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WO2004068918A2 - Procede de production de couches minces d'argent - Google Patents

Procede de production de couches minces d'argent Download PDF

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Publication number
WO2004068918A2
WO2004068918A2 PCT/IB2004/000230 IB2004000230W WO2004068918A2 WO 2004068918 A2 WO2004068918 A2 WO 2004068918A2 IB 2004000230 W IB2004000230 W IB 2004000230W WO 2004068918 A2 WO2004068918 A2 WO 2004068918A2
Authority
WO
WIPO (PCT)
Prior art keywords
silver
substrate
layer
coated
coating
Prior art date
Application number
PCT/IB2004/000230
Other languages
English (en)
Other versions
WO2004068918A3 (fr
Inventor
James Anthony Cairns
Graham James Berry
Gary John Callon
Robert Dermot Smith
Barry Gowans
Original Assignee
Aktina Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Aktina Limited filed Critical Aktina Limited
Publication of WO2004068918A2 publication Critical patent/WO2004068918A2/fr
Publication of WO2004068918A3 publication Critical patent/WO2004068918A3/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/42—Coating with noble metals
    • C23C18/44—Coating with noble metals using reducing agents
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
    • C23C18/1208—Oxides, e.g. ceramics
    • C23C18/1216—Metal oxides
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1262—Process of deposition of the inorganic material involving particles, e.g. carbon nanotubes [CNT], flakes
    • C23C18/127—Preformed particles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
    • C23C18/125—Process of deposition of the inorganic material
    • C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/208—Multistep pretreatment with use of metal first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
    • C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
    • C23C18/2073—Multistep pretreatment
    • C23C18/2086—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/285—Sensitising or activating with tin based compound or composition
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H05K3/387—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive for electroless plating

