+

WO2003030609A1 - Electric apparatus comprising shield structure - Google Patents

Electric apparatus comprising shield structure Download PDF

Info

Publication number
WO2003030609A1
WO2003030609A1 PCT/JP2002/009485 JP0209485W WO03030609A1 WO 2003030609 A1 WO2003030609 A1 WO 2003030609A1 JP 0209485 W JP0209485 W JP 0209485W WO 03030609 A1 WO03030609 A1 WO 03030609A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed board
electric apparatus
shield member
section
face
Prior art date
Application number
PCT/JP2002/009485
Other languages
French (fr)
Japanese (ja)
Inventor
Noriyoshi Sato
Masaki Amie
Original Assignee
Matsushita Electric Industrial Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.
Publication of WO2003030609A1 publication Critical patent/WO2003030609A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • H05K9/0016—Gaskets or seals having a spring contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

An electric apparatus a shield structure which facilitates the automation of the mounting of a shield member on a printed board without reducing the component mounting range of a printed board back, prevents the shield member from coming off by a drop, and facilitates maintenance. A shield member (101) of this electric apparatus has a top face (102), which covers the circuit section on a printed board (109), and an outer periphery (103) including the circuit section. A clamping member (104) has a plane section (105) and a clamping section (106), which is formed at both ends of one face of the plane section (105) and elastically clamps both faces of the outer periphery (103). A face opposite the one face of the plane section (105) is connected by soldering on the printed board (109), so that the shield member (101) is mounted on the printed board (109).
PCT/JP2002/009485 2001-09-28 2002-09-17 Electric apparatus comprising shield structure WO2003030609A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2001-302578 2001-09-28
JP2001302578A JP2003110274A (en) 2001-09-28 2001-09-28 Electronic equipment equipped with shield structure

Publications (1)

Publication Number Publication Date
WO2003030609A1 true WO2003030609A1 (en) 2003-04-10

Family

ID=19122797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/009485 WO2003030609A1 (en) 2001-09-28 2002-09-17 Electric apparatus comprising shield structure

Country Status (2)

Country Link
JP (1) JP2003110274A (en)
WO (1) WO2003030609A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7501587B2 (en) 2007-04-16 2009-03-10 Laird Technologies, Inc. Mounting clips for use with electromagnetic interference shielding and methods of using the same
GB2464328A (en) * 2008-10-13 2010-04-14 Askey Computer Corp Attaching method of an isolation cover that reduces heat dissipation during manufacture
US8337219B2 (en) 2011-02-19 2012-12-25 Laird Technologies, Inc. Card guide grounding strips

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007034754A1 (en) * 2005-09-20 2007-03-29 Murata Manufacturing Co., Ltd. Shield structure
JP4631970B2 (en) 2006-05-30 2011-02-16 株式会社村田製作所 Shield structure
JP4827135B2 (en) * 2006-11-10 2011-11-30 北川工業株式会社 Surface mount clip
JP5170583B2 (en) * 2010-05-26 2013-03-27 シャープ株式会社 Shield cover and base unit having the shield cover
KR101169955B1 (en) * 2010-10-06 2012-09-19 (주)케이티엑스 A clip for fixing of shield can protecting emi
KR101029221B1 (en) 2011-01-14 2011-04-14 에프엔티주식회사 Shield can fixing clip for electromagnetic shielding with partial plating layer
KR101052559B1 (en) * 2011-02-25 2011-07-29 김선기 Shield case for electromagnetic shielding and protection
JP2013211294A (en) * 2012-03-30 2013-10-10 Auto Splice Kk Shield case assembly
JP6160910B2 (en) * 2013-07-10 2017-07-12 北川工業株式会社 Electromagnetic shielding structure

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814600A (en) * 1981-07-17 1983-01-27 富士通テン株式会社 Device for mounting shielding plate for electronic equipment
US5792994A (en) * 1995-08-09 1998-08-11 Mitsubishi Denki Kabushiki Kaisha Device for mounting a component
JPH10294585A (en) * 1997-04-22 1998-11-04 Kokusai Electric Co Ltd Shield case for printed circuit board
JPH1126978A (en) * 1997-07-03 1999-01-29 Ace Five:Kk Electromagnetic shield connecting device and connecting terminal
WO2000025563A1 (en) * 1998-10-28 2000-05-04 Qualcomm Incorporated A shield clip and method of securing a shield cover

