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WO2004113594A2 - Galvanoplastie de matieres conductrices chargees a base de resine pour la fabrication peu couteuse d'articles conducteurs - Google Patents

Galvanoplastie de matieres conductrices chargees a base de resine pour la fabrication peu couteuse d'articles conducteurs Download PDF

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Publication number
WO2004113594A2
WO2004113594A2 PCT/US2004/019013 US2004019013W WO2004113594A2 WO 2004113594 A2 WO2004113594 A2 WO 2004113594A2 US 2004019013 W US2004019013 W US 2004019013W WO 2004113594 A2 WO2004113594 A2 WO 2004113594A2
Authority
WO
WIPO (PCT)
Prior art keywords
conductive
resin
based material
platable
metal layer
Prior art date
Application number
PCT/US2004/019013
Other languages
English (en)
Other versions
WO2004113594A3 (fr
Inventor
Thomas Aisenbrey
Original Assignee
Integral Technologies, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Integral Technologies, Inc. filed Critical Integral Technologies, Inc.
Publication of WO2004113594A2 publication Critical patent/WO2004113594A2/fr
Publication of WO2004113594A3 publication Critical patent/WO2004113594A3/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1603—Process or apparatus coating on selected surface areas
    • C23C18/1605—Process or apparatus coating on selected surface areas by masking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1635—Composition of the substrate
    • C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
    • C23C18/1641—Organic substrates, e.g. resin, plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1646—Characteristics of the product obtained
    • C23C18/165—Multilayered product
    • C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material

Definitions

  • This invention relates to conductive resin-based materials and, more particularly, to metal plating of conductive loaded resin-based materials comprising micron conductive powders, micron conductive fibers, or a combination thereof, homogenized within a base resin when molded. This manufacturing process yields a conductive part or material usable within the EMF or electronic spectru (s) .
  • Resin-based articles of manufacture are used in a wide variety of applications. Resin-based materials offer low cost, very flexible manufacturing, excellent weight to strength ratio, and excellent resistance to environmental deterioration. While considering all of the advantages of resin-based materials, resin-based article of manufacture may suffer the disadvantage of looking like plastic. This is especially a concern for applications, such as in the arts of automotive or of plumbing, that have traditionally fabricated articles from metal. In these applications, customer acceptance of a "plastic faucet", for example, may be a significant problem. Therefore, it is particularly advantageous to clad such resin-based articles in a metal layer. In addition, some resin-based articles of manufacture, such as food handling or medical devices may require a metal cladding for smoothness, ease of complete cleaning, etc.,. Further, typical resin-based articles of manufacture are thermal and/or electrical insulators and may require a metal cladding to improve thermal or electrical conductivity.
  • U.S. Patent Publication US 2004/0086646 Al to Brandes et al teaches a method of electroless metal plating on non-conductive surfaces, more specifically on (ABS) copolymers and (ABS) blends.
  • U.S. Patent 4,610,895 to Tubergen et al teaches a process for metallizing plastics by electroless deposition that is especially useful in the plating of foamed plastics, particularly a foamed blend of ABS and polyphenylene ether, foamed polycarbonate, foamed polystyrene, foamed ABS, foamed polyester, etc.
  • Patent Publication US2002/0135519 Al to Luch teaches the production of electrically conductive patterned surfaces and more specifically antennas and complex circuitry using directly electroplateable resins.
  • the directly electroplateable resins (DER) comprise a mixture of carbon black and sulfur in the polymer matrix. Further, metal fillers may be added to the DER material.
  • U.S. Patent 4,429,020 teaches electrodeposition of a tin/metal layer over a DER as defined above.
  • a principal object of the present invention is to provide an effective metal-plated, conductive loaded resin- based material.
  • a further object of the present invention is to provide a method to form a metal layer on a conductive loaded resin-based material.
  • a further object of the present invention is to provide various devices and structures formed of metal- plated, conductive loaded resin-based materials.
  • a yet further object of the present invention is to provide a method to alter visual, thermal, mechanical, and/or electrical characteristics of a conductive-loaded resin-based by forming a metal layer over the conductive loaded resin-based material.
  • a yet further object of the present invention is to provide a method to electrically and/or thermally interface a conductive loaded resin-based device or structure by means of a metal layer formed thereon.
