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WO2003035744A1 - Composition de resine thermodurcissable - Google Patents

Composition de resine thermodurcissable Download PDF

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Publication number
WO2003035744A1
WO2003035744A1 PCT/JP2002/010909 JP0210909W WO03035744A1 WO 2003035744 A1 WO2003035744 A1 WO 2003035744A1 JP 0210909 W JP0210909 W JP 0210909W WO 03035744 A1 WO03035744 A1 WO 03035744A1
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WO
WIPO (PCT)
Prior art keywords
thermosetting
resin composition
weight
component
monomer
Prior art date
Application number
PCT/JP2002/010909
Other languages
English (en)
Japanese (ja)
Inventor
Toru Fujiki
Toshiyuki Hasegawa
Hironobu Iyama
Toshiki Mori
Shigeki Naitoh
Original Assignee
Sumitomo Chemical Company, Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Company, Limited filed Critical Sumitomo Chemical Company, Limited
Publication of WO2003035744A1 publication Critical patent/WO2003035744A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters
    • C08L23/0884—Epoxide-containing esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0869—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with unsaturated acids, e.g. [meth]acrylic acid; with unsaturated esters, e.g. [meth]acrylic acid esters

Definitions

  • the present invention relates to a thermosetting resin composition
  • a thermosetting resin composition comprising ethylene ′′ a,] 3-unsaturated carboxylic acid, an epoxy group-containing ethylene-based copolymer, and a solvent, a thermosetting film obtained from the composition
  • the present invention relates to a laminate obtained by thermosetting the film.
  • Adhesives used for electrical and electronic components such as interlayer insulating layers between sheets and substrates are required to have low elastic modulus and thin film in addition to heat resistance when soldering.
  • the adhesive before curing be in a dry film form.
  • a resin composition obtained by dry-blending an ethylene ', i3-unsaturated carboxylic acid copolymer containing a polar group and an ethylene copolymer containing an epoxy group followed by extrusion molding.
  • a film is disclosed in JP-A-64-142435.
  • the resin composition film does not have sufficient adhesive strength, and the method described in the publication does not make it easy to obtain a thin film.
  • thermosetting resin composition having excellent coatability and fluidity before thermosetting and capable of easily forming a thin film
  • thermosetting film having excellent adhesiveness and heat resistance and a low elastic modulus
  • an electronic and electrical device in which a layer obtained by thermosetting the film and an adherend layer are in close contact with each other.
  • An object of the present invention is to provide a laminate suitable for parts and the like. Disclosure of the invention The present invention
  • thermosetting resin composition containing the following components (A), (B) and (C): (A): (a ethylene,
  • R represents an alkenyl group having 2 to 18 carbon atoms
  • X represents a carbonyl group, a phenylene group or a methylene group.
  • the content of the structural unit derived from the monomer (a 2 ) is 0.01 to 20 parts by weight based on 100 parts by weight of the component (A), and the content of the structural unit derived from the monomer (a 3 ) is The thermosetting resin composition according to [1], wherein the content of the structural unit is 25 to 70 parts by weight,
  • thermosetting composition according to [1] or [2], wherein the content of the structural unit derived from the monomer (b 2 ) is 1 to 30 parts by weight based on 100 parts by weight of the component (B).
  • the component (B) may further comprise (b 3 ) a monomer copolymerizable with ethylene, which does not react with the epoxy group.
  • the total content of the structural unit derived from the monomer () and the structural unit derived from the monomer) is 30 to 100 parts by weight of the total of the polymers of the components (A) and (B). 75 parts by weight of the thermosetting resin composition according to any one of [1] to [4],
  • thermosetting resin composition according to any one of [1] to [5], wherein the component (C) is an aromatic hydrocarbon,
  • thermosetting adhesive according to any one of [1] to [7], wherein the total weight of the components (A) and (B) is 100 to 150 parts by weight based on 100 parts by weight of the component (C).
  • Resin composition
