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WO2004068596A1 - Module de lampe a diode electroluminescente - Google Patents

Module de lampe a diode electroluminescente Download PDF

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Publication number
WO2004068596A1
WO2004068596A1 PCT/KR2004/000120 KR2004000120W WO2004068596A1 WO 2004068596 A1 WO2004068596 A1 WO 2004068596A1 KR 2004000120 W KR2004000120 W KR 2004000120W WO 2004068596 A1 WO2004068596 A1 WO 2004068596A1
Authority
WO
WIPO (PCT)
Prior art keywords
lamp module
electrode
unit
reflection
substrate
Prior art date
Application number
PCT/KR2004/000120
Other languages
English (en)
Inventor
Nam-Young Kim
Original Assignee
Nam-Young Kim
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nam-Young Kim filed Critical Nam-Young Kim
Publication of WO2004068596A1 publication Critical patent/WO2004068596A1/fr

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H01L2224/48139—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate with an intermediate bond, e.g. continuous wire daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other

Definitions

  • the present invention relates to a lamp module, and more particularly, to a lamp module with light emitting diodes.
  • lamps used in lighting devices and various image display devices emit light by exciting fluorescent substances using a glow discharge generating ultraviolet rays.
  • a lamp is a light emitting diode (LED), which changes electric signals into infrared rays or light using special properties of compound semiconductors.
  • LED is widely used in displays of various mechanical devices, lighting devices for the interior and exterior of vehicles, and electric signs. LEDs emit light by combining electrons and holes, wherein the color of the emitted light is determined by the energy of an emitted photon.
  • various colors can be realized by organizing various materials, because the band gaps of the materials are different. LEDs consuming low electric power may be formed at a small scale, discharge a small amount of heat, and have long lifespans. Thus, so LEDs are widely used as lighting devices.
  • Each LED include a lead frame to which a cathode and an anode are applied and on which a chip having a p-type layer and an n-type layer is mounted.
  • the chip is electrically connected to a lead terminal, to which the cathode is applied, via a gold wire.
  • the ends of the chip and the gold wire, and the ends of the lead frame and the lead terminal are molded together by using an epoxy resin.
  • a plurality of LEDs are arranged to form a single unit in order to improve brightness.
  • the arrangement of single units reduces the degree of integration.
  • Korean Laid-open Utility Model Publication No. 1999-0021718 discloses a light bulb using LEDs.
  • the light bulb has a bulb base connected to an external power source, a plurality of LEDs arranged in a matrix structure to form a light emitting unit, an LED substrate for supporting the plurality of LEDs, electric wires for supplying electric power from the LED substrate to the plurality of LEDs, ano) a plurality of connectors to which lead terminals of the LEDs are inserted and from which the lead terminals are discharged.
  • Such a light bulb including a plurality of unit LEDs is limited with respect to increasing the degree of integration of the LED so that the brightness of the light bulb cannot be improved.
  • Japanese Laid-open Patent No. 7-129100 discloses an assembly lamp panel module that easily controls brightness.
  • the lamp panel module uses a plurality of LEDs of three primary colors, such as red, green, and blue.
  • the LEDs of the three primary colors form one pixel, and a plurality of pixels are arranged.
  • the red and green LEDs are used as anode or cathode common circuits, and the blue LED is used independently.
  • the above described lamps use the LEDs of single units resulting in the impossibility to increase the degree of integration of LEDs.
  • the present invention provides a lamp using light emitting diodes (LEDs) that improves integration of LEDs and brightness.
  • LEDs light emitting diodes
  • the present invention also provides a lamp using LEDs that improves light emitting efficiency.
  • the present invention also provides a lamp using LEDs that improves productivity and enables mass production by forming a plurality of LED chips into a module.
  • a lamp module including a substrate, a plurality of reflection cells formed on one surface of the substrate in a predetermined pattern, at least one LED chip, a first electrode unit formed on the substrate and acting as an electrode of the LED chip, and a second electrode unit insulated from the first electrode unit and acting as another electrode of the LED chip.
  • the substrate is formed of a conductive material, and the first electrode unit is integrally formed with the substrate.
  • each of the reflection cells includes a receipt unit on which the LED chip is mounted, and a barrier unit, which is formed on at least one edge of the receipt unit, having an inclining reflection surface and separating the reflection cells.
  • the receipt unit and the barrier unit are integrally formed with the substrate. It is preferable that the reflection surface of the barrier unit is formed by a packing material that is arranged between the barrier unit and the receipt unit.
  • a first insulating layer is formed on an upper surface of the barrier unit, a conductive layer is formed on an upper surface of the first insulating layer, and the second electrode unit is electrically connected to the conductive layer.
  • the lamp module further includes a transparent insulating layer covering the reflection cells, wherein the second electrode unit is a transparent electrode layer electrically connected to the LED chips through via holes, which are arranged on an upper portion of the transparent insulating layer and penetrate the transparent insulating layer.
