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WO2004066369A2 - Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser - Google Patents

Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser Download PDF

Info

Publication number
WO2004066369A2
WO2004066369A2 PCT/NL2004/000040 NL2004000040W WO2004066369A2 WO 2004066369 A2 WO2004066369 A2 WO 2004066369A2 NL 2004000040 W NL2004000040 W NL 2004000040W WO 2004066369 A2 WO2004066369 A2 WO 2004066369A2
Authority
WO
WIPO (PCT)
Prior art keywords
plate
carrier
products
holes
semiconductor products
Prior art date
Application number
PCT/NL2004/000040
Other languages
English (en)
Other versions
WO2004066369A3 (fr
Inventor
Henri Joseph Van Egmond
Joannes Leonardus Jurrian Zijl
Marcel Hermanus Johannes Rensen
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Priority to JP2006500732A priority Critical patent/JP2006517730A/ja
Priority to EP04703293A priority patent/EP1588405A2/fr
Priority to US10/542,213 priority patent/US20060231454A1/en
Publication of WO2004066369A2 publication Critical patent/WO2004066369A2/fr
Publication of WO2004066369A3 publication Critical patent/WO2004066369A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Definitions

  • the invention relates to a carrier and to a holder for supporting and engaging semiconductor products during separating of the products using laser light.
  • the invention also relates to a method for supporting and engaging semiconductor products during separating of the products using laser light.
  • the foil When the semiconductor components are separated with laser light, the foil remains (at least substantially) intact, so that even after the assembly of semiconductor products has been cut through the semiconductor components are still connected to each other by the foil layer.
  • the problem of positioning semiconductor components of limited dimensions (for instance with a surface area of less than 0.36 mm 2 ) can thus be solved using the foil.
  • the drawback however is that arranging and removing the foil are costly operations.
  • the foil material also has the effect of increasing cost price.
  • the separated semiconductor products can be contaminated by for instance glue residues that are left behind.
  • the international patent application WO 01 75966 describes a method of separating objects by means of a laser and water beam. Prior to cutting, the objects are arranged for this purpose on a carrier provided with adhesive. The laser and water beam is displaced over the object along a contour for cutting out in order to separate the products, whereafter the cut-out products still adhering to the carrier are available for further processing.
  • the carrier can be permeable for laser radiation.
  • a specific embodiment variant describes a carrier embodied as a mat which makes use, among other things, of underpressure for a further processing of the cut-out products.
  • the object of the present invention is to simplify and make cheaper the separation of semiconductor products by means of laser cutting.
  • the invention provides for this purpose a carrier for supporting and engaging semiconductor products during separating of the products using laser light, comprising: a plate provided with a pattern of holes arranged in a flat carrying side of the plate, which plate is manufactured from a material at least substantially not absorbing the laser light. Examples of such materials are glass and ceramic. A material at least partially permeable to laser light will not absorb any energy, or hardly any, from the laser light and will not therefore be damaged under the influence of the laser beam. By means of the pattern of holes an underpressure can be exerted on the assembly of semiconductor products (and, after separation, on the individual components), this being further elucidated hereinbelow.
  • glass as material for the plate is that it is not expensive and, in addition, can be readily processed by means of micro-mechanical production techniques (for instance powder blasting). Boro-silicate glass is thus suitable for manufacturing a plate which can be applied in combination with a YAG laser (1064 nm).
  • a YAG laser 1064 nm
  • zinc selenide embodied as a ceramic material
  • CO 2 laser 10600 nm
  • calcium fluoride likewise embodied as a ceramic material
  • UV laser 354 nm
  • laser light is understood to mean electromechanical radiation in a single colour, or electromechanical radiation comprising substantially a single wavelength.
  • carriers can be manufactured with a very large number of holes (up to more than 100 holes per cm 2 ) with great precision in respect of dimensioning.
  • the use of adhesive foil becomes unnecessary due to the carrier according to the invention, which has the effect of reducing cost and whereby the problem of glue residues being left on semiconductor products is obviated.
  • the cross-sections through the holes close to the carrying side of the plate are larger than at a distance from the carrying side. This is the case when the holes have a top angle between 15 and 45°, preferably a top angle of 30°.
  • the surface area of the assembly of semiconductor products on which an underpressure is exerted can thus be enlarged, with the advantage that the assembly of semiconductor products is drawn with a greater force against the plate. This results in improved engaging of the assembly of semiconductor products and the separated components.
  • the pattern of holes will generally be grid-shaped as the semiconductor products are generally also placed in a grid form on the assembly of semiconductor products.
  • each product After separation of the products, each product must still cover at least one hole of the pattern of holes such that using this covered hole an underpressure is still exerted on the product for positioning thereof.
  • the carrier can have product-related dimensions (in particular the pattern of holes) although it is also possible to envisage that diverse products with the same carrier can be processed, provided account is taken in the design of the placing of the semiconductor products in the assembly of semiconductor products.
  • the invention also provides a holder for supporting and engaging semiconductor products during separating of the products using laser light, comprising a carrier as described above and means for generating underpressure connecting onto the side of the plate remote from the carrying side.
