WO2003032084A3 - Compositions de precurseur a faible viscosite et procedes de depot d'elements electroniques conducteurs - Google Patents
Compositions de precurseur a faible viscosite et procedes de depot d'elements electroniques conducteurs Download PDFInfo
- Publication number
- WO2003032084A3 WO2003032084A3 PCT/US2002/031884 US0231884W WO03032084A3 WO 2003032084 A3 WO2003032084 A3 WO 2003032084A3 US 0231884 W US0231884 W US 0231884W WO 03032084 A3 WO03032084 A3 WO 03032084A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- deposition
- precursor composition
- low viscosity
- methods
- formation
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 6
- 239000002243 precursor Substances 0.000 title abstract 6
- 230000008021 deposition Effects 0.000 title abstract 4
- 230000015572 biosynthetic process Effects 0.000 abstract 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 2
- 238000006243 chemical reaction Methods 0.000 abstract 2
- 229910052802 copper Inorganic materials 0.000 abstract 2
- 239000010949 copper Substances 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/06—Coating on selected surface areas, e.g. using masks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0346—Organic insulating material consisting of one material containing N
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/013—Inkjet printing, e.g. for printing insulating material or resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1142—Conversion of conductive material into insulating material or into dissolvable compound
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Electrodes Of Semiconductors (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Conductive Materials (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Chemically Coating (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
- Ink Jet Recording Methods And Recording Media Thereof (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CA2461338A CA2461338C (fr) | 2001-10-05 | 2002-10-04 | Compositions de precurseur a faible viscosite et procedes de depot d'elements electroniques conducteurs |
JP2003534993A JP2005537386A (ja) | 2001-10-05 | 2002-10-04 | 導電性電子フィーチャを堆積するための低粘度前駆体組成物および方法 |
AU2002337822A AU2002337822A1 (en) | 2001-10-05 | 2002-10-04 | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
EP02773719A EP1448725A4 (fr) | 2001-10-05 | 2002-10-04 | Compositions de precurseur a faible viscosite et procedes de depot d'elements electroniques conducteurs |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US32762001P | 2001-10-05 | 2001-10-05 | |
US32762101P | 2001-10-05 | 2001-10-05 | |
US60/327,621 | 2001-10-05 | ||
US60/327,620 | 2001-10-05 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003032084A2 WO2003032084A2 (fr) | 2003-04-17 |
WO2003032084A3 true WO2003032084A3 (fr) | 2003-08-21 |
Family
ID=26985968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/031884 WO2003032084A2 (fr) | 2001-10-05 | 2002-10-04 | Compositions de precurseur a faible viscosite et procedes de depot d'elements electroniques conducteurs |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1448725A4 (fr) |