Definitions

  • the present invention relates to a method for producing thin metal layers on printed circuit boards. More particularly, the present invention concerns thin film silver layers providing maximum benefit from conductor surface treatment of pcb's to minimize skin effect losses.
  • US 5,215,645 describes a process for preparing a low profile copper foil for printed circuit boards by using a special electrodeposition bath solution comprising a surface roughness decreasing agent.
  • a process of preparing a PCB's package having good electrical characteristics at frequencies in excess of 1 GHz is disclosed in US 5,268,064.
  • the process avoids oxidising step so that the PCB package obtained comprises a double sided double treated copper clad laminate used as an inner layer in which propagation speeds are not worsened by oxide.
  • the known method of preparing PCB package requires some additional steps that makes the process more complex.
  • multilayer PCB packages comprising single and double sided copper clad laminates that have only single treated copper foil. However, typically, they have significantly lower characteristics.
  • a multilayer printed circuit board comprising a plurality of planar layers made of dielectric material and a thin metal film secured to these dielectric material layers, wherein a thin porous ceramic layer is incorporated between the metal layer and dielectric material.
  • conductive traces can be formed in the thin metal film by using conventional methods, such as photolithography and wet etching.
  • a method of producing a thin film silver coated multilayer structure comprises the steps of:
  • a low dissipation silver plated pcb structure comprising: - a polyimide coated dielectric substrate;
  • a thin silver layer deposited onto the ceramic layer to a thickness of from 50 nm to 350 nm.
  • the substrate was then heated on a hot plate to 95°C for 10 minutes and the SU-8 layer was then exposed to ultraviolet light of wavelength 365nm for 20 seconds.
  • the substrate was then baked on a hot plate for 10 minutes at 95°C and then heated in an oven at 150°C for 30 minutes.
  • Figure 1 schematically illustrates the SU-8 coated FR4.
  • Figures 2a and 2b show a comparison between the surfaces of the uncoated FR4 and the SU-8 coated FR4 and it can be seen that the SU-8 coating yields a much smoother surface.
  • the substrate was immersed in dichloromethane for 2 minutes, rinsed with isopropanol and dried in a jet of nitrogen.
  • the substrate was then heated to 170°C for 1 hour in a furnace.
  • the substrate was immersed in a 5% solution of tin chloride and then thoroughly rinsed with deionised water.
  • the substrate was then immersed in an electroless silver plating solution as supplied by Peacock Laboratories Inc. Philadelphia, USA until a layer of silver had been deposited.
  • This solution consisted of: A: HE-300 silver solution B: HE-300 activator solution C: HE-300 reducer solution
  • component solution A was diluted with water in the ratio 1A to 30 water by volume.
  • Component solution B was diluted 1 B to 30 water by volume.
  • Component solution C was diluted 1C to 100 water by volume. The final mixture contained equivolumes of these diluted component solutions.
  • the substrate was rinsed in deionised water and dried in a jet of nitrogen.
  • Figure 3 illustrates schematically the silver coated substrate.
  • the silver exhibited excellent adhesion to the substrate. This was demonstrated by applying a layer of 'Scotch' tape to the silver and attempting to peel it off. It was found that the silver remained on the substrate and that none had been transferred to the tape. It was also demonstrated that the silver layer could be patterned by photolithography and wet etching, employing a solution comprising: 10ml hydrogen peroxide, 10ml ammonium hydroxide and 40ml of methanol. The photolithography process involved spin coating a layer of Microposit S1813 photoresist onto the silver and then heating the substrate to 90°C for 10 minutes on a hotplate.
  • the layer of photoresist was then exposed to ultraviolet light, of wavelength 365nm, through an appropriate photomask and subsequently developed in Microposit MF319 developer.
  • the substrate was then baked on a hotplate at 120°C for 20 minutes prior to immersion in the silver etching solution.
  • the remaining photoresist was then removed by rinsing in acetone to yield the desired, patterned layer of silver on the substrate.
  • the thickness of the silver was measured as being approximately 100nm and after patterning, the adhesion was still excellent. Additional samples were made by the same process and it was found that the thickness of the silver was dependent on the concentration of the electroless silver solution and the length of time that the sample was plated for.
  • Figure 4 illustrates a patterned layer of silver on the SU-8 coated FR4.
  • Example 2 illustrates a patterned layer of silver on the SU-8 coated FR4.
  • a solution containing 1.5g of zirconium propionate dissolved in ethanol can be spin coated onto the surface of the SU-8 coated FR4, or onto polyester sheet and then thermally cured at 150°C for 20 minutes on a hotplate.
  • the SU-8 coated FR4 is initially immersed in acetone for 2 minutes, followed by a rinse in isopropanol prior to coating with the zirconium propionate in ethanol solution.
  • These substrates can then be subjected to the electroless silver deposition process to produce a well adhered silver layer on the substrates.
  • the silver can be patterned by photolithography and wet etching with a solution containing; methanol, ammonium hydroxide and hydrogen peroxide. Electrical resistivity measurements have been made on these silver layers and a value of 5.56 micro ohm centimetres has been obtained for a film which is 160nm in thickness.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nanotechnology (AREA)
  • Ceramic Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)

Abstract

La présente invention se rapporte à un procédé de production de couches métalliques minces sur des cartes de circuits imprimés, notamment sur des cartes de circuits imprimés recouvertes d'argent. Le procédé de production d'une structure multicouche recouverte d'un film mince d'argent comprend les étapes consistant à se doter d'un substrat diélectrique recouvert de polyimide ; à recouvrir le substrat avec une solution contenant du propionate de zirconium et de l'acétate de palladium ; à chauffer le substrat pour sécher le revêtement ; et à l'immerger dans une solution de dépôt autocatalytique d'argent jusqu'à ce qu'une couche d'argent de l'épaisseur souhaitée soit formée. Cette invention permet de tirer un profit maximum d'un traitement de surface conductrice de cartes à circuits imprimés ayant pour but de minimiser les pertes dues à l'effet de peau.
PCT/IB2004/000230 2003-01-31 2004-01-29 Procede de production de couches minces d'argent WO2004068918A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US44388803P 2003-01-31 2003-01-31
US60/443,888 2003-01-31

