WO2003003369A1 - Dispositif a micro deplacement et procede de fabrication - Google Patents
Dispositif a micro deplacement et procede de fabrication Download PDFInfo
- Publication number
- WO2003003369A1 WO2003003369A1 PCT/JP2002/006433 JP0206433W WO03003369A1 WO 2003003369 A1 WO2003003369 A1 WO 2003003369A1 JP 0206433 W JP0206433 W JP 0206433W WO 03003369 A1 WO03003369 A1 WO 03003369A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- drive electrode
- moving device
- flexible substrate
- piezoelectric
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 23
- 239000000758 substrate Substances 0.000 claims abstract description 137
- 239000012212 insulator Substances 0.000 claims description 66
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 48
- 238000000605 extraction Methods 0.000 claims description 46
- 239000000853 adhesive Substances 0.000 claims description 45
- 230000001070 adhesive effect Effects 0.000 claims description 45
- 238000000034 method Methods 0.000 claims description 41
- 239000013078 crystal Substances 0.000 claims description 37
- 239000000395 magnesium oxide Substances 0.000 claims description 34
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 34
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 27
- 229910052697 platinum Inorganic materials 0.000 claims description 24
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 claims description 16
- 229910052451 lead zirconate titanate Inorganic materials 0.000 claims description 16
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 13
- 229910052737 gold Inorganic materials 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 11
- 239000004642 Polyimide Substances 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 9
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 7
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- 238000000059 patterning Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 230000008602 contraction Effects 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052719 titanium Inorganic materials 0.000 claims description 2
- 239000010936 titanium Substances 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 19
- 230000008569 process Effects 0.000 description 19
- 238000000206 photolithography Methods 0.000 description 16
- 238000004544 sputter deposition Methods 0.000 description 11
- 230000007246 mechanism Effects 0.000 description 9
- 230000008859 change Effects 0.000 description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 4
- 229920002120 photoresistant polymer Polymers 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 230000008901 benefit Effects 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000001039 wet etching Methods 0.000 description 3
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- ZMZDMBWJUHKJPS-UHFFFAOYSA-M Thiocyanate anion Chemical compound [S-]C#N ZMZDMBWJUHKJPS-UHFFFAOYSA-M 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 239000007772 electrode material Substances 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- ZMZDMBWJUHKJPS-UHFFFAOYSA-N hydrogen thiocyanate Natural products SC#N ZMZDMBWJUHKJPS-UHFFFAOYSA-N 0.000 description 1
- ZCQJTYXMYDQDLF-UHFFFAOYSA-M potassium iodide hydroiodide Chemical compound I.I[K] ZCQJTYXMYDQDLF-UHFFFAOYSA-M 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000005641 tunneling Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
- G11B5/54—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed with provision for moving the head into or out of its operative position or across tracks
- G11B5/55—Track change, selection or acquisition by displacement of the head
- G11B5/5521—Track change, selection or acquisition by displacement of the head across disk tracks
- G11B5/5552—Track change, selection or acquisition by displacement of the head across disk tracks using fine positioning means for track acquisition separate from the coarse (e.g. track changing) positioning means
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S438/00—Semiconductor device manufacturing: process
- Y10S438/928—Front and rear surface processing
Definitions
- the present invention moves a recording head of a device requiring high precision positioning, such as a recording / reproducing device such as a magnetic recording medium, an optical recording medium, and a magneto-optical recording medium, with high accuracy.
- a recording / reproducing device such as a magnetic recording medium, an optical recording medium, and a magneto-optical recording medium, with high accuracy.
- the present invention relates to a microphone port moving device and a method of manufacturing the same.
- a magnetic head is used to write or read information on a magnetic recording plate.
- This magnetic head is supported by a head support mechanism.
- the magnetic head can be moved to a desired position by scanning the surface of the magnetic recording plate with the head support mechanism.However, in order to write or read high-density information, the position of the magnetic head must be precisely controlled. Need to be controlled.
- Magnetic recording devices are not only required to increase capacity but also to read or write information at high speed. For this purpose, it is necessary to rotate the magnetic recording plate at a high speed and move the position of the magnetic head at a high speed.
- the magnetic recording plate rotates at high speed, and the magnetic head records information.
- the recording head moves horizontally with respect to the magnetic recording plate by the support mechanism of the magnetic head.
- a large inertial force is generated in the magnetic head attached to the tip of the head support mechanism, and it becomes difficult to stop at a predetermined position.
- an object of the present invention is to provide a micro moving device that supplies a stable voltage and a method for manufacturing the same.
- the present invention provides a fixing substrate which is fixed to an end surface to which a pedestal for mounting a recording head is connected so that the dimension of the elastic body does not change on the other end surface.
- An external electrode connecting portion for supplying a voltage for changing the dimension of the elastic body is provided in the fixed region in the above.
- the microphone opening moving device for finely adjusting the position of the magnetic head is firmly fixed on the fixed substrate at the tip, and the voltage signal Is connected to the electrode pad on the flexible board from the external electrode connection part provided on this fixed substrate, so that the head support mechanism moves at high speed. Also, the voltage can be supplied stably without changing the shape of the voltage supply unit, and the fine adjustment of the recording head position becomes easy.
- FIG. 1 is an exploded perspective view of the microphone opening moving device according to the first embodiment of the present invention.
- FIG. 2 is an exploded plan view of a main part of the microphone opening moving device.
- FIG. 3 is an exploded plan view of a main part of the microphone opening moving device.
- FIG. 4 is an enlarged sectional view of a main part of the microphone opening moving device.
- 5A to 5H are views for explaining the manufacturing process of the microphone opening moving device.
- FIG. 6 is an exploded perspective view of the microphone opening moving device according to the second embodiment of the present invention.
- 7A and 7B are enlarged cross-sectional views of main parts of the micro moving device.