  • a pad unit is formed on the reflection surface of the barrier unit, and the first electrode unit is a wire electrically connecting the pad unit to the LED chip.
  • a transparent insulating material is filled in the reflection cells.
  • a light scattering material or a fluorescent material is further included in the transparent insulating material.
  • a filter layer is further installed on an upper portion of the substrate. It is preferable that at least one scratch groove in a predetermined shape is formed on the surface of the LED chip.
  • a reflection horn having a plurality of inclining reflection surfaces is formed at the center of the reflection cell, and the LED chips are arranged around the reflection horn. It is preferable that the reflection cell includes a reflection layer, which covers the LED chip having an inclining reflection surface.
  • an optical material layer including a fluorescent material or a light scattering material is further included in the reflection layer. It is preferable that a heat emission member is further combined with another surface of the substrate.
  • the first electrode unit includes a first electrode pin penetrating the substrate, and a first electrode wiring electrically connected to the first electrode pin and patterned on an upper surface of the substrate
  • the second electrode unit includes a second electrode pin penetrating the substrate, and a second electrode wiring electrically connected to the second electrode pin and patterned on the upper surface of the substrate.
  • each of the reflection cells includes a receipt unit on which the LED chip is mounted, and a barrier unit, which is formed on at least one edge of the receipt unit, having an inclining reflection surface and separating the reflection cells.
  • the reflection cells are formed as lines.
  • a plurality of LED chips are mounted on each of the reflection cells and arranged so that the sides of the LED chips form an acute angle against the reflection surface of the reflection cell.
  • the lamp module includes at least one light emitting unit in which a plurality of LED chips are connected in a series and are connected to the first electrode wiring and the second electrode wiring to be parallel.
  • a mother board having a first electrode circuit unit and a second electrode circuit unit in a predetermined pattern is combined with another surface of the substrate, and the first electrode pin and the second electrode pin are electrically connected to the first electrode circuit unit and the second electrode circuit unit, respectively.
  • a heat emission member is further combined with the
  • FIGS. 1A and 1 B are a plane view and a sectional view of an example of a lamp unit according to the present invention, respectively;
  • FIGS. 2A and 2B are a plane view and a sectional view of another example of a lamp unit according to the present invention, respectively;
  • FIGS. 3A through 3C are plane views of substrates mounted in a lamp unit;
  • FIGS. 4A and 4B are a plane view and a sectional view of a lamp module according to a first embodiment of the present invention, respectively;
  • FIGS. 5A and 5B are a plane view and a sectional view of a lamp module according to a second embodiment of the present invention, respectively;
  • FIG. 6 is a sectional view of a lamp module according to a third embodiment of the present invention.
  • FIG. 7 is a sectional view of a lamp module according to a fourth embodiment of the present invention.
  • FIG. 8 is a sectional view of a lamp module according to a fifth embodiment of the present invention.
  • FIG. 9 is a sectional view of a lamp module according to a sixth embodiment of the present invention.
  • FIG. 10 is a sectional view of a lamp module according to a seventh embodiment of the present invention.
  • FIG. 11 is a sectional view of a lamp module according to an eighth embodiment of the present invention.
  • FIG. 12 is a sectional view of a lamp module according to a ninth embodiment of the present invention.
  • FIG. 13 is a sectional view of a lamp module according to a tenth embodiment of the present invention.
  • FIGS. 14A and 14B are a plane view and a sectional view of a lamp module according to an eleventh embodiment of the present invention, respectively;
  • FIGS. 15A and 15B are a plane view and a sectional view of a lamp module according to a twelfth embodiment of the present invention, respectively;
  • FIGS. 16A and 16B are a plane view and a sectional view of a lamp module according to a thirteenth embodiment of the present invention, respectively;
  • FIG. 17 is a sectional view of a lamp module according to a fourteenth embodiment of the present invention
  • FIG. 18 is a sectional view of a lamp module according to a fifteenth embodiment of the present invention
  • FIGS. 19A and 19B are a plane view and a sectional view of a lamp module according to a sixteenth embodiment of the present invention, respectively;
  • FIG. 20 is a sectional view of an example of a lamp assembly using a lamp module according to the present invention.
  • FIGS. 21 and 22 are sectional views of lamps using a lamp module according to the present invention
  • FIGS. 23A and 23B are a plane view and a sectional view of a lamp module according to a seventeenth embodiment of the present invention, respectively;
  • FIGS. 24 through 26 are views of a lamp module according to an eighteenth embodiment of the present invention.
  • FIG. 27 is a sectional view of a lamp module according to a nineteenth embodiment of the present invention.
  • FIG. 28 is a sectional view of a lamp module according to a twentieth embodiment of the present invention.
  • FIG. 29 is a sectional view of a lamp module according to a twenty-first embodiment of the present invention.
  • FIG. 30 is a sectional view of a lamp module according to a twenty- second embodiment of the present invention.
  • FIG. 31 is a sectional view of a lamp module according to a twenty-third embodiment of the present invention
  • FIG. 32 is a sectional view of a lamp module according to a twenty-fourth embodiment of the present invention.