JP (1) | JP2005537386A (fr) |
KR (1) | KR100893564B1 (fr) |
AU (1) | AU2002337822A1 (fr) |
CA (1) | CA2461338C (fr) |
WO (1) | WO2003032084A2 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7621976B2 (en) | 1997-02-24 | 2009-11-24 | Cabot Corporation | Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom |
Families Citing this family (109)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1468054A1 (fr) * | 2001-11-01 | 2004-10-20 | Yissum Research Development Company of the Hebrew University of Jerusalem | Encres pour jet d'encre contenant des nanoparticules metalliques |
US7005378B2 (en) * | 2002-08-26 | 2006-02-28 | Nanoink, Inc. | Processes for fabricating conductive patterns using nanolithography as a patterning tool |
KR100545288B1 (ko) * | 2003-03-28 | 2006-01-25 | 주식회사 잉크테크 | 유기은 조성물 및 그 제조방법, 그로부터 제조되는 잉크및 그 잉크를 이용한 도전배선 형성 방법 |
DE10326547A1 (de) * | 2003-06-12 | 2005-01-05 | Siemens Ag | Tandemsolarzelle mit einer gemeinsamen organischen Elektrode |
JP2005097345A (ja) * | 2003-09-22 | 2005-04-14 | Konica Minolta Medical & Graphic Inc | インクジェットインクおよびこれを用い作製した非接触通信機能を有するic基体 |
US7618704B2 (en) | 2003-09-29 | 2009-11-17 | E.I. Du Pont De Nemours And Company | Spin-printing of electronic and display components |
KR100568419B1 (ko) * | 2003-12-15 | 2006-04-05 | 매그나칩 반도체 유한회사 | 반도체 소자의 인덕터 제조 방법 |
EP1760171B1 (fr) * | 2004-01-29 | 2011-04-27 | Nippon Mining & Metals Co., Ltd. | Agent de pretraitement pour deposition autocatalytique et methode de deposition autocatalytique utilisant le meme agent |
JP4848617B2 (ja) * | 2004-02-02 | 2011-12-28 | セイコーエプソン株式会社 | 回路基板の製造方法、回路基板、薄膜トランジスタ、電気光学装置、電子機器 |
KR20070040761A (ko) * | 2004-05-28 | 2007-04-17 | 사카타 인쿠스 가부시키가이샤 | 니켈 화합물 함유 용액, 그 제조방법 및 그것을 사용한니켈금속 박막 형성법 |
US20060024447A1 (en) * | 2004-08-02 | 2006-02-02 | Mccomas Edward | Electroless plating with nanometer particles |
US20060083694A1 (en) | 2004-08-07 | 2006-04-20 | Cabot Corporation | Multi-component particles comprising inorganic nanoparticles distributed in an organic matrix and processes for making and using same |
WO2006083326A2 (fr) | 2004-08-07 | 2006-08-10 | Cabot Corporation | Fabrication d'une dispersion gazeuse de nanoparticules, et produits contenant des nanoparticules et traitement de ceux-ci |
US8143326B2 (en) | 2004-09-28 | 2012-03-27 | E.I. Du Pont De Nemours And Company | Spin-printing of electronic and display components |
WO2006071419A2 (fr) * | 2004-11-24 | 2006-07-06 | Nanotechnologies, Inc. | Utilisations electriques, de revetement metallique et catalytiques de compositions de nanomateriaux metalliques |
US20060130700A1 (en) * | 2004-12-16 | 2006-06-22 | Reinartz Nicole M | Silver-containing inkjet ink |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
WO2006076606A2 (fr) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Impression multicouches optimisee de dispositifs electroniques et d'afficheurs |
US7533361B2 (en) | 2005-01-14 | 2009-05-12 | Cabot Corporation | System and process for manufacturing custom electronics by combining traditional electronics with printable electronics |
