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WO2003009363A1 - Plasma processor and plasma processing method - Google Patents

Plasma processor and plasma processing method Download PDF

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Publication number
WO2003009363A1
WO2003009363A1 PCT/JP2002/006665 JP0206665W WO03009363A1 WO 2003009363 A1 WO2003009363 A1 WO 2003009363A1 JP 0206665 W JP0206665 W JP 0206665W WO 03009363 A1 WO03009363 A1 WO 03009363A1
Authority
WO
WIPO (PCT)
Prior art keywords
plasma
potential
processing method
control
focus ring
Prior art date
Application number
PCT/JP2002/006665
Other languages
English (en)
French (fr)
Inventor
Akihiro Kikuchi
Satoshi Kayamori
Shinya Shima
Yuichiro Sakamoto
Kimihiro Higuchi
Kaoru Oohashi
Takehiro Ueda
Munehiro Shibuya
Tadashi Gondai
Original Assignee
Tokyo Electron Limited
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Limited filed Critical Tokyo Electron Limited
Priority to US10/483,251 priority Critical patent/US8056503B2/en
Priority to JP2003514608A priority patent/JP4223396B2/ja
Publication of WO2003009363A1 publication Critical patent/WO2003009363A1/ja
Priority to US13/242,851 priority patent/US8387562B2/en
Priority to US13/783,564 priority patent/US8904957B2/en
Priority to US14/561,785 priority patent/US9728381B2/en
Priority to US14/561,595 priority patent/US9437402B2/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H01J37/32724—Temperature
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45563—Gas nozzles
    • C23C16/45565—Shower nozzles
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • C23C16/509—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using internal electrodes
    • C23C16/5096—Flat-bed apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H01J37/32174—Circuits specially adapted for controlling the RF discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3244—Gas supply means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32623—Mechanical discharge control means
    • H01J37/32642—Focus rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32715—Workpiece holder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/002—Cooling arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/0203—Protection arrangements
    • H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/334—Etching

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Drying Of Semiconductors (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Plasma Technology (AREA)
PCT/JP2002/006665 2001-07-10 2002-07-02 Plasma processor and plasma processing method WO2003009363A1 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US10/483,251 US8056503B2 (en) 2001-07-10 2002-07-02 Plasma procesor and plasma processing method
JP2003514608A JP4223396B2 (ja) 2001-07-10 2002-07-02 プラズマ処理装置
US13/242,851 US8387562B2 (en) 2001-07-10 2011-09-23 Plasma processor and plasma processing method
US13/783,564 US8904957B2 (en) 2001-07-10 2013-03-04 Plasma processor and plasma processing method
US14/561,785 US9728381B2 (en) 2001-07-10 2014-12-05 Plasma processor and plasma processing method
US14/561,595 US9437402B2 (en) 2001-07-10 2014-12-05 Plasma processor and plasma processing method

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2001-210035 2001-07-10
JP2001210035 2001-07-10
JP2001-216424 2001-07-17
JP2001216424 2001-07-17
JP2002068423 2002-03-13
JP2002-68423 2002-03-13

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US10/483,251 A-371-Of-International US8056503B2 (en) 2001-07-10 2002-07-02 Plasma procesor and plasma processing method
US10483251 A-371-Of-International 2002-07-02
US13/242,851 Continuation US8387562B2 (en) 2001-07-10 2011-09-23 Plasma processor and plasma processing method

Publications (1)

Publication Number Publication Date
WO2003009363A1 true WO2003009363A1 (en) 2003-01-30

Family

ID=27347135

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2002/006665 WO2003009363A1 (en) 2001-07-10 2002-07-02 Plasma processor and plasma processing method

Country Status (4)

Country Link
US (5) US8056503B2 (ja)
JP (2) JP4223396B2 (ja)
TW (2) TWI234417B (ja)
WO (1) WO2003009363A1 (ja)

Cited By (18)

