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WO2003031912A3 - Gyroscope a diapason - Google Patents

Gyroscope a diapason Download PDF

Info

Publication number
WO2003031912A3
WO2003031912A3 PCT/US2002/031721 US0231721W WO03031912A3 WO 2003031912 A3 WO2003031912 A3 WO 2003031912A3 US 0231721 W US0231721 W US 0231721W WO 03031912 A3 WO03031912 A3 WO 03031912A3
Authority
WO
WIPO (PCT)
Prior art keywords
proof mass
tuning fork
fork gyroscope
sense plate
gyroscope
Prior art date
Application number
PCT/US2002/031721
Other languages
English (en)
Other versions
WO2003031912A2 (fr
Inventor
Marc S Weinberg
Anthony S Kourepenis
William D Sawyer
Jeffrey T Borenstein
James H Connelly
Amy E Duwel
Christopher M Lento
James R Cousens
Original Assignee
Draper Lab Charles S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/004,145 external-priority patent/US6548321B1/en
Application filed by Draper Lab Charles S filed Critical Draper Lab Charles S
Publication of WO2003031912A2 publication Critical patent/WO2003031912A2/fr
Publication of WO2003031912A3 publication Critical patent/WO2003031912A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Gyroscopes (AREA)

Abstract

L'invention concerne un gyroscope à diapason comprenant généralement au moins une masse effective, une plaque de détection supérieure étant disposée au-dessus de la masse effective et une plaque de détection inférieure état disposée au-dessous de la masse effective, ainsi que des moyens permettant de détecter des changements dans les espaces nominaux entre la plaque de détection et la masse effective et permettant d'émettre un signal indiquant la vitesse angulaire du gyroscope.
PCT/US2002/031721 2001-10-05 2002-10-04 Gyroscope a diapason WO2003031912A2 (fr)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
US32745001P 2001-10-05 2001-10-05
US32743401P 2001-10-05 2001-10-05
US60/327,450 2001-10-05
US60/327,434 2001-10-05
US10/004,145 2001-10-23
US10/004,145 US6548321B1 (en) 2001-10-23 2001-10-23 Method of anodically bonding a multilayer device with a free mass

Publications (2)

Publication Number Publication Date
WO2003031912A2 WO2003031912A2 (fr) 2003-04-17
WO2003031912A3 true WO2003031912A3 (fr) 2004-03-04

Family

ID=27357574

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/031721 WO2003031912A2 (fr) 2001-10-05 2002-10-04 Gyroscope a diapason

Country Status (2)

Country Link
US (2) US6862934B2 (fr)
WO (1) WO2003031912A2 (fr)

Families Citing this family (29)

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Publication number Priority date Publication date Assignee Title
US7093370B2 (en) 2002-08-01 2006-08-22 The Charles Stark Draper Laboratory, Inc. Multi-gimbaled borehole navigation system
WO2004013573A2 (fr) 2002-08-01 2004-02-12 The Charles Stark Draper Laboratory, Inc. Systeme de navigation dans un trou de sondage
JP2004317484A (ja) * 2003-03-31 2004-11-11 Denso Corp 振動型角速度センサ
US6918186B2 (en) 2003-08-01 2005-07-19 The Charles Stark Draper Laboratory, Inc. Compact navigation system and method
US7426861B2 (en) * 2005-06-15 2008-09-23 The Charles Stark Draper Laboratory, Inc. Tuning fork gyroscopes, accelerometers, and other sensors with improved scale factor
US20070114643A1 (en) * 2005-11-22 2007-05-24 Honeywell International Inc. Mems flip-chip packaging
US7491567B2 (en) * 2005-11-22 2009-02-17 Honeywell International Inc. MEMS device packaging methods
JP4310325B2 (ja) * 2006-05-24 2009-08-05 日立金属株式会社 角速度センサ
US8187902B2 (en) * 2008-07-09 2012-05-29 The Charles Stark Draper Laboratory, Inc. High performance sensors and methods for forming the same
TWI374268B (en) * 2008-09-05 2012-10-11 Ind Tech Res Inst Multi-axis capacitive accelerometer
US8205498B2 (en) * 2008-11-18 2012-06-26 Industrial Technology Research Institute Multi-axis capacitive accelerometer
DE102009000345A1 (de) * 2009-01-21 2010-07-22 Robert Bosch Gmbh Drehratensensor
EP2435789B1 (fr) * 2009-05-27 2015-04-08 King Abdullah University Of Science And Technology Système masse-ressort-amortisseur de système microélectromécanique (mems) utilisant un schéma de suspension hors-plan
US8534127B2 (en) 2009-09-11 2013-09-17 Invensense, Inc. Extension-mode angular velocity sensor
US9097524B2 (en) 2009-09-11 2015-08-04 Invensense, Inc. MEMS device with improved spring system
FR2974895B1 (fr) * 2011-05-02 2013-06-28 Commissariat Energie Atomique Gyrometre a capacites parasites reduites
US8833162B2 (en) 2011-09-16 2014-09-16 Invensense, Inc. Micromachined gyroscope including a guided mass system
US9714842B2 (en) 2011-09-16 2017-07-25 Invensense, Inc. Gyroscope self test by applying rotation on coriolis sense mass
US9170107B2 (en) 2011-09-16 2015-10-27 Invensense, Inc. Micromachined gyroscope including a guided mass system
US9863769B2 (en) 2011-09-16 2018-01-09 Invensense, Inc. MEMS sensor with decoupled drive system
US10914584B2 (en) 2011-09-16 2021-02-09 Invensense, Inc. Drive and sense balanced, semi-coupled 3-axis gyroscope
FI124624B (en) * 2012-06-29 2014-11-14 Murata Manufacturing Co Improved oscillating gyroscope
US9568491B2 (en) * 2013-07-08 2017-02-14 Honeywell International Inc. Reducing the effect of glass charging in MEMS devices
US9476712B2 (en) * 2013-07-31 2016-10-25 Honeywell International Inc. MEMS device mechanism enhancement for robust operation through severe shock and acceleration
US9958271B2 (en) 2014-01-21 2018-05-01 Invensense, Inc. Configuration to reduce non-linear motion
US10696541B2 (en) 2016-05-26 2020-06-30 Honeywell International Inc. Systems and methods for bias suppression in a non-degenerate MEMS sensor
US11530917B2 (en) 2018-09-24 2022-12-20 The Charles Stark Draper Laboratory, Inc. Methods for fabricating silicon MEMS gyroscopes with upper and lower sense plates
US11561094B2 (en) 2018-10-16 2023-01-24 The Charles Stark Draper Laboratory, Inc. Method and system for control and readout of tuning fork gyroscope
DE102020120906B4 (de) * 2020-08-07 2024-09-19 Infineon Technologies Ag Verfahren zum Bestimmen eines Torsionswinkels eines Spiegelkörpers einer MEMS-Vorrichtung