US8167393B2 (en) | 2005-01-14 | 2012-05-01 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
WO2006076611A2 (fr) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Production de nanoparticules metalliques |
JP4284283B2 (ja) * | 2005-02-02 | 2009-06-24 | Dowaエレクトロニクス株式会社 | 銀の粒子粉末の製造法 |
TWI285568B (en) * | 2005-02-02 | 2007-08-21 | Dowa Mining Co | Powder of silver particles and process |
JP4710342B2 (ja) * | 2005-02-08 | 2011-06-29 | 東洋インキScホールディングス株式会社 | フレキソ印刷用活性エネルギー線硬化型導電性インキおよびそれを用いた印刷物、非接触型メディア |
US7704483B2 (en) | 2005-04-29 | 2010-04-27 | Cabot Corporation | High surface area tetragonal zirconia and processes for synthesizing same |
WO2006135113A1 (fr) * | 2005-06-17 | 2006-12-21 | Sumitomo Metal Mining Co., Ltd. | Liquide d'enduction destiné à former une pellicule de nickel, pellicule de nickel et procédé pour la produire |
US7638072B2 (en) * | 2005-06-27 | 2009-12-29 | E. I. Du Pont De Nemours And Company | Electrically conductive polymer compositions |
JP2007043113A (ja) * | 2005-06-30 | 2007-02-15 | Semiconductor Energy Lab Co Ltd | 半導体装置、半導体装置の作製方法 |
US7732330B2 (en) | 2005-06-30 | 2010-06-08 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method using an ink-jet method of the same |
WO2007004437A1 (fr) * | 2005-07-04 | 2007-01-11 | Osaka Industrial Promotion Organization | $g(b)-cetocarboxylate d'argent, materiau en comportant pour la formation de d'argent metallique, et leur utilisation |
KR100729719B1 (ko) | 2005-09-02 | 2007-06-18 | 연세대학교 산학협력단 | 잉크젯 프린팅용 전도성 잉크 조성물 및 이를 이용한 금속패턴 형성방법 |
DE112006003567T5 (de) * | 2005-12-27 | 2008-10-30 | Bp Corporation North America Inc., Warrenville | Verfahren zum Ausbilden elektrischer Kontakte auf einem Halbleiterwafer unter Verwendung einer Phasenwechsel-Druckfarbe |
JP4899504B2 (ja) * | 2006-02-02 | 2012-03-21 | 株式会社日立製作所 | 有機薄膜トランジスタの製造方法および製造装置 |
TW200800609A (en) * | 2006-02-20 | 2008-01-01 | Daicel Chem | Porous membrane film and laminate using the same |
JP4811066B2 (ja) * | 2006-03-17 | 2011-11-09 | 株式会社村田製作所 | 回路形成用荷電性粉末およびその製造方法ならびに回路パターンを有するガラス基板の製造方法 |
AT9473U1 (de) * | 2006-05-04 | 2007-10-15 | Austria Tech & System Tech | Verfahren zur herstellung wenigstens eines leitfähigen elements einer leiterplatte sowie leiterplatte und verwendung eines derartigen verfahrens |
JP5127155B2 (ja) | 2006-05-12 | 2013-01-23 | 株式会社日立製作所 | 配線および有機トランジスタとその製法 |
DE102006028536A1 (de) * | 2006-06-21 | 2007-12-27 | Axel Ahnert | Verfahren zur Herstellung eines Schaltungsteils auf einem Substrat |
JP4235921B2 (ja) * | 2006-09-21 | 2009-03-11 | 株式会社フューチャービジョン | 液晶表示パネルの製造方法および液晶表示パネル |
JP5219296B2 (ja) * | 2006-09-22 | 2013-06-26 | フライズ・メタルズ・インコーポレイテッド | 金属およびインクのための溶剤系 |
JP5179092B2 (ja) * | 2006-10-03 | 2013-04-10 | 新光電気工業株式会社 | 銅膜の形成方法 |
DE102007037079A1 (de) | 2006-10-25 | 2008-04-30 | Bayer Materialscience Ag | Silberhaltige wässrige Formulierung und ihre Verwendung zur Herstellung von elektrisch leitenden oder spiegelnden Beschichtungen |
WO2008111484A1 (fr) | 2007-03-15 | 2008-09-18 | Dic Corporation | Encre conductrice pour une impression en transparence typographique |
