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WO2004077493A3 - Procede pour realiser un substrat expose - Google Patents

Procede pour realiser un substrat expose Download PDF

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Publication number
WO2004077493A3
WO2004077493A3 PCT/EP2004/001816 EP2004001816W WO2004077493A3 WO 2004077493 A3 WO2004077493 A3 WO 2004077493A3 EP 2004001816 W EP2004001816 W EP 2004001816W WO 2004077493 A3 WO2004077493 A3 WO 2004077493A3
Authority
WO
WIPO (PCT)
Prior art keywords
producing
exposed substrate
image areas
substrate
photoresistant
Prior art date
Application number
PCT/EP2004/001816
Other languages
German (de)
English (en)
Other versions
WO2004077493A2 (fr
Inventor
Wittich Kaule
Original Assignee
Giesecke & Devrient Gmbh
Wittich Kaule
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke & Devrient Gmbh, Wittich Kaule filed Critical Giesecke & Devrient Gmbh
Priority to EP04713881A priority Critical patent/EP1599763A2/fr
Priority to JP2006501940A priority patent/JP2006520010A/ja
Priority to US10/545,195 priority patent/US7241537B2/en
Publication of WO2004077493A2 publication Critical patent/WO2004077493A2/fr
Publication of WO2004077493A3 publication Critical patent/WO2004077493A3/fr

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/22—Exposing sequentially with the same light pattern different positions of the same surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/001—Phase modulating patterns, e.g. refractive index patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/095—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having more than one photosensitive layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
    • G03F7/203—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure comprising an imagewise exposure to electromagnetic radiation or corpuscular radiation
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/02—Details of features involved during the holographic process; Replication of holograms without interference recording
    • G03H1/024—Hologram nature or properties
    • G03H1/0244—Surface relief holograms
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/0005—Adaptation of holography to specific applications
    • G03H1/0011—Adaptation of holography to specific applications for security or authentication
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H1/00—Holographic processes or apparatus using light, infrared or ultraviolet waves for obtaining holograms or for obtaining an image from them; Details peculiar thereto
    • G03H1/04—Processes or apparatus for producing holograms
    • G03H1/18—Particular processing of hologram record carriers, e.g. for obtaining blazed holograms
    • G03H2001/187—Trimming process, i.e. macroscopically patterning the hologram
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2250/00—Laminate comprising a hologram layer
    • G03H2250/33—Absorbing layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03H—HOLOGRAPHIC PROCESSES OR APPARATUS
    • G03H2260/00—Recording materials or recording processes
    • G03H2260/14—Photoresist

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Electromagnetism (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Holo Graphy (AREA)
  • Diffracting Gratings Or Hologram Optical Elements (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

La présente invention concerne un procédé pour réaliser un substrat exposé qui présente au moins deux zones de motif différentes. Le substrat est pour cela doté d'au moins deux couches de résine photosensible qui sont adaptées au type de zones de motif à réaliser.
PCT/EP2004/001816 2003-02-26 2004-02-24 Procede pour realiser un substrat expose WO2004077493A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP04713881A EP1599763A2 (fr) 2003-02-26 2004-02-24 Procede pour realiser un substrat expose
JP2006501940A JP2006520010A (ja) 2003-02-26 2004-02-24 露光基体の作製方法
US10/545,195 US7241537B2 (en) 2003-02-26 2004-02-24 Method for producing an exposed substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10308328A DE10308328A1 (de) 2003-02-26 2003-02-26 Verfahren zur Herstellung eines belichteten Substrats
DE10308328.6 2003-02-26

Publications (2)

Publication Number Publication Date
WO2004077493A2 WO2004077493A2 (fr) 2004-09-10
WO2004077493A3 true WO2004077493A3 (fr) 2005-09-15

Family

ID=32841925

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/001816 WO2004077493A2 (fr) 2003-02-26 2004-02-24 Procede pour realiser un substrat expose

Country Status (6)