  • a holder for supporting and engaging semiconductor products during separating of the products using laser light comprising a carrier as described above and means for generating underpressure connecting onto the side of the plate remote from the carrying side.
  • such means for generating underpressure connecting onto the side of the plate remote from the carrying side are formed by a chamber connecting onto the carrier and an extractor connecting onto the chamber.
  • the means for generating underpressure can be thus connected in simple manner to all holes in the carrier.
  • the chamber is preferably also provided with positioning means for the carrier, so that the carrier can be correctly positioned in simple manner relative to the means for generating underpressure. Also an advantage is that the carrier can thus be mounted for easy exchange with the means for generating underpressure.
  • the invention furthermore provides a laser cutting device for supporting and engaging semiconductor products during separating of the products using laser light, provided with a holder as described, wherein the laser source is located on the carrying side of the plate.
  • the laser source is located on the carrying side of the plate.
  • the laser beam comes into direct contact with the assembly of semiconductor products. It must be possible to displace the plate and the laser beam in precisely controllable manner relative to each other with displacing means in order to thus be able to determine precisely the position of separation of the assembly of semiconductor products.
  • the invention further provides a method for supporting and engaging semiconductor products during separating of the products using laser light, comprising the processing steps of: A) placing an assembly of semiconductor products for separating onto a flat plate provided with a pattern of holes, B) applying an underpressure to the holes of the pattern of holes such that the assembly of semiconductor products is drawn against the plate, C) directing at least one laser beam onto the assembly and cutting through the assembly where this is desired by means of mutual displacement of the laser source and the flat plate such that each severed semiconductor product is still connected to at least one hole in the flat plate, and D) taking the separated products from the plate.
  • the assembly of semiconductor products often has a form deviating slightly from flat as a result of heating during previous processing steps.
  • an assembly of semiconductor products which is warped to some extent can be made flat once again before the cutting operation begins.
  • the assembly of semiconductor products is preferably drawn against the plate during processing step B) such that possible deviations in the flatness in the contact side of the assembly are removed by the suction of the plate. It will be apparent that this will have a positive effect on the accuracy during separation.
  • figure 1 shows a view of the carrier according to the invention
  • figure 2 shows a perspective view of a holder according to the invention
  • figure 3 is a perspective view of a holder according to the invention with a lead frame placed thereon from which a number of semiconductor products have been released
  • figure 4 shows a view of a cross-section through a part of a carrier.
  • Figure 1 shows a carrier 1 manufactured from a transparent material which can hardly be activated by laser light.
  • Arranged in carrier 1 is a grid-like pattern of holes 2 built up of individual holes 3 with which an assembly of semiconductor products, not shown in this figure, can be engaged.
  • FIG. 2 shows a holder 4 according to the invention of which a carrier 5 forms part. Holes 6 in carrier 5 are shown schematically.
  • a vacuum chamber 7 is provided with a central opening 8 to which a pump 11 connects via a throughfeed 9 and a pipe 10.
  • pump 11 By activating pump 11 an underpressure can be generated in vacuum chamber 7, at least when carrier 5 connects onto chamber 7. The consequence is that air will then be drawn in through holes 6.
  • an underpressure will be exerted on assembly 12 by the holes.
  • FIG. 3 shows a lead frame 13 having a housing 14 injected thereon with which a plurality of semiconductor products (not shown) are encapsulated. Such a unit has already been designated above as an assembly of semiconductor products.
  • Lead frame 13 is sucked down by openings 15 in a carrier 16. It is noted that some of the openings 15 in carrier 16 are not covered by lead frame 13; this is not a problem however, at least when the means for generating an underpressure on the non- visible side of carrier 16 are sufficiently powerful.
  • Also shown in this figure are cutting lines 17 in housing 14 where separation of the individual semiconductor products 18 has taken place.
  • figure 4 shows a cross-section through a part of carrier 16, wherein an opening 15 is shown in more detail.
  • the opening 15 On a carrying side 19 of carrier 16 the opening 15 has a larger cross-section than at a greater distance from the carrying side 19. Opening 19 thus forms a kind of cup whereby the area is relatively large over which underpressure can be applied to an assembly of semiconductor products 12 (figure 2) or to already separated products 18 (figure 3).
  • blow air can be carried through opening 15 in a direction opposite to the suction during underpressure situations.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne une plaque de support et un dispositif de support destinés à soutenir et à fixer des produits à semiconducteurs au cours de la séparation par lumière laser desdits produits. L'invention se rapporte également à un procédé permettant de soutenir et fixer des produits à semiconducteurs au cours de leur séparation par lumière laser.
PCT/NL2004/000040 2003-01-22 2004-01-19 Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser WO2004066369A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2006500732A JP2006517730A (ja) 2003-01-22 2004-01-19 キャリヤ、ホルダー、レーザー切断装置及びレーザー光を使用する半導体製品の分離方法
EP04703293A EP1588405A2 (fr) 2003-01-22 2004-01-19 Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser
US10/542,213 US20060231454A1 (en) 2003-01-22 2004-01-19 Carrier, holder, laser cutting device and method for separating semiconductor products using laser light