WO2008114430A1 (fr) * | 2007-03-20 | 2008-09-25 | Kabushiki Kaisha Nihon Micronics | Elément de boîtier empilé, procédé de formation de borne de l'élément de boîtier empilé, boîtier empilé, et procédé de formation de boîtier empilé |
JP5069744B2 (ja) * | 2007-05-14 | 2012-11-07 | 株式会社日本マイクロニクス | 積層型パッケージ、及び、積層型パッケージの形成方法 |
ATE556572T1 (de) | 2007-06-01 | 2012-05-15 | Bae Systems Plc | Direktschreib- und additive herstellungsprozesse und -vorrichtung |
US8143431B2 (en) | 2007-06-05 | 2012-03-27 | Air Products And Chemicals, Inc. | Low temperature thermal conductive inks |
US20090023235A1 (en) * | 2007-07-19 | 2009-01-22 | Mackenzie John D | Method and Apparatus for Improved Printed Cathodes for Light-Emitting Devices |
JP2009167522A (ja) * | 2007-12-21 | 2009-07-30 | Shinko Electric Ind Co Ltd | 銅膜の形成方法 |
US8048488B2 (en) * | 2008-01-14 | 2011-11-01 | Xerox Corporation | Methods for removing a stabilizer from a metal nanoparticle using a destabilizer |
JP5108628B2 (ja) * | 2008-05-23 | 2012-12-26 | 克廣 前川 | 高密着性金属ナノ粒子焼結体膜の形成方法 |
KR100978671B1 (ko) * | 2008-08-05 | 2010-08-30 | 삼성전기주식회사 | 금속입자 분산액 |
EP2159270A1 (fr) * | 2008-08-28 | 2010-03-03 | Bayer MaterialScience AG | Procédé de fabrication de structures conductrices électriques |
KR101096031B1 (ko) | 2009-03-31 | 2011-12-19 | 한양대학교 산학협력단 | 자기조립단분자막 형성방법과 이를 이용한 반도체 소자의 구리배선 및 그의 형성방법 |
DE102009053943A1 (de) * | 2009-11-19 | 2011-05-26 | Evonik Degussa Gmbh | Verfahren zur Erzeugung silberhaltiger Strukturen, die silberhaltigen Strukturen aufweisende Erzeugnisse und ihre Verwendung |
JP5468885B2 (ja) * | 2009-12-01 | 2014-04-09 | ハリマ化成株式会社 | 導電性アルミニウムペースト |
KR20110064153A (ko) | 2009-12-07 | 2011-06-15 | 삼성전자주식회사 | 금속 유기 전구체, 이의 제조방법, 및 이를 이용한 전도성 금속막 또는 패턴 형성방법 |
JP2011122177A (ja) * | 2009-12-08 | 2011-06-23 | Tosoh Corp | 複合体微粒子、その製造方法、並びにそれを用いた導電膜形成用組成物、及び導電膜の形成方法 |
US9080067B2 (en) * | 2010-03-01 | 2015-07-14 | Sun Chemical Corporation | Surface tension of inks for high speeding printing |
US8877103B2 (en) | 2010-04-13 | 2014-11-04 | Johnson & Johnson Vision Care, Inc. | Process for manufacture of a thermochromic contact lens material |
US8697770B2 (en) | 2010-04-13 | 2014-04-15 | Johnson & Johnson Vision Care, Inc. | Pupil-only photochromic contact lenses displaying desirable optics and comfort |
JP5866749B2 (ja) * | 2010-05-19 | 2016-02-17 | 東ソー株式会社 | 導電性インク組成物、電気的導通部位の製造方法、及びその用途 |
WO2012010893A1 (fr) * | 2010-07-21 | 2012-01-26 | Bae Systems Plc | Formation d'éléments fonctionnels ou structuraux par écriture directe sur une surface |
EP2410077A1 (fr) * | 2010-07-21 | 2012-01-25 | BAE Systems PLC | Formation d'éléments structurels ou fonctionnels d'écriture directe sur une surface |
JP2012126815A (ja) * | 2010-12-15 | 2012-07-05 | Tosoh Corp | 導電性インク組成物及びその製造方法 |
JP2012126814A (ja) * | 2010-12-15 | 2012-07-05 | Tosoh Corp | 導電性インク組成物、及び電気的導通部位の製造方法 |
JP2012131894A (ja) * | 2010-12-21 | 2012-07-12 | Tosoh Corp | 導電性インク組成物、及びそれを用いて製造された電気的導通部位 |
DE102011000562A1 (de) * | 2011-02-08 | 2012-08-09 | Solarworld Innovations Gmbh | Verfahren zur Erzeugung von lötbaren Kontaktstrukturen auf einer Substratoberfläche |