- 8A to 8G are diagrams for explaining a manufacturing process of the microphone opening moving device.
- 9A to 9E are diagrams for explaining a manufacturing process of the microphone opening moving device.
- the end surface to which the pedestal on which the recording head is mounted is connected to the other end surface is firmly fixed to a fixed substrate so that the dimensions of the elastic body do not change even when a voltage is applied.
- an external electrode connecting portion for supplying a voltage to the elastic body is provided in the region on the fixed substrate.
- the first drive electrode is formed on the surface of the piezoelectric body opposite to the flexible substrate, and the first drive electrode has substantially the same shape and area as the piezoelectric body. Since the one drive electrode and the piezoelectric body have substantially the same shape, it has an effect that a voltage can be uniformly and efficiently supplied to the entire surface of the piezoelectric body.
- the present invention is particularly a piezoelectric element in which the elastic body is composed of a first drive electrode, a piezoelectric body, a second drive electrode, and an insulator, and the insulator is provided between the piezoelectric body and the second drive electrode.
- This insulator has a frame-like shape whose outer shape is larger than that of the piezoelectric material and whose inner shape is smaller than that of the piezoelectric material at the portion facing the flexible substrate. In the portion placed on the piezoelectric element, the insulator covers the entire surface of the piezoelectric element. Since the insulator is formed only on the peripheral portion of the piezoelectric body on the flexible substrate, the second drive electrode is in close contact with the piezoelectric body at the position where the piezoelectric body expands and contracts substantially, and the maximum expansion and contraction can be obtained. This has the effect of preventing an electrical short between the first drive electrode and the second drive electrode at the end.
- the first drive electrode and the second drive electrode are each formed with an external electrode connection portion at each end in a region where the first drive electrode and the second drive electrode are fixed to the fixed substrate.
- the electrode connection portion has a shape such that a part thereof protrudes from the outer shape of the insulator.
- the external electrode connection is formed at the end of the first drive electrode and the second drive electrode, and the external electrode connection of the second drive electrode partially protrudes from the outer shape of the insulator. Since it has a shape, it has an effect that it is possible to make an electrical connection with the electrode pad portion provided on the flexible substrate from the surface on the first drive electrode side by the conductive paste.
- the insulator is formed below the second drive electrode, and a through hole for exposing a part of the second drive electrode is formed in a portion of the stretchable body fixed to the fixed substrate. It is provided on the insulator.
- the size of the piezoelectric body, the first drive electrode, and the second drive electrode constituting the piezoelectric element, which is an elastic body are substantially the same in area and shape.
- the body and the second drive electrode have the same shape, making the piezoelectric body uniform It is possible to efficiently apply a voltage signal to the entire surface.
- a through hole is provided in a part of the insulator in a region where the elastic body is fixed to the fixed substrate.
- a part of the second drive electrode is exposed, and the second extraction electrode is formed so as to be electrically connected to the second drive electrode in the exposed portion.
- the second extraction electrode has an external electrode connection at an end opposite to the connection of the second drive electrode, and the external electrode connection is provided at a location facing the electrode pad of the flexible substrate. ing. Since the second drive electrode is drawn out to the flexible substrate side by the second lead-out electrode, the second drive electrode has an effect of enabling voltage supply from the flexible substrate side.
- At least a part mounted on the fixed substrate is provided with a through hole in the second drive electrode, the piezoelectric body, and the insulator, and the through hole provided in the second drive electrode and the piezoelectric body is
- the hole on the one drive electrode side has a narrower hole diameter.
- the size of the through hole provided in the insulator also makes this narrow hole diameter smaller, and the first extraction electrode cuts the through hole in the insulator. It is formed to cover.
- An external electrode connection is formed at one end of the first extraction electrode, and the external electrode connection is provided so as to face the electrode pad of the flexible substrate.
- the through hole provided in the second drive electrode and the piezoelectric body has a smaller hole diameter on the first drive electrode side, and the through hole in the insulator is made smaller than this narrow hole diameter.
- the insulator reliably covers the periphery of the first drive electrode and the through hole of the piezoelectric body, and the first lead electrode is less likely to break in the through hole, and the second lead electrode further reduces the breakage. Has a function of preventing short circuit failure from occurring with the drive electrode.
- the shape of the adhesive for bonding the elastic body and the flexible substrate is any one of the first drive electrode, the second drive electrode, the second lead electrode, and the first lead electrode. It exposes a part of the connection part. Since a part of the external electrode connection part of this electrode is exposed from the adhesive, voltage can be supplied from the flexible substrate side even after the adhesive is formed, and furthermore, the electrical connection with the electrode pad of the flexible substrate is possible. It has the effect of facilitating connection.
- the external electrode connection portion of the electrode is closer to the end face of the external electrode connection portion of this electrode.
- the end face of the exposed portion is located at a distance greater than the thickness of the adhesive. Since the external electrode connection part of the electrode is exposed from the end more than the distance greater than the thickness of the adhesive, the external electrode connection part of the exposed electrode can be freely bent, and the wall surface of the end of the adhesive is provided. And can be in contact with the electrode pad portion of the flexible substrate. As a result, there is an effect that these electrical connections are further facilitated.
- the present invention particularly has a projection on the electrode pad on the flexible substrate.
- the protruding portion is smaller than the area of the exposed portion of the external electrode connection portion, and the exposed portion and the protruding portion are located at positions where the expandable body and the flexible substrate face each other.
- the external electrode connection portion of the electrode exposed by removing the adhesive and the protrusion formed on the flexible substrate are formed at positions exactly overlapping with each other. Since the alignment with the flexible substrate is completed, it has the effect of facilitating the alignment.
- the projection is a projection formed of a conductor and having a step higher than the thickness of the adhesive material. Since the electrical connection between the exposed portion and the protrusion of the electrode pad portion of the flexible substrate is completed at the same time, the electrical connection work is facilitated.
