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WO2003063212A1 - Dispositif de platine et dispositif d'exposition - Google Patents

Dispositif de platine et dispositif d'exposition Download PDF

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Publication number
WO2003063212A1
WO2003063212A1 PCT/JP2003/000267 JP0300267W WO03063212A1 WO 2003063212 A1 WO2003063212 A1 WO 2003063212A1 JP 0300267 W JP0300267 W JP 0300267W WO 03063212 A1 WO03063212 A1 WO 03063212A1
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WO
WIPO (PCT)
Prior art keywords
stage
stator
base
driving
surface plate
Prior art date
Application number
PCT/JP2003/000267
Other languages
English (en)
Japanese (ja)
Inventor
Dai Arai
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to JP2003562979A priority Critical patent/JPWO2003063212A1/ja
Publication of WO2003063212A1 publication Critical patent/WO2003063212A1/fr

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70833—Mounting of optical systems, e.g. mounting of illumination system, projection system or stage systems on base-plate or ground
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Definitions

  • the present invention relates to a stage device in which a stage body holding a substrate moves in a plurality of directions, and an exposure device that performs an exposure process using a mask and a substrate held by the stage device, and particularly relates to a semiconductor integrated circuit and a liquid crystal display.
  • the present invention relates to a stage apparatus and an exposure apparatus suitably used in the production of devices such as a lithographic apparatus. Background art
  • a circuit pattern formed on a mask or a reticle (hereinafter, referred to as a reticle) is formed on a wafer or glass plate coated with a resist (photosensitive agent).
  • a resist photosensitive agent
  • Various exposure apparatuses for transferring images onto a substrate have been used.
  • a pattern of a reticle is projected on a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of a pattern accompanying the high integration of integrated circuits in recent years.
  • a reduction projection exposure apparatus that performs reduction transfer on the top is mainly used.
  • this reduction projection exposure apparatus examples include a step-and-beat type static exposure reduction projection exposure apparatus (so-called stepper) that sequentially transfers a reticle pattern to a plurality of shot areas (exposure areas) on a wafer.
  • stepper is an improvement on the reticle and wafer in a one-dimensional direction by synchronously moving the reticle and the wafer as disclosed in Japanese Patent Laid-Open No. 8-16643, etc. 2. Description of the Related Art
  • a scanning exposure type exposure apparatus (so-called scanning stepper) of an "and scan type" is known.
  • a base plate serving as a reference for the apparatus is first installed on the floor as a stage apparatus, and a reticle stage, a wafer stage, and a projection apparatus are placed on the base plate via a vibration isolating table for isolating floor vibration.
  • Optical system projection lens
  • the one in which a main body column for supporting etc. is arranged is often used.
  • Recent stage devices are equipped with an air mount that can control the internal pressure, an actuator such as a voice coil motor, etc. as the vibration isolating table, and measure, for example, six accelerometers attached to the main body column (main frame).
  • An active vibration isolator that controls the vibration of the main body column by controlling the voice coil motor or the like based on the value is employed.
  • the wafer stage in the case of a stepper or a reticle stage and a wafer stage
  • the reaction force generated by the acceleration and deceleration movements of the scanning (stepping step) causes vibration of the main body column, causing a relative position error between the projection optical system and the wafer.
  • the relative position error at the time of alignment or exposure may result in an image blur (pattern line width) when a pattern is transferred to a position different from the design value on the wafer as a result, or when the position error includes a vibration component. Or increase).
  • 8-632321 discloses a stage in which a drive frame is provided with a stage body floating and supported on a base, and the drive frame is retracted by a reaction force accompanying the forward movement of the stage body.
  • An apparatus is disclosed. According to this technology, the law of conservation of momentum acts between the stage body and the drive frame, and the position of the center of gravity of the device on the base is maintained, so that the effect of vibration on the frame member is reduced. Can be.
  • FIGS 13A and 13B show an example of this type of stage device.
