WO2004043849A3 - Procede de realisation d'un composant comportant un micro-joint et composant realise par ce procede - Google Patents
Procede de realisation d'un composant comportant un micro-joint et composant realise par ce procede Download PDFInfo
- Publication number
- WO2004043849A3 WO2004043849A3 PCT/FR2003/003288 FR0303288W WO2004043849A3 WO 2004043849 A3 WO2004043849 A3 WO 2004043849A3 FR 0303288 W FR0303288 W FR 0303288W WO 2004043849 A3 WO2004043849 A3 WO 2004043849A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- micro
- component
- joint
- production
- polymer layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
- 238000000034 method Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 abstract 7
- 229920000642 polymer Polymers 0.000 abstract 5
- 239000000126 substance Substances 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
- B29C65/526—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive by printing or by transfer from the surfaces of elements carrying the adhesive, e.g. using brushes, pads, rollers, stencils or silk screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J19/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J19/0093—Microreactors, e.g. miniaturised or microfabricated reactors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/112—Single lapped joints
- B29C66/1122—Single lap to lap joints, i.e. overlap joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/13—Single flanged joints; Fin-type joints; Single hem joints; Edge joints; Interpenetrating fingered joints; Other specific particular designs of joint cross-sections not provided for in groups B29C66/11 - B29C66/12
- B29C66/131—Single flanged joints, i.e. one of the parts to be joined being rigid and flanged in the joint area
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/53—Joining single elements to tubular articles, hollow articles or bars
- B29C66/534—Joining single elements to open ends of tubular or hollow articles or to the ends of bars
- B29C66/5346—Joining single elements to open ends of tubular or hollow articles or to the ends of bars said single elements being substantially flat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/54—Joining several hollow-preforms, e.g. half-shells, to form hollow articles, e.g. for making balls, containers; Joining several hollow-preforms, e.g. half-cylinders, to form tubular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00119—Arrangement of basic structures like cavities or channels, e.g. suitable for microfluidic systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00357—Creating layers of material on a substrate involving bonding one or several substrates on a non-temporary support, e.g. another substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/008—Aspects related to assembling from individually processed components, not covered by groups B81C3/001 - B81C3/002
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00783—Laminate assemblies, i.e. the reactor comprising a stack of plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00819—Materials of construction
- B01J2219/00833—Plastic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J2219/00—Chemical, physical or physico-chemical processes in general; Their relevant apparatus
- B01J2219/00781—Aspects relating to microreactors
- B01J2219/00851—Additional features
- B01J2219/00858—Aspects relating to the size of the reactor
- B01J2219/0086—Dimensions of the flow channels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/06—Fluid handling related problems
- B01L2200/0689—Sealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
- B01L2200/12—Specific details about manufacturing devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/04—Closures and closing means
- B01L2300/041—Connecting closures to device or container
- B01L2300/044—Connecting closures to device or container pierceable, e.g. films, membranes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L2300/00—Additional constructional details
- B01L2300/08—Geometry, shape and general structure
- B01L2300/0809—Geometry, shape and general structure rectangular shaped
- B01L2300/0819—Microarrays; Biochips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/02—Preparation of the material, in the area to be joined, prior to joining or welding