- the present invention particularly has an elastic body and at least two flexible substrates, and electrically connects a second drive electrode of the first elastic body and a second drive electrode of the second elastic body. It is short-circuited. Since the two are electrically short-circuited, the alignment and the external electrode connection are performed when the alignment and the electrical connection between the external electrode connection of the elastic body and the electrode pad of the flexible board are completed. It can be very easily determined whether or not the electrical connection is normally completed at the electrode pad portion. For this purpose, of the electrode pad of the first flexible substrate and the electrode pad of the second flexible substrate, the second drive electrode of the first elastic body and the second drive electrode of the second elastic body It is only necessary to measure the electric resistance between the connected electrode pads.
- the present invention particularly relates to a piezoelectric material made of a material mainly composed of lead zirconate titanate.
- the second drive electrode is mainly composed of platinum, and by sandwiching both sides of lead zirconate titanate with platinum, an intermetallic electromotive force is generated between the first drive electrode and the second drive electrode Therefore, it has an effect that corrosion of lead zirconate titanate due to battery action does not occur.
- the insulator is made of a material mainly composed of polyimide. Since the dielectric constant of polyimide for insulators is sufficiently lower than that of lead zirconate titanate, the polyimide should be sandwiched between the piezoelectric and the second drive electrode in the region where the piezoelectric is not to be deformed. However, even if a voltage is supplied between the first drive electrode and the second drive electrode, no voltage is applied to the piezoelectric body at the place where the polyimide is sandwiched, that is, the piezoelectric body is not deformed. Having.
- the first or first extraction electrode is formed of a material mainly containing gold. Since the material is mainly composed of gold, patterning is performed without damaging the first drive electrode, the second drive electrode, and the insulator when etching the second extraction electrode and the first extraction electrode by the photolithography process. It has the effect that it can be processed.
- a single crystal plate of magnesium oxymagnesium is particularly used as a substrate on which the elastic body is formed.
- a substrate on which a layer mainly composed of platinum and lead zirconate titanate is formed as a first conductive layer and a piezoelectric layer by sputtering, which is a normal thin film forming means, on a single crystal plate of magnesium oxide By using a substrate on which a layer mainly composed of platinum and lead zirconate titanate is formed as a first conductive layer and a piezoelectric layer by sputtering, which is a normal thin film forming means, on a single crystal plate of magnesium oxide, A high-quality platinum layer and a lead zirconate titanate layer can be obtained, and a plurality of elastic bodies can be collectively formed on the same substrate.
- the piezoelectric body and the first drive electrode are formed in substantially the same shape using the same photomask. Photolithography etching. Piezoelectric body and first drive electrode Since the masks are patterned all at once using the same mask, there is no need to change the masks for forming each layer, and this has the effect of enabling efficient production.
- the outer shape of the insulator is larger than that of the piezoelectric body, and the inner shape is the piezoelectric body, particularly when the insulator is formed on the flexible substrate after the piezoelectric layer and the first conductive layer are patterned. It has a hollow shape smaller than the body.
- the insulator is patterned by a photolithography process so as to cover the entire surface of the piezoelectric body. As a result, the insulator covers only the end portion of the stretchable body fixed to the flexible substrate, so that the second drive electrode can be formed directly on the piezoelectric body, so that effective driving can be performed. At the end, it has an effect of preventing an electrical short circuit between the first drive electrode and the second drive electrode.
- a conductive layer such as platinum, chromium, copper, or gold is formed as a second conductive layer by a sputtering or vapor deposition method, and the shape of the second drive electrode is formed on a fixed substrate.
- a patterning process is performed by a photolithography process so that at least a part of the region to be fixed is protruded from the outer shape of the insulator.
- a conductive layer such as platinum, chromium, copper, or gold formed as the second drive electrode layer is formed and patterned, the second drive electrode extends beyond the insulating layer in a region fixed to the fixed substrate. It is patterned in the shape to be put out.
- the second drive electrode protrudes from the end of the insulator.
- the first drive electrode and the second drive electrode can be taken out from the same surface opposite to the flexible substrate.
- the first conductive layer and the piezoelectric layer of the elastic body by sputtering platinum is formed as the second conductive layer by sputtering under the same conditions as the first conductive layer. Then, the first drive electrode, the piezoelectric body, and the second drive electrode are subjected to dry etching by the same photomask so that they have substantially the same shape. Same conditions for the first conductive layer and the second conductive layer on a magnesium oxide single crystal plate Therefore, the film stress generated by the interaction of these layers with the magnesium oxide single crystal plate is in the same direction, and there is an effect that the stress does not conflict with each other and the adhesion of the film is improved.
- an insulator having a through hole is formed so that a part of the second drive electrode is exposed
- a material layer mainly composed of any of aluminum, chromium, titanium, and gold is formed as an electrode by a vapor deposition method
- the second extraction electrode is patterned by a photolithography process so as to cover the through-hole portion. Since the second extraction electrode is formed by the photolithography process so as to cover the periphery of the through-hole formed in the insulator, the second drive electrode can be reliably extracted from the through-hole portion, and the reliability is high. It can be an electrical connection. Furthermore, since the patterning is performed by the photolithography process, a plurality of external electrode connection portions can be formed at one time.
- a through hole is formed by dry etching using a photoresist with the same photomask, particularly in the first drive electrode and the piezoelectric body.
- the adhesive is subjected to a photolithography process so as to expose a part of the external electrode connection portion.
- a photolithography process so that a part of the external electrode connection part of the elastic body is exposed when applying the adhesive, the external electrode connection part remains on the flexible substrate side even after forming the adhesive.
- the electrode can be taken out from the surface.
- the magnesium oxide single crystal plate is removed by etching, the external electrode connection portion can be bent.
- the end face of the adhesive is formed at the external electrode connection portion of the elastic body.
