WO2003012166A2 - Method for producing a metal flat base material particularly for a superconducting layer - Google Patents
Method for producing a metal flat base material particularly for a superconducting layer Download PDFInfo
- Publication number
- WO2003012166A2 WO2003012166A2 PCT/DE2002/002687 DE0202687W WO03012166A2 WO 2003012166 A2 WO2003012166 A2 WO 2003012166A2 DE 0202687 W DE0202687 W DE 0202687W WO 03012166 A2 WO03012166 A2 WO 03012166A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- base material
- substrate
- metal
- superconducting
- Prior art date
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 title claims abstract description 44
- 239000000463 material Substances 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims abstract description 27
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000004332 silver Substances 0.000 claims description 11
- 238000005240 physical vapour deposition Methods 0.000 claims description 9
- 239000002131 composite material Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 7
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229910001316 Ag alloy Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 4
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 4
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 229910021521 yttrium barium copper oxide Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 239000002887 superconductor Substances 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005408 paramagnetism Effects 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N60/00—Superconducting devices
- H10N60/01—Manufacture or treatment
- H10N60/0268—Manufacture or treatment of devices comprising copper oxide
- H10N60/0296—Processes for depositing or forming copper oxide superconductor layers
- H10N60/0576—Processes for depositing or forming copper oxide superconductor layers characterised by the substrate
Definitions
- the invention relates to a method for producing a flat base material made of metal for applying a superconducting layer.
- RABITS Rolling Assisted Biaxial Testuring of Substrates
- the invention has for its object to provide a method for producing a flat base material for applying a superconducting layer, which can not only be carried out comparatively inexpensively, but which can also be used to produce base material with which superconducting, in particular high-temperature superconducting components with very good superconducting properties can be produced let create.
- a metal layer is galvanically produced on a single-crystalline substrate and the metal layer is detached from the substrate to obtain the base material.
- Microx can be produced by a simple electroplating process and subsequent detachment of the metal layer from the matrix or from the substrate, a two-dimensional base material made of metal, which is used to apply a layer made of a superconducting material, in particular a high-temperature superconducting material Formation of a superconductor is very suitable because this base material has the favorable texture of the substrate for this purpose. Another important advantage is that the - expensive substrate is reusable.
- a metallic auxiliary layer is advantageously formed on the substrate prior to the galvanic production of the metal layer, and at least the metal layer is detached from the substrate to obtain the base material.
- the auxiliary layer can advantageously by means of z. B. PCT (Physical Vapor Deposition). The auxiliary layer can therefore remain on the substrate; if it is replaced in each case, then the Detach the double layer more easily from the substrate without damage and then process it further.
- a metallic auxiliary layer is formed on the substrate before the galvanic production of the metal layer, and at least one insulating buffer layer is applied to the metal layer and, in turn, the superconducting layer thereon, and then the layer composite thus formed, at least including the metal layer detached from the substrate. From this composite layer - with us without an auxiliary layer - superconducting components can be obtained by relatively simple mechanical structuring.
- the layered composite can in a simple manner - either before it is detached from this substrate or later - by a metal coating, e.g. B. from a precious metal, to be able to manufacture a superconducting device with a shunt.
- a metal coating e.g. B. from a precious metal
- This metal pad can be formed in different ways. It is considered to be particularly advantageous if the metal coating is produced by means of PVD (Physical Vapor Deposition).
- YBCO YBa 2 Cu 3 0 7
- sapphire is advantageously used as the substrate.
- Titanium which is advantageously applied by means of PVD, is particularly suitable as an auxiliary in such a substrate.
- metal layers made of different metals can be produced on the substrate.
- the application of a metal layer made of nickel or a nickel alloy can be advantageous.
- the invention is also based on the object of specifying a flat base material which can be produced particularly cost-effectively and is particularly well suited for the production of superconductors.
- the areal base material is a base material that is electroplated by means of a single-crystalline substrate.
- the flat base material advantageously consists of nickel or a nickel alloy or of silver or copper or of a silver or copper alloy.
- a sheet-like base material made of metal such as. B. silver or a silver alloy, considered as a carrier for a layer of a superconducting material to form a superconducting conductor.
- a superconducting conductor causes a base material made of silver or copper no disturbing influences when used in alternating magnetic fields.
- a single-crystalline substrate is required in any case, which can be made of sapphire, for example.
- the illustration 1 shows a section of a single-crystalline substrate 1, on which an auxiliary layer 2 z. B. is made of titanium. Subsequently - as the illustration 2 shows - a metal layer 3 is galvanically produced on the auxiliary layer 2, which has taken over the texture of the substrate 1.
