WO2003001264A2 - Improvements in mounting of an optical fibre - Google Patents
Improvements in mounting of an optical fibre Download PDFInfo
- Publication number
- WO2003001264A2 WO2003001264A2 PCT/GB2002/002811 GB0202811W WO03001264A2 WO 2003001264 A2 WO2003001264 A2 WO 2003001264A2 GB 0202811 W GB0202811 W GB 0202811W WO 03001264 A2 WO03001264 A2 WO 03001264A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- channel
- optical
- optical fibre
- face
- substrate according
- Prior art date
Links
- 239000013307 optical fiber Substances 0.000 title claims abstract description 83
- 230000003287 optical effect Effects 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 230000008878 coupling Effects 0.000 claims abstract description 9
- 238000010168 coupling process Methods 0.000 claims abstract description 9
- 238000005859 coupling reaction Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 abstract description 8
- 230000001070 adhesive effect Effects 0.000 abstract description 8
- 230000003116 impacting effect Effects 0.000 abstract description 3
- 239000000835 fiber Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 239000012212 insulator Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920004482 WACKER® Polymers 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005253 cladding Methods 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
- G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
- G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
- G02B6/3684—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier
- G02B6/3692—Mechanical coupling means for mounting fibres to supporting carriers characterised by the manufacturing process of surface profiling of the supporting carrier with surface micromachining involving etching, e.g. wet or dry etching steps
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
Definitions
- the present invention relates to improvements in mounting an optical fibre, and is particularly, although not exclusively, concerned with mounting of an optical fibre to a substrate for an optical chip.
- An optical chip may have one or more optical components which, for example, either produce photocurrent, emit light in response to an injection of electric current, multiplex or demultiplex optical signals of different wavelengths, or simply transport an optical signal.
- the optical chip has a silicon substrate on a surface of which the or each optical component is located.
- the silicon substrate is mounted on an insulator and the optical chip is consequently termed a silicon-on-insulator chip, otherwise referred to as a SOI).
- SOI silicon-on-insulator chip
- One example of an optical chip is an optical transceiver in which a laser diode and a photodiode are located on the substrate surface together with associated waveguides.
- the first problem is getting the fibre to lie flat in the channel so that the central core of the optical fibre is optimally aligned with the optical component for optical coupling therebetween.
- One reason for not obtaining a flat lie of the optical fibre is that adhesive is typically used to secure the optical fibre in place and that no provision is made to accommodate excess adhesive. The excess adhesive then leads to the fibre being displaced from a flat lie.
- Another reason is that the free end of the optical fibre may be of a greater circumference than the fibre body due to flaring caused on cleavage of the fibre. This is a particular problem when the free end is formed by laser cleaving.
- the second problem is preventing the free end of the optical fibre from impacting the optical component and damaging itself and/or the optical component as the fibre is fed along the channel.
- a previous proposal for addressing this problem has been to provide a stop surface in the channel spaced from the optical component for the free end of the optical fibre to abut before impacting the optical component.
- One such stop surface is disclosed in US-A-5787214 (Harpin et al/Bookham Technology Ltd.).
- a force sensor would typically be used to sense the reaction force created when the free end of the optical fibre contacts the stop surface and to generate a stop signal for stopping further feeding of the fibre.
- the stop surface is positioned a short distance from the optical component, preferably 5 ⁇ m or less, so that the fibre and optical component remain optically coupled.
- the present invention proposes to provide means for alleviating these problems.
- a substrate for an optical chip having a surface in which a channel is provided for an optical fibre to be received in, the channel having a bottom with a stepped profile.
- the stepped profile provides a run-off for excess adhesive used to secure the optical fibre in the channel.
- a substrate for an optical chip having a surface along which a channel extends for receiving an optical fibre, the channel having an end face for a free end of the optical fibre to be juxtaposed with with a recess being formed in the end face at the surface of the substrate.
- An optical component can thus be located on the surface at the recess with the end face acting to space the free end of the optical fibre from the optical component to prevent impact damage on the optical component.
- a substrate for an optical chip having a surface in which is provided a channel for receiving an optical fibre, the channel having an axis and an end face for a free end of the optical fibre to be juxtaposed with, the end face extending widthwise at an inclined angle to the axis.
- a system comprising an optical fibre having a free end and a structure having a surface in which is provided a channel having a bottom with a stepped profile, the optical fibre being mountable in the channel.