  • FIG. 33 is a sectional view of a lamp module according to a twenty-fifth embodiment of the present invention.
  • FIG. 34 is a sectional view of a lamp module according to a twenty-sixth embodiment of the present invention.
  • FIGS. 35 through 38 are views of examples of lamp assemblies using a lamp module according to the present invention. Best mode for carrying out the Invention
  • FIGS. 1A and 1 B are views of an example of a lamp unit (L) according to the present invention.
  • a lamp module is formed by mounting a plurality of light emitting diode (LED) chips (2) on one surface of a substrate (1 ).
  • the LED chips (2) are sealed by a transparent insulating material to form a first sealing unit (5).
  • a base member (71 ) including a plurality of heat emission fins (72) is combined with another surface of the substrate (1 ) to emit heat from the substrate (1 ).
  • the substrate (1 ), the first electrode connector (31 ), and the second electrode connector (41 ) are sealed by a transparent insulating material to form a second sealing unit (6).
  • FIGS. 2A and 2B are views of another example of a lamp unit (L) according to the present invention.
  • a heat pipe (73) is buried in a substrate (1 ), and LED chips (2) are mounted on the substrate (1 ) to form a lamp module.
  • Other structures of the lamp module of FIGS. 2A and 2B are the same as the lamp module of FIGS. 1A and 1B, except for a lens (61 ), which is mounted on an upper surface of a second sealing unit (6) to improve light efficiency.
  • the LED chips (2) are integrated in a substrate (1 ), which is mounted on a lamp unit (L) in various shapes, for example, concentric circles shown in FIG. 3A, a mosaic shape shown in FIG. 3B, a honeycomb shown in FIG. 3C, and other shapes.
  • the substrate (1 ) may be a substrate formed of any material, such as plastic or metal.
  • FIGS. 4A and 4B are a plane view and a sectional view of a lamp module according to a first embodiment of the present invention that is mounted in a lamp unit (L).
  • a plurality of reflection cells (11 ) are formed on one surface of a substrate (1 ), in other words, on an upper surface of the substrate (1 ) referring to FIG. 4B, in a predetermined pattern.
  • the substrate (1) is formed of a conductive material, for example, a high conductive metal such as aluminium.
  • the substrate (1 ) is a first electrode unit of LED chips in the first embodiment of the present invention.
  • At least one LED chip (2) is mounted on each reflection cell (11 ).
  • one LED chip (2) is mounted on one reflection cell (11 ) as shown in FIG. 4A.
  • the reflection cell (11) includes a receipt unit (113) on which the LED chip (2) is mounted, and a barrier unit (111) arranged at one side of the receipt unit (113) and separating the reflection cells (11).
  • the barrier unit (111 ) has an inclining reflection surface (112).
  • the reflection surface (112) of the reflection cell (11 ) may be formed to a curve as shown in FIG. 4B, and the receipt unit (113) may be formed at the center of the reflection cell (11 ).
  • the LED chip (2) is combined with the receipt unit (113) by using a conductive adhesive, and electrically connected to the substrate (1 ) acting as a first electrode unit.
  • the reflection cell (11 ) may be formed using a press process, in which one surface of the substrate (1 ) is pressed using a mold in a shape corresponding to the shape of the reflection cell (11 ). In other words, one surface of the substrate (1 ) is pressed using a mold in a shape corresponding to the shape of the reflection cell (11 ) so that the surface of the substrate (1 ) becomes uneven, then the uneven surface is used as the reflection cell (11 ). Accordingly, the receipt unit (113) and the barrier unit (111 ) are integrally formed on the substrate (1 ).
  • a first insulating layer (223) is formed on the barrier unit (111 ), and a conductive layer (222) is formed on the first insulating layer (223).
  • the conductive layer (222) and the LED chip (2) connected by a second electrode wiring (221 ) form a second electrode unit (21 ).
  • a transparent insulating material that seals the reflection cell (11 ) is formed on the second electrode unit (21 ), resulting in the formation of a first sealing unit (5).
  • the first electrode connector (31) and the first electrode lead (3) are combined with the first electrode unit of the lamp module, and a second electrode connector (41) and the second electrode lead (4) are combined with the second electrode unit (21 ) of the lamp module as shown in FIGS. 1A through 2B, so that a lamp unit is formed.
  • light emitted from the LED chip is reflected on the reflection surface of the reflection cell toward a direction, as shown in FIG. 4B, resulting in an improvement in the brightness of the lamp.
  • FIGS. 5A and 5B are a plane view and a sectional view of a lamp module according to a second embodiment of the present invention.
  • the basic structure of the lamp module according to the second embodiment is the same as that of the first embodiment.
  • a first electrode pad (211 ) is formed on a reflection surface (112) of a reflection cell (11), and the first electrode pad (211 ) and an LED chip (2) are connected by a first electrode wiring (212).
