board 20, which components C x , R and L are discrete components connected to one or more of the integrated circuits 1.
  • the integrated circuits 1 are of the type provided with a boundary- scan test circuit IEEE Std.
  • the reference component C R may be directly connected to the printed circuit board 20, for example as a fixed component, for carrying out the method according to the invention, and/or be incorporated in the measuring instrument 18.
  • a capacitance value in the order of 1 ⁇ F will suffice for the reference component for carrying out the preferred method according to Fig. 4, depending on the capacitance value of the component to be measured.
  • capacitances of up to 10 pF can be determined with an accuracy level of more than 95%, and capacitances of up to 100 pF can be determined with an accuracy level of 99% or higher.
  • the invention also relates to software for enabling the measuring device 18 to deliver suitable control commands to the test control circuit 12 for controlling the switches of the ABM 5, 6 and the test bus interface circuit 9, which software can be loaded into the control processor 19.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Measurement Of Resistance Or Impedance (AREA)

Abstract

L'invention concerne un procédé et un dispositif permettant de déterminer la capacité d'un composant électrique capacitif (CX) connecté à un circuit intégré. Le circuit est pourvu de bornes analogues (AT1, AT2) pouvant être connectées au moyen de commutateurs (S5, S6, SB1, SB2) au composant (CX) destiné à être mesuré. Les commutateurs (S5, S6, SB1, SB2) sont commutés pour échanger une charge électrique par l'intermédiaire des bornes analogues (AT1, AT2) entre le composant (CX) destiné à être mesuré et un composant de référence électrique capacitif (CR) avec une capacité connue, jusqu'à ce que les tensions du composant (CX) destiné à être mesuré et le composant de référence (CR) soient sensiblement égales. Grâce à la mesure ultérieure de la tension du composant de référence (CR), la capacité du composant (CX) destiné à être mesuré est déterminée à partir de la capacité connue du composant de référence (CR) et de la tension mesurée dans le composant de référence (CR).
PCT/NL2004/000661 2003-09-26 2004-09-23 Procede et dispositif de mesure permettant de determiner la capacite d'un composant electrique capacitif connecte a un circuit integre WO2005031375A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1024386A NL1024386C2 (nl) 2003-09-26 2003-09-26 Werkwijze en meetinrichting voor het bepalen van de capaciteit van een capacitieve elektrische component aangesloten op een geïntegreerde schakeling.
NL1024386 2003-09-26

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WO2005031375A1 true WO2005031375A1 (fr) 2005-04-07

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US7521942B2 (en) 2005-06-03 2009-04-21 Synaptics, Inc. Methods and systems for guarding a charge transfer capacitance sensor for proximity detection
US7683641B2 (en) 2005-06-03 2010-03-23 Synaptics Incorporated Methods and systems for detecting a capacitance using sigma-delta measurement techniques
US7262609B2 (en) 2005-06-03 2007-08-28 Synaptics Incorporated Methods and systems for guarding a charge transfer capacitance sensor for proximity detection
US7288946B2 (en) 2005-06-03 2007-10-30 Synaptics Incorporated Methods and systems for detecting a capacitance using sigma-delta measurement techniques
US7301350B2 (en) 2005-06-03 2007-11-27 Synaptics Incorporated Methods and systems for detecting a capacitance using sigma-delta measurement techniques
US7417441B2 (en) 2005-06-03 2008-08-26 Synaptics Incorporated Methods and systems for guarding a charge transfer capacitance sensor for proximity detection
US7423437B2 (en) 2005-06-03 2008-09-09 Synaptics Incorporated Methods and systems for detecting a capacitance using sigma-delta measurement techniques
US7449895B2 (en) 2005-06-03 2008-11-11 Synaptics Incorporated Methods and systems for detecting a capacitance using switched charge transfer techniques
US7453270B2 (en) 2005-06-03 2008-11-18 Synaptics Incorporated Methods and systems for detecting a capacitance using sigma-delta measurement techniques
US7973542B2 (en) 2005-06-03 2011-07-05 Synaptics Incorporated Methods and systems for guarding a charge transfer capacitance sensor for proximity detection
US7948245B2 (en) 2005-06-03 2011-05-24 Synaptics Incorporated Methods and systems for detecting a capacitance using sigma-delta measurement techniques
WO2006133082A1 (fr) 2005-06-03 2006-12-14 Synaptics Incorporated Procedes et systemes de detection d'une capacite au moyen de techniques de transfert de charge par commutation
US7521941B2 (en) 2005-06-03 2009-04-21 Synaptics, Inc. Methods and systems for detecting a capacitance using switched charge transfer techniques
US7750649B2 (en) 2005-06-03 2010-07-06 Synaptics Incorporated Methods and systems for detecting a capacitance using switched charge transfer techniques
US7777501B2 (en) 2005-06-03 2010-08-17 Synaptics Incorporated Methods and systems for sigma delta capacitance measuring using shared component
US7777503B2 (en) 2005-06-03 2010-08-17 Synaptics Incorporated Methods and systems for guarding a charge transfer capacitance sensor for proximity detection
US7977954B2 (en) 2005-06-03 2011-07-12 Synaptics Incorporated Methods and systems for sigma delta capacitance measuring using shared components
US7902842B2 (en) 2005-06-03 2011-03-08 Synaptics Incorporated Methods and systems for switched charge transfer capacitance measuring using shared components
WO2007057179A3 (fr) * 2005-11-16 2007-07-05 Microsystems On Silicon Pty Lt Procede pour le controle de capteur infrarouge passif
WO2009122315A1 (fr) * 2008-03-31 2009-10-08 Nxp B.V. Circuit intégré à agencement de test, agencement de circuit intégré et procédé de test
US20110018550A1 (en) * 2008-03-31 2011-01-27 Nxp B.V. Integrated circuit with test arrangement, integrated circuit arrangement and text method
US9274643B2 (en) 2012-03-30 2016-03-01 Synaptics Incorporated Capacitive charge measurement

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