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WO2003036693A3 - Method and system to provide electrical contacts for electrotreating processes - Google Patents

Method and system to provide electrical contacts for electrotreating processes Download PDF

Info

Publication number
WO2003036693A3
WO2003036693A3 PCT/US2002/034633 US0234633W WO03036693A3 WO 2003036693 A3 WO2003036693 A3 WO 2003036693A3 US 0234633 W US0234633 W US 0234633W WO 03036693 A3 WO03036693 A3 WO 03036693A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical contacts
provide electrical
processes
electrotreating
electrotreating processes
Prior art date
Application number
PCT/US2002/034633
Other languages
French (fr)
Other versions
WO2003036693A2 (en
Inventor
Bulent M Basol
Homayoun Talieh
Boguslaw A Nagorski
Cyprian E Uzoh
Jeffrey A Bogart
Original Assignee
Nutool Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nutool Inc filed Critical Nutool Inc
Priority to JP2003539084A priority Critical patent/JP2005507170A/en
Priority to KR10-2004-7006065A priority patent/KR20040070342A/en
Priority to EP02786571A priority patent/EP1444722A2/en
Priority to AU2002350038A priority patent/AU2002350038A1/en
Publication of WO2003036693A2 publication Critical patent/WO2003036693A2/en
Publication of WO2003036693A3 publication Critical patent/WO2003036693A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
PCT/US2002/034633 2001-10-26 2002-10-28 Method and system to provide electrical contacts for electrotreating processes WO2003036693A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2003539084A JP2005507170A (en) 2001-10-26 2002-10-28 Method and system for forming electrical contacts for electrical processing processes
KR10-2004-7006065A KR20040070342A (en) 2001-10-26 2002-10-28 Method and system to provide electrical contacts for electrotreating processes
EP02786571A EP1444722A2 (en) 2001-10-26 2002-10-28 Method and system to provide electrical contacts for electrotreating processes
AU2002350038A AU2002350038A1 (en) 2001-10-26 2002-10-28 Method and system to provide electrical contacts for electrotreating processes

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US34875801P 2001-10-26 2001-10-26
US60/348,758 2001-10-26

Publications (2)

Publication Number Publication Date
WO2003036693A2 WO2003036693A2 (en) 2003-05-01
WO2003036693A3 true WO2003036693A3 (en) 2003-11-13

Family

ID=23369412

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/034633 WO2003036693A2 (en) 2001-10-26 2002-10-28 Method and system to provide electrical contacts for electrotreating processes

Country Status (7)

Country Link
EP (1) EP1444722A2 (en)
JP (1) JP2005507170A (en)
KR (1) KR20040070342A (en)
CN (1) CN1316557C (en)
AU (1) AU2002350038A1 (en)
TW (1) TWI223848B (en)
WO (1) WO2003036693A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102353480B (en) * 2011-07-12 2013-05-08 北京邮电大学 Normal pressure applying device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156167A (en) * 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US20010000396A1 (en) * 1998-11-30 2001-04-26 Applied Materials Inc. Electric contact element for electrochemical deposition system
WO2001071066A1 (en) * 2000-03-17 2001-09-27 Nu Tool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US20010035354A1 (en) * 2000-05-12 2001-11-01 Nu Tool Inc. Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
US20020053516A1 (en) * 2000-11-03 2002-05-09 Basol Bulent M. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6001235A (en) * 1997-06-23 1999-12-14 International Business Machines Corporation Rotary plater with radially distributed plating solution
US6132587A (en) * 1998-10-19 2000-10-17 Jorne; Jacob Uniform electroplating of wafers
US6251236B1 (en) * 1998-11-30 2001-06-26 Applied Materials, Inc. Cathode contact ring for electrochemical deposition

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6156167A (en) * 1997-11-13 2000-12-05 Novellus Systems, Inc. Clamshell apparatus for electrochemically treating semiconductor wafers
US20010000396A1 (en) * 1998-11-30 2001-04-26 Applied Materials Inc. Electric contact element for electrochemical deposition system
WO2001071066A1 (en) * 2000-03-17 2001-09-27 Nu Tool Inc. Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US20010035354A1 (en) * 2000-05-12 2001-11-01 Nu Tool Inc. Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing
US20020053516A1 (en) * 2000-11-03 2002-05-09 Basol Bulent M. Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate

Also Published As

Publication number Publication date
EP1444722A2 (en) 2004-08-11
JP2005507170A (en) 2005-03-10
KR20040070342A (en) 2004-08-07
TWI223848B (en) 2004-11-11
CN1316557C (en) 2007-05-16
WO2003036693A2 (en) 2003-05-01
CN1636266A (en) 2005-07-06
AU2002350038A1 (en) 2003-05-06
TW200300577A (en) 2003-06-01

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