  • thermosetting film obtained by forming the thermosetting resin composition according to any one of [1] to [8] into a film, and removing a solvent in the composition. 10] The thermosetting film according to [9], wherein the molding is performed by applying the thermosetting resin composition onto a support substrate surface.
  • thermosetting film comprising applying the thermosetting resin composition according to any one of [1] to [8] by roll coating, and removing a solvent in the composition.
  • thermosetting the thermosetting film according to [9] or [10] and an adherend layer are adhered and laminated
  • thermosetting film according to [9] or [10] which is formed by laminating one surface on the support substrate surface, and the surface opposite to the lamination surface with the support substrate is used as the adherend layer.
  • a method for producing a laminate comprising peeling a supporting substrate after laminating, and thermally curing the thermosetting film.
  • Component (A) used in the present invention (ai) ethylene, (a 2) a,] 3- unsaturated cull Bonn acid and / Matawahi monounsaturated carboxylic acid anhydrides, ⁇ Pi (a 3) Bieruesute Ethylene.
  • ⁇ ⁇ -unsaturated carboxylic acid copolymers obtained by polymerizing R-Z or ⁇ -unsaturated ruponic acid esters.
  • ⁇ -unsaturated carboxylic acid of the component (a 2 ) for example, Monocarponic acids such as lylic acid, crotonic acid, monoalkyl fumarate, and monoalkyl malate; maleic acid, fumaric acid, itaconic acid, citraconic acid, 3,6-endo methylene 1,2,3,6-tetrahidonic acid And dicarboxylic acids such as drosis-phthalic acid.
  • the monounsaturated carboxylic acid anhydride of the component (a 2 ) is an intramolecular or intermolecular anhydride of an ⁇ , ⁇ monounsaturated carboxylic acid.
  • acrylic acid methacrylic acid, and maleic anhydride are particularly preferable.
  • component structural units derived from the monomer (3 ⁇ 4) (hereinafter, (a 2) referred to as monomer units.)
  • the content of, per 1 0 0 parts by weight of component (A) Usually, it is about 0.1 to 20 parts by weight, preferably about 0.1 to 15 parts by weight. It is preferable that the content of () the monomer unit be 0.01 part by weight or more, since the mechanical strength of the obtained adhesive tends to be improved.
  • A) It is preferable because it tends to have excellent storage stability as a component.
  • an ⁇ ,] 3-unsaturated carboxylic acid alkyl ester having about 3 to 8 carbon atoms is used.
  • acrylic acid Acrylic esters such as methyl, ethyl acrylate, ⁇ -propyl acrylate, isopropyl acrylate, ⁇ -butyl acrylate, t-butyl acrylate, and isobutyl acrylate; methyl methacrylate, ethyl methacrylate, and n-methacrylate Methacrylates such as —propyl, isopropyl methacrylate, n-butyl methacrylate, t-butyl methacrylate, and isobutyl methacrylate;
  • a vinyl ester of sulfonic acid having about 1 to 20 carbon atoms is used.
  • vinyl acetate, butyl butyrate, butyl propionate, piperic acid Examples include burs, vinyl laurate, burs isononanoate, and bielsnosatic acid.
  • the monomer (a 3 ) among them, biel acetate, methyl acrylate, ethyl acrylate, n-butyl acrylate and methyl methacrylate are preferred.
  • the content of the structural unit derived from the monomer (a 3 ) in the component (A) (hereinafter referred to as () monomer unit) in the component (A) is usually based on 100 parts by weight of the component (A). , 25 to 70 parts by weight, preferably about 25 to 65 parts by weight.
  • the solubility of the component (C) is excellent when the component (C) is an organic solvent, and when the amount is at most 70 parts by weight, a high pressure radical method or the like is used.
  • the component (A) may be any of a block copolymer, a graft copolymer, a random copolymer, and an alternating copolymer.
  • the component (B) in the present invention comprises () ethylene and (b 2 ) the following general formula (1)
  • R represents an alkenyl group having 2 to 18 carbon atoms
  • X represents a carbonyl group, a phenylene group or a methylene group.
  • component (b 2 ) examples include unsaturated glycidyl ethers such as aryl glycidyl ether, 2-methylaryl glycidyl ether and styrene-p-glycidyl ether; glycidyl phthalate, glycidyl methacrylate, and glycidyl ester itaconic acid. And unsaturated glycidyl esters.
  • the content of the structural unit derived from the monomer (b 2 ) in the component (B) (hereinafter referred to as “(b 2 ) monomer unit”) is usually based on 100 parts by weight of the component (B). , 1 to 30 parts by weight. (B 2 )