  • an XZY stage (stage main body) 1 for holding a wafer W as a substrate (photosensitive substrate) is driven by a linear motor or the like, and is moved along an X guide bar 2 in the X direction (the horizontal direction in the figure).
  • the mover 5 provided on the X guide bar 2 moves in the Y direction along the stator 3 constituting the linear motor, the wafer W moves in a two-dimensional direction along the XY plane.
  • Each stator 3 constitutes a countermass (3, 6) that is levitated and supported on a base (platen) 4 via an air pad 6 so as to be movable in the Y direction.
  • XZY stage 1 force s for example, when accelerating (moving) in the + Y direction indicated by the arrow in the figure, the countermass (3, 6) accelerates in one Y direction due to the reaction force accompanying acceleration, and the law of momentum conservation works. , The position of the center of gravity of the device on the base is maintained. As a result, the X / Y stage 1 (ie, the wafer W) can be moved without transmitting a reaction force to the outside of the apparatus, and vibration during the stage movement can be minimized.
  • a stage device having a configuration shown in FIG. 14 has been considered.
  • the stator 3 is levitated and supported via an air pad 6 on a side surface plate (support portion) 7 provided separately and independently from the base 4.
  • the base 4 and the side surface plate 7 are independent, even when the stator 3 moves as the counter mass (3, 6), the distortion due to the movement Energy / vibration is not transmitted to the base 4 Therefore, the surface accuracy of the running surface is maintained, and the XZY stage 1 can be protected from vibration.
  • the base 4 is generally mounted on the floor via a vibration isolator 8 for vibration isolation.
  • this type of vibration isolator has a drive stroke, but the allowable stroke of the vibration isolator must be smaller than the gap between the stator 3 and the mover 5 constituting the linear motor.
  • the gap between the stator 3 and the mover 5 must be increased. In this case, heat generated by driving the motor or the motor itself becomes larger. Occurs.
  • a configuration is considered in which a side surface plate 7 is installed on the floor via an actuator 9 such as a motor, an air spring, or an air cylinder.
  • an actuator 9 such as a motor, an air spring, or an air cylinder.
  • the actuator 9 for driving the side surface plate 7 is frequently driven in a servo state, and generates heat. There is no problem if the actuator 9 is operating normally, but if an unexpected situation occurs and the actuator does not operate or operates outside the specified range, it can move with the motor stator 3. There is a risk of contact with the child 5 and damage.
  • the present invention has been made in consideration of the above points, and separates the motor stator from the base.Even if the motor stator is arranged independently, the thrust of the motor is reduced and the vibration isolation performance is reduced. It is an object of the present invention to provide a stage apparatus and an exposure apparatus capable of performing a reaction force treatment without causing damage to the stage. Disclosure of the invention In order to achieve the above object, the present invention employs the following configuration corresponding to FIGS. 1 to 11 showing the embodiment.
  • a stage device of the present invention comprises: a stage main body movably supported by a base having a moving surface; a first driving device having a stator and a mover provided on the stage main body for driving the stage main body; A stage provided with a stator, a support provided independently of the base, a base and a support in a first direction (Z direction) substantially perpendicular to the moving surface. And a release device for releasing the support portion from the independent state with respect to the base in accordance with the relative displacement of
  • the supporting portion for supporting the stator is provided independently of the base, even if the stator moves due to the reaction force accompanying the movement of the stage main body, it is caused by the movement of the stator. Strain energy ⁇ vibration can be prevented from being transmitted to the base.
  • the independent state of the base and the support is released, and the base and the support are subordinate to each other. It is possible to prevent the gap between the movable element and the movable element from becoming smaller than a predetermined value, thereby preventing damage due to contact.
  • the gap between the stator and the mover is made unnecessarily large to reduce the thrust of the first drive unit, and the stroke of the second drive unit for driving the base in the first direction is reduced and prevented.