  • the LED chip (2) is formed so that a first electrode and a second electrode on an upper surface of the LED chip (2) can be connected.
  • the LED chip (2) is adhered to a receipt unit (113) using a nonconductive adhesive.
  • the reflection cell (11 ) may be formed using a press process, and the LED chip (2) is mounted on the reflection cell (11 ) to improve brightness and integration of the LED chips (2).
  • a resin layer (51 ) in which a transparent insulating material is filled is formed in a reflection cell (11 ).
  • a light scattering material that scatters light emitted from an LED chip (2) to improve brightness may be distributed in the resin layer (51 ).
  • fluorescent materials radiating red, green, blue, and white lights may be distributed in the resin layer (51 ) so that the reflection cell (11 ) emits red, green, blue, and white lights.
  • a transparent insulating layer (52) covering reflection cells (11) and a second electrode unit (22) is formed, and a resin layer (51) is formed on the transparent insulating layer (52).
  • a light scattering material or fluorescent materials may be distributed in the resin layer (51 ).
  • the resin layer (51) operates as a color filter layer.
  • a first sealing layer (5) is formed on the resin layer (51 ).
  • FIG. 8 is a sectional view of a lamp module according to a fifth embodiment of the present invention.
  • a reflection surface (112) of a reflection cell (11 ) is flat and not curved.
  • LED chips (2) connected by second electrode wirings (221 ) form a second electrode unit (22).
  • various changes may be made, and the structures of the lamp modules according to the fifth through fourth embodiments, except for the reflection surfaces thereof, may be adopted.
  • a barrier unit (111 ), which forms a reflection surface (112), is formed to be separate from a substrate (1 ).
  • a reflection cell (11 ) is formed by forming the barrier unit (111) on the surface of the substrate (1 ), in a predetermined pattern by using a reflection material, such as metal.
  • FIG. 10 is a sectional view of a lamp module according to a seventh embodiment of the present invention.
  • a first insulating layer (223) is formed on an upper surface of a barrier unit (111 ), and a conductive layer (222) is formed on the first insulating layer (223). Then, the conductive layer (222) and an LED chip (2) are connected by a second electrode wiring (221 ) to form a second electrode unit (22).
  • FIG. 11 is a sectional view of a lamp module according to an eighth embodiment of the present invention.
  • a barrier layer (111 ) having a side perpendicular to a substrate (1 ) is formed, and a packing material (114) is filled between the barrier layer (111) and a receipt unit (113) resulting in a reflection surface (112).
  • the barrier layer (111 ) may be formed separately from the substrate (1 ).
  • the second electrode unit (22) may be formed using a second electrode wiring 221 as shown in the above described embodiments.
  • a second electrode unit may be formed by a transparent electrode layer.
  • a reflection cell (11 ) is formed, and an LED chip (2) is bonded to a receipt unit (113) of the reflection cell (11 ) using a conductive adhesive.
  • a transparent insulating layer (52) covering the reflection cell (11 ) is formed, and a transparent electrode layer (224) is formed on the transparent insulating layer (52) resulting in a second electrode unit (22).
  • the transparent electrode layer (224) is connected to the LED chip (2) through a via hole (225), which penetrates the transparent insulating layer (52).
  • the transparent electrode layer (224) may be formed of a transparent conductive material, such as ITO or IZO.
  • a barrier layer (111 ) contacts a conductive layer (222) by interposing a first insulating layer (223), as shown in FIG. 12.
  • a light scattering material or a fluorescent material may be distributed throughout the transparent insulating layer (52).
  • the effect of the lamp module according to the ninth embodiment of the present invention is the same as the effects of the lamp modules described above.
  • the structure of a second electrode unit (22) using a transparent electrode layer is adopted in the structure including a flat reflection surface (112).
  • FIGS. 14A and 14B are a plane view and a sectional view of a lamp module according to an eleventh embodiment of the present invention. Scratch grooves (23) in a predetermined shape are formed on a surface of an LED chip (2), which is mounted on a reflection cell (11 ).
  • a large sized chip with high brightness is used as the LED chip (2), and at least one scratch groove (23) is formed on the surface of the LED chip (2) in order to improve the brightness.
  • the scratch grooves (23) are formed on the surface of the LED chip (2), light comes through the grooves (23) resulting in the increase in a light emitting area.
  • the scratch grooves (23) may be formed in various shapes and at various locations, for example, in a V-shape or a W-shape while being formed in straight lines as shown in FIG. 14A or cross lines.
  • auxiliary electrodes (225) are additionally formed in a second electrode unit (22).
  • a second electrode pad unit (224) is laterally formed on the surface of the LED chip (2), and the auxiliary electrodes (225) are formed on the second electrode pad unit (224) in order to supply power to the divided LED chip (2).
  • the integration of the LED chip is increased, thereby resulting in the obtainment of an LED lamp with an excellent brightness.
  • FIGS. 15A and 15B are a plane view and a sectional view of a lamp module according to a twelfth embodiment of the present invention.