  • the amount of the monomer unit is 1 part by weight or more, the mechanical strength of the obtained adhesive tends to be improved, and when the amount is 30 parts by weight or less, storage as the component (B) is preferred. It is preferable because it tends to have excellent stability.
  • the component (B) is obtained by adding a monomer (bj) and a monomer (b 2 ) to a monomer (b 3 ) which is not reactive with an epoxy group and which can be copolymerized with ethylene, if necessary. Or a copolymer obtained by polymerizing these.
  • the monomer (b 3 ) can be used.
  • ⁇ -olefins containing about 3 to 20 carbon atoms including propylene, and vinyl compounds such as vinyl chloride, styrene, acrylonitrile, methacrylotrile, acrylamide, and methacrylamide.
  • propylene, biel acetate, methyl acrylate, ethyl acrylate, n-butyl acrylate, and methyl methacrylate are preferred.
  • the content of the structural unit derived from the monomer (b 3 ) in the component (B) (hereinafter, referred to as (b 3 ) monomer unit) is as follows, based on 100 parts by weight of the component (B). Usually, it is about 0 to 70 parts by weight, preferably about 25 to 60 parts by weight. (B 3) Then containing monomer units, (B) component is an organic solvent (C) good since it tends to dissolve the ingredients preferred, is not more than 70 parts by weight, the high-pressure radical method, (B) It is preferable because the component tends to be easily produced.
  • the component (B) in the present invention may be any of a block copolymer, a graft copolymer, a random copolymer, and an alternating copolymer.
  • a block copolymer for example, propylene-ethylene described in Japanese Patent No. 2632980.
  • the block copolymer (b 2) a copolymer component grafted, Japanese Patent No. 2600248 JP ethylene one epoxy group-containing monomer copolymer Nihi, obtained by grafting the ⁇ monounsaturated carboxylic acid ester Copolymers and the like.
  • the monomer) and the monomer () are ethylene, and the content of the structural unit derived from ethylene is 100% in total of the components (A) and (B).
  • the total amount of the components (A) and (B) is preferably about 30 to 75 parts by weight with respect to parts by weight.
  • the method for producing the component (A) or (B) in the present invention includes, for example, a predetermined amount of a monomer (monomer (a 2 ) and monomer (a 2 ); b 2 ); a monomer (b 2 ) and a monomer (b 3 ) etc., in the presence of a predetermined amount of ethylene and a radical generator, at about 500 to 4000 atm, about 100 to 300 ° C.
  • a method for producing a copolymer of ethylene and an epoxy group-containing monomer described in Japanese Patent Publication No. 58-55964, propylene-ethylene described in Japanese Patent No. A method for producing a copolymer in which the component (b 2 ) is grafted onto a block copolymer, and ⁇ , ⁇ - is added to the ethylene-epoxy group-containing monomer copolymer described in Japanese Patent No. 260002/48.
  • Examples of the method include a method for producing a copolymer in which an unsaturated carboxylic acid ester is darafted.
  • component (II) and the component (II) are commercially available, and such commercially available products can be used in the present invention.
  • Commercially available ( ⁇ ) components include, for example, “Bondane (registered trademark)” series (manufactured by Sumika AtoFina), “Seporjon ⁇ ” series (manufactured by Sumitomo Seika Co., Ltd.), and “Let's Pearl ⁇ ⁇ ” series. (Manufactured by Nippon Polyolefin ( ⁇ )), the PRIMA CO RJ series (manufactured by Dow Chemical 1), and the like, and the commercially available (B) component is “Pond First (registered trademark)” series.
  • the molecular weight of each of the component (A) and the component (B) in the present invention is usually such that the thermosetting resin composition of the present invention can be uniformly dissolved and has a viscosity that allows coating. Molecular weight.
  • the organic solvent that can be used as the component (C) examples include aromatic hydrocarbons such as toluene, esters such as ethyl acetate and butyl acetate, and ketones such as acetone, methyl ethyl ethyl ketone, and methyl isobutynole ketone.
  • Aromas such as methanol, methanol, butanol, polyethylene glycol, partially saponified polybutyl alcohol, fully saponified polyvinyl alcohol, chlorinated hydrocarbons such as methylene chloride, hexane, heptane, petroleum ether, etc.