  • the reaction force due to the movement of the stage body can be processed without lowering the vibration performance.
  • the release device may include a first member provided on the base and a second member provided on the support. In this case, the independent state of the support portion with respect to the base can be released by the first member and the second member.
  • the first member and the second member may be in non-contact when the support portion is independent of the base, and may be in contact when releasing the independent state. In this case, the independent state of the support portion with respect to the base can be released by contact and non-contact between the first member and the second member.
  • One or more of the first member and the second member may be provided along the direction orthogonal to the first direction. In this case, even when the base is relatively displaced in a direction other than the first direction, the independent state of the supporting portion with respect to the base can be reliably released and the base can be moved.
  • the structure may be such that the weight of the support portion is supported by an elastic member. In this case, it is possible to prevent heat from being generated by the support on the support portion.
  • the elastic member may be configured to support the supporting portion at at least three points forming the vertices of a triangle.
  • the support portion can be stably supported in a planar manner.
  • a second driving device for driving the base in a first direction can be released from the independent state with respect to the base driven in the first direction.
  • a third driving device for driving the support portion in a first direction may be provided.
  • the force for distorting the base when the independent state is released can be significantly reduced.
  • It may have a support mechanism for movably supporting the stator with respect to a support portion. In this case, even when the stator moves, the force that distorts the base when the independent state is released can be significantly reduced.
  • a control device may be provided for controlling the third driving device so as to correct the movement of the center of gravity of the support part accompanying the movement of the stator.
  • the movement of the center of gravity accompanying the movement of the stator can be compensated for, and the rigidity of the elastic member can be reduced.
  • the third drive device may be movably connected to the support when the drive is stopped. In this case, even when the driving of the third driving device is stopped, the support portion can reliably follow the base.
  • an exposure apparatus of the present invention is an exposure apparatus that exposes a pattern of a mask held on a mask stage to a substrate held on a substrate stage, wherein at least one of a mask stage and a substrate stage Stage equipment is used.
  • An exposure apparatus exposes a pattern on a first substrate held on a first substrate stage, and comprises: a movable element connected to the first substrate stage; and a stator.
  • a first driving device that drives the first substrate stage, a first platen having a moving surface on which the first substrate stage moves, and the stator is provided.
  • a second platen provided independently of the first platen; a second drive device for driving the first platen in a first direction substantially orthogonal to the moving surface; and the second platen.
  • a third drive device for driving the board in the first direction.
  • the exposure apparatus may include a support mechanism that movably supports the stator with respect to the second platen.
  • the exposure apparatus controls the second driving device so as to correct a change in the center of gravity of the first platen accompanying the movement of the first substrate stage, and responds to the movement of the first substrate stage.
  • a control device may be provided for controlling the third drive device so as to correct a change in the center of gravity of the second platen caused by the movement of the stator.
  • the exposure apparatus includes: a projection optical system that projects the pattern onto the first substrate; and a third surface plate that supports the projection optical system independently of the first surface plate and the second surface plate. You may have.
  • the exposure apparatus may include a fourth driving device that drives the third surface plate in the first direction.
  • the exposure apparatus may include a second substrate stage that moves on the moving surface of the first platen.
  • An exposure apparatus is a method for exposing a pattern on a substrate held on a substrate stage, the method comprising: a movable member connected to the substrate stage; A step of driving a first platen having a moving surface on which the substrate stage moves, in a first direction substantially orthogonal to the moving surface, and a step of driving the stator. Driving a second surface plate provided independently of the first surface plate in the first direction.
  • An exposure apparatus is a method of exposing a pattern on a substrate held on a substrate stage, the method comprising: providing the substrate stage on a first platen having a moving image; Installing a stator on a second surface plate provided independently of the surface plate, driving the substrate stage by the stator and a mover connected to the substrate stage, and Releasing the independent state of the first and second surface plates.
  • FIG. 1 is a schematic diagram showing an overall configuration of an exposure apparatus according to a first embodiment of the present invention.