- the external electrode connection part will cover the end surface of the adhesive. This facilitates electrical connection with the electrode pads of the flexible substrate.
- the adhesive by allowing the adhesive to expose a part of the external electrode connection part, even if the external electrode connection part is not sufficiently bent, the external electrode connection part and the electrode pad part of the flexible substrate are formed. After the magnesium oxide single crystal plate is removed by etching, a conductive paste can be poured into this gap, and the electrical connection between the external electrode connection part and the electrode pad is more reliable. It has the effect that it becomes.
- the pattern alignment adjustment is formed on the exposed portion formed at the external electrode connection portion of the elastic body and the electrode pad portion of the flexible substrate. It is performed so that the projected portion overlaps. If the exposed portion, that is, the concave portion formed on the external electrode connection portion of the elastic body is overlapped with the projection formed on the electrode pad portion of the flexible substrate, the positioning of the elastic body and the flexible substrate is completed. This has the effect that the superposition position can be adjusted smoothly.
- the present invention particularly relates to a method of bonding an external electrode connection portion of a flexible substrate and an electrode pad portion of an elastic body by determining that the positions of the two are overlapped with each other by determining the electric resistance value between the connector connection portions formed on the flexible substrate. Confirm by measuring.
- the electric resistance value between the electrodes drawn out to the flexible substrate can be checked.
- it can be easily determined whether or not the elastic body side and the flexible substrate side are electrically joined at the external electrode connection portion.
- the electric capacitance value between the electrodes formed on the flexible substrate is measured by checking that the positions of both overlap.
- the first drive electrode of the telescopic body is the first
- the external electrode connection is determined by examining the capacitance value between the electrode pads of each flexible board connected to the first drive electrode and the second drive electrode of the elastic body. In addition to being able to easily check whether the alignment and electrical connection between the unit and the electrode pads have been completed, it is also possible to determine whether the capacitance characteristics of each expansion unit are normal. This has the effect of making the process extremely simple.
- the magnesium oxide single crystal plate is removed by a solution mainly containing phosphoric acid, and then exposed.
- the electrical connection between the external electrode connection part of the stretchable body and the external electrode connection part of the flexible substrate is made by conductive paste. If the external electrode connection part is formed so as to protrude beyond the insulator After removing the magnesium oxide single crystal plate, all the external electrode connection portions of the elastic body are exposed to the first drive electrode side, and the electrode pads of the flexible substrate can be provided at adjacent positions. It is said that these electrical connections can be completed only by dropping a suitable amount of the conductive paste onto this location, and an extremely simple electrical connection process is possible. It has a function.
- FIG. 1 is an exploded perspective view of a microphone opening moving device according to Embodiment 1 of the present invention.
- an elastic body 1 has two elastic portions 101 and 102 having mirror symmetry with each other.
- the expansion and contraction portions 101 and 102 are formed on the piezoelectric bodies 201 and 202 made of lead zirconate titanate, respectively, and the first drive electrodes 301 and 302 made of platinum are formed upward.
- an insulator 7 made of polyimide is formed below the piezoelectric bodies 201, 202, and a second drive electrode 4 made of platinum is formed below the insulator 7.
- the first drive electrodes 301 and 302 and the piezoelectric bodies 201 and 202 are substantially the same in shape and area, respectively, and the two expandable and contractible portions 101 and 102
- the second drive electrode 4 has a structure electrically connected.
- Elastic body with such a configuration 1 is adhered on a flexible substrate 9 by an adhesive 8, but the flexible substrate 9 has a region fixed to the fixed substrate 11 and a region not fixed.
- FIG. 2 is a plan view showing a state in which the insulator is formed on the piezoelectric body. As shown in FIGS.
- the insulator 7 has the piezoelectric body 201, It has a frame-like shape that covers only the periphery of 202, and has a shape that covers the surfaces of the piezoelectric bodies 201 and 202 in a fixed region.
- the adhesive 8 for bonding the flexible substrate 9 and the elastic body 1 has a shape that exposes a part of the external electrode connection part 6 of the second drive electrode formed at the end of the elastic body 1.
- FIG. 3 is a plan view showing a state in which the adhesive 8 is formed on the second drive electrode 4. At this time, the exposed area is, as shown in FIG. The end of the adhesive is positioned at a distance greater than or equal to the film thickness.
- electrode pads 10 are formed on the flexible substrate 9, and these are formed at positions facing the external electrode connection portions 501, 502, and 6 of the elastic body 1. I have. As shown in FIG. 4, the external electrode connection portion 6 of the second drive electrode 4 and the electrode pad 10 on the flexible substrate 9 are electrically connected by the conductive paste 12. Although not shown, similarly, the first drive electrodes 301 and 302 connect each of the external electrode connection portions 501 and 502 to the corresponding electrode pad 10. A conductive paste is applied to the electrodes to be electrically connected.
- the first drive electrodes 301, 302 of the left and right expandable members 1 A voltage is applied between the second drive electrodes 4, whereby the shapes of the piezoelectric bodies 201 and 202 are deformed, and the flexible substrate 9 is also deformed. Accordingly, the pedestal 13 on which the magnetic head connected to one end of the flexible substrate 9 is mounted receives a pulling or pushing force, and the position of the pedestal 13 moves.
- a predetermined voltage is applied to the expansion and contraction sections 101 and 102, if one is stretched and the other expands and contracts, a rotational moment is applied to the pedestal, and the base moves slightly in the vertical direction. .
- the elastic portions 101 and 102 extend simultaneously in the same direction. If it is configured to shrink, it will move slightly in the horizontal direction.
- external electrode connection portions 501, 502, and 6 are provided in a region where elastic body 1 is fixed to fixed substrate 11. Therefore, the elastic body 1 undergoes a shape change only in the area where it is not fixed, and no mechanical load is applied to the external electrode connection portions 501, 502 and 6 and the electrical connection is made. Can provide a highly reliable microphone port moving device that is kept well.