US9487669B2 (en) * | 2011-05-04 | 2016-11-08 | Liquid X Printed Metals, Inc. | Metal alloys from molecular inks |
JP5876996B2 (ja) * | 2011-06-24 | 2016-03-02 | ハリマ化成株式会社 | 傾斜構造の形成方法及び分散液 |
FR2977178B1 (fr) * | 2011-06-30 | 2014-05-16 | Thales Sa | Procede de fabrication d'un dispositif comprenant des brasures realisees a partir d'oxalate metallique |
WO2013036519A1 (fr) | 2011-09-06 | 2013-03-14 | Henkel Corporation | Matériau conducteur et procédé associé |
DE102012206587A1 (de) | 2012-04-20 | 2013-11-07 | Technische Universität Berlin | Lotmaterial, Verfahren zu dessen Herstellung und seine Verwendung zum drucklosen Fügen metallischer Substrate |
US9034075B2 (en) | 2012-04-30 | 2015-05-19 | Dow Global Technologies Llc | Methods of manufacturing high aspect ratio silver nanowires |
US9758688B2 (en) | 2012-09-21 | 2017-09-12 | Sumitomo Chemical Company, Limited | Composition for forming conductive film |
EP2733759A1 (fr) * | 2012-11-15 | 2014-05-21 | Heraeus Precious Metals GmbH & Co. KG | Composite multicouche avec couche organométallique |
US8828503B1 (en) * | 2013-02-28 | 2014-09-09 | Eastman Kodak Company | Making multi-layer micro-wire structure |
US10883011B2 (en) * | 2014-06-19 | 2021-01-05 | Groupe Graham International Inc. | Molecular inks |
JP6920631B2 (ja) * | 2014-08-29 | 2021-08-18 | 株式会社Flosfia | 金属膜形成方法 |
JP6945120B2 (ja) * | 2014-08-29 | 2021-10-06 | 株式会社Flosfia | 金属膜形成方法 |
DE102015013238A1 (de) | 2014-10-28 | 2016-04-28 | Dow Global Technologies Llc | Verfahren mit niedriger Sauerstoffkonzentration zur Herstellung von Silber-Nanodrähten |
DE102015013239A1 (de) | 2014-10-28 | 2016-04-28 | Dow Global Technologies Llc | Hydrothermalverfahren zur Herstellung von Silber-Nanodrähten |
DE102015013219A1 (de) | 2014-10-28 | 2016-04-28 | Dow Global Technologies Llc | Verfahren zur Herstellung von Silber-Nanodrähten |
DE102015013220A1 (de) | 2014-10-28 | 2016-04-28 | Dow Global Technologies Llc | Verfahren zur Herstellung von Silber-Nanodrähten |
JP6483462B2 (ja) * | 2015-02-13 | 2019-03-13 | 株式会社ミマキエンジニアリング | 印刷方法及び印刷装置 |
JP5983805B2 (ja) * | 2015-03-06 | 2016-09-06 | 東ソー株式会社 | 導電性インク組成物、電気的導通部位の製造方法、及びその用途 |
EP3085811A1 (fr) * | 2015-04-20 | 2016-10-26 | Heraeus Deutschland GmbH & Co. KG | Compositions ag à basse température |
US10376898B2 (en) | 2015-06-12 | 2019-08-13 | Dow Global Technologies Llc | Method for manufacturing high aspect ratio silver nanowires |
US10081020B2 (en) | 2015-06-12 | 2018-09-25 | Dow Global Technologies Llc | Hydrothermal method for manufacturing filtered silver nanowires |
WO2017065395A1 (fr) * | 2015-10-13 | 2017-04-20 | (주)썬텍엔지니어링 | Appareil d'analyse de métaux lourds d'articles multiples en temps réel, procédé d'analyse de métaux lourds d'articles multiples en temps réel, et procédé de fabrication de capteur d'appareil d'analyse de métaux lourds |
FR3045675A1 (fr) * | 2015-12-17 | 2017-06-23 | Univ Toulouse Iii - Paul Sabatier | Procede de fabrication d'une piece ou d'une microstructure supportee par insolation laser a partir d'un oxalate de metal |