- the structure of the two layers 2 and 3 can be detached from the substrate 1 in order to continue to be used as the base material for superconducting components.
- the method according to the invention can also be carried out or continued such that initially - according to the partial representation of epitaxial buffer layers 4 and 5 made of z. B. Cu0 2 and YSZ are applied to the epitaxial metal layer 3, on which then again (see. Partial representation 4) z. B. a high-temperature superconducting layer 6 is produced from, for example, YBCo by means of PVD.
- the layer composite produced in this way can be pulled off the substrate 1 and, after mechanical structuring, form superconducting components. If such components are to have an integrated electrical shunt, then, according to partial illustration 5, a metal coating 7, for example made of gold, is applied to the epitaxial superconducting layer 6 before detaching by means of PVD.
- the partial representation 6 shows the layer composite after the detachment in front of the substrate 1.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Abstract
Description
Beschreibungdescription
Verfahren zum Erzeugen eines flächenhaften Basismaterials aus Metall, danach hergestelltes Basismaterial und seine Anwen- düngProcess for the production of a flat base material from metal, base material produced afterwards and its application
Die Erfindung bezieht sich auf ein Verfahren zum Erzeugen eines flächenhaften Basismaterials aus Metall zum Aufbringen einer supraleitenden Schicht.The invention relates to a method for producing a flat base material made of metal for applying a superconducting layer.
Ein solches Verfahren ist beispielsweise aus der Zeitschrift "Supercond. Sei. Technol . " 12 (1999), Seiten 624 bis 632 bekannt. Bei diesem bekannten Verfahren wird ein Band aus Metall mit einer Textur versehen, indem Walzprozeduren mit Bän- dern aus Nickel oder Silber bzw. aus Legierungen mit diesen Metallen in Verbindung mit nachfolgenden Glühungen zur Initiierung von Rekristallisierungsprozessen durchgeführt werden. In der Fachwelt werden solche Bänder als RABITS (Rolling assisted biaxial testuring of Substrates) bezeichnet. Solche RABITS bilden das Basismaterial zum Herstellen supraleitender Leiter.Such a method is known, for example, from the magazine "Supercond. Sei. Technol." 12 (1999), pages 624 to 632. In this known method, a strip of metal is provided with a texture by carrying out rolling procedures with strips of nickel or silver or from alloys with these metals in conjunction with subsequent annealing to initiate recrystallization processes. In the professional world, such tapes are referred to as RABITS (Rolling Assisted Biaxial Testuring of Substrates). Such RABITS form the base material for the production of superconducting conductors.
Der Erfindung liegt die Aufgabe zugrunde, ein Verfahren zum Erzeugen eines flächenhaften Basismaterials zum Aufbringen einer supraleitenden Schicht anzugeben, das sich nicht nur vergleichsweise kostengünstig durchführen lässt, sondern mit dem auch Basismaterial herstellbar ist, mit dem sich supraleitende, insbesondere hochtemperatursupraleitende Bauelemente mit sehr guten Supraleitungseigenschaften schaffen lassen.The invention has for its object to provide a method for producing a flat base material for applying a superconducting layer, which can not only be carried out comparatively inexpensively, but which can also be used to produce base material with which superconducting, in particular high-temperature superconducting components with very good superconducting properties can be produced let create.
Zur Lösung dieser Aufgabe wird erfindungsgemäß auf einem einkristallinen Substrat eine Metallschicht galvanisch erzeugt und die Metallschicht unter Gewinnung des Basismaterials von dem Substrat gelöst.To achieve this object, a metal layer is galvanically produced on a single-crystalline substrate and the metal layer is detached from the substrate to obtain the base material.
Der wesentliche Vorteil des erfindungsgemäßen Verfahrens be- steht darin, dass mit einem einkristallinen Substrat alsThe main advantage of the method according to the invention is that with a single-crystalline substrate as
"Matrize" durch jeweils einen einfachen Galvanikprozess und anschließendes Lösen der Metallschicht von der Matrize bzw. von dem Substrat ein flächenhaftes Basismaterial aus Metall erzeugt werden kann, das zum Aufbringen einer Schicht aus ei- nem supraleitendem Werkstoff, insbesondere aus einem hoch- temperatursupraleitenden Werkstoff zur Bildung eines Supraleiters sehr gut geeignet ist, weil dieses Basismaterial die für diesen Zweck günstige Textur des Substrates aufweist. Ein weiterer wesentlicher Vorteil beruht darin, dass das - teure- Substrat wieder verwendbar ist."Matrix" can be produced by a simple electroplating process and subsequent detachment of the metal layer from the matrix or from the substrate, a two-dimensional base material made of metal, which is used to apply a layer made of a superconducting material, in particular a high-temperature superconducting material Formation of a superconductor is very suitable because this base material has the favorable texture of the substrate for this purpose. Another important advantage is that the - expensive substrate is reusable.
