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WO2004066369A3 - Carrier, holder, laser cutting device and method for separating semiconductor products using laser light - Google Patents

Carrier, holder, laser cutting device and method for separating semiconductor products using laser light Download PDF

Info

Publication number
WO2004066369A3
WO2004066369A3 PCT/NL2004/000040 NL2004000040W WO2004066369A3 WO 2004066369 A3 WO2004066369 A3 WO 2004066369A3 NL 2004000040 W NL2004000040 W NL 2004000040W WO 2004066369 A3 WO2004066369 A3 WO 2004066369A3
Authority
WO
WIPO (PCT)
Prior art keywords
holder
carrier
laser light
cutting device
semiconductor products
Prior art date
Application number
PCT/NL2004/000040
Other languages
French (fr)
Other versions
WO2004066369A2 (en
Inventor
Egmond Henri Joseph Van
Joannes Leonardus Jurrian Zijl
Marcel Hermanus Johanne Rensen
Original Assignee
Fico Bv
Egmond Henri Joseph Van
Joannes Leonardus Jurrian Zijl
Marcel Hermanus Johanne Rensen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico Bv, Egmond Henri Joseph Van, Joannes Leonardus Jurrian Zijl, Marcel Hermanus Johanne Rensen filed Critical Fico Bv
Priority to JP2006500732A priority Critical patent/JP2006517730A/en
Priority to EP04703293A priority patent/EP1588405A2/en
Priority to US10/542,213 priority patent/US20060231454A1/en
Publication of WO2004066369A2 publication Critical patent/WO2004066369A2/en
Publication of WO2004066369A3 publication Critical patent/WO2004066369A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention relates to a carrier and to a holder for supporting and engaging semiconductor products during separating of the products using laser light. The invention also relates to a method for supporting and engaging semiconductor products during separating of the products using laser light.
PCT/NL2004/000040 2003-01-22 2004-01-19 Carrier, holder, laser cutting device and method for separating semiconductor products using laser light WO2004066369A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006500732A JP2006517730A (en) 2003-01-22 2004-01-19 Carrier, holder, laser cutting device, and method for separating semiconductor product using laser beam
EP04703293A EP1588405A2 (en) 2003-01-22 2004-01-19 Carrier, holder, laser cutting device and method for separating semiconductor products using laser light
US10/542,213 US20060231454A1 (en) 2003-01-22 2004-01-19 Carrier, holder, laser cutting device and method for separating semiconductor products using laser light

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1022463 2003-01-22
NL1022463A NL1022463C2 (en) 2003-01-22 2003-01-22 Support, holder, laser cutting device and method for separating semiconductor products with the aid of laser light.

Publications (2)

Publication Number Publication Date
WO2004066369A2 WO2004066369A2 (en) 2004-08-05
WO2004066369A3 true WO2004066369A3 (en) 2004-09-30

Family

ID=32768719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2004/000040 WO2004066369A2 (en) 2003-01-22 2004-01-19 Carrier, holder, laser cutting device and method for separating semiconductor products using laser light

Country Status (8)

Country Link
US (1) US20060231454A1 (en)
EP (1) EP1588405A2 (en)
JP (1) JP2006517730A (en)
KR (1) KR20050099506A (en)
CN (1) CN1742359A (en)
NL (1) NL1022463C2 (en)
TW (1) TW200417101A (en)
WO (1) WO2004066369A2 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1027929C2 (en) * 2004-12-31 2006-07-03 Fico Bv Holder for supporting objects such as electronic components during separation using laser, comprises gas permeable flexible layer located above suction holes in support
DE102006003591A1 (en) 2005-01-26 2006-08-17 Disco Corporation Laser beam processing machine
DE102005046031B3 (en) 2005-09-26 2007-07-12 Schott Ag Process for separating parts from a substrate
KR101079365B1 (en) * 2006-09-27 2011-11-02 시바우라 메카트로닉스 가부시끼가이샤 Film cutting apparatus, and film cutting method
WO2013082076A1 (en) * 2011-11-30 2013-06-06 Corning Incorporated Carrier for thin glass sheets and method of using
DE102016106706A1 (en) * 2016-04-12 2017-10-12 Laser Imaging Systems Gmbh Device for fixing objects by means of vacuum
CN113547225A (en) * 2020-04-22 2021-10-26 鸿鎷科技有限公司 Precision ceramic table with quartz base

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102850A (en) * 1989-09-18 1991-04-30 Fujitsu Ltd Wafer holder
WO2001075966A1 (en) * 2000-04-04 2001-10-11 Synova S.A. Method for cutting an object and for further processing the cut material and a carrier for holding the object or the cut material
US20020139235A1 (en) * 2001-02-20 2002-10-03 Nordin Brett William Singulation apparatus and method for manufacturing semiconductors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028991U (en) * 1983-08-02 1985-02-27 日本電気株式会社 Laser processing equipment
TW524873B (en) * 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
JPH1140523A (en) * 1997-07-22 1999-02-12 Mitsubishi Electric Corp Substrate cutting device and substrate cutting method
JP2000164535A (en) * 1998-11-24 2000-06-16 Mitsubishi Electric Corp Laser working device
JP2000164536A (en) * 1998-11-25 2000-06-16 Disco Abrasive Syst Ltd Chuck table
US6885522B1 (en) * 1999-05-28 2005-04-26 Fujitsu Limited Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
JP2002144070A (en) * 2000-11-02 2002-05-21 Tdk Corp Device for supporting work for laser beam machining

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03102850A (en) * 1989-09-18 1991-04-30 Fujitsu Ltd Wafer holder
WO2001075966A1 (en) * 2000-04-04 2001-10-11 Synova S.A. Method for cutting an object and for further processing the cut material and a carrier for holding the object or the cut material
US20020139235A1 (en) * 2001-02-20 2002-10-03 Nordin Brett William Singulation apparatus and method for manufacturing semiconductors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 015, no. 291 (E - 1093) 24 July 1991 (1991-07-24) *

Also Published As

Publication number Publication date
WO2004066369A2 (en) 2004-08-05
EP1588405A2 (en) 2005-10-26
US20060231454A1 (en) 2006-10-19
NL1022463C2 (en) 2004-07-26
CN1742359A (en) 2006-03-01
TW200417101A (en) 2004-09-01
JP2006517730A (en) 2006-07-27
KR20050099506A (en) 2005-10-13

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