  • a reflection horn (115) having a plurality of reflection surfaces (116) is formed at a center of the reflection cell (11 ), and LED chips (2) are arranged around the reflection horn
  • FIGS. 16A and 16B The structure using a reflection horn (115) is shown in FIGS. 16A and 16B according to a thirteenth embodiment of the present invention.
  • a reflection horn (115) having a plurality of reflection surfaces (116) is formed at a center of a reflection cell (11 ), and LED chips (2), on which scratch grooves (23) as described in the eleventh embodiment are arranged, around the reflection horn (115).
  • An upper surface (117) of the reflection horn (115) is formed by planarizing the reflection horn (115), and the LED chips (2) and a substrate (1 ) as a first electrode unit are electrically connected by a first electrode wiring (212), on the upper surface (117).
  • the structure having a reflection horn is not limited to the lamp modules according to the twelfth and thirteenth embodiments of the present invention, but may be adopted in any of the lamp modules of the present invention.
  • the reflection cells are formed to be concave and the LED chips are mounted on the concave reflection cells so that the light emitted from the LED chips is reflected onto the walls of the reflection cells.
  • a convex surface may be used as a reflection surface.
  • FIG. 17 is a sectional view of a lamp module according to a fourteenth embodiment of the present invention in which a reflection cell (11 ) includes a reflection layer (118) formed to cover an LED chip (2).
  • the reflection layer (118) has surfaces inclining toward an outside, thereby resulting in reflecting light emitted from an adjacent LED chip (2).
  • the reflection layer (118) is formed of a transparent insulating material.
  • a transparent insulating layer (52) is formed to cover the reflection layer
  • a via hole (225) is formed in the transparent insulating layer (52), and a transparent electrode layer (224) is formed on the transparent insulating layer (52) to be electrically connected to the LED chip (2) through the via hole (225).
  • the transparent insulating layer (52) is formed of a material denser than the reflection layer (118), because when light is input from a dense material to a sparser material, a total reflection occurs in the case where an incidence angle is larger than a critical angle. As a result, the light emitted from the adjacent LED chip is total reflected and emitted toward an upward direction of FIG. 17.
  • An optical material layer (119) including a fluorescent material or a light scattering material may be further included in the reflection layer (118) to improve light efficiency.
  • FIG. 18 is a sectional view of a lamp module according to a fifteenth embodiment of the present invention.
  • a reflection layer (118) as described in the fourteenth embodiment is applied to an LED chip (2) having scratch grooves (23) as described in the eleventh embodiment.
  • the effects of the lamp module according to the fifteenth embodiment are the same as those of the lamp modules described above.
  • FIGS. 19A and 19B are a plane view and a sectional view of a lamp module according to a sixteenth embodiment of the present invention.
  • reflection cells (11 ) are formed in concentric circles.
  • a first electrode lead (3) is combined with a lower surface of a substrate (1 ), and a second electrode lead (4) penetrates the substrate (1 ).
  • An insulating tube (53) is formed on the surface of the second electrode lead (4) to prevent the second electrode lead (4) from contacting the substrate (1 ).
  • heat emission fins (72) are integrally formed on the lower surface of the substrate (1 ).
  • Other structures of the lamp module according to the sixteenth embodiment of the present invention are the same as those described above, and thus, their descriptions will be omitted.
  • the structure of the lamp module according to the sixteen embodiment can be adopted to the lamp module described above.
  • An anion generating unit or a far-infrared ray generating unit may be added to the above described lamp modules to generate anions or far-infrared rays.
  • a material generating anions and far-infrared rays is formed of Monazite which is an anion stone and at least one of hardwood charcoal powder, elvan, yellow earth, jade, amethyst, rutile, and tourmaline.
  • the above described lamp modules may be assembled to a lamp unit (L) as shown in FIGS. 1A through 2B.
  • the lamp unit (L) may be formed on a lamp assembly (A) as shown in FIG. 20.
  • the lamp unit (L) is connected to a power supply (P) by interposing a buffering member (K) between the lamp unit (L) and the power supply (P).
  • the power supply (P) includes an
  • a first electrode terminal (32) and a second electrode terminal (42) are removed from the AC/DC converter (T) to be located outside of the power supply
  • Such a lamp assembly (A) can be of various shapes and used as a lamp. Referring to FIG. 21 , a reflector (R) to which a cover glass (C) is combined is assembled on a light emitting side of the lamp assembly (A).
  • the lamp assembly (A) Since a plurality of LED chips are integrated in the lamp assembly (A), high brightness is realized.
  • the lamp assembly (A) generates various colors by adding fluorescent materials in an insulating material. Accordingly, the lamp can be used as traffic lights and street lights.
  • the lamp assembly (A) of FIG. 21 may be used as a light bulb by connecting a socket (S) to the lamp assembly (A).
  • a first electrode lead and a second electrode lead are connected to the socket (S) by using a pipe (33) including electric wires.
  • FIGS. 23A and 23B are a plane view and a sectional view of a lamp module according to a seventeenth embodiment of the present invention.