  • a device is achieved.
  • the device comprises a conductive loaded, r loaded, resin-based material.
  • a method to form a device comprises providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host.
  • the conductive loaded, resin-based material is molded into a device.
  • a metal layer overlies the device.
  • a method to form a device comprises providing a conductive loaded, resin-based material comprising conductive materials in a resin-based host.
  • the conductive loaded, resin-based material is molded into a device.
  • a metal layer overlies the device.
  • a plated metal layer overlies the device. The plated metal layer is not formed over the non-platable masking layer.
  • Figs, la through lb illustrate a first preferred embodiment of the present invention showing a metal-plated conductive loaded resin-based material.
  • Fig. 2 illustrates a first preferred embodiment of a conductive loaded resin-based material wherein the conductive materials comprise a powder.
  • Fig. 3 illustrates a second preferred embodiment of a conductive loaded resin-based material wherein the conductive materials comprise micron conductive fibers.
  • Fig. 4 illustrates a third preferred embodiment of a conductive loaded resin-based material wherein the conductive materials comprise both conductive powder and micron conductive fibers .
  • Figs. 5a and 5b illustrate a fourth preferred embodiment wherein conductive fabric-like materials are formed from the conductive loaded resin-based material.
  • Figs. 6a and 6b illustrate, in simplified schematic form, an injection molding apparatus and an extrusion molding apparatus that may be used to mold devices or structures of a conductive loaded resin-based material.
  • Figs. 7a through 7c illustrates a second preferred embodiment of the present invention showing a metal-plated conductive loaded resin-based heat sink device. Electroless plating and electroplating are used to form the overlying metal layers .
  • Fig. 8 illustrates a third preferred embodiment of present invention showing a method of forming metal layers on a conductive loaded resin-based device.
  • Figs. 9a and 9b illustrate a fourth preferred embodiment of the present invention showing a first method to selectively metal plate a conductive loaded resin-based article .
  • Figs. 10a through lOd illustrate a fifth preferred embodiment of the present invention showing a second method to selectively metal plate a conductive loaded resin-based article.
  • Fig. 11 illustrates a sixth preferred embodiment of the present invention showing an antenna structure formed of the conductive loaded resin-based material with metal selectively plated onto the conductive loaded resin-based material to optimize the frequency response of the antenna.
  • Fig. 12 illustrates a seventh preferred embodiment of the present invention showing an antenna structure formed of the conductive loaded resin-based material with an overlying platable, resin-based material. A metal layer is selectively plated to optimize the frequency response of the antenna.
  • This invention relates to molded conductive loaded resin-based materials comprising micron conductive powders, micron conductive fibers, or a combination thereof, homogenized within a base resin when molded.
  • the conductive loaded resin-based materials of the invention are base resins loaded with conductive materials, which then makes any base resin a conductor rather than an insulator.
  • the resins provide the structural integrity to the molded part.
  • the micron conductive fibers, micron conductive powders, or a combination thereof, are homogenized within the resin during the molding process, providing the electrical continuity.
  • the conductive loaded resin-based materials can be molded, extruded or the like to provide almost any desired shape or size.
  • the molded conductive loaded resin-based materials can also be cut, stamped, or vacuumed formed from an injection molded or extruded sheet or bar stock, over- molded, laminated, milled or the like to provide the desired shape and size.
  • the thermal or electrical conductivity characteristics of devices or structures fabricated using conductive loaded resin-based materials depend on the composition of the conductive loaded resin- based materials, of which the loading or doping parameters can be adjusted, to aid in achieving the desired structural, electrical or other physical characteristics of the material.
  • the selected materials used to fabricate the devices or structures are homogenized together using molding techniques and or methods such as injection molding, over-molding, thermo-set, protrusion, extrusion or the like.
  • Characteristics related to 2D, 3D, 4D, and 5D designs, molding and electrical characteristics include the physical and electrical advantages that can be achieved during the molding process of the actual parts and the polymer physics associated within the conductive networks within the molded part(s) or formed material (s).
  • conductive loaded resin-based materials in the fabrication of devices or structures significantly lowers the cost of materials and the design and manufacturing processes used to hold ease of close tolerances, by forming these materials into desired shapes and sizes.
