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WO2005076977A3 - Procede et appareil d'electrodeposition - Google Patents

Procede et appareil d'electrodeposition Download PDF

Info

Publication number
WO2005076977A3
WO2005076977A3 PCT/US2005/003760 US2005003760W WO2005076977A3 WO 2005076977 A3 WO2005076977 A3 WO 2005076977A3 US 2005003760 W US2005003760 W US 2005003760W WO 2005076977 A3 WO2005076977 A3 WO 2005076977A3
Authority
WO
WIPO (PCT)
Prior art keywords
plating apparatus
plating
autocatalytic
electroless
disposing
Prior art date
Application number
PCT/US2005/003760
Other languages
English (en)
Other versions
WO2005076977A2 (fr
Inventor
Martin Bleck
Robert Wayne Berner
Gerard Minogue
Fernando M Sanchez
Mathew Hannon
Thomas P Griego
Original Assignee
Surfect Technologies Inc
Martin Bleck
Robert Wayne Berner
Gerard Minogue
Fernando M Sanchez
Mathew Hannon
Thomas P Griego
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Surfect Technologies Inc, Martin Bleck, Robert Wayne Berner, Gerard Minogue, Fernando M Sanchez, Mathew Hannon, Thomas P Griego filed Critical Surfect Technologies Inc
Priority to JP2006552314A priority Critical patent/JP2007525595A/ja
Publication of WO2005076977A2 publication Critical patent/WO2005076977A2/fr
Publication of WO2005076977A3 publication Critical patent/WO2005076977A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Chemically Coating (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La présente invention porte sur un procédé et sur un appareil de galvanoplastie, approprié notamment pour le dépôt autocatalytique, cet appareil comprenant un réceptacle étanche sous pression pour le dépôt d'un substrat à galvaniser et pour circulation de solutions de galvanisation, les températures et la pressure pouvant être extrêmement contrôlées.
PCT/US2005/003760 2004-02-04 2005-02-04 Procede et appareil d'electrodeposition WO2005076977A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006552314A JP2007525595A (ja) 2004-02-04 2005-02-04 メッキ装置及び方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US54168704P 2004-02-04 2004-02-04
US60/541,687 2004-02-04

Publications (2)

Publication Number Publication Date
WO2005076977A2 WO2005076977A2 (fr) 2005-08-25
WO2005076977A3 true WO2005076977A3 (fr) 2008-09-25

Family

ID=34860208

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/003760 WO2005076977A2 (fr) 2004-02-04 2005-02-04 Procede et appareil d'electrodeposition

Country Status (4)

Country Link
US (1) US20050230260A1 (fr)
JP (1) JP2007525595A (fr)
TW (1) TW200533791A (fr)
WO (1) WO2005076977A2 (fr)

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US8661496B2 (en) * 2002-12-10 2014-02-25 Ol2, Inc. System for combining a plurality of views of real-time streaming interactive video
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US8474468B2 (en) * 2006-09-30 2013-07-02 Tokyo Electron Limited Apparatus and method for thermally processing a substrate with a heated liquid
US9383138B2 (en) * 2007-03-30 2016-07-05 Tokyo Electron Limited Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
US20080241400A1 (en) * 2007-03-31 2008-10-02 Tokyo Electron Limited Vacuum assist method and system for reducing intermixing of lithography layers
TWI385605B (zh) * 2009-12-30 2013-02-11 Univ Ishou Applicable to the fuzzy control teaching of the card plating device
US20110226613A1 (en) * 2010-03-19 2011-09-22 Robert Rash Electrolyte loop with pressure regulation for separated anode chamber of electroplating system
US9062388B2 (en) * 2010-08-19 2015-06-23 International Business Machines Corporation Method and apparatus for controlling and monitoring the potential
US8937014B2 (en) 2010-10-14 2015-01-20 Tokyo Electron Limited Liquid treatment apparatus and liquid treatment method
US9404194B2 (en) 2010-12-01 2016-08-02 Novellus Systems, Inc. Electroplating apparatus and process for wafer level packaging
CN103433309B (zh) * 2013-08-20 2015-07-15 首钢总公司 一种控制模拟高线斯太尔摩风冷线冷速的装置
US10760178B2 (en) 2018-07-12 2020-09-01 Lam Research Corporation Method and apparatus for synchronized pressure regulation of separated anode chamber
WO2021070659A1 (fr) * 2019-10-09 2021-04-15 東京エレクトロン株式会社 Appareil de traitement de substrat par liquide et procédé de traitement de substrat par liquide
JP7399258B2 (ja) * 2020-03-02 2023-12-15 東京エレクトロン株式会社 めっき処理装置
IT202100033113A1 (it) * 2021-12-30 2023-06-30 Nuovo Pignone Tecnologie Srl Sistema e metodo per realizzare placcatura in nichel non-elettrolitica

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Also Published As

Publication number Publication date
JP2007525595A (ja) 2007-09-06
US20050230260A1 (en) 2005-10-20
WO2005076977A2 (fr) 2005-08-25
TW200533791A (en) 2005-10-16

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