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JP2005277369A (ja) * 2003-09-05 2005-10-06 Tokyo Electron Ltd フォーカスリング及びプラズマ処理装置
JP2005302848A (ja) * 2004-04-07 2005-10-27 Toshiba Corp 半導体製造装置および半導体製造方法
JP2006523382A (ja) * 2003-03-21 2006-10-12 東京エレクトロン株式会社 処理中の基板裏面堆積を減らす方法および装置。
JP2008153315A (ja) * 2006-12-15 2008-07-03 Tokyo Electron Ltd 基板載置台の製造方法
WO2009150968A1 (ja) * 2008-06-13 2009-12-17 芝浦メカトロニクス株式会社 プラズマ処理装置、プラズマ処理方法、および電子デバイスの製造方法
JP2010232694A (ja) * 2003-09-05 2010-10-14 Tokyo Electron Ltd フォーカスリング及びプラズマ処理装置
US8043971B2 (en) 2003-02-07 2011-10-25 Tokyo Electron Limited Plasma processing apparatus, ring member and plasma processing method
CN102484940A (zh) * 2009-08-31 2012-05-30 朗姆研究公司 局部等离子体约束和压强控制装置及其方法
JP2012191158A (ja) * 2011-02-23 2012-10-04 Tokyo Electron Ltd マイクロ波照射装置
WO2013161106A1 (ja) * 2012-04-25 2013-10-31 東京エレクトロン株式会社 被処理基体に対する微粒子付着の制御方法、及び、処理装置
CN104115260A (zh) * 2012-04-24 2014-10-22 应用材料公司 具有冷却工艺环与加热工作件支撑表面的等离子体反应器静电夹盘
US9484180B2 (en) 2013-09-06 2016-11-01 Tokyo Electron Limited Plasma processing method and plasma processing apparatus
JP2017092156A (ja) * 2015-11-03 2017-05-25 ナショナル チュン−シャン インスティテュート オブ サイエンス アンド テクノロジー 高密度のプラズマ及び高温の半導体製造プロセスに用いられる窒化アルミニウムの静電チャンク
JP2017147370A (ja) * 2016-02-18 2017-08-24 東芝メモリ株式会社 半導体製造装置および半導体装置の製造方法
JP2019160846A (ja) * 2018-03-07 2019-09-19 東京エレクトロン株式会社 被処理体の載置装置及び処理装置
US10837479B2 (en) 2017-02-14 2020-11-17 Whirlpool Corporation Multi-layer encapsulation system for joint sealing of vacuum insulated cabinets
JP2021061390A (ja) * 2019-10-02 2021-04-15 東京エレクトロン株式会社 プラズマ処理装置
KR20220123373A (ko) 2021-02-25 2022-09-06 주식회사 히타치하이테크 플라스마 처리 장치

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US7993489B2 (en) * 2005-03-31 2011-08-09 Tokyo Electron Limited Capacitive coupling plasma processing apparatus and method for using the same
JP4642528B2 (ja) * 2005-03-31 2011-03-02 東京エレクトロン株式会社 プラズマ処理装置およびプラズマ処理方法
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JP2007250967A (ja) * 2006-03-17 2007-09-27 Tokyo Electron Ltd プラズマ処理装置および方法とフォーカスリング
US7988814B2 (en) * 2006-03-17 2011-08-02 Tokyo Electron Limited Plasma processing apparatus, plasma processing method, focus ring, and focus ring component
US8916001B2 (en) * 2006-04-05 2014-12-23 Gvd Corporation Coated molds and related methods and components
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JP5227264B2 (ja) * 2009-06-02 2013-07-03 東京エレクトロン株式会社 プラズマ処理装置，プラズマ処理方法，プログラム
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JP5486383B2 (ja) * 2010-04-13 2014-05-07 富士フイルム株式会社 ドライエッチング方法及び装置
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US9263240B2 (en) 2011-11-22 2016-02-16 Lam Research Corporation Dual zone temperature control of upper electrodes
US8898889B2 (en) 2011-11-22 2014-12-02 Lam Research Corporation Chuck assembly for plasma processing
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US9728381B2 (en) 2017-08-08
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TWI234417B (en) 2005-06-11
JP4828585B2 (ja) 2011-11-30
US20040177927A1 (en) 2004-09-16
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US9437402B2 (en) 2016-09-06
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