CN110382637A (zh) * | 2017-02-08 | 2019-10-25 | 加拿大国家研究委员会 | 可印刷分子油墨 |
TW201842087A (zh) | 2017-02-08 | 2018-12-01 | 加拿大國家研究委員會 | 具改良之熱穩定性的分子油墨 |
TWI842668B (zh) * | 2017-02-08 | 2024-05-21 | 加拿大國家研究委員會 | 具低黏度與低加工溫度之銀分子油墨 |
EP3625296A1 (fr) | 2017-05-15 | 2020-03-25 | Basf Se | Procédé pour la préparation de couches de nanoparticules métalliques et leur utilisation pour des éléments décoratifs ou de sécurité |
US11643561B2 (en) | 2017-07-28 | 2023-05-09 | Basf Se | Process for the preparation of metallic nano-particle layers and their use for decorative or security elements |
CN112334029A (zh) * | 2018-02-13 | 2021-02-05 | 液体X印刷金属有限公司 | 使用无颗粒导电油墨制造的电子纺织物 |
US11284510B2 (en) * | 2018-04-17 | 2022-03-22 | Board Of Trustees Of Michigan State University | Controlled wetting and spreading of metals on substrates using porous interlayers and related articles |
US11724471B2 (en) | 2019-03-28 | 2023-08-15 | Johnson & Johnson Vision Care, Inc. | Methods for the manufacture of photoabsorbing contact lenses and photoabsorbing contact lenses produced thereby |
KR102129886B1 (ko) * | 2019-03-29 | 2020-08-05 | 주식회사 픽스앤맥스 | 목재 pcb 기판 제작 방법 및 이를 이용하여 제작된 목재 pcb 기판 |
EP3972980A4 (fr) | 2019-05-20 | 2023-06-21 | Liquid X Printed Metals, Inc. | Encres adhésives à base d'or exemptes de particules |
EP4055617B1 (fr) * | 2019-11-06 | 2023-05-31 | Heraeus Deutschland GmbH & Co. KG | Préparations des complexes de platine |
IT201900022953A1 (it) * | 2019-12-04 | 2021-06-04 | Cleanby S R L | “uso di una miscela pulente per la detersione di ugelli di stampanti digitali ceramiche” |
US20220145102A1 (en) * | 2020-11-09 | 2022-05-12 | General Electric Company | Dip-coat binder solutions comprising metal dip-coat powder for use in additive manufacturing |
US12064810B2 (en) * | 2020-11-09 | 2024-08-20 | General Electric Company | Dip-coat binder solutions comprising a dip-coat metallic precursor for use in additive manufacturing |
WO2022119584A1 (fr) * | 2020-12-01 | 2022-06-09 | Hewlett-Packard Development Company, L.P. | Tracés conducteurs |
KR20230019148A (ko) * | 2020-12-15 | 2023-02-07 | 코쿠리츠켄큐카이하츠호징 붓시쯔 자이료 켄큐키코 | 구리 니켈 합금 전극용 도전성 잉크, 구리 니켈 합금 전극 부착 기판, 및 그것들의 제조 방법 |
CN114975378B (zh) * | 2022-04-29 | 2024-02-06 | 西安电子科技大学 | 基于3d打印的柔性射频封装模块及制备方法 |
WO2024248066A1 (fr) * | 2023-05-30 | 2024-12-05 | 株式会社ダイセル | Polymère, composition de résine photosensible le contenant, pâte de cuivre, composition liquide, procédé de fabrication de dispositif à semi-conducteurs, et procédé de fabrication de pilier en cuivre pour connexion à semi-conducteurs |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4170480A (en) * | 1976-09-07 | 1979-10-09 | Fuji Photo Film Co., Ltd. | Thermally developable light-sensitive material |
US4622069A (en) * | 1984-03-16 | 1986-11-11 | Okuno Chemical Industry Co., Ltd. | Catalyst composition for forming electroless plating on ceramics |
JPS63278983A (ja) * | 1987-05-09 | 1988-11-16 | Toyota Autom Loom Works Ltd | 金属有機物インク |
EP0696515A1 (fr) * | 1994-07-11 | 1996-02-14 | Agfa-Gevaert N.V. | Procédé d'impression par jet d'encre |