Bei dem erfindungsgemäßen Verfahren können unterschiedliche Substrate eingesetzt werden. Als besonders vorteilhaft wird es aber angesehen, wenn ein Substrat verwendet wird, dessen Gitterstruktur zu der der aufzubringenden supraleitendenDifferent substrates can be used in the method according to the invention. However, it is considered to be particularly advantageous if a substrate is used whose lattice structure matches that of the superconducting layer to be applied
Schicht passt, damit ein qualitativ hochwertiger Supraleiter gewonnen werden kann.Layer fits so that a high quality superconductor can be obtained.
Um das Abscheiden der Metallschicht auf dem einkristallinen Substrat zu erleichtern, wird vorteilhafterweise vor dem galvanischen Erzeugen der Metallschicht eine metallische Hilfsschicht auf dem Substrat gebildet, und zumindest die Metall- Schicht wird unter Gewinnung des Basismaterials von dem Substrat gelöst. Die Hilfsschicht lässt sich in vorteilhafter Weise mittels z. B. PCT (Physical Vapour Deposition) erzeugen. Die Hilfsschicht kann also auf dem Substrat verbleiben; wird sie jeweils mit abgelöst, dann lässt sich die so gebil- dete Doppelschicht leichter von dem Substrat ohne Beschädigungen lösen und anschließend weiter bearbeiten.In order to facilitate the deposition of the metal layer on the single-crystalline substrate, a metallic auxiliary layer is advantageously formed on the substrate prior to the galvanic production of the metal layer, and at least the metal layer is detached from the substrate to obtain the base material. The auxiliary layer can advantageously by means of z. B. PCT (Physical Vapor Deposition). The auxiliary layer can therefore remain on the substrate; if it is replaced in each case, then the Detach the double layer more easily from the substrate without damage and then process it further.
Bei einer anderen vorteilhaften Ausführungsform des erfin- dungsgemäßen Verfahrens wird vor dem galvanischen Erzeugen der Metallschicht eine metallische Hilfsschicht auf dem Substrat gebildet und mindestens eine isolierende Pufferschicht auf die Metallschicht und darauf wiederum die supraleitende Schicht aufgebracht und anschließend der so gebildete Schichtverbund mindestens unter Einbeziehung der Metallschicht von dem Substrat gelöst. Aus diesem Schichtenverbund - mit uns ohne Hilfsschicht - lassen sich durch verhältnismäßig einfache mechanische Strukturierung supraleitende Bau- e1emente gewinnen.In another advantageous embodiment of the method according to the invention, a metallic auxiliary layer is formed on the substrate before the galvanic production of the metal layer, and at least one insulating buffer layer is applied to the metal layer and, in turn, the superconducting layer thereon, and then the layer composite thus formed, at least including the metal layer detached from the substrate. From this composite layer - with us without an auxiliary layer - superconducting components can be obtained by relatively simple mechanical structuring.
Der Schichtverbund kann in einfacher Weise - entweder vor seiner Ablösung von diesem Substrat oder später - durch eine Metallauflage, z. B. aus einem Edelmetall, ergänzt werden, um ein supraleitendes Bauelement mit einem Shunt herstellen zu können .The layered composite can in a simple manner - either before it is detached from this substrate or later - by a metal coating, e.g. B. from a precious metal, to be able to manufacture a superconducting device with a shunt.
Diese Metallauflage kann in unterschiedlicher Weise gebildet werden. Als besonders vorteilhaft wird es erachtet, wenn die Metallauflage mittels PVD (Physical Vapour Deposition) er- zeugt wird.This metal pad can be formed in different ways. It is considered to be particularly advantageous if the metal coating is produced by means of PVD (Physical Vapor Deposition).
Als supraleitender bzw. hochtemperatursupraleitender Werkstoff ist YBCO (YBa2 Cu3 07) bekannt. Soll ein Supraleiter mit diesem Werkstoff hergestellt werden, dann wird vorteilhafter- weise Saphir als Substrat verwendet.YBCO (YBa 2 Cu 3 0 7 ) is known as a superconducting or high-temperature superconducting material. If a superconductor is to be produced with this material, then sapphire is advantageously used as the substrate.
