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WO2003034490A3 - Semiconductor structure with one or more through-holes - Google Patents

Semiconductor structure with one or more through-holes Download PDF

Info

Publication number
WO2003034490A3
WO2003034490A3 PCT/EP2002/011605 EP0211605W WO03034490A3 WO 2003034490 A3 WO2003034490 A3 WO 2003034490A3 EP 0211605 W EP0211605 W EP 0211605W WO 03034490 A3 WO03034490 A3 WO 03034490A3
Authority
WO
WIPO (PCT)
Prior art keywords
holes
semiconductor structure
seal
feed
disclosed
Prior art date
Application number
PCT/EP2002/011605
Other languages
French (fr)
Other versions
WO2003034490A2 (en
Inventor
Matthias Heschel
Original Assignee
Hymite As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hymite As filed Critical Hymite As
Priority to AT02787490T priority Critical patent/ATE464656T1/en
Priority to JP2003537117A priority patent/JP4546087B2/en
Priority to DE60236007T priority patent/DE60236007D1/en
Priority to AU2002351771A priority patent/AU2002351771A1/en
Priority to EP02787490A priority patent/EP1436837B1/en
Publication of WO2003034490A2 publication Critical patent/WO2003034490A2/en
Publication of WO2003034490A3 publication Critical patent/WO2003034490A3/en
Priority to HK05107072A priority patent/HK1074913A1/en

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4279—Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76898—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics formed through a semiconductor substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Element Separation (AREA)
  • Optical Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Weting (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

Semiconductor structures with one or more through-holes are disclosed. A feed-through metallization process may be used to seal the through-holes hermetically.
PCT/EP2002/011605 2001-10-17 2002-10-15 Semiconductor structure with one or more through-holes WO2003034490A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
AT02787490T ATE464656T1 (en) 2001-10-17 2002-10-15 SEMICONDUCTOR STRUCTURE WITH ONE OR MORE THROUGH HOLES
JP2003537117A JP4546087B2 (en) 2001-10-17 2002-10-15 Semiconductor structure with one or more through holes, method for providing the semiconductor structure, and optoelectronic assembly structure including the semiconductor structure
DE60236007T DE60236007D1 (en) 2001-10-17 2002-10-15 SEMICONDUCTOR STRUCTURE WITH ONE OR MORE CONTINUOUS HOLES
AU2002351771A AU2002351771A1 (en) 2001-10-17 2002-10-15 Semiconductor structure with one or more through-holes
EP02787490A EP1436837B1 (en) 2001-10-17 2002-10-15 Semiconductor structure with one or more through-holes
HK05107072A HK1074913A1 (en) 2001-10-17 2005-08-16 Semiconductor structure with one or more through-holes

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US32969901P 2001-10-17 2001-10-17
US60/329,699 2001-10-17
US10/264,440 2002-10-04
US10/264,440 US6818464B2 (en) 2001-10-17 2002-10-04 Double-sided etching technique for providing a semiconductor structure with through-holes, and a feed-through metalization process for sealing the through-holes

Publications (2)

Publication Number Publication Date
WO2003034490A2 WO2003034490A2 (en) 2003-04-24
WO2003034490A3 true WO2003034490A3 (en) 2004-04-01

Family

ID=26950546

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2002/011605 WO2003034490A2 (en) 2001-10-17 2002-10-15 Semiconductor structure with one or more through-holes

Country Status (9)

Country Link
US (3) US6818464B2 (en)
EP (1) EP1436837B1 (en)
JP (1) JP4546087B2 (en)
CN (1) CN100377333C (en)
AT (1) ATE464656T1 (en)
AU (1) AU2002351771A1 (en)
DE (1) DE60236007D1 (en)
HK (1) HK1074913A1 (en)
WO (1) WO2003034490A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8993450B2 (en) 2003-09-15 2015-03-31 Nuvotronics, Llc Device package and methods for the fabrication and testing thereof

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