- B29C66/024—Thermal pre-treatments
- B29C66/0242—Heating, or preheating, e.g. drying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/756—Microarticles, nanoarticles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0214—Biosensors; Chemical sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/05—Microfluidics
- B81B2201/058—Microfluidics not provided for in B81B2201/051 - B81B2201/054
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/019—Bonding or gluing multiple substrate layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Dispersion Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Analytical Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Clinical Laboratory Science (AREA)
- Hematology (AREA)
- Organic Chemistry (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
- Micromachines (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03767900A EP1558518A2 (fr) | 2002-11-08 | 2003-11-04 | Procede de realisation d'un composant comportant un micro-joint et composant realise par ce procede |
US10/533,296 US20060048885A1 (en) | 2002-11-08 | 2003-11-04 | Method for reproduction of a compnent with a micro-joint and component produced by said method |
JP2004550736A JP2006505418A (ja) | 2002-11-08 | 2003-11-04 | 微小接合部付きコンポーネントの製造方法及び該製造方法により製造されたコンポーネント |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR02/13998 | 2002-11-08 | ||
FR0213998A FR2846906B1 (fr) | 2002-11-08 | 2002-11-08 | Procede de realisation d'un composant comportant un micro-joint et composant realise par ce procede |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004043849A2 WO2004043849A2 (fr) | 2004-05-27 |
WO2004043849A3 true WO2004043849A3 (fr) | 2004-07-08 |
Family
ID=32116466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/FR2003/003288 WO2004043849A2 (fr) | 2002-11-08 | 2003-11-04 | Procede de realisation d'un composant comportant un micro-joint et composant realise par ce procede |
Country Status (5)
Country | Link |
---|---|
US (1) | US20060048885A1 (fr) |
EP (1) | EP1558518A2 (fr) |
JP (1) | JP2006505418A (fr) |
FR (1) | FR2846906B1 (fr) |
WO (1) | WO2004043849A2 (fr) |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0711430B2 (ja) * | 1985-09-13 | 1995-02-08 | キヤノン電子株式会社 | エンコ−ダ装置 |
US7521292B2 (en) | 2004-06-04 | 2009-04-21 | The Board Of Trustees Of The University Of Illinois | Stretchable form of single crystal silicon for high performance electronics on rubber substrates |
CN102683391B (zh) * | 2004-06-04 | 2015-11-18 | 伊利诺伊大学评议会 | 用于制造并组装可印刷半导体元件的方法和设备 |
EP1652579A1 (fr) * | 2004-10-28 | 2006-05-03 | CSEM Centre Suisse d'Electronique et de Microtechnique SA Recherche et Développement | Systèmes fluidiques comprenant un capillaire et procédé pour leur fabrication. |
WO2006061025A2 (fr) * | 2004-12-09 | 2006-06-15 | Inverness Medical Switzerland Gmbh | Dispositif microfluidique et son procede de production |
US7473616B2 (en) * | 2004-12-23 | 2009-01-06 | Miradia, Inc. | Method and system for wafer bonding of structured substrates for electro-mechanical devices |
WO2006074665A2 (fr) * | 2005-01-12 | 2006-07-20 | Inverness Medical Switzerland Gmbh | Procede permettant de produire un dispositif microfluidique et dispositifs microfluidiques correspondants |
TWI306490B (en) * | 2006-02-27 | 2009-02-21 | Nat Applied Res Laboratoires | Apparatus for driving microfluid driving the method thereof |
US8877484B2 (en) | 2007-01-10 | 2014-11-04 | Scandinavian Micro Biodevices Aps | Microfluidic device and a microfluidic system and a method of performing a test |
US7901527B2 (en) * | 2007-03-02 | 2011-03-08 | Konica Minolta Opto, Inc. | Microchip manufacturing method |
WO2009120394A2 (fr) * | 2008-01-04 | 2009-10-01 | Massachusetts Institute Of Technology | Procédé et appareil pour former des structures de nanoperles de polymère |
WO2010017441A2 (fr) * | 2008-08-07 | 2010-02-11 | Massachusetts Institute Of Technology | Procédé et appareil de traçage de motifs latéral et vertical simultanément sur des pellicules organiques moléculaires |
US8748219B2 (en) * | 2008-09-08 | 2014-06-10 | Massachusetts Institute Of Technology | Method and apparatus for super radiant laser action in half wavelength thick organic semiconductor microcavities |