Als Hilfsmittel ist bei einem solchen Substrat Titan besonders geeignet, das vorteilhaft mittels PVD aufgebracht wird. Bei dem erfindungsgemäßen Verfahren können Metallschichten aus unterschiedlichen Metallen auf dem Substrat erzeugt werden. Vorteilhaft kann das Aufbringen einer Metallschicht aus Nickel oder einer Nickellegierung sein. Besonders vorteilhaft erscheint es jedoch, wenn eine Metallschicht aus Silber oder Kupfer oder aus einer Silber- oder Kupferlegierung aufgebracht wird, weil bei einem späteren Einsatz in einem magnetischen Wechselfeld - anders als bei Nickel - durch Verluste aufgrund von Paramagnetismus keine störenden Einflüsse auftreten.Titanium, which is advantageously applied by means of PVD, is particularly suitable as an auxiliary in such a substrate. In the method according to the invention, metal layers made of different metals can be produced on the substrate. The application of a metal layer made of nickel or a nickel alloy can be advantageous. However, it appears to be particularly advantageous if a metal layer made of silver or copper or of a silver or copper alloy is applied, because during later use in an alternating magnetic field - unlike nickel - there are no disruptive influences due to losses due to paramagnetism.
Der Erfindung liegt ferner die Aufgabe zugrunde, ein besonders kostengünstig erzeugbares und für die Herstellung von Supraleitern besonders gut geeignetes flächenhaftes Basismaterial anzugeben.The invention is also based on the object of specifying a flat base material which can be produced particularly cost-effectively and is particularly well suited for the production of superconductors.
Zur Lösung dieser Aufgabe ist erfindungsgemäß das flächenhafte Basismaterial ein mittels eines einkristallinen Sub- strats galvanisch hergestelltes Basismaterial.To achieve this object, according to the invention the areal base material is a base material that is electroplated by means of a single-crystalline substrate.
Vorteilhafterweise besteht das flächenhafte Basismaterial aus Nickel oder einer Nickellegierung oder aus Silber oder Kupfer oder aus einer Silber- oder Kupferlegierung.The flat base material advantageously consists of nickel or a nickel alloy or of silver or copper or of a silver or copper alloy.
Als zur Erfindung gehörend wird ferner die Verwendung eines mittels eines einkristallinen Substrates galvanisch hergestellte flächenhafte Basismaterial aus Metall, wie z. B. Silber oder einer Silberlegierung, als Träger für eine Schicht aus einem supraleitenden Material zur Bildung eines supraleitenden Leiters angesehen. Ein solcher supraleitender Leiter verursacht bei einem Basismaterial aus Silber oder Kupfer keine störenden Einflüsse bei einem Einsatz in magnetischen Wechselfeldern.As part of the invention is also the use of a sheet-like base material made of metal, such as. B. silver or a silver alloy, considered as a carrier for a layer of a superconducting material to form a superconducting conductor. Such a superconducting conductor causes a base material made of silver or copper no disturbing influences when used in alternating magnetic fields.
Zur weiteren Erläuterung des erfindungsgemäßen Verfahrens sind nachfolgend anhand einer Figur mehrere Ausführungsbeispiele des erfindungsgemäßen Verfahrens beschrieben.To further explain the method according to the invention, several exemplary embodiments of the method according to the invention are described below with reference to a figure.
Zur Durchführung des erfindungsgemäßen Verfahrens ist in jedem Falle ein einkristallines Substrat erforderlich, das bei- spielsweise aus Saphir hergestellt sein kann.In order to carry out the method according to the invention, a single-crystalline substrate is required in any case, which can be made of sapphire, for example.
Die Darstellung 1 zeigt einen Ausschnitt aus einem einkristallinen Substrat 1, auf das durch PVD eine Hilfsschicht 2 z. B. aus Titan aufgebracht ist. Anschließend ist - wie die Darstellung 2 zeigt - auf die Hilfsschicht 2 galvanisch eine Metallschicht 3 erzeugt, die die Textur des Substrats 1 übernommen hat .The illustration 1 shows a section of a single-crystalline substrate 1, on which an auxiliary layer 2 z. B. is made of titanium. Subsequently - as the illustration 2 shows - a metal layer 3 is galvanically produced on the auxiliary layer 2, which has taken over the texture of the substrate 1.
Der Aufbau aus den beiden Schichten 2 und 3 kann von dem Sub- strat 1 abgelöst werden, um als Basismaterial für supraleitende Bauelemente weiter verwendet zu werden.The structure of the two layers 2 and 3 can be detached from the substrate 1 in order to continue to be used as the base material for superconducting components.