  • aliphatic hydrocarbons may be a mixture of two or more of water and an organic solvent, or a mixture of two or more of an organic solvent.
  • component (C) is an organic solvent
  • an aromatic hydrocarbon is preferably used.
  • the thermosetting resin composition of the present invention is used to disperse the components (A) and (B) and to improve the storage stability of the thermosetting resin composition. It preferably contains an emulsifying and dispersing agent such as partially saponified polyvinyl alcohol, fully saponified polyvinyl alcohol, and polyethylene glycol.
  • an emulsifying and dispersing agent such as partially saponified polyvinyl alcohol, fully saponified polyvinyl alcohol, and polyethylene glycol.
  • Components containing the modified dispersant in the component (A) or the component (B) are commercially available, and such commercially available products, for example, “Seporjon M” series, “Seporjon G” series (Sumitomo) (Manufactured by Seika Co., Ltd.) can also be used.
  • the thermosetting resin composition of the present invention is a liquid composition containing the components (A), (B) and (C).
  • the production method include a method in which the components (A) and (B) are dissolved or dispersed in the component (C), and then mixed, and the components (A) and (B) are collectively converted into the component (C).
  • Examples thereof include a method of mixing the component (B) and a method of mixing the emulsion (B) and the component (A) dissolved or dispersed in the component (C).
  • thermosetting resin composition of the present invention includes inorganic fillers, pigments, antioxidants, processing stabilizers, weathering agents, heat stabilizers, light stabilizers, nucleating agents, lubricants, as long as the effects of the present invention are not impaired. It may contain additives such as a release agent, a flame retardant, and an antistatic agent.
  • the total weight of the components (A) and (B) in the thermosetting resin composition of the present invention is usually 10 to 150 parts by weight based on 100 parts by weight of the component (C).
  • the coatability of the thermosetting resin composition of the present invention on the support substrate tends to be excellent
  • the components (A) and (B) When the total amount of the components is 150 parts by weight or less, the viscosity of the composition comprising the components (A), (B) and (C) decreases, and the coating properties of the composition on the supporting substrate tend to be excellent. Because it is Good.
  • the solvent in the composition is removed to obtain the thermosetting film of the present invention.
  • the molding can be usually performed by coating the thermosetting resin composition of the present invention on the surface of the supporting substrate.
  • the removal of the solvent from the thermosetting resin composition of the present invention formed into a film is a so-called drying treatment, which can be specifically performed by a standing treatment at normal temperature, a heating treatment, a blowing treatment, or the like. . Further, the formation into a film and the removal of the solvent may be performed continuously.
  • the removal of the solvent means that the solvent (component (C)) contained in the thermosetting resin composition of the present invention is substantially completely removed.
  • the support substrate in the present invention is a film-like substrate through which the thermosetting resin composition of the present invention does not penetrate, and examples thereof include a polyolefin-based film, release paper, and release polyethylene terephthalate (PET) film. No.
  • thermosetting resin composition examples include, for example, a rohner coating using a rohno recorder such as a reverse throw coater, a gravure coater, a microknow coater, a kiss coater, a Meyer coater, and an air knife coater.
  • a rohner coating using a rohno recorder such as a reverse throw coater, a gravure coater, a microknow coater, a kiss coater, a Meyer coater, and an air knife coater.
  • the method examples include coating by blade coating using a blade coater or the like.
  • solvent removing method examples include a method of drying by leaving the coating as it is, and a method of drying in a heated blast oven. Among them, it is preferable to produce a thermosetting film by roll coating using a roll coater because the thickness of the film from a thin film to a thick film can be easily controlled.