  • FIG. 2 is a perspective view of the external appearance of the wafer stage according to the present invention.
  • FIG. 3 is a plan view showing an arrangement of a vibration isolation unit and a coil spring.
  • FIG. 4 is a schematic configuration diagram of the wafer stage according to the first embodiment of the present invention.
  • FIG. 5 is an enlarged view of a release device constituting the wafer stage.
  • FIG. 6 is a side sectional view of the releasing device.
  • FIG. 7 is a block diagram of the control according to the first embodiment.
  • FIG. 8 is a schematic diagram of a wafer stage according to the second embodiment of the present invention.
  • FIG. 9 is a plan view showing the arrangement of the vibration isolating unit, the coil spring, and the actuator.
  • FIG. 10 is a control block diagram according to the second embodiment.
  • FIG. 11 is a diagram showing another embodiment of the elastic member and the third driving device.
  • FIG. 12 is a flowchart illustrating an example of a semiconductor device manufacturing process.
  • FIGS. 13A and 13B show an example of a conventional stage device, where FIG. 13A is a plan view and FIG. 13B is a front view.
  • FIG. 14 is a front view showing another example of the conventional stage device.
  • FIG. 15 is a front view showing another example of the conventional stage device. BEST MODE FOR CARRYING OUT THE INVENTION
  • a reticle and a wafer are synchronously moved in a one-dimensional direction (here, the Y-axis direction) while a circuit pattern of a semiconductor device formed on the reticle is transferred onto the wafer.
  • a scanning exposure type exposure device including a scan type or a step-and-stitch type is used.
  • the stage device of the present invention is used as a wafer stage.
  • the same components as those in FIGS. 13 to 15 shown as conventional examples are denoted by the same reference numerals, and the description thereof will be omitted. Is omitted.
  • FIG. 1 schematically shows the entire configuration of an exposure apparatus 10 according to one embodiment of the present invention.
  • the exposure apparatus 10 illuminates a rectangular (or arc-shaped) illumination area on a reticle R as a mask with uniform illumination by exposure illumination light (hereinafter simply referred to as “illumination light”) IL.
  • An illumination system (not shown), a reticle stage RST as a mask stage for holding the reticle R, a projection optical system PL for projecting illumination light emitted from the reticle R onto the wafer W, and a substrate stage for holding the wafer W Wafer stage (stage device) WST, projection optical system PL, reticle stage RST, wafer stage Main body column 14 as body mounted with WST, and main body column
  • an ultraviolet bright line (g-line, i-line) from an ultra-high pressure mercury lamp and far ultraviolet light (DUV light) such as KrF excimer laser light (wavelength 248 nm), a r F excimer laser light (wavelength 1 9 3 nm) and F 2 laser beam (wavelength: 1 5 7 nm) vacuum ultraviolet light (VUV light) is used.
  • DUV light far ultraviolet light
  • the main body column 14 is composed of a rectangular base plate BP serving as a reference for the device placed horizontally on the floor FD, and the vibration isolation units 16 A arranged near the apex of the triangle on the upper surface of the base plate BP. 16 C (however, the vibration isolating unit 16 C on the far side of the drawing is not shown in FIG. 1) and the lens barrel supported substantially horizontally via these vibration isolating units 16 A to 16 C.
  • Each of the vibration isolation units 16A to 16C includes an actuator section 28 arranged in series above the base plate BP and an air mount 30 whose internal pressure is adjustable.
  • Each of the actuator units 28 of the anti-vibration units 16A to 16C includes at least one voice coil motor.
  • at least three voice coil motors for driving in the vertical direction (ie, the Z direction in FIG. 1) and the X direction Voice Cally At least three voice coil motors for Y-direction drive and at least three voice coil motors for X-direction drive and one direction coil drive are included.