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1022463 2003-01-22
NL1022463A NL1022463C2 (nl) 2003-01-22 2003-01-22 Drager, houder, lasersnij-inrichting en werkwijze voor het met behulp van laserlicht separeren van halfgeleider producten.

Publications (2)

Publication Number Publication Date
WO2004066369A2 true WO2004066369A2 (fr) 2004-08-05
WO2004066369A3 WO2004066369A3 (fr) 2004-09-30

Family

ID=32768719

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2004/000040 WO2004066369A2 (fr) 2003-01-22 2004-01-19 Plaque de support, dispositif de support, dispositif de decoupage au laser, et procede permettant de separer des produits a semiconducteurs au moyen d'un lumiere laser

Country Status (8)

Country Link
US (1) US20060231454A1 (fr)
EP (1) EP1588405A2 (fr)
JP (1) JP2006517730A (fr)
KR (1) KR20050099506A (fr)
CN (1) CN1742359A (fr)
NL (1) NL1022463C2 (fr)
TW (1) TW200417101A (fr)
WO (1) WO2004066369A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1027929C2 (nl) * 2004-12-31 2006-07-03 Fico Bv Houder en werkwijze voor het separeren van objecten, en flexibele materiaallaag met gesepareerde objecten.
US7642485B2 (en) 2005-01-26 2010-01-05 Disco Corporation Laser beam processing machine
US8193073B2 (en) 2005-09-26 2012-06-05 Schott Ag Method for separating parts from a substrate

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101079365B1 (ko) * 2006-09-27 2011-11-02 시바우라 메카트로닉스 가부시끼가이샤 필름 커트 장치 및 필름 커트 방법
WO2013082076A1 (fr) * 2011-11-30 2013-06-06 Corning Incorporated Support pour feuilles de verre mince et procédé d'utilisation
DE102016106706A1 (de) * 2016-04-12 2017-10-12 Laser Imaging Systems Gmbh Vorrichtung zum Fixieren von Objekten mittels Vakuum
CN113547225A (zh) * 2020-04-22 2021-10-26 鸿鎷科技有限公司 具有石英底座的精密陶瓷工作台

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6028991U (ja) * 1983-08-02 1985-02-27 日本電気株式会社 レ−ザ加工装置
JPH03102850A (ja) * 1989-09-18 1991-04-30 Fujitsu Ltd ウェハホルダ
TW524873B (en) * 1997-07-11 2003-03-21 Applied Materials Inc Improved substrate supporting apparatus and processing chamber
JPH1140523A (ja) * 1997-07-22 1999-02-12 Mitsubishi Electric Corp 基板切断装置および基板切断方法
JP2000164535A (ja) * 1998-11-24 2000-06-16 Mitsubishi Electric Corp レーザ加工装置
JP2000164536A (ja) * 1998-11-25 2000-06-16 Disco Abrasive Syst Ltd チャックテーブル
US6885522B1 (en) * 1999-05-28 2005-04-26 Fujitsu Limited Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
ATE375603T1 (de) * 2000-04-04 2007-10-15 Synova Sa Verfahren zum schneiden eines gegenstands und zur weiterverarbeitung des schnittguts sowie träger zum halten des gegenstands bzw. des schnittguts
JP2002144070A (ja) * 2000-11-02 2002-05-21 Tdk Corp レーザ加工用被加工物支持装置
US20020139235A1 (en) * 2001-02-20 2002-10-03 Nordin Brett William Singulation apparatus and method for manufacturing semiconductors

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL1027929C2 (nl) * 2004-12-31 2006-07-03 Fico Bv Houder en werkwijze voor het separeren van objecten, en flexibele materiaallaag met gesepareerde objecten.
US7642485B2 (en) 2005-01-26 2010-01-05 Disco Corporation Laser beam processing machine
US8193073B2 (en) 2005-09-26 2012-06-05 Schott Ag Method for separating parts from a substrate

Also Published As

Publication number Publication date
EP1588405A2 (fr) 2005-10-26
US20060231454A1 (en) 2006-10-19
NL1022463C2 (nl) 2004-07-26
CN1742359A (zh) 2006-03-01
TW200417101A (en) 2004-09-01
JP2006517730A (ja) 2006-07-27
KR20050099506A (ko) 2005-10-13
WO2004066369A3 (fr) 2004-09-30

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