  • a first electrode wiring (34) and a second electrode wiring (44) are patterned on an upper surface of a substrate (1) that is insulated, and a first electrode pin (35) and a second electrode pin (45) penetrate the substrate (1 ) so as to be electrically connected to the first electrode wiring (34) and the second electrode wiring (44), respectively.
  • a plurality of reflection cells (11 ) are formed between the first electrode wiring (34) and the second electrode wiring (44), and LED chips (2) are formed on the reflection cells (11). Thereafter, the LED chips (2) are connected to the first electrode wiring (34) and the second electrode wiring (44).
  • LED chips (2) are connected in a series to form a light emitting unit, and the LED chips (2) are connected to the first electrode wiring (34) and the second electrode wiring (44) to be parallel.
  • the number of the LED chips (2) forming the light emitting unit may be changed.
  • a first sealing unit (5) covering the reflection cells (11 ) is formed of an insulating material.
  • FIGS. 24 through 26 are views of a lamp module according to an eighteenth embodiment of the present invention.
  • the lamp module according to the eighteenth embodiment includes a substrate (1 ) shown in FIG. 24.
  • Reflection cells (11 ) are formed as lines on the substrate (1 ).
  • the reflection cells (11 ) may be formed as curved lines.
  • the substrate (1) may be formed of a metal, for example, aluminium, copper, or brass, ceramic, plastic, or synthetic resin.
  • a reflection layer is formed on the substrate and an insulation coating is formed on the reflection layer.
  • an insulation coating is formed on an upper surface of the substrate (1 ) to prevent wire patterns from short circuiting.
  • a heat pipe hole (74) is formed in the substrate (1 ) in a lateral direction.
  • first electrode screw holes (36) and a second electrode screw hole (46) are formed in the substrate (1 ).
  • first electrode wirings (34) and second electrode wirings (44) are formed on the substrate (1 ).
  • LED chips (2) are formed on the reflection cells (11 ) that are formed as lines between the first electrode wirings (34) and the second electrode wirings (44). The LED chips (2) and the electrode wirings (34, 44) are connected in a series and are parallel.
  • a mother board (8) in which a circuit unit (81 ) is patterned is mounted on a lower portion of the substrate (1 ).
  • First electrode pins (35) and a second electrode pin (45) are combined with the mother board (8) by penetrating the substrate (1 ).
  • the electrode pins (35, 45) penetrate the substrate (1 ) through the first electrode screw holes (36) and the second electrode screw hole (46) of the substrate (1 ), respectively, and are connected to the mother board (8) and to circuit units.
  • insulating coats (37) are formed on the electrode pins (35, 45) to insulate the electrode pins (35, 45) from the substrate (1 ).
  • the LED chips (2) may be arranged in a right direction for the sides of the LED chips (2) to face each other, and may be arranged in a slightly tilted direction for the sides of the LED chips (2) to form an acute angle against reflection surfaces of the reflection cells (11 ).
  • the LED chips (2) are arranged in a slightly tilted direction, the light emitted from the LED chips (2) is reflected on the sides of the adjacent LED chips (2) in an outwardly direction, resulting in the improvement of light efficiency.
  • a heat pipe is not formed in a substrate (1 ) but heat emission fins (72) are formed on a lower surface of the substrate (1 ).
  • a thermoelectric semiconductor may be used as a heat emission member.
  • reflection cells (11) are formed in circles, and one LED chip (2) is mounted on each reflection cell (11 ).
  • a reflection horn (115) is formed at the center of a reflection cell (11 ), and LED chips (2) are arranged around the reflection horn (115).
  • FIG. 30 according lo a twenty-second embodiment of the present invention, two lines of LED chips (2) are installed to be parallel on each reflection cell (11 ).
  • FIG. 31 according to a twenty-third embodiment of the present invention, reflection cells (11) are formed so as to be perpendicular to the lateral direction of a substrate (1 ), and LED chips (2) are arranged on inclining reflection surfaces of the reflection cells (11 ).
  • FIG. 32 according to a twenty-fourth embodiment of the present invention, a first electrode wiring (34) and a second electrode wiring (44) are formed on a square substrate (1), and LED chips (2) are arranged at the edges of the substrate.
  • the wires (34, 44), the LED chips (2), and electrode pins (35, 45) are connected by wires.
  • a substrate (1 ) is formed in a circle.
  • a substrate (1) is formed as a rectangle, and two lines of LED chips (2) are arranged.
  • electrode pins (35, 45) are connected to a central portion of the substrate (1 ); thus, interoperability of the lamp modules with conventional lamp modules is improved.
  • Other structures of the lamp modules according to the twenty-fourth through twenty-sixth embodiments of the present invention are the same as those described above, so their descriptions are omitted.
  • the lamp modules according to the twenty-fourth through twenty-sixth embodiments of the present invention further include anion generating units or far-infrared ray generating units to generate anions and far- infrared rays.