  • the lens barrel base 18 has a vibration sensor (for example, a semiconductor acceleration sensor) that detects the vibration in the axial direction of the main body column 14 including the lens barrel base 18. ), And at least three vibration sensors (for example, accelerometers such as semiconductor accelerometers) that detect vibrations in the X and ⁇ directions. (Includes one sensor for directional vibration detection.)
  • the outputs of at least six of these vibration sensors (hereinafter referred to as “vibration sensor group 32”) are supplied to a main controller 50 (see FIG. 7), which will be described later, and the main controller 50 controls the main body column 1 Movement in the direction of 4 6 degrees of freedom is required, and the vibration isolation units 16 A to 16 C are controlled. That is, in the present embodiment, an active vibration isolation system for controlling the vibration of the main body column 14 is configured by the vibration sensor group, the vibration isolation units 16 # to 16 C, and the main controller 50. I have.
  • the second chamber 26 is a frame having a substantially trapezoidal shape in a side view, an overall shape of a polyhedron having an octagonal bottom surface and a top surface, a trapezoidal opening formed on each side surface, and a completely open bottom surface.
  • the upper surface of the second illuminator 26 is a support plate for supporting the reticle stage base 25.
  • the support plate is formed with a rectangular opening (not shown) forming a passage for the illumination light IL.
  • a reticle stage base 25 is placed on the upper surface of the region including the opening.
  • the reticle stage base 25 also has a predetermined opening facing the opening.
  • Reticle stage R S ⁇ is arranged on reticle stage surface plate 25 described above.
  • the reticle stage RS ⁇ ⁇ can linearly drive the reticle R on the reticle stage surface plate 25 with a large stroke in the ⁇ axis direction, and can minutely drive in the X axis direction and the ⁇ ⁇ direction (rotation direction around the ⁇ axis). Configuration.
  • the reticle stage RS ⁇ includes a reticle coarse movement stage 11 that moves along a ⁇ guide (not shown) provided on the reticle stage surface plate 25 along the ⁇ axis direction, and a reticle coarse movement stage 11 1 Above are a pair of X voice coil motors 36 6, 36 ⁇ (not shown in FIG. 1; see FIG. 7) and a pair of ⁇ ⁇ ⁇ voice coil motors 36 C, 36 D (Fig. 1, not shown, but see FIG. 7), and a reticle fine movement stage 12 that is finely driven in the X, Y, and 0 ° directions.
  • Reticle R is fixed to reticle fine movement stage 12 by, for example, vacuum suction.
  • the reticle coarse movement stage 11 is supported by an air bearing (not shown) in a non-contact manner with respect to ⁇ guide, and ⁇ linear motors 34 ⁇ and 34 ⁇ (not shown in FIG. 1, see FIG. 7) ), It is configured to be driven with a predetermined stroke in the ⁇ -axis direction.
  • the driving system of the reticle stage 13 is driven by the ⁇ linear motors 34 ⁇ , 34 ⁇ , the X voice coil motors 36 ⁇ , 36 ⁇ and the ⁇ voice coil motors 36 C, 36 D. 3 7 (see Figure 7).
  • Each of the ⁇ linear motors 34 A and 34 B is a reticle provided on the reticle stage base 25, which is supported by a plurality of air bearings and is extended in the Y-axis direction.
  • Coarse stage 11 Consists of a mover fixed to 1. Therefore, in the present embodiment, when the reticle stage RST moves in the scanning direction (Y-axis direction), the mover and the stator of the pair of Y linear motors 34A and 34B are relatively in opposite directions. Go to That is, reticle stage R ST and the stator relatively move in opposite directions.
  • the reticle stage RST and the stator relatively move in opposite directions, and the center of gravity of the entire system including the reticle stage RST, the reticle stage base plate 25, and the like is maintained at a predetermined position. Uneven load due to movement of the center of gravity is prevented. Such details are described in, for example, JP-A-8-63231.