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5911156A (en) * 1997-02-24 1999-06-08 The Charles Stark Draper Laboratory, Inc. Split electrode to minimize charge transients, motor amplitude mismatch errors, and sensitivity to vertical translation in tuning fork gyros and other devices
US20010001928A1 (en) * 1997-11-04 2001-05-31 Ngk Insulators, Ltd. Vibrators, vibratory gyroscopes, devices for measuring a linear acceleration and a method of measuring a turning angular rate
US6250156B1 (en) * 1996-05-31 2001-06-26 The Regents Of The University Of California Dual-mass micromachined vibratory rate gyroscope
US6257059B1 (en) * 1999-09-24 2001-07-10 The Charles Stark Draper Laboratory, Inc. Microfabricated tuning fork gyroscope and associated three-axis inertial measurement system to sense out-of-plane rotation

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0810170B2 (ja) 1987-03-06 1996-01-31 株式会社日立製作所 半導体絶対圧力センサの製造方法
US6155115A (en) * 1991-01-02 2000-12-05 Ljung; Per Vibratory angular rate sensor
US5492596A (en) * 1994-02-04 1996-02-20 The Charles Stark Draper Laboratory, Inc. Method of making a micromechanical silicon-on-glass tuning fork gyroscope
JP3613838B2 (ja) * 1995-05-18 2005-01-26 株式会社デンソー 半導体装置の製造方法
US5992233A (en) * 1996-05-31 1999-11-30 The Regents Of The University Of California Micromachined Z-axis vibratory rate gyroscope
US6265246B1 (en) * 1999-07-23 2001-07-24 Agilent Technologies, Inc. Microcap wafer-level package
US6272925B1 (en) * 1999-09-16 2001-08-14 William S. Watson High Q angular rate sensing gyroscope
JP3573048B2 (ja) * 2000-02-14 2004-10-06 松下電器産業株式会社 半導体装置の製造方法
JP3379518B2 (ja) * 2000-08-14 2003-02-24 株式会社村田製作所 圧電素子の製造方法
JP3957038B2 (ja) * 2000-11-28 2007-08-08 シャープ株式会社 半導体基板及びその作製方法
US6548321B1 (en) * 2001-10-23 2003-04-15 The Charles Stark Draper Laboratory, Inc. Method of anodically bonding a multilayer device with a free mass
EP1490699A1 (fr) * 2002-03-26 2004-12-29 The Charles Stark Draper Laboratory, INC. Capteurs microelectromecaniques a erreur de polarisation de signaux reduite et leur procede de fabrication
US7138293B2 (en) * 2002-10-04 2006-11-21 Dalsa Semiconductor Inc. Wafer level packaging technique for microdevices

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6250156B1 (en) * 1996-05-31 2001-06-26 The Regents Of The University Of California Dual-mass micromachined vibratory rate gyroscope
US5911156A (en) * 1997-02-24 1999-06-08 The Charles Stark Draper Laboratory, Inc. Split electrode to minimize charge transients, motor amplitude mismatch errors, and sensitivity to vertical translation in tuning fork gyros and other devices
US20010001928A1 (en) * 1997-11-04 2001-05-31 Ngk Insulators, Ltd. Vibrators, vibratory gyroscopes, devices for measuring a linear acceleration and a method of measuring a turning angular rate
US6257059B1 (en) * 1999-09-24 2001-07-10 The Charles Stark Draper Laboratory, Inc. Microfabricated tuning fork gyroscope and associated three-axis inertial measurement system to sense out-of-plane rotation

Also Published As

Publication number Publication date
WO2003031912A2 (fr) 2003-04-17
US6862934B2 (en) 2005-03-08
US7172919B2 (en) 2007-02-06
US20050081631A1 (en) 2005-04-21
US20070062283A9 (en) 2007-03-22
US20030066351A1 (en) 2003-04-10

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