  • a material generating anions and far-infrared rays is formed of Monazite which is an anion stone and at least one of hardwood charcoal powder, elvan, yellow earth, jade, amethyst, rutile, and tourmaline.
  • FIG. 35 is an example of a lamp formed by assembling the above- described lamp modules.
  • more than one lamp module (M) are mounted on a mother board (8), and the mother board (8) is installed in a case (H).
  • the installation of the mother board (8) follows the method described with reference to FIG. 25B.
  • the case (H) includes a power supply (P), a controller (D) for controlling the brightness and the color of the lamp modules (M), and a program chip (E).
  • heat pipes (73) of the lamp modules (M) are connected to a heat sink (74), which is installed in the case (H), to improve heat emission efficiency.
  • heat emission fins (72) are installed outside of the case (H).
  • a reflector (R) including a lens (61) installed on a front surface of the reflector R may be installed on a side of the case (H) where light emission takes place.
  • a plurality of air flow holes (75) are formed in a substrate (1 ), and a lens (61 ) covers upper portions of reflection cells (11 ).
  • a lamp module according to the present invention is combined with a socket (S), and a cover glass (C) is combined with a light emission side of the lamp module to form a fluorescent lamp.
  • a fluorescent substance is coated on an inner surface of the cover glass (C), and an active gas is filled in the cover glass (C).
  • a donut-shaped reflecting mirror (F) is arranged in a cover glass (C) to improve brightness.
  • the lamp may be used as a traffic light.
  • a lamp module improving brightness and light emission efficiency is obtained by assembling a plurality of LEDs on a reflection cell.
  • lamp modules are mass produced and used as outdoor lighting by easily assembling the lamp modules having high brightness.
  • a lamp module according to the present invention can be applied to various lighting devices, such as a traffic light and a lighthouse.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un module de lampe utilisant une diode électroluminescente (LED), conçu de manière à améliorer l'intégration, la brillance, le rendement luminescent et la productivité, en disposant une pluralité de puces LED dans des modules. Le module de lampe selon l'invention comprend un substrat, une pluralité de cellules de réflexion formées sur une surface du substrat selon un modèle prédéterminé, au moins une puce LED, une première unité d'électrode formée sur le substrat et agissant comme électrode de la puce LED, et une seconde unité d'électrode, isolée de la première unité d'électrode, et agissant comme une autre électrode de la puce LED.
PCT/KR2004/000120 2003-01-25 2004-01-24 Module de lampe a diode electroluminescente WO2004068596A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20030005093 2003-01-25
KR10-2003-0005093 2003-01-25
KR20030060452 2003-08-29
KR10-2003-0060452 2003-08-29

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WO2004068596A1 true WO2004068596A1 (fr) 2004-08-12

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WO (1) WO2004068596A1 (fr)

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DE102005019375A1 (de) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh LED-Array
EP1715523A1 (fr) * 2005-04-21 2006-10-25 C.R.F. Società Consortile per Azioni Dispositif d'affichage transparent à diodes LED
EP1715522A1 (fr) * 2005-04-21 2006-10-25 C.R.F. Società Consortile per Azioni Dispositif d'affichage transparent à diodes LED et son procédé de fabrication
WO2007122555A1 (fr) * 2006-04-25 2007-11-01 Koninklijke Philips Electronics N.V. Diodes led immergees
WO2009139787A1 (fr) * 2008-05-12 2009-11-19 Occam Portfolio Llc Ensemble boîtier de diodes électroluminescentes
WO2012004049A1 (fr) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Diode électroluminescente
EP2779807A1 (fr) * 2013-03-15 2014-09-17 ABL IP Holding LLC Optique pour source de lumière
EP2851198A1 (fr) * 2013-09-23 2015-03-25 GEW (EC) Limited Appareil de durcissement d'encre à DEL
JP2015073131A (ja) * 2015-01-05 2015-04-16 ローム株式会社 Ｌｅｄ発光体およびｌｅｄ電球