- a system comprising an optical fibre having a free end and a structure having a surface and a channel which extends along the surface and which has an end face in which a recess is formed at the surface of the substrate, the optical fibre being mountable in the channel so that the free end is located juxtaposed with the end face.
- a system comprising an optical fibre having a free end and a structure having a surface in which is provided a channel having an axis and an end face which extends widthwise at an inclined angle to the axis, the optical fibre being mountable in the channel such that the free end is disposed adjacent the end face.
- FIGURE 1 is a schematic, fragmentary cross-sectional side view of an optical fibre mounted to an optical chip in accordance with a first embodiment of the present invention
- FIGURE 2 is schematic, fragmentary plan view of the optical chip of the first embodiment
- FIGURE 3 is a cross-sectional view along section Ill-Ill in FIGURE 2 with the optical fibre omitted;
- FIGURE 4 is a schematic, fragmentary plan view of an optical fibre cleaved by laser cleaving mounted in the optical chip of the first embodiment
- FIGURE 5 is a cross-sectional view along section V-V in FIGURE 4.
- FIGURE 6 is a schematic, fragmentary cross-sectional side view of an optical fibre mounted to an optical chip in accordance with a second embodiment of the present invention.
- FIGURE 7 is a schematic, fragmentary cross-sectional side view of an optical fibre mounted to an optical chip in accordance with a third embodiment of the present invention.
- FIGURES 1 to 3 there is shown an optical chip 10 in accordance with a first embodiment of the invention comprising a substrate 1 , preferably of silicon, having an upper surface 3 on which optical components are formed.
- a monolithic optical waveguide 5 is formed on the upper surface 3 in a manner known per se.
- a groove 7 is etched in the upper surface 3 of the substrate 1 so as to extend from an edge 9 between the upper surface 3 and a side surface 11 to an end face 12 adjacent the waveguide 5.
- Mounted in the groove 7 is an optical fibre 13 with a free end 14 of the optical fibre 13 juxtaposed with the waveguide 5 for optical coupling therebetween.
- the optical fibre 13 has a central optical core 15 and an optical cladding 17 and would typically have a diameter of about 125 ⁇ m.
- the waveguide 5 may be one of several waveguides on the upper surface 3 and may communicate with another optical component, such as a laser diode or photodiode, or simply extend to an edge of the upper surface 3 for optical coupling with another optical fibre.
- another optical component such as a laser diode or photodiode
- the groove 7 is formed so as to have a rear section 19 and a front section 21. As shown in FIGURE 1 , the rear and front sections 19, 21 respectively have a bottom 23, 25 with the bottom 25 of the front section 21 being at a greater depth than the bottom 23 of the rear section 19. Thus, the bottom of the groove 7 has a stepped profile.
- the advantage of providing a stepped profile to the bottom of the groove 7 is that any excess adhesive used for securing the optical fibre 13 in the groove 7 is able to flow into the deeper front section 21 whilst the optical fibre 13 is supported on the bottom 23 of the rear portion 19.
- the optical fibre 13 tends to lie flat in the groove 7 despite the presence of excess adhesive whereby the core 15 of the optical fibre 13 remains aligned with the waveguide 5 for efficient optical coupling therebetween.
- the stepped profile of the bottom of the groove 7 can take other forms for achieving the intended effect.
- the bottom 25 of the front section 21 may taper from the rear section 19 towards the end face 12.
- the front section 21 has a transverse axis which is slanted to the longitudinal axis of the groove 7.
- the end face 12 is inclined to the longitudinal axis of the groove 7 and, concomitantly, the longitudinal axis of the optical fibre 13.
- the end face 12 is inclined in this instance because the free end 14 of the optical fibre 13 is cleaved to be inclined to the longitudinal axis of the optical fibre 13.
- the inclination of the free end 14 of the optical fibre 13 reduces optical signal transmission loss between the optical fibre 13 and the waveguide 5, as outlined in US-A-5787214 supra, the content of which is incorporated herein by reference.
- the angle of inclination of the free end 14 is substantially equal to that of the end face 12 so that a substantially flush contact is made between the free end 14 of the optical fibre 13 and the end face 12 thereby minimizing impact forces between the two.
- the end face 12 is inclined so that a normal thereto (when viewed in plan) makes an angle of 6-10° with the longitudinal axis of the groove 7, more preferably an angle of 6- 7°.