  • a moving mirror 40 that reflects the length measurement beam from the reticle laser interferometer system 38 which is a position measuring device for measuring the position and amount of movement, is attached to a part of the reticle fine movement stage 12.
  • Reticle laser interferometer system 38 It is fixed to the upper surface of the cylinder platen 18.
  • the fixed mirror 42 corresponding to the reticle laser interferometer system 38 is provided on the side surface of the lens barrel of the projection optical system PL.
  • the position of the reticle stage RST (specifically, the reticle fine movement stage 12) in the X, ⁇ , and ⁇ directions is measured by the retinal laser interferometer system 38 with reference to the projection optical system PL.
  • the position information (or speed information) of the reticle stage RST (ie, reticle R) measured by the reticle laser interferometer system 38 described above is transmitted to the stage controller 44 (not shown in FIG. 1; see FIG. 7) and Through this, it is supplied to the main controller 50 (see FIG. 7).
  • the stage controller 44 basically has the same position information (or speed information) output from the reticle laser interferometer system 38 as the command values (target position, target speed) from the main controller 50.
  • the above-mentioned ⁇ linear motor 34 4, 34 4 and voice control motor 36 6 to 36 ⁇ D are controlled.
  • a circular opening is formed at the center of the lens barrel base plate 18, and a first invar 24 made of a cylindrical member having a flange provided at an upper end is inserted into the circular opening.
  • the projection optical system PL is inserted into the inside of 4 from above with its optical axis direction set to the ⁇ axis direction.
  • the material of the first invar 24 is a low thermal expansion material, for example, Invar (a low-expansion alloy made of 36% nickel, 0.25% manganese, and iron containing trace amounts of carbon and other elements). Is used.
  • a flange FLG made of a material or the like integrated with the lens barrel is provided on the outer periphery of the lens barrel of the projection optical system PL.
  • This flange FLG constitutes a so-called kinematic support mount that supports the projection optical system PL at three points with respect to the first invar 24 via points, surfaces, and V-grooves. Adopting such a kinematic support structure makes it easy to assemble the projection optical system PL to the first invar 24, and furthermore, the vibration, temperature change, and posture of the first invar 24 and the projection optical system PL after assembly. There is an advantage that stress caused by a change or the like can be reduced most effectively.
  • the projection optical system PL here, both the object plane (reticle R) side and the image plane (Jeha W) side are telecentric and have a circular projection field, and quartz and fluorite are used as optical glass materials.
  • a refracting optical system consisting of only a refracting optical element (lens element) with a projection magnification of 1 Z 4 (or 1/5) is used. Therefore, illumination light IL is applied to reticle R. Illuminates the projection optical system PL from the portion of the circuit pattern area on the reticle R that is illuminated by the illumination light IL, and a partial inverted image of the circuit pattern is projected onto the projection optical system PL. In the center of the circular field of view on the image plane side, an image is formed in a slit shape limited. As a result, the projected partial inverted image of the circuit pattern is reduced and transferred to the resist layer on the surface of one of the plurality of shot areas on the wafer W arranged on the imaging plane of the projection optical system PL. You.
  • the wafer stage WST holds the wafer W and moves in the XY two-dimensional direction.
  • the wafer stage WST is shown in a simplified form in FIG. 1, but in fact, as shown in FIG. 2, a wafer stage base (base) having a moving surface 22 a is provided. 2 2, moving stage (stage body) 1 A, 1 B (collectively referred to as moving stage 1 as appropriate), Y motor (first driving device) that drives moving stages 1 A, 1 B in the Y direction, respectively 6 1 A , 61B, and X stage motors 62A and 62B that drive the moving stages 1A and 1B in the X direction, respectively.
  • the wafer (substrate) W2 can be exchanged and aligned on the moving stage 1B side during the traveling exposure to (substrate) W1.
  • the wafer stage base 22 is supported substantially horizontally above the base plate BP via a vibration isolating unit (second driving device) 29.