  • the devices or structures can be manufactured into infinite shapes and sizes using conventional forming methods such as injection molding, over-molding, or extrusion or the like.
  • the conductive loaded resin-based materials when molded, typically but not exclusively produce a desirable usable range of resistivity from between about 5 and 25 ohms per square, but other resistivities can be achieved by varying the doping parameters and/or resin selection (s) .
  • the conductive loaded resin-based materials comprise micron conductive powders, micron conductive fibers, or any combination thereof, which are homogenized together within the base resin, during the molding process, yielding an easy to produce low cost, electrically conductive, close tolerance manufactured part or circuit.
  • the micron conductive powders can be of carbons, graphites, amines or the like, and/or of metal powders such as nickel, copper, silver, or plated or the like. The use of carbons or other forms of powders such as graphite (s) etc.
  • micron conductive fibers can be nickel plated carbon fiber, stainless steel fiber, copper fiber, silver fiber, or the like, or combinations thereof.
  • the structural material is a material such as any polymer resin.
  • Structural material can be, here given as examples and not as an exhaustive list, polymer resins produced by GE PLASTICS, Pittsfield, MA, a range of other plastics produced by GE PLASTICS, Pittsfield, MA, a range of other plastics produced by other manufacturers, silicones produced by GE SILICONES, Waterford, NY, or other flexible resin-based rubber compounds produced by other manufacturers .
  • the resin-based structural material loaded with micron conductive powders, micron conductive fibers, or in combination thereof can be molded, using conventional molding methods such as injection molding or over-molding, or extrusion to create desired shapes and sizes.
  • the molded conductive loaded resin-based materials can also be stamped, cut or milled as desired to form create the desired shape form factor (s) of the heat sinks.
  • the doping composition and directionality associated with the micron conductors within the loaded base resins can affect the electrical and structural characteristics of the devices or structures and can be precisely controlled by mold designs, gating and or protrusion design (s) and or during the molding process itself.
  • the resin base can be selected to obtain the desired thermal characteristics such as very high melting point or specific thermal conductivity.
  • a resin-based sandwich laminate could also be fabricated with random or continuous webbed micron stainless steel fibers or other conductive fibers, forming a cloth like material.
  • the webbed conductive fiber can be laminated or the like to materials such as Teflon, Polyesters, or any resin-based flexible or solid material (s), which when discretely designed in fiber content (s), orientation (s) and shape (s), will produce a very highly conductive flexible cloth-like material.
  • Such a cloth-like material could also be used in forming devices or structures that could be embedded in a person' s clothing as well as other resin materials such as rubber (s) or plastic (s) .
  • the fibers When using conductive fibers as a webbed conductor as part of a laminate or cloth-like material, the fibers may have diameters of between about 3 and 12 microns, typically between about 8 and 12 microns or in the range of about 10 microns, with length (s) that can be seamless or overlapping.
  • the conductive loaded resin-based material of the present invention can be made resistant to corrosion and/or metal electrolysis by selecting micron conductive fiber and/or micron conductive powder and base resin that are resistant to corrosion and/or metal electrolysis. For example, if a corrosion/electrolysis resistant base resin is combined with stainless steel fiber and carbon fiber/powder, then a corrosion and/or metal electrolysis resistant conductive loaded resin-based material is achieved.
  • the conductive loaded resin-based material of the present invention may be made flame retardant. Selection of a flame-retardant (FR) base resin material allows the resulting product to exhibit flame retardant capability. This is especially important in applications as described herein.
  • FR flame-retardant
  • the homogeneous mixing of micron conductive fiber and/or micron conductive powder and base resin described in the present invention may also be described as doping. That is, the homogeneous mixing converts the typically non- conductive base resin material into a conductive material.
  • This process is analogous to the doping process whereby a semiconductor material, such as silicon, can be converted into a conductive material through the introduction of donor/acceptor ions as is well known in the art of semiconductor devices. Therefore, the present invention uses the term doping to mean converting a typically non- conductive base resin material into a conductive material through the homogeneous mixing of micron conductive fiber and/or micron conductive powder into a base resin.
  • the molded conductor loaded resin-based material exhibits excellent thermal dissipation characteristics. Therefore, devices or structures manufactured from the molded conductor loaded resin-based material can provide added thermal dissipation capabilities to the application. For example, heat can be dissipated from electrical devices physically and/or electrically connected to devices or structures of the present invention.