- FIGURES 2 and 3 also show that the front section 21 of the groove 7 possesses a width w1 which is greater than the width w2 of the rear section 19 thereby giving the groove 7 a generally T-shape when viewed in plan.
- FIGURE 3 shows that the rear section 19 of the groove 7 has a generally V-shape cross- sectional profile and the front section 21 a generally U-shaped cross-sectional profile.
- the rear portion 19 may be formed by wet or chemical etching in a manner known per se whereas the front portion 21 may be formed by a dry etch process with well known lithographic techniques, for instance through plasma etching.
- the increased width w1 of the front portion 21 provides an additional reservoir for excess adhesive, it also provides means for enabling the optical fibre 13 to lie flat in the groove 7 when the free end 14 of the optical fibre 13 has a greater circumference than the bulk, for instance as caused by heating when the free end 14 is cleaved by laser cleaving.
- FIGURES 4 and 5 show an optical fibre 113 having a flared free end 114 caused by laser cleaving mounted in the groove 7 of the substrate 1.
- the increased width w1 of the front portion 21 accommodates the flared free end 114 so that the optical fibre 113 lies flatter in the groove 7 than if the groove 7 had a uniform cross-section with the width w2 of the rear portion 19.
- the increased depth of the front portion 21 also assists in improving the lie of the optical fibre 113 by accommodating the flared free end 114 of the optical fibre 113.
- a recess 27 is etched in the end face 12 of the groove 7.
- the recess 27 is wet etched at the same time as the V-shaped rear section 19 of the groove 7.
- the recess 27 is aligned with, and tapers to, the waveguide 5 which is spaced by a distance d from the end face 12.
- the dimensions of the recess 27 are such that the free end 14; 114 of the optical fibre 13; 113 contacts the end face 12 when fed along the groove 7 whereupon feeding can be stopped through use of an appropriate sensor. In this way, the free end 14; 114 of the optical fibre 13; 113 is prevented from abutting the waveguide 5 and damaging it.
- the distance d between the end face 12 and the waveguide 5 is selected so that the optical fibre 13; 113 is still optically coupled with the waveguide 5.
- the distance d is no more than about 5 ⁇ m, more preferably in the range of 2-3 ⁇ m.
- FIGURE 6 there is shown an optical chip 110 in accordance with the present invention which corresponds to the optical chip 10 of FIGURES 1 to 5 other than being provided with a recess 127 which has a stepped profile.
- the recess 127 functions in the same way as the recess 27 of the optical chip 10 of FIGURES 1 to 5.
- the recess 27; 127 in the end face 12; 112 of the groove 7; 107 may receive a material which has a refractive index which matches that of the core 15 of the optical fibre 13; 113 for optical coupling of the optical fibre 13; 113 with the waveguide 5; 105 through the index-matching material.
- the index-matching material may be an epoxy resin or an encapsulant.
- An example of a suitable epoxy resin is OPTOCAST 3553 (Electronic Materials, Inc.) and examples of suitable encapsulants are WACKER SilGel 612 and GE Silicones RTV615 and RTV655. The use of such a material increases optical transmission and reduces input power.
- FIGURE 7 shows an optical chip 210 in accordance with the present invention which corresponds to the optical chip 10 of FIGURES 1 to 5 other than having a recess 227 in the end face 212 which extends from the upper surface 203 to the bottom 225 of the front section 221 of the groove 207.
- the recess 227 is filled with an index-matching material 229, such as an epoxy resin or encapsulant, to the level of the waveguide 205.