  • the screw-proof unit 29 like the above-mentioned vibration-proof unit 16A to 16C, constitutes an active vibration-damping system including an actuator and an air mount whose internal pressure can be adjusted. As shown in the figure, they are located at the three power points forming the vertices of the triangle (note that the anti-vibration unit on the far side of the paper is not shown in Fig. 1).
  • the wafer stage base 22 has at least three vibration sensors (for example, accelerometers such as semiconductor acceleration sensors) for detecting vibration of the base 22 in the Z-axis direction, and the X direction.
  • At least three vibration sensors (for example, accelerometers such as semiconductor acceleration sensors) that detect vibration in the Y direction (including one sensor for X direction vibration detection and one sensor for Y direction vibration detection) ) Installed. Outputs of at least six of these vibration sensors (hereinafter, referred to as “vibration sensor group 33”) are supplied to a main controller 50 (see FIG. 7), which will be described later, and the main controller 50 controls the wafer stage base. 2 2 of 6 degrees of freedom Motion is required, and the vibration isolating unit 29 is driven in the Z direction (first direction) substantially perpendicular to the moving surface 22 a, so that micro vibration transmitted to the wafer stage base 22 via the base plate BP is It is controlled to be insulated at G level. The relative position of wafer stage base 22 to projection optical system PL is detected by position sensor 77 (see FIG. 7) and output to main control system 50.
  • position sensor 77 see FIG. 7
  • the moving stages 1A and IB are supported on the wafer stage base plate 22 via floating bearings (not shown).
  • Specimen tables (holders) 63 A and 63 B are placed on the moving stages 1 A and IB, respectively, and wafers (substrates) that are photosensitive substrates are mounted on these sample tables 63 A and 63 B.
  • Wl and W2 (collectively referred to as wafer W as appropriate) are held by vacuum suction or the like.
  • the sample stage 63 A and 63 B can be finely moved in the X direction, Y direction, and rotation direction around the Z axis with respect to the moving stage 1 A, IB, and Z for leveling and focusing.
  • the configuration allows for directional displacement and tilting around two axes (ie, around the X and Y axes).
  • the X motor 62A drives the moving stage 1A in the X direction, which is the step moving direction, and includes an X stator (not shown) embedded in an X guide bar 2A extending in the X direction.
  • the X guide par is described as an X stator), and an X mover (not shown) provided on the moving stage 1A and driven in the X direction by electromagnetic interaction with the X stator. ing.
  • the X motor 62B drives the moving stage 1B in the X direction, and is embedded in an X guide bar 2B extending in the X direction (collectively referred to as X guide bar 2 as appropriate).
  • X stator (not shown) provided on the moving stage 1B and driven in the X direction by electromagnetic interaction with the X stator. ing.
  • the Y motor 61A drives the moving stage 1A in the Y direction, which is the scanning direction (running direction), and as shown in FIG. 4 through the X guide bar 2A.
  • Y movers (movers) 64 A, 64 A provided at both ends of the moving stage 1 A and open to Y movers 64 A, and Y movers 64 A, 64 A
  • FIG. 2 Shown in As shown in Fig. 1 and Fig. 3, the countermass has the same shape for convenience.
  • the counter mass 65 arranged on the X side (the left side in Fig.
  • the Y motor 61B drives the moving stage 1B in the Y direction, which is the scanning direction (scanning direction), and is provided at both ends of the moving stage 1B via the X guide bar 2B.
  • the Y mover (movable element) 6 4 B, 6 4 B is opened toward the Y mover 6 4 B, and the Y mover 6 4 B, 6 4 B is opened by the electromagnetic interaction. It comprises a mover 64 B, a counter mass 65 having a U-shaped cross section as a stator for driving the mover 64 B in the Y direction.
  • the Y movers 64 A and 64 B are provided for each of the plurality of moving stages 1 A and IB, but the counter mass 65 is in the moving range of the moving stages 1 A and 1 B! : It has a configuration in which it is shared by these Y movers 64 A and 64 B by having a length.