Wie die weiteren Teildarstellungen 3 bis 6 der Figur erkennen lassen, kann das erfindungsgemäße Verfahren auch so ausge- führt bzw. weitergeführt werden, dass zunächst - gemäß Teildarstellung zu mittels PVD epitaxiale Pufferschichten 4 und 5 aus z. B. Cu02 und YSZ auf die epitaxiale Metallschicht 3 aufgebracht werden, auf die dann wiederum (vgl. Teildarstellung 4) ebenfalls z. B. mittels PVD eine hochtemperatursupra- leitende Schicht 6 aus beispielsweise YBCo erzeugt wird. Der insoweit hergestellte Schichtenverbund kann von dem Substrat 1 abgezogen werden und nach mechanischer Strukturierung supraleitende Bauelemente bilden. Sollen solche Bauelemente integriert einen elektrisch Shunt aufweisen, dann wird gemäß Teildarstellung 5 vor dem Ablösen mittels PVD eine Metallauflage 7 beispielsweise aus Gold auf die epitaxiale supraleitende Schicht 6 aufgebracht.As can be seen from the further partial representations 3 to 6 of the figure, the method according to the invention can also be carried out or continued such that initially - according to the partial representation of epitaxial buffer layers 4 and 5 made of z. B. Cu0 2 and YSZ are applied to the epitaxial metal layer 3, on which then again (see. Partial representation 4) z. B. a high-temperature superconducting layer 6 is produced from, for example, YBCo by means of PVD. The layer composite produced in this way can be pulled off the substrate 1 and, after mechanical structuring, form superconducting components. If such components are to have an integrated electrical shunt, then, according to partial illustration 5, a metal coating 7, for example made of gold, is applied to the epitaxial superconducting layer 6 before detaching by means of PVD.
Die Teildarstellung 6 zeigt den Schichtenverbund nach der Ablösung vor dem Substrat 1. The partial representation 6 shows the layer composite after the detachment in front of the substrate 1.
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10136891.7 | 2001-07-25 | ||
| DE10136891A DE10136891B4 (en) | 2001-07-25 | 2001-07-25 | Method for producing a flat base material made of metal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| WO2003012166A2 true WO2003012166A2 (en) | 2003-02-13 |
| WO2003012166A3 WO2003012166A3 (en) | 2003-10-16 |
Family
ID=7693460
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/DE2002/002687 WO2003012166A2 (en) | 2001-07-25 | 2002-07-17 | Method for producing a metal flat base material particularly for a superconducting layer |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE10136891B4 (en) |
| WO (1) | WO2003012166A2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005031043A1 (en) * | 2003-09-29 | 2005-04-07 | Siemens Aktiengesellschaft | Method and facility for the production of a layer-like part |
| WO2003012172A3 (en) * | 2001-07-25 | 2005-08-18 | Siemens Ag | Method and device for producing a textured metal strip |
| US9468003B2 (en) | 2008-08-11 | 2016-10-11 | Koninklijke Philips N.V. | Medium access control (MAC) protocol for body area networks |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0612114B1 (en) * | 1993-02-15 | 1997-05-14 | Sumitomo Electric Industries, Ltd. | Method for forming a patterned oxide superconductor thin film |
| US5741377A (en) * | 1995-04-10 | 1998-04-21 | Martin Marietta Energy Systems, Inc. | Structures having enhanced biaxial texture and method of fabricating same |
| GB2336849B (en) * | 1998-04-27 | 2003-02-26 | Telcon Ltd | Substrate materials |
| KR100352976B1 (en) * | 1999-12-24 | 2002-09-18 | 한국기계연구원 | Electrical Plating Process and Device for Ni Plate Layer Having Biaxial Texture |
-
2001
- 2001-07-25 DE DE10136891A patent/DE10136891B4/en not_active Expired - Fee Related
-
2002
- 2002-07-17 WO PCT/DE2002/002687 patent/WO2003012166A2/en not_active Application Discontinuation
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2003012172A3 (en) * | 2001-07-25 | 2005-08-18 | Siemens Ag | Method and device for producing a textured metal strip |
| US7666290B2 (en) | 2001-07-25 | 2010-02-23 | Siemens Aktiengesellschaft | Method and device for producing a textured metal strip |
| WO2005031043A1 (en) * | 2003-09-29 | 2005-04-07 | Siemens Aktiengesellschaft | Method and facility for the production of a layer-like part |
| US9468003B2 (en) | 2008-08-11 | 2016-10-11 | Koninklijke Philips N.V. | Medium access control (MAC) protocol for body area networks |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10136891B4 (en) | 2004-07-22 |
| DE10136891A1 (en) | 2003-02-20 |
| WO2003012166A3 (en) | 2003-10-16 |
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