- the insulator 7 has a frame shape that covers only the peripheral portions of the piezoelectric bodies 201 and 202 in a region not fixed to the fixed substrate 11, and the second drive electrode 4 is formed thereunder. Therefore, the insulator 7 does not hinder the contact between the second drive electrode 4 and the piezoelectric members 201 and 202 at the portions where the piezoelectric members 201 and 202 substantially expand and contract. Therefore, a short circuit does not occur between the first drive electrodes 301 and 302 and the second drive electrode 4.
- the first drive electrode is made of platinum and the second drive electrode is made of a dissimilar metal such as chromium, an electromotive force is usually generated between the dissimilar metals, but the first drive electrode 301, 3 Since the insulator 7 is interposed between the end face of the second drive electrode 4 and the end face of the second drive electrode 4, there is an advantage that the electrolyte does not come into contact with the end in a process such as wet etching, and the end face corrosion due to the battery action does not easily occur. .
- the voltage to be supplied is uniformly set to the piezoelectric members 201 and 200. 2 to be stable and obtain maximum displacement.
- the insulator 7 is formed so as to cover the entire surface of the piezoelectric members 201 and 202, so that the first drive electrodes 301 and 302 are In addition to further preventing short circuit failure between the second drive electrodes 4, when a voltage is supplied between these electrodes, it is more sufficient than lead zirconate titanate which is a material of the piezoelectric bodies 201 and 202. Since the polyimide having a low dielectric constant is formed as the insulator 7, substantially no supplied voltage is applied to the piezoelectric bodies 201 and 202. That is, in the region on the fixed substrate 11, the shapes of the two expandable portions do not change, so that a more stable voltage can be supplied.
- FIG. 4 is a cross-sectional view of the periphery of the external electrode connection portion 6 corresponding to the portion A in FIG. 5H. As shown in FIG. 4, when bonding the flexible substrate 9 and the extensible body 1 with the adhesive 8, the flexible substrate 9 is bonded to a position larger than the thickness of the adhesive 8 from the end of the external electrode connection portion 6.
- the external electrode connecting portions 6 can be bent along the outer edge of the adhesive 8. Thereby, the electrical connection between the external electrode connection part 6 and the electrode pad 10 is further facilitated. Further, at this time, even if a gap is formed due to insufficient bending of the end face of the adhesive, the conductive paste 12 can flow through the gap, so that electrical connection can be ensured.
- 5A to 5H are cross-sectional views illustrating a manufacturing method according to the present embodiment. First, as shown in FIG.
- platinum is formed as a first conductive layer 21 and lead zirconate titanate as a piezoelectric layer 22 on a single crystal plate 20 of magnesium oxide by sputtering.
- a single crystal plate 20 of magnesium oxide by sputtering.
- high-quality platinum and lead zirconate titanate can be formed on the magnesium oxide single crystal plate 20.
- the magnesium oxide single crystal plate 20 Since the elastic body 1 can be easily removed by etching, a plurality of the elastic bodies 1 can be collectively formed by forming a plurality of the elastic bodies 1 on the substrate and then removing the magnesium oxide single crystal plate 20.
- the first conductive layer 21 and the piezoelectric layer 22 are continuously etched using the same photomask, and the piezoelectric body 201 and the first drive electrode 3 are etched.
- 0 1 is formed to have almost the same shape.
- there are dry etching and wet etching as etching methods and there is a slight difference in a finished shape depending on which method is used, but either method may be used as long as etching is performed continuously. .
- polyimide is formed as an insulator 7 by a photolithography process.
- the whole surface of the piezoelectric body 201 is covered, and in a region not fixed, only the end of the piezoelectric body 201 is covered.
- the insulator 7 is made of polyimide, the piezoelectric body 201 is entirely covered in a region to be fixed to the fixed substrate 11 later, and the piezoelectric body 201 is covered in a region not fixed.
- the photolithography process can easily and collectively form a shape in which only the ends are covered in a frame shape. In this way, when the second drive electrode 4 is formed later, the shape of the elastic body 1 is not deformed in the region fixed to the fixed substrate 11, but is formed in the region not fixed. Voltage can be supplied uniformly and stably.
- a second drive electrode 4 is formed on the piezoelectric body 201 and the insulator 7 by a photolithography process.
- the piezoelectric body 201 has a configuration in which the piezoelectric body 201 is sandwiched between the first drive electrode 301 and the second drive electrode 4 with the insulator 7 in the peripheral portion.
- the electrode material used is preferably a conductor such as platinum, chromium, gold, or copper.
- the external electrode connection portion 6 is formed so that a part thereof is outside the outer shape of the insulator 7.
- the magnesium oxide single crystal plate 20 is later etched, the external electrode connection portion is exposed from the upper surface, so that electrical extraction from the upper surface is facilitated and the subsequent steps are performed. Since the electrode pads 10 are provided on the flexible substrate 9 side, electrical connection can be completed only by applying an appropriate amount of conductive paste.
- the second drive electrodes 4 of the two elastic portions (101 and 102 in FIG. 1) of the elastic body 1 have a common electrode structure that is electrically connected.
- the effect of the second drive electrode 4 being electrically connected will be described later in detail.
- the electrical connection with the electrode pad 10 of the flexible board can be confirmed by measuring the electrical resistance value from the connector connection portion of the flexible board.
- an adhesive 8 is formed by a photolithography process so as to expose a part of the external electrode connection 6.
- the end of the adhesive 8 is a pattern that is located at an inner position at a distance larger than the thickness of the adhesive 8 from the end of the external electrode connection 6.
- the flexible substrate 9 and the elastic body 1 are aligned and bonded.
- the magnesium oxide single crystal plate 20 is removed with a phosphoric acid solution.