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5814600A (en) * 1981-07-17 1983-01-27 富士通テン株式会社 Device for mounting shielding plate for electronic equipment
US5792994A (en) * 1995-08-09 1998-08-11 Mitsubishi Denki Kabushiki Kaisha Device for mounting a component
JPH10294585A (en) * 1997-04-22 1998-11-04 Kokusai Electric Co Ltd Shield case for printed circuit board
JPH1126978A (en) * 1997-07-03 1999-01-29 Ace Five:Kk Electromagnetic shield connecting device and connecting terminal
WO2000025563A1 (en) * 1998-10-28 2000-05-04 Qualcomm Incorporated A shield clip and method of securing a shield cover

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7501587B2 (en) 2007-04-16 2009-03-10 Laird Technologies, Inc. Mounting clips for use with electromagnetic interference shielding and methods of using the same
GB2464328A (en) * 2008-10-13 2010-04-14 Askey Computer Corp Attaching method of an isolation cover that reduces heat dissipation during manufacture
GB2464328B (en) * 2008-10-13 2011-01-26 Askey Computer Corp Circuit board of communication product and manufacturing method thereof
US8337219B2 (en) 2011-02-19 2012-12-25 Laird Technologies, Inc. Card guide grounding strips

Also Published As

Publication number Publication date
JP2003110274A (en) 2003-04-11

Similar Documents

Publication Publication Date Title
WO2001084898A3 (en) Electronic control module for a vehicle
TW374976B (en) Protective shield
US6377462B1 (en) Circuit board assembly with heat sinking
AU5136398A (en) Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
WO2006102876A3 (en) Electronic assembly
CA2261551A1 (en) Socket for integrated circuit chip
WO2003030609A1 (en) Electric apparatus comprising shield structure
CA2182852A1 (en) Shield Assembly and Method of Shielding Suitable for Use in a Communication Device
ATE166495T1 (en) CONNECTOR BLOCK
SE9302243D0 (en) DEVICE FOR SHIELDING AND COOLING ELECTRONIC COMPONENT
EP1096516A3 (en) Low profile inductive component
CA2214656A1 (en) Surface mount wire connector
EP0660460A3 (en) Electrical connector for mounting on a printed circuit board.
JP2004319381A (en) Grounding terminal
US4741472A (en) Method of soldering an integrated circuit and printed circuit board
JPH06101615B2 (en) Component mounting structure on printed circuit board
SG96612A1 (en) Electronic component of a high frequency current suppression type and bonding wire for the same
AU2002258691A1 (en) Shielded electrical connector for mounting on a printed circuit board
CA2104540A1 (en) Solder Paste
DE59814036D1 (en) Sub-D plug in SMD technology
KR100229891B1 (en) Emi-shielding device
WO2002058444A3 (en) High-g mounting arrangement for electronic chip carrier
WO2003065449A3 (en) Power semiconductor, and method for producing the same
EP1079476A3 (en) Method of mounting an electric part on a circuit board
KR20040008218A (en) Method for assembly and/or disassembly of an electronic module on an application card method for production and corresponding mechanical fixing clip

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BY BZ CA CH CN CO CR CU CZ DE DM DZ EC EE ES FI GB GD GE GH HR HU ID IL IN IS KE KG KP KR KZ LK LR LS LT LU LV MA MD MG MK MW MX MZ NO NZ OM PH PL PT RO SD SE SG SI SK SL TJ TM TN TR TT UA UG US UZ VN YU ZA ZM

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW MZ SD SL SZ UG ZM ZW AM AZ BY KG KZ RU TJ TM AT BE BG CH CY CZ DK EE ES FI FR GB GR IE IT LU MC PT SE SK TR BF BJ CF CG CI GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
122 Ep: pct application non-entry in european phase
点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载