JP2000011875A (ja) * | 1998-06-19 | 2000-01-14 | Dainippon Toryo Co Ltd | プラズマディスプレイの製造方法 |
US6143356A (en) * | 1999-08-06 | 2000-11-07 | Parelec, Inc. | Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards |
US6197366B1 (en) * | 1997-05-06 | 2001-03-06 | Takamatsu Research Laboratory | Metal paste and production process of metal film |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB566718A (en) * | 1943-09-07 | 1945-01-10 | Johnson Matthey Co Ltd | Improvements in or relating to the silvering of non-metallic surfaces |
KR960010822B1 (ko) * | 1987-12-24 | 1996-08-09 | 미쓰비시 가스 가가꾸 가부시끼가이샤 | 구리 필름 발포체의 제조방법 |
EP0508399A2 (fr) * | 1991-04-08 | 1992-10-14 | Mitsubishi Gas Chemical Company, Inc. | Procédé de fabrication de substrats recouverts d'un film mince |
US5980998A (en) * | 1997-09-16 | 1999-11-09 | Sri International | Deposition of substances on a surface |
US6753108B1 (en) * | 1998-02-24 | 2004-06-22 | Superior Micropowders, Llc | Energy devices and methods for the fabrication of energy devices |
AU2000225122A1 (en) * | 2000-01-21 | 2001-07-31 | Midwest Research Institute | Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
-
2002
- 2002-10-04 JP JP2003534993A patent/JP2005537386A/ja active Pending
- 2002-10-04 AU AU2002337822A patent/AU2002337822A1/en not_active Abandoned
- 2002-10-04 EP EP02773719A patent/EP1448725A4/fr not_active Withdrawn
- 2002-10-04 WO PCT/US2002/031884 patent/WO2003032084A2/fr active Search and Examination
- 2002-10-04 CA CA2461338A patent/CA2461338C/fr not_active Expired - Fee Related
- 2002-10-04 KR KR1020047004984A patent/KR100893564B1/ko not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4170480A (en) * | 1976-09-07 | 1979-10-09 | Fuji Photo Film Co., Ltd. | Thermally developable light-sensitive material |
US4622069A (en) * | 1984-03-16 | 1986-11-11 | Okuno Chemical Industry Co., Ltd. | Catalyst composition for forming electroless plating on ceramics |
JPS63278983A (ja) * | 1987-05-09 | 1988-11-16 | Toyota Autom Loom Works Ltd | 金属有機物インク |
EP0696515A1 (fr) * | 1994-07-11 | 1996-02-14 | Agfa-Gevaert N.V. | Procédé d'impression par jet d'encre |
US6197366B1 (en) * | 1997-05-06 | 2001-03-06 | Takamatsu Research Laboratory | Metal paste and production process of metal film |
JP2000011875A (ja) * | 1998-06-19 | 2000-01-14 | Dainippon Toryo Co Ltd | プラズマディスプレイの製造方法 |
US6143356A (en) * | 1999-08-06 | 2000-11-07 | Parelec, Inc. | Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7621976B2 (en) | 1997-02-24 | 2009-11-24 | Cabot Corporation | Coated silver-containing particles, method and apparatus of manufacture, and silver-containing devices made therefrom |
Also Published As
Publication number | Publication date |
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CA2461338A1 (fr) | 2003-04-17 |
WO2003032084A2 (fr) | 2003-04-17 |
CA2461338C (fr) | 2011-12-20 |
KR20050033513A (ko) | 2005-04-12 |
JP2005537386A (ja) | 2005-12-08 |
EP1448725A2 (fr) | 2004-08-25 |
KR100893564B1 (ko) | 2009-04-17 |
AU2002337822A1 (en) | 2003-04-22 |
EP1448725A4 (fr) | 2008-07-23 |
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