  • the thickness of the thermosetting film is not particularly limited. Usually, when the thickness is about 3 ⁇ or more, the adhesiveness tends to be excellent, preferably about 3 to 100 ⁇ m, and particularly preferably about 3 to 100 ⁇ m. It is about 50 ⁇ .
  • Approximate value (For example, when the coating thickness is 50 ⁇ and the weight ratio is 50%, the thickness of the heat-cured green film is expected to be 25 ⁇ m), and the estimated value and the actual
  • the desired thickness of the thermosetting film can be obtained by appropriately adjusting the coating thickness of the thermosetting resin composition based on the thickness of the obtained thermosetting film.
  • the laminate in the present invention is a laminate in which a layer obtained by thermosetting the thermosetting film of the present invention and an adherend layer are laminated in close contact with each other. It can be obtained by laminating with a body layer and then thermosetting.
  • the adherend in the present invention is a material that can be bonded to the thermosetting film of the present invention by thermosetting, unlike the above-mentioned support substrate, and the adherend layer is the adherend. It is layered.
  • Specific examples of the adherend include cellulosic polymer materials, metals such as gold, silver, copper, iron, tin, and lead; inorganic substances such as ceramics; and polar resins.
  • the polar resin is a resin containing a polar group in the resin, and specifically, a melamine resin, an acrylic resin, a urethane resin, a urethane resin, a (meth) acrylic resin, Styrene acrylonitrile-based copolymer, polycarbonate-based resin, phenol resin, alkyd resin, epoxy resin and the like may be mentioned, and these may be a mixed material of two or more kinds or a composite material.
  • thermosetting film of the present invention As a method for producing a laminate, for example, after the thermosetting film of the present invention is peeled from the supporting substrate, the laminate is laminated with the adherend layer, usually heated at about 80 to 150 ° C., and pressed.
  • thermosetting film of the present invention A method in which the surface opposite to the support substrate is laminated with the adherend layer in the state of being laminated, and the support substrate is peeled off after heating and pressing in the same manner; one side of the thermosetting film of the present invention A method in which the surface opposite to the supporting substrate is laminated with the adherend layer in a state in which the supporting substrate is laminated, and the supporting substrate is peeled off, followed by heating and pressing similarly; Laminated with the adherend layer with one side of the thermosetting film laminated with the supporting substrate After the base material is peeled off, another adherend layer is laminated on the surface from which the supporting base material has been peeled off, followed by heating and pressing in the same manner.
  • the present invention will be described in more detail with reference to Examples, but the present invention is not limited thereto.
  • the MFR (melt flow rate) is a value measured under the conditions of 190 ° C and a load of 2160 g according to JIS-K7210.
  • 'Total content of ethyl acrylate and maleic anhydride units in the copolymer is 20% by weight
  • B-1 "Bond First 7M” manufactured by Sumitomo Chemical Co., Ltd.
  • thermosetting resin composition The solution of (A-1) and (B-1) obtained by the above (1) and (2) is stirred and mixed at room temperature for 10 minutes at the mixing ratio (parts by weight) shown in Table 1. As a result, a thermosetting resin composition was obtained. Table 1 also shows the weight ratio (%) of each of the components (A) to (C) in the obtained composition.
  • thermosetting resin The aqueous emulsion solution of (A-2) and (B-2) was stirred and mixed at room temperature for 10 minutes at the mixing ratio (parts by weight) shown in Table 2 to obtain a thermosetting resin. A composition was obtained. Table 2 also shows the weight ratio (%) of each of the components (A) to (C) in the obtained composition.
  • thermosetting film (before bonding)
  • thermosetting resin composition obtained by the above (3) and (4) was released from a PET film (“FF-50” manufactured by Unitika Ltd.) using a bar coater. 4 ⁇ m 8 ⁇ and 20 ⁇ m laminated on the release PET film surface by coating on the release surface of PET film and film thickness and drying for 3 minutes at 80 ° C open A thermosetting film having a thickness of m was subjected to a heat test using a solder.