US9559142B2 (en) 2012-12-10 2017-01-31 Apple Inc. Active matrix display panel with ground tie lines
US9620487B2 (en) 2012-12-10 2017-04-11 Apple Inc. Light emitting device reflective bank structure
EP3597268B1 (fr) 2018-07-19 2020-10-28 JK-Holding GmbH Dispositif et procédé d'irradiation

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KR100719072B1 (ko) * 2005-10-28 2007-05-16 (주) 아모센스 엘이디 패키지의 세라믹의 경사면 형성 방법
KR100742249B1 (ko) * 2005-11-07 2007-07-24 진재필 신호등
KR100779120B1 (ko) * 2005-12-20 2007-11-23 서울반도체 주식회사 측면 발광 다이오드 패키지
JP3914954B1 (ja) * 2006-05-24 2007-05-16 株式会社エレメント電子 発光装置およびその製造方法
KR100756897B1 (ko) 2007-01-26 2007-09-07 주식회사 혜성엘앤엠 Ｌｅｄ 발광 조명등
KR100889603B1 (ko) * 2007-06-26 2009-03-20 (주)아스트로 방열 기능이 향상된 조명용 발광 다이오드 모듈
KR100930502B1 (ko) * 2008-01-16 2009-12-09 (주)웨이브닉스이에스피 금속 기판을 이용한 광소자 패키지 플랫폼 제조방법
KR100897072B1 (ko) * 2008-08-13 2009-05-14 이금용 엘이디 조명 어셈블리
KR101005324B1 (ko) 2009-01-07 2011-01-05 오명호 Ｌｅｄ 조명램프
KR101460027B1 (ko) 2013-03-15 2014-11-12 지스마트 주식회사 패턴간의 간섭을 방지하는 패턴 안전장치
KR101895452B1 (ko) 2017-12-08 2018-09-06 주식회사 포메링 공랭식 led 조명등기구
KR102526778B1 (ko) 2018-08-07 2023-05-02 삼성디스플레이 주식회사 표시 장치 및 표시 장치 제조 방법
CN112268237B (zh) * 2020-10-20 2022-06-21 深圳市好兵光电科技有限公司 一种多基色无光斑柔性灯带

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US7726835B2 (en) 2005-02-28 2010-06-01 Osram Opto Semiconductors Gmbh LED array
DE102005019375A1 (de) * 2005-02-28 2006-09-07 Osram Opto Semiconductors Gmbh LED-Array
EP1715523A1 (fr) * 2005-04-21 2006-10-25 C.R.F. Società Consortile per Azioni Dispositif d'affichage transparent à diodes LED
EP1715522A1 (fr) * 2005-04-21 2006-10-25 C.R.F. Società Consortile per Azioni Dispositif d'affichage transparent à diodes LED et son procédé de fabrication
JP2006301650A (ja) * 2005-04-21 2006-11-02 Crf Soc Consortile Per Azioni 透明なｌｅｄディスプレイ及びその製造方法
US7884784B2 (en) 2005-04-21 2011-02-08 C.R.F. Societa Consortile Per Azioni Transparent LED display
US7932524B2 (en) 2005-04-21 2011-04-26 C.R.F. Societa Consortile Per Azioni Transparent LED display and method for manufacture thereof
WO2007122555A1 (fr) * 2006-04-25 2007-11-01 Koninklijke Philips Electronics N.V. Diodes led immergees
US7905635B2 (en) 2006-04-25 2011-03-15 Koninklijke Phillips Electronics N.V. Immersed LEDs
US20120077293A1 (en) * 2008-05-12 2012-03-29 Occam Portfolio Llc Light-Emitting Diode Package Assembly
WO2009139787A1 (fr) * 2008-05-12 2009-11-19 Occam Portfolio Llc Ensemble boîtier de diodes électroluminescentes
US8067777B2 (en) 2008-05-12 2011-11-29 Occam Portfolio Llc Light emitting diode package assembly
US8890306B2 (en) 2010-07-07 2014-11-18 Osram Opto Semiconductor Gmbh Light-emitting diode
US9431378B2 (en) 2010-07-07 2016-08-30 Osram Opto Semiconductors Gmbh Light-emitting diodes
WO2012004049A1 (fr) * 2010-07-07 2012-01-12 Osram Opto Semiconductors Gmbh Diode électroluminescente
US10043784B2 (en) 2012-12-10 2018-08-07 Apple Inc. Light emitting device reflective bank structure
US10784236B2 (en) 2012-12-10 2020-09-22 Apple Inc. Light emitting device reflective bank structure
US11916048B2 (en) 2012-12-10 2024-02-27 Apple Inc. Light emitting device reflective bank structure
US11373986B2 (en) 2012-12-10 2022-06-28 Apple Inc. Light emitting device reflective bank structure
US9559142B2 (en) 2012-12-10 2017-01-31 Apple Inc. Active matrix display panel with ground tie lines
US9620487B2 (en) 2012-12-10 2017-04-11 Apple Inc. Light emitting device reflective bank structure
US10578276B2 (en) 2013-03-15 2020-03-03 Abl Ip Holding Llc Optic for a light source
EP2779807A1 (fr) * 2013-03-15 2014-09-17 ABL IP Holding LLC Optique pour source de lumière
US10890313B2 (en) 2013-03-15 2021-01-12 Abl Ip Holding Llc Optic for a light source
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
EP2851198A1 (fr) * 2013-09-23 2015-03-25 GEW (EC) Limited Appareil de durcissement d'encre à DEL
JP2015073131A (ja) * 2015-01-05 2015-04-16 ローム株式会社 Ｌｅｄ発光体およびｌｅｄ電球
EP3597268B1 (fr) 2018-07-19 2020-10-28 JK-Holding GmbH Dispositif et procédé d'irradiation
DE202019005804U1 (de) 2018-07-19 2022-03-23 Jk-Holding Gmbh Bestrahlungsvorrichtung

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KR20040068504A (ko) 2004-07-31
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