Country Link
US (1) US7241537B2 (fr)
EP (1) EP1599763A2 (fr)
JP (1) JP2006520010A (fr)
DE (1) DE10308328A1 (fr)
RU (1) RU2344455C2 (fr)
WO (1) WO2004077493A2 (fr)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10308328A1 (de) 2003-02-26 2004-09-09 Giesecke & Devrient Gmbh Verfahren zur Herstellung eines belichteten Substrats
DE10348623A1 (de) 2003-10-15 2005-05-25 Giesecke & Devrient Gmbh Optisch variable Beugungsstruktur und Verfahren zu ihrer Herstellung
US7229745B2 (en) * 2004-06-14 2007-06-12 Bae Systems Information And Electronic Systems Integration Inc. Lithographic semiconductor manufacturing using a multi-layered process
GB0422266D0 (en) * 2004-10-07 2004-11-10 Suisse Electronique Microtech Security device
WO2006085741A1 (fr) * 2005-02-09 2006-08-17 Stichting Dutch Polymer Institute Procédé servant à préparer une structure polymérique en relief
GB0601093D0 (en) * 2006-01-19 2006-03-01 Rue De Int Ltd Optically Variable Security Device
JP2008146691A (ja) * 2006-12-06 2008-06-26 Fujifilm Corp スタンパ原版およびスタンパの製造方法
GB0711434D0 (en) 2007-06-13 2007-07-25 Rue De Int Ltd Holographic security device
JP2009182075A (ja) * 2008-01-30 2009-08-13 Canon Inc インプリントによる構造体の製造方法
JP4453767B2 (ja) * 2008-03-11 2010-04-21 ソニー株式会社 ホログラム基板の製造方法
US10354175B1 (en) 2013-12-10 2019-07-16 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10479126B1 (en) 2013-12-10 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument
US10513081B1 (en) * 2013-12-10 2019-12-24 Wells Fargo Bank, N.A. Method of making a transaction instrument
US10380476B1 (en) 2013-12-10 2019-08-13 Wells Fargo Bank, N.A. Transaction instrument
DE102016002451A1 (de) * 2016-02-29 2017-08-31 Giesecke & Devrient Gmbh Prägeplatte, Herstellungsverfahren und geprägtes Sicherheitselement
US10613268B1 (en) * 2017-03-07 2020-04-07 Facebook Technologies, Llc High refractive index gratings for waveguide displays manufactured by self-aligned stacked process
US10482365B1 (en) 2017-11-21 2019-11-19 Wells Fargo Bank, N.A. Transaction instrument containing metal inclusions

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US4282308A (en) * 1975-06-03 1981-08-04 E. I. Du Pont De Nemours And Company Negative-working multilayer photosensitive element
DE3837874A1 (de) * 1988-11-08 1990-05-10 Siemens Ag Verfahren zur herstellung von gitterstrukturen mit um eine halbe gitterperiode gegeneinander versetzten abschnitten
JPH02187012A (ja) * 1989-01-13 1990-07-23 Nec Corp レジストパターン形成方法
JPH02262319A (ja) * 1989-04-03 1990-10-25 Toshiba Corp パターン形成方法
DE19524099A1 (de) * 1995-07-01 1997-01-02 Karlsruhe Forschzent Verfahren zur Herstellung von Formeinsätzen
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WO2001020402A1 (fr) * 1999-09-14 2001-03-22 Massachusetts Institute Of Technology Fabrication de dispositif a motifs fins par etampage par liquides
JP2001135565A (ja) * 1999-11-08 2001-05-18 Sony Corp 半導体装置の製造方法
US6337163B1 (en) * 1998-09-22 2002-01-08 Kabushiki Kaisha Toshiba Method of forming a pattern by making use of hybrid exposure
EP1225477A1 (fr) * 2001-01-17 2002-07-24 Hubert Lorenz Procédé de fabrication et de marquage de composants micromécaniques réalisés par photostructuration et électroformage
EP1321890A1 (fr) * 2001-12-18 2003-06-25 Istituto Poligrafico E Zecca Dello Stato Support de données optique avec un code optique diffractive, et son lecteur

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US4255514A (en) * 1979-04-27 1981-03-10 Rca Corporation Method for fabricating a diffractive subtractive filter embossing master
DE3837874A1 (de) * 1988-11-08 1990-05-10 Siemens Ag Verfahren zur herstellung von gitterstrukturen mit um eine halbe gitterperiode gegeneinander versetzten abschnitten
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WO2001020402A1 (fr) * 1999-09-14 2001-03-22 Massachusetts Institute Of Technology Fabrication de dispositif a motifs fins par etampage par liquides
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EP1225477A1 (fr) * 2001-01-17 2002-07-24 Hubert Lorenz Procédé de fabrication et de marquage de composants micromécaniques réalisés par photostructuration et électroformage
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Also Published As

Publication number Publication date
US20060141385A1 (en) 2006-06-29
JP2006520010A (ja) 2006-08-31
WO2004077493A2 (fr) 2004-09-10
RU2344455C2 (ru) 2009-01-20
EP1599763A2 (fr) 2005-11-30
RU2005129549A (ru) 2007-04-20
DE10308328A1 (de) 2004-09-09
US7241537B2 (en) 2007-07-10

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