  • thermosetting film before bonding
  • the thermosetting resin composition obtained by the above (3) and (4) was applied to a polyethylene terephthalate (PET) film (DI AFO IL T600E50 W07, manufactured by Mitsubishi Chemical Corporation) using a Meyer bar coater, 50 m) and dried in an oven at 80 ° C. for 3 minutes to obtain a thermosetting film laminated on the PET film.
  • PET polyethylene terephthalate
  • a Meyer bar coater 50 m
  • thermosetting film laminated on the PET film By adjusting the amount of the thermosetting resin composition used, three types of thermosetting films having a thickness of 4 ⁇ , 8 and 20 tm were obtained.
  • the thermosetting film having a thickness of 20 ⁇ m was subjected to a peel test.
  • thermosetting film side of the two-layer film consisting of the release PET film Z thermosetting film obtained in (5) above was placed on the printed wiring board (Single-sided copper-clad laminate R made by Matsushita Electric Works, Ltd.) -Laminated on the wiring pattern side of 1705 (FR4 printed wiring board)), using a laminator (“Fast Laminator VA-700J” manufactured by Taisei Laminator Co., Ltd.), upper and lower roll temperature 110 ° C, line pressure 14.5 k gZcm, thermocompression bonding at a speed of 0.5 m / min, followed by thermocompression at 100 ° C, 3MPa for 10 minutes using a hot press, and 180 ° C, 3MPa using a hot press. After heat curing for 60 minutes under the condition of a, the release PET film on the surface of the laminate was peeled off to obtain a laminate in which the printed wiring board and the thermosetting film obtained by thermosetting were in close contact with each other. .
  • the obtained laminate was subjected to 260 using SOLDERAB ILITY TES TER E ST-11 made by Tabai Espec. C was immersed in a solder bath for 10 seconds. After repeating this immersion six times, the surface appearance was visually observed. The results are shown in Tables 1 and 2. The determination of the solder heat test was based on the following criteria.
  • thermosetting film has abnormal appearance (peeling, swelling),
  • thermosetting film side of the two-layer film (8 OmmX 10 Omm) made of the PET film thermosetting film obtained in (6) above was used as the adherend with resin-coated copper.
  • the two-layer film was laminated and adhered to the adherend (copper foil with resin) in a width of 25 mm by heat sealing at a pressure of (gauge pressure) for 60 minutes.
  • thermosetting resin composition composed of (A-2) and (B-2)
  • peeling occurred at the interface between the thermosetting film and the PET film as the supporting substrate, Since the peel strength between the adherend Z thermosetting resin layers cannot be obtained, the peel strength between the adherend Z thermosetting films is at least 12.3 N / 10 mm or more obtained in Example 2. It shows very good adhesion.
  • A-1 copolymer 50 parts by weight of B_1 copolymer
  • a small patch-type eder (“Laboplast Mill R-10" manufactured by Toyo Seiki Seisaku-sho, Ltd.) 0)) to set the barrel temperature to 100.
  • the mixture was preliminarily kneaded at 10 rpm for 7 minutes, and then kneaded at 50 rpm for 5 minutes.
  • a significant increase in the temperature of the tree due to shearing heat was observed, and an increase in the kneading torque due to the progress of the curing reaction was confirmed.
  • the obtained A-1 / B-1 resin yarn composition was already a cured product and could not be filled in an extruder to form a thin film.
  • thermosetting resin composition of the present invention is excellent in coatability, operability, and fluidity on a supporting substrate, and is adhered in a thin film by coating the composition and removing the component (C).
  • a thermosetting film having excellent properties can be easily obtained. Further, when an adherend is laminated on the thermosetting film and thermally cured, the film layer in the obtained laminate has excellent heat resistance and low elastic modulus.
  • the laminate has such excellent characteristics, for example, a semiconductor encapsulating material, an encapsulating material for electronic components such as solar cells and EL (electroluminescence) lamps, and a die between an integrated circuit and a substrate.
  • Interlayer insulating layer between bonder sheet and board, printed wiring It can be used as a solder resist for boards and paints for baking automotive parts.