  • a wire ⁇ can be attached to the conductive loaded resin-based material via a screw that is fastened to the material.
  • a simple sheet-metal type, self tapping screw can, when fastened to the material, achieve excellent electrical connectivity via the conductive matrix of the conductive loaded resin-based material.
  • a boss may be molded into the conductive loaded resin-based material to accommodate such a screw.
  • a solderable screw material such as copper, then a wire can be soldered to the screw is embedded into the conductive loaded resin-based material.
  • the conductive loaded resin-based material is partly or completely plated with a metal layer.
  • the metal layer forms excellent electrical conductivity with the conductive matrix.
  • a connection of this metal layer to another circuit or to ground is then made. For example, if the metal layer is solderable, then a soldered connection may be made between the devices or structures and a grounding wire.
  • an article of manufacture 10 is formed of the conductive loaded resin- based material 12 according to the present invention.
  • the device or structure 10 is formed by molding the conductive loaded resin-based material 12.
  • the material 12 is molded using any of the well-known molding processes, such as but not limited to injection molding or extrusion molding.
  • post-molding processing such as but not limited to milling, stamping, machining, drilling, is performed the conductive loaded resin-based material 12, as needed, to achieve the desired shape of the article 10.
  • a metal layer 14 is plated onto the conductive loaded resin-based 12 to form a metal-plated article 10.
  • the metal layer 14 is plated by electroplating or by electroless plating or by a combination of both electroplating and electroless plating as is described below.
  • the resulting metal layer 14 bonds with the base resin of the conductive loaded resin-based or to both the base resin and the conductive loading material.
  • Electroplating is accomplished by immersing the conductive loaded resin-based article 10 into a plating solution.
  • the plating solution comprises, in part, the metal species that is to be plated.
  • the plating solution comprises, in part, tin ions dissolved into the solution.
  • An electrical potential is then established between the plating solution and the article 10.
  • the conductive loaded resin-based article 10 is hung on a conductive rack or is placed into a conductive basket.
  • a first electrical terminal is then connected to this conductive rack or basket.
  • a second electrical terminal is then attached to the plating solution using, for example, a large piece of metal of the same type as is dissolved in the plating solution.
  • a DC voltage is then established between the solution and the conductive loaded resin-based article by forcing a positive voltage onto the solution (ANODE) and a negative voltage onto the article 10 (CATHODE) .
  • the positively charged metal ions in the solution are attracted to the negatively charged article 10.
  • the ions plate, or bond to, the charged article 10, the ions take on electrons from the article 10 and, as a result, a net current flows from the ANODE to CATHODE. Further, as metal ions are removed from the solution due to plating, additional metal ions are added to the solution by dissolution from the metal ANODE. The rate of plating is controlled by the relative concentration of metal ions in the solution and the relative voltage potential between ANODE and CATHODE. In addition, the net amount of plated metal is carefully controlled by monitoring the net current flow in the circuit.
  • the plated metal layer 14 bonds with and secures itself primarily to the base resin of the conductive loaded resin-based material 12.
  • the base resin is one that can be metal plated.
  • the polymer resins that can be plated with metal layers For example, GE Plastics,
  • SUPEC, VALOX, ULTEM, CYCOLAC, UGIKRAL, STYRON, CYCOLOY are a few resin-based materials that can be metal plated.
  • the plated metal layer 14 bonds with and secures itself to the conductive network of micron conductive fibers and/or micron conductive powders and to the base resin within the molded structure 12.
  • the conductive loading material also comprises a material that bonds to the plated metal 14.
  • the above-described electroplating process may be repeated multiple times with solutions containing different plating species to thereby form a series of metal plating layers.
  • optimal metal plating properties can be achieved.
  • a metal species with particularly good adhesion to the conductive loaded resin-based material is first plated.
  • an excellent wearing material is plated over the adhesion layer.
  • an optimal appearance layer is plated over the wearing layer.
  • an excellent conductor layer or solderable layer may be plated last according to the specific needs of the application.
  • the conductive loaded resin-based material 12 of the present invention is of a highly conductive material due to the current bearing capability of the network of conductive fibers/particles homogeneously combined into the base resin.