- the elastic body 1 is removed from the magnesium oxide single crystal plate 20 and formed on the flexible substrate 9.
- the elastic body 1 is fixed to the magnesium oxide single crystal plate 20 until it is bonded to the flexible substrate 9, so that it is easy to handle and does not break.
- an appropriate amount of conductive paste 12 is applied to the connection between the external electrode connection portion 501 and the connection portion of the electrode pad 10 to complete the electrical connection therebetween.
- the magnesium oxide single crystal plate 20 is removed, the external electrode connection portion 5 is exposed upward, and a suitable amount of the conductive paste 12 is applied to the ends of the external electrode connection portions 501 and 502.
- the connection with the electrode pads 10 of the flexible substrate 9 is completed only by coating.
- the external electrode connection 6 covers the end of the adhesive 8 and is in contact with the electrode pad 10 as described above. However, the external electrode connection 6 is not electrically bent due to insufficient bending or the like. If the connection is not established, apply an appropriate amount of conductive paste 12 to this location.
- the conductive paste flows into the gap formed between the external electrode connection portion 6 and the electrode pad 10, and the electrical connection can be more reliably performed.
- the electric resistance value of the connector connection portion 14 provided on the flexible substrate 11 is examined. Since the second drive electrode 4 of the expandable body 1 has a common electrode structure electrically connected, if the electrical connection between the external electrode connection part 4 and the electrode pad 10 is completed normally, the electric resistance value becomes Since a short-circuit condition occurs, if this is examined, it is easy to determine whether or not the electrical connection is normal.
- the connector connection portion 1 provided on the flexible substrate 11
- the electric capacitance value between the first drive electrode and the second drive electrode in step 4 is examined. If the capacitance value matches the capacitance value calculated from the area of the piezoelectric body 201, it can be determined whether the connection at the electrode pad 10 is normal.
- a plurality of elastic bodies can be formed on a single crystal plate of magnesium oxide by using the production method of the present invention as described above. As a result, a plurality of high-quality microphone opening moving devices can be easily obtained in a lump.
- FIG. 6 is an exploded perspective view of the micro moving device according to the second embodiment of the present invention.
- an elastic body 31 has elastic parts 301 and 302 having mirror symmetry with each other.
- the device according to the second embodiment will be described using the piezoelectric body 32, the first drive electrode 33, and the second drive electrode 34 of one of the elastic portions 301 of the elastic member 31 as a representative. explain in detail.
- the expandable body 31 includes a piezoelectric body 32 made of lead zirconate titanate, a first drive electrode 33 made of platinum formed above, and a second drive electrode 34 made of platinum formed on the piezoelectric body 3.
- FIG. 7 is a cross-sectional view of a region where the elastic body 31 is fixed to the fixed substrate 43 (a cross section taken along line BB ′ in FIG. 6). As shown, the piezoelectric body 32 and The second drive electrode 34 is provided with a third through-hole 47, and the hole diameter of the third through-hole 47 is smaller on the first drive electrode 33 side. I have. Further insulator
- a second through hole 45 and a first through hole 46 are provided in 39, and the first through hole 46 is further larger than the hole diameter on the smaller side of the third through hole 47. It is small.
- the second extraction electrode 35 is in contact with the second drive electrode 34 through the second through hole 45 of the insulator 39, and the first extraction electrode 36 is provided on the insulator 39.
- the first drive electrode 33 is in contact with the first through hole 46 provided.
- external electrode connection portions 37 and 38 are provided in a region fixed to the fixed substrate 43.
- the elastic body 31 composed of the elastic parts 310 and 302 constructed in this manner is adhered on the flexible substrate 41 with the adhesive 40, but the flexible substrate 41 and the elastic body 31 are fixed.
- a fourth through hole 48 exposing a part of the external electrode connection portions 37 and 38 is formed in the bonding material 40. Further, a projection 49 of a conductor made of copper, gold, or the like is formed on the electrode pad 42 of the flexible substrate 41, and the projection 49 is formed on the external electrode connection sections 37, 38.
- the fourth through hole 48 is provided at a position where the elastic body 31 and the flexible substrate 41 face each other, and the fourth through hole 48 of the external electrode connection portions 37 and 38 and the projection are formed. Section 49 is electrically connected.
- the first drive electrode 33, the piezoelectric body 32, and the second drive electrode 34 have substantially the same shape, so that a uniform voltage is applied to the entire surface of the piezoelectric body 32. Becomes possible. Also, since the first drive electrode 33 and the second drive electrode 34 are both made of platinum, there is no potential difference between metals between the two electrodes, so that the piezoelectric material 32 is less likely to be corroded by the battery action. It has the advantage that.
- the second extraction electrode 35 is connected to the second drive electrode 34 through the second through hole 45 provided in the insulator 39. Therefore, the second extraction electrode 35 is drawn out to the flexible substrate 41 without short-circuiting with the first drive electrode 33.
- the third through hole
- the wall surface of 4 7 is inclined so that the hole diameter of the first drive electrode side 3 3 becomes smaller, Since the first through hole 46 is smaller than this, there is little disconnection at the wall of the through hole when the first extraction electrode 36 is provided, and a short circuit with the second drive electrode 34 is provided. Without being pulled out, it is surely drawn out to the flexible substrate 41 side.
- the adhesive 40 exposes part of the external electrode connection portions 37 and 38 provided on the second extraction electrode 35 and the first extraction electrode 36, and the fourth through hole A conductor projection 49 is provided at a position on the side of the flexible substrate 41 opposite to 48, but since the height of the projection 49 is higher than the thickness of the adhesive material 40, reliable electric power is provided. Connection is possible. In the case where the first extraction electrode 36 is not provided, the electrical connection by the conductive paste is possible as described in the first embodiment.
- FIGS. 8A to 8G and FIGS. 9A to 9E are cross-sectional views illustrating a method of manufacturing the micro transfer device according to the present embodiment.