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)

Abstract

L'invention concerne une composition de résine thermodurcissable contenant les composants suivants : (A) un copolymère d'acide carboxylique à insaturation α,β et d'éthylène, obtenu par copolymérisation (a1) d'éthylène avec (a2) un acide carboxylique à insaturation α,β et/ou un anhydride carboxylique à insaturation α,β, et (a3) un ester de vinyle et/ou un ester d'acide carboxylique à insaturation α,β ; (B) un copolymère d'éthylène contenant de l'époxy, obtenu par copolymérisation (b1) d'éthylène avec (b2) un monomère de formule générale (1), R étant alcényle portant 2 à 18 atomes de carbone et X étant carbonyle, phénylène ou méthylène ; et, (C) un solvant organique et/ou de l'eau. L'invention concerne également une pellicule thermodurcissable réalisée à partir de la composition selon l'invention, ainsi que des laminés produits par thermodurcissage de ladite pellicule.
PCT/JP2002/010909 2001-10-24 2002-10-22 Composition de resine thermodurcissable WO2003035744A1 (fr)

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JP2001/326073 2001-10-24

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8080727B2 (en) 2008-11-24 2011-12-20 E. I. Du Pont De Nemours And Company Solar cell modules comprising an encapsulant sheet of a blend of ethylene copolymers
US8084129B2 (en) 2008-11-24 2011-12-27 E. I. Du Pont De Nemours And Company Laminated articles comprising a sheet of a blend of ethylene copolymers
CN102372888A (zh) * 2010-07-30 2012-03-14 住友化学株式会社 固化性树脂组合物
US8507097B2 (en) 2010-12-21 2013-08-13 E I Du Pont De Nemours And Company Multilayer films containing a fluorinated copolymer resin layer and a cross-linkable ionomeric encapsulant layer

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH1046122A (ja) * 1996-08-02 1998-02-17 Mitsui Petrochem Ind Ltd 接着剤組成物
WO2000000566A1 (fr) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Composition adhesive thermofusible, adhesif collant a chaud et procede de collage a l'aide de la composition adhesive thermofusible
EP1088870A1 (fr) * 1999-09-30 2001-04-04 3M Innovative Properties Company Composition d'adhésif thermodurcissable et structure collée

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JPH1046122A (ja) * 1996-08-02 1998-02-17 Mitsui Petrochem Ind Ltd 接着剤組成物
WO2000000566A1 (fr) * 1998-06-29 2000-01-06 Minnesota Mining And Manufacturing Company Composition adhesive thermofusible, adhesif collant a chaud et procede de collage a l'aide de la composition adhesive thermofusible
EP1088870A1 (fr) * 1999-09-30 2001-04-04 3M Innovative Properties Company Composition d'adhésif thermodurcissable et structure collée

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8080727B2 (en) 2008-11-24 2011-12-20 E. I. Du Pont De Nemours And Company Solar cell modules comprising an encapsulant sheet of a blend of ethylene copolymers
US8084129B2 (en) 2008-11-24 2011-12-27 E. I. Du Pont De Nemours And Company Laminated articles comprising a sheet of a blend of ethylene copolymers
CN102372888A (zh) * 2010-07-30 2012-03-14 住友化学株式会社 固化性树脂组合物
CN102372888B (zh) * 2010-07-30 2016-06-29 住友化学株式会社 固化性树脂组合物
US8507097B2 (en) 2010-12-21 2013-08-13 E I Du Pont De Nemours And Company Multilayer films containing a fluorinated copolymer resin layer and a cross-linkable ionomeric encapsulant layer

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