  • the base resin itself, remains not conductive. Therefore, at the atomic level, individual molecules within the base resin will not readily bond with the plating metal ions based on a strictly electroplating mechanism.
  • Fig. 8 shows a flow diagram of this method of plating a conductive loaded resin-based article.
  • the plating is a chemical process not controlled by electrical current flow.
  • Electroless plating typically uses a catalyst solution, such as tin-palladium, to provide a surface to initiate the electroless plating of the desired metal species.
  • a heat sink device 100 is first molded of the conductive loaded resin- based material 102 in step 154 of the method 150 illustrated in Fig. 8.
  • a heat sink device 100 is illustrated in Figs.
  • the fins or pins 104 create deep clefts 108 that are difficult to electroplate due to charge concentration effects. Therefore, it is particularly useful, in this case, to perform a first electroless plating operation.
  • the conductive loaded resin-based heat sink device 102 is cleaned to remove any molding residue, dirt, oil, and the like, in step 158 of Fig. 8.
  • the surfaces of the device 102 are partially etched to prepare the device for plating.
  • the heat sink device 102 is electroless plated to form a very thin, first plated metal layer 112 in step 162 of Fig.
  • the device 102 is immersed in a solution comprising a catalyst, such as tin-palladium.
  • the catalyst is absorbed into the surface layer of the conductive loaded resin-based material 102 to create a very thin catalyst layer, not shown.
  • the base resin of the conductive loaded resin-based material comprises one that can be metal plated as described above.
  • the heat sink device 100 is immersed into a solution containing the plating species.
  • the electroless solution comprises a complex mix of the plating species, an oxidizing or reducing agent, a surface active agent, and a pH adjustor.
  • the electroless plating solution reacts with the catalyst and the base resin surfaces.
  • a thin layer 112 of the metal species is plated onto the heat sink surfaces.
  • Any platable metal may be used. Exemplary platable metals include copper, tin, nickel, zinc, chromium, silver, gold, and the like.
  • the electroless plating process is typically more expensive, per unit thickness, and more difficult to control than the electroplating process. Therefore, after first plating metal 112 is deposited by electroless plating, the heat sink 100 is transferred to an electrolplating bath. In the electroplating bath, a second plating metal 116 is deposited using the electroplating process, as described above, in step 166. This second metal layer 116 is preferably thicker than the first metal layer
  • Exemplary second platable metals include copper, tin, nickel, zinc, chromium, silver, gold, and the like.
  • the first and second metal layer 112 and 116 may or may not be the same material.
  • the presence of the first metal layer 112 provides a consistent conductive surface across the surface of the heat sink 100.
  • the first metal layer 112 may catalyze the deposition reaction in the electroplating bath by providing an initial lattice for metal ion bonding.
  • the two step sequence of electroless plating and electroplating facilitates conformal and defect free metal plating 112 and 116 over the surface of the heat sink device 100, even in areas 108 between pins or fins 104.
  • a fourth preferred embodiment of the present invention is illustrated.
  • a method 200 to selectively plate a metal layer over a conductive loaded resin-based structure is shown.
  • a partially completed device 200 is shown.
  • the device 200 comprises two, distinct regions or parts.
  • a first part 208 is molded of the conductive loaded resin-based material according to the present invention. More particularly, the first part 208 comprises a base resin that is metal platable such as, for example, any of the base resins described above.
  • a second part 204 is any material that is not platable. More preferably, the second part comprises a resin-based material that is over-molded onto the first part 208. This second part 204 may further comprise a conductive loading as described in the present invention. However, the combined effect of the conductive loading and the base resin in the second part 204 of the device 200 is not sufficient to cause metal plating. More preferably, the second part 204 comprises a non-conductive and non-platable material.
  • the first part 208 and second part 204 of the device 200 form two distinct regions in the overall device.
  • the device Referring now to Fig. 9b, the device
  • a metal plating layer 212 is plated onto the conductive loaded resin-based material 208 of the first part 208 of the device 200.
  • This metal plating layer may be formed by a single electroless plating step, a single electroplating step, or by a combined electroless and electroplating sequence as described above.