Publications (2)

Publication Number Publication Date
WO2004068918A2 true WO2004068918A2 (fr) 2004-08-12
WO2004068918A3 WO2004068918A3 (fr) 2005-03-10

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PCT/IB2004/000230 WO2004068918A2 (fr) 2003-01-31 2004-01-29 Procede de production de couches minces d'argent

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005045095A2 (fr) * 2003-10-29 2005-05-19 Conductive Inkjet Technology Limited Formation de couches sur des substrats
WO2006076604A2 (fr) * 2005-01-14 2006-07-20 Cabot Corporation Procedes pour planariser des substrats et pour encapsuler des elements electroniques imprimables
TWI387002B (zh) * 2008-03-26 2013-02-21 Merck Patent Gmbh 用於製造ＳｉＯ2光阻層之組合物及其使用方法
WO2015069532A3 (fr) * 2013-11-08 2015-07-30 Corning Incorporated Revêtements à base de liquide et résistant aux éraflures pour du verre

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001513697A (ja) 1997-02-24 2001-09-04 スーペリア マイクロパウダーズ リミテッド ライアビリティ カンパニー エアロゾル法及び装置、粒子製品、並びに該粒子製品から製造される電子装置
US20060189113A1 (en) 2005-01-14 2006-08-24 Cabot Corporation Metal nanoparticle compositions
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
US7533361B2 (en) 2005-01-14 2009-05-12 Cabot Corporation System and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5348574A (en) * 1993-07-02 1994-09-20 Monsanto Company Metal-coated polyimide
US6440576B1 (en) * 1999-02-03 2002-08-27 Ube Industries, Ltd. Metal plated aromatic polyimide film
WO2003021004A1 (fr) * 2001-08-30 2003-03-13 The University Of Dundee Procede pour produire des composites en ceramique-metal en films minces poreux et composites obtenus par ce procede

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5348574A (en) * 1993-07-02 1994-09-20 Monsanto Company Metal-coated polyimide
US6440576B1 (en) * 1999-02-03 2002-08-27 Ube Industries, Ltd. Metal plated aromatic polyimide film
WO2003021004A1 (fr) * 2001-08-30 2003-03-13 The University Of Dundee Procede pour produire des composites en ceramique-metal en films minces poreux et composites obtenus par ce procede

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
CHEMICAL ABSTRACTS + INDEXES, AMERICAN CHEMICAL SOCIETY. COLUMBUS, US, 16 December 1991 (1991-12-16), XP000318737 ISSN: 0009-2258 *

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005045095A2 (fr) * 2003-10-29 2005-05-19 Conductive Inkjet Technology Limited Formation de couches sur des substrats
WO2005045095A3 (fr) * 2003-10-29 2005-10-20 Conductive Inkjet Tech Ltd Formation de couches sur des substrats
WO2006076604A2 (fr) * 2005-01-14 2006-07-20 Cabot Corporation Procedes pour planariser des substrats et pour encapsuler des elements electroniques imprimables
WO2006076604A3 (fr) * 2005-01-14 2006-09-21 Cabot Corp Procedes pour planariser des substrats et pour encapsuler des elements electroniques imprimables
TWI387002B (zh) * 2008-03-26 2013-02-21 Merck Patent Gmbh 用於製造ＳｉＯ2光阻層之組合物及其使用方法
WO2015069532A3 (fr) * 2013-11-08 2015-07-30 Corning Incorporated Revêtements à base de liquide et résistant aux éraflures pour du verre
US9663400B2 (en) 2013-11-08 2017-05-30 Corning Incorporated Scratch-resistant liquid based coatings for glass
US10358383B2 (en) 2013-11-08 2019-07-23 Corning Incorporated Wear-resistant liquid-based coatings for glass

Also Published As

Publication number Publication date
WO2004068918A3 (fr) 2005-03-10

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