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WO2004040620A3 - Procede et appareil destine a la mise en oeuvre de mesure ou d'instrumentation sur un equipement de production - Google Patents

Procede et appareil destine a la mise en oeuvre de mesure ou d'instrumentation sur un equipement de production Download PDF

Info

Publication number
WO2004040620A3
WO2004040620A3 PCT/US2003/033715 US0333715W WO2004040620A3 WO 2004040620 A3 WO2004040620 A3 WO 2004040620A3 US 0333715 W US0333715 W US 0333715W WO 2004040620 A3 WO2004040620 A3 WO 2004040620A3
Authority
WO
WIPO (PCT)
Prior art keywords
enclosure
instrumentation
production equipment
module
process tool
Prior art date
Application number
PCT/US2003/033715
Other languages
English (en)
Other versions
WO2004040620A2 (fr
Inventor
Keith Pearson
Original Assignee
Keith Pearson
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Keith Pearson filed Critical Keith Pearson
Priority to AU2003286648A priority Critical patent/AU2003286648A1/en
Publication of WO2004040620A2 publication Critical patent/WO2004040620A2/fr
Publication of WO2004040620A3 publication Critical patent/WO2004040620A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un module à utiliser dans un outil de traitement. Le module comprend une enveloppe permettant de loger un dispositif à tester; et une structure raccordée à l'enveloppe. La structure comprend une interface standard pour l'outil de traitement et une interface cinématique pour l'enveloppe afin de faciliter un raccordement haute précision et reproductible de l'enveloppe. Les dispositifs de mesure ou d'instrumentation peuvent être des composants d'inspection, des dispositifs de mesure ou d'autres formes d'instrumentation utilisés pour rassembler des informations et/ou analyser des données. L'équipement peut être utilisé, entre autres, pour la fabrication de substrats, notamment de dispositifs à semi-conducteurs, réticules, et autres produits.
PCT/US2003/033715 2002-10-25 2003-10-24 Procede et appareil destine a la mise en oeuvre de mesure ou d'instrumentation sur un equipement de production WO2004040620A2 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003286648A AU2003286648A1 (en) 2002-10-25 2003-10-24 Method and apparatus for implementing measurement or instrumentation on production equipment

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US42126802P 2002-10-25 2002-10-25
US60/421,268 2002-10-25
US10/693,170 US20040090152A1 (en) 2002-10-25 2003-10-23 Method and apparatus for implementing measurement or instrumentation on production equipment
US10/693,170 2003-10-23

Publications (2)

Publication Number Publication Date
WO2004040620A2 WO2004040620A2 (fr) 2004-05-13
WO2004040620A3 true WO2004040620A3 (fr) 2009-08-27

Family

ID=32233436

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/033715 WO2004040620A2 (fr) 2002-10-25 2003-10-24 Procede et appareil destine a la mise en oeuvre de mesure ou d'instrumentation sur un equipement de production

Country Status (3)

Country Link
US (1) US20040090152A1 (fr)
AU (1) AU2003286648A1 (fr)
WO (1) WO2004040620A2 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US5733024A (en) * 1995-09-13 1998-03-31 Silicon Valley Group, Inc. Modular system
US6134107A (en) * 1998-10-19 2000-10-17 International Business Machines Corporation Reverse convective airflow cooling of computer enclosure
US6135698A (en) * 1999-04-30 2000-10-24 Asyst Technologies, Inc. Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
US6193339B1 (en) * 1999-04-12 2001-02-27 Inclose Design, Inc. Docking adapter for memory storage devices

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4532970A (en) * 1983-09-28 1985-08-06 Hewlett-Packard Company Particle-free dockable interface for integrated circuit processing
US5733024A (en) * 1995-09-13 1998-03-31 Silicon Valley Group, Inc. Modular system
US6138721A (en) * 1997-09-03 2000-10-31 Asyst Technologies, Inc. Tilt and go load port interface alignment system
US6134107A (en) * 1998-10-19 2000-10-17 International Business Machines Corporation Reverse convective airflow cooling of computer enclosure
US6193339B1 (en) * 1999-04-12 2001-02-27 Inclose Design, Inc. Docking adapter for memory storage devices
US6135698A (en) * 1999-04-30 2000-10-24 Asyst Technologies, Inc. Universal tool interface and/or workpiece transfer apparatus for SMIF and open pod applications

Also Published As

Publication number Publication date
AU2003286648A1 (en) 2004-05-25
WO2004040620A2 (fr) 2004-05-13
US20040090152A1 (en) 2004-05-13
AU2003286648A8 (en) 2009-10-08

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