  • the non- platability of the second part 208 material results in an absence of metal plating 212 in this area 204. Therefore, the result of the global or batch plating process is to selectively form a plated metal layer only over the platable conductive loaded resin-based section 208.
  • the presence of the selectively plated metal layer 212 will serve to compliment this function by, for example, carrying additional current or thermal energy.
  • this complimentary function will be limited to the conductive loaded resin-based area 208 and not, for example, cause current to flow over the second area 204 when this area is intended to be an electrical or thermal insulator. This selectivity is achieved without the additional application and patterning of a masking layer.
  • a fifth preferred embodiment of the present invention is illustrated. Another method to selectively plate a metal layer 270 onto a conductive loaded resin-based material 255 is shown.
  • a device or structure 250 of the conductive loaded resin-based material has been previously molded according to the teachings of the present invention as shown in Fig. 10a.
  • a masking layer is applied and patterned overlying the conductive loaded resin-based material 255.
  • This masking layer 260 comprises any of several types of materials.
  • the masking layer 260 comprises a polymer or resin-based ink, as well known in the art, that is printed onto the conductive loaded resin-based material 255.
  • this ink 260 is selectively applied by a screen printing technique.
  • this ink comprises a photosensitive ink, as is well known in the art.
  • This photosensitive ink 260 is then patterned using a photolithographic technique.
  • the masking layer 260 comprises a resin-based material that is over-molded onto the conductive loaded resin-based material 255. In either case, an opening is formed in the masking layer 260 to expose a portion of the underlying conductive loaded resin-based material 255.
  • the device 250 is immersed in a plating solution as part of an electroplating or an electroplating process as described above.
  • a metal plating layer 270 is plated onto the conductive loaded resin-based material 255 of the device 250.
  • This metal plating layer may be formed by a single electroless plating step, a single electroplating step, or by a combined electroless and electroplating sequence as described above.
  • the non-platability of the masking layer 260 results in an absence of metal plating 270 in this area. Therefore, the result of the global or batch plating process is to selectively form a plated metal layer 270 only over the platable conductive loaded resin-based section 255. Referring now to Fig.
  • a sixth preferred embodiment of the present invention is illustrated.
  • the selectively plated metal layer 285 is applied to an antenna structure 280 molded of the conductive loaded resin-based material 290.
  • a cross section of the antenna structure 280 is shown.
  • a serpentine pattern or zig-zag pattern is formed in the conductive loaded resin-based material 290 and/or in the plated metal circuit layer 285 to form an antenna structure.
  • the conductive loaded resin- based materia'l 290 described in the present invention is particularly useful for forming antenna structures for a range of application, such as mobile communications systems.
  • the conductive loaded resin-based material 290 absorbs electromagnetic energy over a large bandwidth.
  • the conductive loaded resin- based antenna 290 is altered by selectively plating metal circuit layer 285 over the conductive loaded resin-based material. By carefully designing the plated metal circuit 285 pattern, an optimally tunable antenna 280 is achieved. The antenna 280 is tuned by the metal plating pattern 285 to create frequency resonance based on fractional multiples
  • the metal plating circuit layer 285 can further increase the frequency bandwidth of the antenna 290.
  • the base resin of the conductive loaded resin-based material 290 is a platable material, such as described above.
  • the above-described embodiment is also easily extended to non- antenna applications such as electronics circuits.
  • a seventh preferred embodiment of the present invention is illustrated.
  • Another antenna structure 300 formed of the conductive loaded resin-based material 310 is shown. Again, a cross section of the antenna structure 300 is shown. In this case, a platable, insulating layer 320 is formed over the conductive loaded resin-based antenna 310.
  • This platable, insulating layer 320 preferable comprises a resin-based material and, more preferably, comprises the same base resin as is used in the conductive loaded resin-based antenna 310. However, any platable material 320 may be used.
  • the platable, insulating layer 320 is over-molded onto a previously molded conductive loaded resin-based antenna 310.
  • the platable insulating layer 320 is applied to the previously molded conductive loaded resin-based antenna 310 by spraying, dipping, or coating.
  • the platable, insulating layer 320 is laminated onto the conductive loaded resin-based antenna 310 by an adhesive layer, not shown, or by a welding process.
  • a metal layer 315 is selectively plated onto the platable, insulating layer 320.