- platinum is continuously formed as the first conductive layer 51
- lead zirconate titanate is formed as the piezoelectric layer 52 by sputtering
- platinum is further formed as the second conductive layer 53.
- the conductive layer 51 is formed under the same conditions as when the conductive layer 51 is formed.
- high-quality platinum and lead zirconate titanate can be formed on magnesium oxide single crystal plate 50.
- magnesium oxide single crystal plate 50 can be easily etched.
- the first conductive layer 51, the piezoelectric layer 52, and the second conductive layer 5 3 is continuously etched using the same photomask to form the first drive electrode 33, the piezoelectric body 32, and the second drive electrode 34 in substantially the same shape.
- dry etching is preferable as an etching method. This is because when wet etching is performed using the same mask, a side etch becomes large in a layer having a large thickness, and when the thickness of the piezoelectric body 32 is large, a side etch occurs in the piezoelectric body 32. This is because the first drive electrode 33 and the second drive electrode 34 may be short-circuited.
- the first conductive layer, the piezoelectric layer, and the second conductive layer are continuously dry-etched using the same mask.
- the first drive electrode 33, the piezoelectric body 32, and the second drive electrode 34, which are of high quality and have no pattern shift inevitable when manufacturing by changing the size, are placed on a magnesium oxide single crystal plate 50. This makes it easier to obtain multiple packages in a stable manner.
- FIGS. 9A to 9E are cross-sectional views in which only a portion where a third through hole is formed is enlarged.
- the method of forming the third through hole will be described in further detail.
- a normal photoresist has a taper structure with a smaller film thickness nearer the opening.
- the resist is on line a as shown.
- the photoresist near the opening is etched by dry etching as shown in FIG. 9B, so that the resist line recedes. happenss.
- the resist line recedes from the b line to the c line, and as a result, the second drive electrode 34 and the piezoelectric body 32 become tapered as shown in FIG. 9C. That is, the diameter of the exposed portion of the first drive electrode 33 is smaller than that of the second drive electrode 34. This enables reliable electrical connection with less disconnection between the insulator to be formed later and the first extraction electrode 36.
- an insulator 39 is formed by a photolithography process.
- a second through hole 45 and a first through hole 46 of the insulator 39 are provided in a region where the shrink body 31 is fixed to the fixed substrate 43.
- the first through hole 46 covers the periphery of the previously formed third through hole 47, that is, the first through hole It is formed so that the hole diameter of 46 becomes smaller.
- the second extraction electrode 35 and the first extraction electrode 36 can be reliably formed without a short circuit.
- a second extraction electrode 35 and a first extraction electrode 36 mainly made of gold are formed by a photolithography process.
- the gold can be etched with a potassium iodide iodide solution, so that it does not damage other materials.
- the adhesive 40 is subjected to a photolithography process.
- a fourth through hole 48 is formed so as to expose a part of the external electrode connection part 37 of the second extraction electrode 35 and a part of the external electrode connection part 38 of the first extraction electrode 36. deep.
- the area exposed at this time is larger than the protrusion 49 provided on the electrode pad 42 of the flexible substrate 41.
- the fourth through hole 48 and the projection 49 can be fitted together, so that the step of superposing the elastic body 31 and the flexible substrate 41 becomes easy.
- the protrusion 49 is smaller than the area of the fourth through hole 48, play at the time of fitting can be performed, and overlay adjustment in a later step is facilitated.
- the protrusion 49 is formed of a conductor, and the thickness of the adhesive 40 is formed to be smaller than the height of the protrusion 49, so that the electrical connection is made together with the fitting. A static connection is made.
- the elastic body 31 is overlaid on the flexible substrate 41.
- the superposed position is adjusted by measuring the electric capacitance value of the connector connection portion provided on the flexible substrate 41. That is, when these overlapping positions are aligned, the fourth through hole 48 of the external electrode connecting portion 37 of the elastic body 31 and the projection portion 49 of the electrode pad 42 of the flexible substrate 41 abut. Therefore, between the first drive electrode 33 and the second drive electrode 34, the capacitance value of the piezoelectric body 32 is observed. With this method, it is possible to confirm the overlay and the electrical connection and perform the adhesive curing.
- the magnesium oxide single crystal plate 50 is removed with a phosphoric acid solution to obtain a microphone opening moving device.
- a plurality of high-quality micro moving devices can be obtained collectively.
- one end of the microphone moving device for finely adjusting the position of the recording head at the tip is firmly fixed on a fixed substrate, and the supply of voltage is performed on the fixed substrate. Since the connection is made from the electrode pad on the flexible substrate to the external electrode connection section provided in the, the voltage supply section does not change shape even during high-speed movement of the head support mechanism, and the voltage is supplied stably This makes it possible to easily adjust the position of the magnetic head easily.
- an elastic body is used.
- a plurality of signal connection portions can be easily formed in a lump, and an elastic body can be attached to the flexible substrate side in a lump, an inexpensive microphone opening moving device can be easily obtained.
- the micro moving device of the present invention is useful for a recording / reproducing apparatus for a disk-shaped recording medium such as a magnetic recording medium, a magneto-optical recording medium, and an optical recording medium, which requires high-speed and high-precision positioning of a recording head.
- a head moving device such as a scanning tunneling microscope because it can be accurately positioned.