US8963262B2 (en) | 2009-08-07 | 2015-02-24 | Massachusettes Institute Of Technology | Method and apparatus for forming MEMS device |
US8739390B2 (en) * | 2008-12-16 | 2014-06-03 | Massachusetts Institute Of Technology | Method for microcontact printing of MEMS |
KR101942967B1 (ko) * | 2012-12-12 | 2019-01-28 | 삼성전자주식회사 | 실록산계 단량체를 이용한 접합 기판 구조체 및 그 제조방법 |
CN103542956A (zh) * | 2013-09-29 | 2014-01-29 | 柳州市宏亿科技有限公司 | 一种Zigbee的温度传感器制作方法 |
US9105800B2 (en) * | 2013-12-09 | 2015-08-11 | Raytheon Company | Method of forming deposited patterns on a surface |
US10986435B2 (en) | 2017-04-18 | 2021-04-20 | Massachusetts Institute Of Technology | Electrostatic acoustic transducer utilized in a hearing aid or audio processing system |
ES2775649B2 (es) * | 2018-07-24 | 2020-12-01 | Consejo Superior Investigacion | Procedimiento de transferencia de motivos micro- y/o nano- estructurados a superficies arbitrarias |
FR3103805A1 (fr) * | 2019-12-02 | 2021-06-04 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de depot localise d’un materiau sur un element |
CN111250185B (zh) * | 2020-02-21 | 2022-11-04 | 京东方科技集团股份有限公司 | 微流控芯片的制备方法及制备装置 |
CN114308161B (zh) * | 2021-12-31 | 2023-07-25 | 上海中航光电子有限公司 | 微流控芯片及其制作方法 |
Citations (2)
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WO1994029400A1 (fr) * | 1993-06-15 | 1994-12-22 | Pharmacia Biotech Ab | Procede de production de structures a microcanaux/microcavites |
WO2003055790A1 (fr) * | 2001-12-31 | 2003-07-10 | Gyros Ab | Dispositif microfluidique et son procede de fabrication |
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US4456570A (en) * | 1982-07-26 | 1984-06-26 | Ethyl Corporation | Treatment of perforated film |
US5147397A (en) * | 1990-07-03 | 1992-09-15 | Allergan, Inc. | Intraocular lens and method for making same |
JP3612945B2 (ja) * | 1997-07-08 | 2005-01-26 | 富士ゼロックス株式会社 | 微小構造体の製造方法 |
JP2002212529A (ja) * | 2000-06-28 | 2002-07-31 | Sumitomo Chem Co Ltd | 接着シート |
JP2002144300A (ja) * | 2000-07-27 | 2002-05-21 | Toshiba Tec Corp | パイプジョイント及びその作製方法並びにそれを用いた流体デバイス |
US6698454B2 (en) * | 2000-11-02 | 2004-03-02 | Biacore Ab | Valve integrally associated with microfluidic liquid transport assembly |
DE10056908A1 (de) * | 2000-11-16 | 2002-05-23 | Merck Patent Gmbh | Verfahren zum Verbinden von Kunststoffteilen |
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2002
- 2002-11-08 FR FR0213998A patent/FR2846906B1/fr not_active Expired - Fee Related
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2003
- 2003-11-04 US US10/533,296 patent/US20060048885A1/en not_active Abandoned
- 2003-11-04 WO PCT/FR2003/003288 patent/WO2004043849A2/fr active Application Filing
- 2003-11-04 EP EP03767900A patent/EP1558518A2/fr not_active Withdrawn
- 2003-11-04 JP JP2004550736A patent/JP2006505418A/ja active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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WO1994029400A1 (fr) * | 1993-06-15 | 1994-12-22 | Pharmacia Biotech Ab | Procede de production de structures a microcanaux/microcavites |
WO2003055790A1 (fr) * | 2001-12-31 | 2003-07-10 | Gyros Ab | Dispositif microfluidique et son procede de fabrication |
Non-Patent Citations (3)
Title |
---|
BECKER H, GÄRTNER C: "Polymer microfabrication methods for microfluidic analytical applications", ELECTROPHORESIS, vol. 21, no. 1, 1 January 2000 (2000-01-01), pages 12 - 26, XP002278131 * |
H. DREUTH, C. HEIDEN: "A method for local application of thin organic adhesive films on micropatterned structures", MATERIALS SCIENCE AND ENGINEERING: C, vol. 5, no. 3-4, 1 February 1998 (1998-02-01), pages 227 - 231, XP002278129 * |
J. COOPER MC DONALD, D.C. DUFFY, J. R. ANDERSON, D.T. CHIU, H. WU, O. J. A. SCHUELLER, G. M. WHITESIDES: "Fabrication of microfluidic systems in poly(dimethylsiloxane)", ELECTROPHORESIS, vol. 21, no. 1, 1 January 2000 (2000-01-01), pages 27 - 40, XP002278130 * |
Also Published As
Publication number | Publication date |
---|---|
EP1558518A2 (fr) | 2005-08-03 |
WO2004043849A2 (fr) | 2004-05-27 |
US20060048885A1 (en) | 2006-03-09 |
JP2006505418A (ja) | 2006-02-16 |
FR2846906B1 (fr) | 2005-08-05 |
FR2846906A1 (fr) | 2004-05-14 |
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