  • the metal circuit layer 315 is selectively plated by using a masking ink or layer, as described above, to define platable regions on the surface of the platable, insulating layer 320.
  • the metal circuit layer 315 is then plated using electroless plating, electroplating, of a combination of both electroless plating and electroplating as described above.
  • this embodiment of the present invention allows a conductive loaded resin-based material 310 formulated with a non- platable base resin to be metal plated. Further, the insulating, platable layer 320 creates a capacitive and/or inductive coupling between the conductive loaded resin- based antenna structure 310 and the plated metal 315. As a result, another novel antenna 300 is achieved. Multiple resonance frequencies can be created by the presence of the capacitively coupled metal plating 315 on the conductive loaded resin-based antenna structure 310.
  • the metal plating pattern 315 is another means to optimize the resonance frequency (s) .
  • the capacitive and/or inductive coupling of the metal plating 315 to the conductive loaded resin-based antenna structure 310 increases the bandwidth of the antenna by increasing the overall conducting surface area.
  • the conductive loaded resin-based material typically comprises a micron powder (s) of conductor particles and/or in combination of micron fiber (s) homogenized within a base resin host.
  • Fig. 2 shows cross section view of an example of conductor loaded resin-based material 32 having powder of conductor particles 34 in a base resin host 30. In this example the diameter D of the conductor particles 34 in the powder is between about 3 and 12 microns.
  • Fig. 3 shows a cross section view of an example of conductor loaded resin-based material 36 having conductor fibers 38 in a base resin host 30.
  • the conductor fibers 38 have a diameter of between about 3 and 12 microns, typically in the range of 10 microns or between about 8 and
  • the conductors used for these conductor particles 34 or conductor fibers 38 can be stainless steel, nickel, copper, silver, or other suitable metals or conductive fibers, or combinations thereof. These conductor particles and or fibers are homogenized within a base resin.
  • the conductive loaded resin-based materials have a resistivity between about 5 and 25 ohms per square, other resistivities can be achieved by varying the doping parameters and/or resin selection. To realize this resistivity the ratio of the weight of the conductor material, in this example the conductor particles 34 or conductor fibers 38, to the weight of the base resin host 30 is between about 0.20 and 0.40, and is preferably about 0.30.
  • Stainless Steel Fiber of 8-11 micron in diameter and lengths of 4-6 mm with a fiber weight to base resin weight ratio of 0.30 will produce a very highly conductive parameter, efficient within any EMF spectrum.
  • Fig. 4 another preferred embodiment of the present invention is illustrated where the conductive materials comprise a combination of both conductive powders 34 and micron conductive fibers 38 homogenized together within the resin base 30 during a molding process.
  • a preferred composition of the conductive loaded, resin-based material is illustrated.
  • the conductive loaded resin-based material can be formed into fibers or textiles that are then woven or webbed into a conductive fabric.
  • the conductive loaded resin-based material is formed in strands that can be woven as shown.
  • Fig. 5a shows a conductive fabric 42 where the fibers are woven together in a two-dimensional weave 46 and
  • Fig. 5b shows a conductive fabric 42' where the fibers are formed in a webbed arrangement. In the webbed arrangement, one or more continuous strands of the conductive fiber are nested in a random fashion.
  • the resulting conductive fabrics or textiles 42 see Fig. 5a, and 42', see Fig. 5b, can be made very thin, thick, rigid, flexible or in solid form(s).
  • a conductive, but cloth-like, material can be formed using woven or webbed micron stainless steel fibers, or other micron conductive fibers. These woven or webbed conductive cloths could also be sandwich laminated to one or more layers of materials such as Polyester (s) , Teflon (s), Kevlar(s) or any other desired resin-based material (s) . This conductive fabric may then be cut into desired shapes and sizes.
  • FIG. 6a shows a simplified schematic diagram of an injection mold showing a lower portion 54 and upper portion 58 of the mold 50.
  • Conductive loaded blended resin-based material is injected into the mold cavity 64 through an injection opening 60 and then the homogenized conductive material cures by thermal reaction.
  • the upper portion 58 and lower portion 54 of the mold are then separated or parted and the devices or structures are removed.
  • Fig. 6b shows a simplified schematic diagram of an extruder 70 for forming devices or structures using extrusion.