Landscapes
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Moving Of The Head To Find And Align With The Track (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
- Supporting Of Heads In Record-Carrier Devices (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Micromachines (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/362,913 US7005304B2 (en) | 2001-06-29 | 2002-06-26 | Micro-moving device and its manufacturing method |
JP2003509456A JP3855996B2 (ja) | 2001-06-29 | 2002-06-26 | マイクロ移動装置およびその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2001198156 | 2001-06-29 | ||
JP2001-198156 | 2001-06-29 |
Publications (1)
Publication Number | Publication Date |
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WO2003003369A1 true WO2003003369A1 (fr) | 2003-01-09 |
Family
ID=19035647
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2002/006433 WO2003003369A1 (fr) | 2001-06-29 | 2002-06-26 | Dispositif a micro deplacement et procede de fabrication |
Country Status (4)
Country | Link |
---|---|
US (1) | US7005304B2 (ja) |
JP (1) | JP3855996B2 (ja) |
CN (1) | CN100337281C (ja) |
WO (1) | WO2003003369A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005312200A (ja) * | 2004-04-22 | 2005-11-04 | Fujitsu Ltd | 圧電アクチュエータ及び圧電アクチュエータを用いたヘッドサスペンション装置 |
JP2010004708A (ja) * | 2008-06-23 | 2010-01-07 | Fujinon Corp | 駆動装置 |
JP2010154691A (ja) * | 2008-12-25 | 2010-07-08 | Nhk Spring Co Ltd | 圧電素子の電気的接続構造、圧電アクチュエータ及びヘッドサスペンション |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4321034B2 (ja) * | 2002-10-16 | 2009-08-26 | パナソニック株式会社 | 圧電アクチュエータおよびディスク装置 |
US20080024920A1 (en) * | 2006-07-28 | 2008-01-31 | Sae Magnetics (H.K.) Ltd. | Head gimbal assembly with micro-actuator and manufacturing method thereof, and disk drive unit with the same |
US8947831B1 (en) | 2011-11-30 | 2015-02-03 | Magnecomp Corporation | GSA suspension with microactuators extending to gimbal through flexible connectors |
US9190086B1 (en) | 2011-11-30 | 2015-11-17 | Magnecomp Corporation | GSA suspension having slider clearance for shock performance |
US8879210B1 (en) | 2011-11-30 | 2014-11-04 | Magnecomp Corporation | DSA suspension with microactuators extending to gimbal through flexible connectors |
CN104810638B (zh) * | 2015-05-19 | 2017-02-22 | 合肥京东方光电科技有限公司 | 印刷电路板及其与柔性电路板连接的检测方法、显示面板 |
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JPH06338673A (ja) * | 1993-05-31 | 1994-12-06 | Murata Mfg Co Ltd | 電極回路の製造方法 |
JP2000218783A (ja) * | 1999-02-03 | 2000-08-08 | Ricoh Co Ltd | インクジェットヘッド |
JP2000299510A (ja) * | 1999-04-15 | 2000-10-24 | Matsushita Electric Ind Co Ltd | 圧電素子及びその製造方法並びにそれを用いたインクジェットヘッド及びその製造方法 |
JP2001043641A (ja) * | 1999-07-30 | 2001-02-16 | Fujitsu Ltd | ヘッドの微小移動機構 |
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US6327120B1 (en) * | 1997-04-17 | 2001-12-04 | Fujitsu Limited | Actuator using piezoelectric element and head-positioning mechanism using the actuator |
US6362542B1 (en) * | 1997-08-15 | 2002-03-26 | Seagate Technology Llc | Piezoelectric microactuator for precise head positioning |
US6552878B2 (en) * | 1998-08-05 | 2003-04-22 | Hitachi, Ltd. | Magnetic disk apparatus |
US7072149B2 (en) * | 2000-02-01 | 2006-07-04 | Matsushita Electric Industrial Co. Ltd. | Head support mechanism and thin film piezoelectric actuator |
JP4298911B2 (ja) * | 2000-12-15 | 2009-07-22 | 日本発條株式会社 | ディスク装置用サスペンション |
-
2002
- 2002-06-26 CN CNB028021576A patent/CN100337281C/zh not_active Expired - Fee Related
- 2002-06-26 WO PCT/JP2002/006433 patent/WO2003003369A1/ja active Application Filing
- 2002-06-26 JP JP2003509456A patent/JP3855996B2/ja not_active Expired - Fee Related
- 2002-06-26 US US10/362,913 patent/US7005304B2/en not_active Expired - Lifetime
Patent Citations (4)
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JPH06338673A (ja) * | 1993-05-31 | 1994-12-06 | Murata Mfg Co Ltd | 電極回路の製造方法 |
JP2000218783A (ja) * | 1999-02-03 | 2000-08-08 | Ricoh Co Ltd | インクジェットヘッド |
JP2000299510A (ja) * | 1999-04-15 | 2000-10-24 | Matsushita Electric Ind Co Ltd | 圧電素子及びその製造方法並びにそれを用いたインクジェットヘッド及びその製造方法 |
JP2001043641A (ja) * | 1999-07-30 | 2001-02-16 | Fujitsu Ltd | ヘッドの微小移動機構 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005312200A (ja) * | 2004-04-22 | 2005-11-04 | Fujitsu Ltd | 圧電アクチュエータ及び圧電アクチュエータを用いたヘッドサスペンション装置 |
JP4585223B2 (ja) * | 2004-04-22 | 2010-11-24 | 東芝ストレージデバイス株式会社 | 圧電アクチュエータ及び圧電アクチュエータを用いたヘッドサスペンション装置 |
JP2010004708A (ja) * | 2008-06-23 | 2010-01-07 | Fujinon Corp | 駆動装置 |
JP2010154691A (ja) * | 2008-12-25 | 2010-07-08 | Nhk Spring Co Ltd | 圧電素子の電気的接続構造、圧電アクチュエータ及びヘッドサスペンション |
Also Published As
Publication number | Publication date |
---|---|
CN1463436A (zh) | 2003-12-24 |
JPWO2003003369A1 (ja) | 2004-10-21 |
JP3855996B2 (ja) | 2006-12-13 |
US7005304B2 (en) | 2006-02-28 |
US20040100735A1 (en) | 2004-05-27 |
CN100337281C (zh) | 2007-09-12 |
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