- an index-matching material 229 such as an epoxy resin or encapsulant
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002311458A AU2002311458A1 (en) | 2001-06-22 | 2002-06-21 | Improvements in mounting of an optical fibre |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB0115364A GB2376754A (en) | 2001-06-22 | 2001-06-22 | Optical chip substrate with a channel having a stepped profile |
GB0115364.2 | 2001-06-22 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003001264A2 true WO2003001264A2 (en) | 2003-01-03 |
WO2003001264A3 WO2003001264A3 (en) | 2003-03-13 |
Family
ID=9917207
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/GB2002/002811 WO2003001264A2 (en) | 2001-06-22 | 2002-06-21 | Improvements in mounting of an optical fibre |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002311458A1 (en) |
GB (1) | GB2376754A (en) |
WO (1) | WO2003001264A2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017123538A1 (en) * | 2016-01-12 | 2017-07-20 | Elenion Technologies, Llc | Optical fiber alignment device |
CN110192134A (en) * | 2016-10-29 | 2019-08-30 | 华为技术有限公司 | Light device and its manufacturing method |
WO2022102053A1 (en) * | 2020-11-12 | 2022-05-19 | 日本電信電話株式会社 | Optical connection structure, optical module, and method for manufacturing optical connection structure |
WO2025079140A1 (en) * | 2023-10-10 | 2025-04-17 | 日本電信電話株式会社 | Silicon photonics optical circuit chip with glass plate and method for manufacturing same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
ES2334306B1 (en) * | 2008-04-02 | 2010-12-03 | Das Photonics, S.L. | OPTOELECTRONIC CONNECTION AND CONVERSION DEVICE FOR A SPACE ENVIRONMENT. |
JP6345153B2 (en) * | 2015-05-21 | 2018-06-20 | Nttエレクトロニクス株式会社 | Si photonics lightwave circuit and manufacturing method thereof |
US12282193B2 (en) | 2020-07-17 | 2025-04-22 | Commscope Technologies Llc | Ferrule-less fiber optic connectors, systems, and methods |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5175781A (en) * | 1991-10-11 | 1992-12-29 | United Technologies Corporation | Attaching optical fibers to integrated optic chips |
DE4134940A1 (en) * | 1991-10-23 | 1993-04-29 | Bosch Gmbh Robert | INTEGRATED OPTICAL COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
JPH0829638A (en) * | 1994-05-12 | 1996-02-02 | Fujitsu Ltd | Optical waveguide / optical fiber connection structure, optical waveguide / optical fiber connection method, optical waveguide substrate used for optical waveguide / optical fiber connection, method of manufacturing the same, and optical fiber with optical fiber substrate used for optical waveguide / optical fiber connection fiber |
JPH08122561A (en) * | 1994-10-21 | 1996-05-17 | Fujitsu Ltd | Method for connecting optical waveguide and optical fiber and optical waveguide type device |
JPH1020159A (en) * | 1996-07-01 | 1998-01-23 | Mitsubishi Electric Corp | Semiconductor laser module |
JPH10282370A (en) * | 1997-04-01 | 1998-10-23 | Sumitomo Electric Ind Ltd | Optical module and manufacturing method thereof |
AU7701998A (en) * | 1997-06-10 | 1998-12-30 | Minnesota Mining And Manufacturing Company | Rib-type integrated optical interconnect |
GB2334344B (en) * | 1998-05-01 | 2000-07-12 | Bookham Technology Ltd | Coupling optical fibre to waveguide |
DE19827553A1 (en) * | 1998-06-20 | 1999-12-30 | Inst Mikrotechnik Mainz Gmbh | Optic coupling element for optical sensors and communication systems |
-
2001
- 2001-06-22 GB GB0115364A patent/GB2376754A/en not_active Withdrawn
-
2002
- 2002-06-21 WO PCT/GB2002/002811 patent/WO2003001264A2/en not_active Application Discontinuation
- 2002-06-21 AU AU2002311458A patent/AU2002311458A1/en not_active Abandoned
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017123538A1 (en) * | 2016-01-12 | 2017-07-20 | Elenion Technologies, Llc | Optical fiber alignment device |
US10025045B2 (en) | 2016-01-12 | 2018-07-17 | Elenion Technologies, Llc | Optical fiber alignment device |
CN110192134A (en) * | 2016-10-29 | 2019-08-30 | 华为技术有限公司 | Light device and its manufacturing method |
WO2022102053A1 (en) * | 2020-11-12 | 2022-05-19 | 日本電信電話株式会社 | Optical connection structure, optical module, and method for manufacturing optical connection structure |
JPWO2022102053A1 (en) * | 2020-11-12 | 2022-05-19 | ||
JP7601113B2 (en) | 2020-11-12 | 2024-12-17 | 日本電信電話株式会社 | Optical connection structure, optical module, and method for manufacturing optical connection structure |
WO2025079140A1 (en) * | 2023-10-10 | 2025-04-17 | 日本電信電話株式会社 | Silicon photonics optical circuit chip with glass plate and method for manufacturing same |
Also Published As
Publication number | Publication date |
---|---|
AU2002311458A1 (en) | 2003-01-08 |
GB0115364D0 (en) | 2001-08-15 |
GB2376754A (en) | 2002-12-24 |
WO2003001264A3 (en) | 2003-03-13 |
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