  • Conductive loaded resin-based material (s) is placed in the hopper 80 of the extrusion unit 74.
  • a piston, screw, press or other means 78 is then used to force the thermally molten or a chemically induced curing conductive loaded resin-based material through an extrusion opening 82 which shapes the thermally molten curing or chemically
  • a method to form a metal layer on a conductive loaded resin-based material is achieved.
  • Various devices and structures are formed of metal-plated, conductive loaded resin-based materials.
  • a method to alter visual, thermal, mechanical, and/or electrical characteristics of a conductive-loaded resin-based is achieved by forming a metal layer over the conductive loaded resin-based material.
  • a method to electrically and/or thermally interface a conductive loaded resin-based device or structure is achieved by means of a metal layer formed thereon.
  • the novel methods and devices of the present invention provide an effective and manufacturable alternative to the prior art.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electrochemistry (AREA)
  • Chemically Coating (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

Des dispositifs se composent d'une matière conductrice chargée à base de résine, recouverte d'une couche de métal plaquée. Cette matière conductrice et chargée à base de résine comprend une ou plusieurs poudres microniques, une ou plusieurs fibres conductrices ou une combinaison de poudre conductrice et de fibres conductrices dans un hôte en résine de base. Le rapport entre le poids de la ou des poudres conductrices, des fibres conductrices ou d'une combinaison des poudres conductrices et des fibres conductrices et le poids de l'hôte en résine de base est compris entre environ 0,20 et 0,40. Les poudres conductrices microniques se composent de non métaux, tels que le carbone, le graphite, pouvant être également plaqués de métal ou similaire, ou de métaux, tels que l'acier inoxydable, le nickel, le cuivre, l'argent, pouvant également être plaqués, ou similaire, ou d'une combinaison de non-métal, de plaqué, ou combinés à des poudres métalliques. Les fibres conductrices microniques sont de préférence des fibres de carbone plaquées de nickel, des fibres d'acier inoxydable, des fibres de cuivre, des fibres d'argent ou similaire.
PCT/US2004/019013 2003-06-16 2004-06-16 Galvanoplastie de matieres conductrices chargees a base de resine pour la fabrication peu couteuse d'articles conducteurs WO2004113594A2 (fr)

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US60/478,917 2003-06-16

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103710649A (zh) * 2014-01-16 2014-04-09 张霞 一种碳纤维增强钛合金复合材料及其制备方法
WO2013083667A3 (fr) * 2011-12-07 2014-05-30 Leopold Kostal Gmbh & Co. Kg Procédé pour produire un élément de commande, un élément décoratif ou un élément d'affichage, présentant un revêtement galvanique sur sa face avant ainsi que des zones non revêtues
CN111205591A (zh) * 2020-02-28 2020-05-29 大连疆宇新材料科技有限公司 一种可电火花线切割的大型聚醚醚酮模压毛坯件

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3024888A1 (de) * 1980-07-01 1982-02-04 Bayer Ag, 5090 Leverkusen Verbundmaterial zur abschirmung elektromagnetischer strahlung
US4434541A (en) * 1980-12-22 1984-03-06 Chomerics, Inc. Electromagnetic shielding
US4734140A (en) * 1985-08-06 1988-03-29 Chomerics, Inc. Heat treatment of electromagnetic shielding composition
US5413694A (en) * 1993-07-30 1995-05-09 The United States Of America As Represented By The Secretary Of The Navy Method for improving electromagnetic shielding performance of composite materials by electroplating

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013083667A3 (fr) * 2011-12-07 2014-05-30 Leopold Kostal Gmbh & Co. Kg Procédé pour produire un élément de commande, un élément décoratif ou un élément d'affichage, présentant un revêtement galvanique sur sa face avant ainsi que des zones non revêtues
CN103710649A (zh) * 2014-01-16 2014-04-09 张霞 一种碳纤维增强钛合金复合材料及其制备方法
CN103710649B (zh) * 2014-01-16 2015-08-19 昌吉市银杏新材料科技有限公司 一种碳纤维增强钛合金复合材料及其制备方法
CN111205591A (zh) * 2020-02-28 2020-05-29 大连疆宇新材料科技有限公司 一种可电火花线切割的大型聚醚醚酮模压毛坯件

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