  • the Y motors 61A and 6IB constitute a moving coil type linear motor.
  • the countermass 65 is an air pad having a guide mechanism (support mechanism) in the Y direction on side bases (supporting parts) 7, 7 provided on both sides in the X direction of the wafer stage base 22. Each is levitated and supported movably in the Y direction via 6.
  • the side platen 7 is provided (vibrationally) independently of the wafer stage platen 22 and its own weight is supported by a coil spring 31 as an elastic member installed on the base plate BP. ing.
  • the coil spring 31 is set to have a rigidity enough to support the own weight of the side platen 7 even when the center of gravity of the counter mass 65 moves, as shown in Fig. 3.
  • the side surface plate 7 is supported at three points forming the vertices of the triangle at both ends and the center.
  • the independent surface of the side surface plate 7 and the wafer stage surface plate 22 are releasably connected by a release device 45.
  • the release devices 45 are provided on both end surfaces in the Y direction of the side surface plate 7 and the wafer stage surface plate 22 (only the release device on one Y side is shown in FIGS. 1, 2 and 4).
  • the wafer stage surface plate 2 The stopper arm (first member) 46 made of stainless steel provided in 2 and the shaft member (second member) 47 and 47 protruding from the side surface plate 7 with an interval in the X direction ' It is configured.
  • the stopper arm 46 is fixed to the wafer stage base 22 by fastening means (not shown) such as a bolt, and a fitting groove 4 extending in the X direction is provided at a position facing the shaft members 47. 8 are formed.
  • the fitting groove 48 has a width and a position at which a gap L1 is formed in the Z direction (and partially in the X direction) between the wafer stage WST and the shaft member 47. Is formed.
  • This gap L 1 is given by the following equation, where L 2 (see FIG. 4) is the gap between the Y movers 64 A, 64 B and the stator 65 in the Y motors 61 A, 61 B. Is set so that the following relationship holds.
  • the wafer stage WST holds the above-mentioned utility supply cables, tubes, etc. for supplying various utilities to the moving stages 1A, IB and the X guide bars 2A, 2B.
  • a tube carrier (not shown) that moves synchronously with the movement of 2A and 2B (that is, the movement of the moving stages 1A and IB in the Y direction) is provided.
  • a moving mirror 79X extends in the Y direction at one end of the upper surface of the moving stages 1A and 1B in the X direction, and a moving mirror 79Y extends at one end of the Y direction. It extends in the X direction.
  • These movable mirrors 79X and 79Y are irradiated with length measuring beams from the laser interferometers constituting the wafer laser interferometer system 80 (see FIG. 1) as position detectors. At least one of the laser interferometers corresponding to these measurement beams uses a two-axis interferometer having two measurement axes.
  • Each fixed mirror corresponding to each laser interferometer constituting the wafer laser interferometer system 80 is fixed to the lower end of the lens barrel of the projection optical system PL.
  • Wafer laser interferometer system 80 is disposed on the top surface of lens barrel base 18.
  • movable mirrors 79X and 79 ⁇ are provided as movable mirrors, and correspondingly, fixed mirrors are provided for the X-direction position measurement and for the ⁇ -direction position measurement, respectively.
  • the laser interferometer is also provided with one for X-direction position measurement and one for ⁇ -direction position measurement. In Fig. 1, these are typically the moving mirror 79, fixed mirror 81, and wafer laser interferometer. Shown as system 80.
  • the wafer laser interferometer system 80 measures the position of the wafer stage WS X in the X, ⁇ , ⁇ ⁇ (rotation around ⁇ ) directions with reference to the projection optical system PL. Position information (or speed information) of the wafer stage WST measured by the wafer laser interferometer system 80 is sent to the stage controller 44 and the main controller 50 via the stage controller 44.
  • the stage control device 44 basically controls the position information (or speed information) output from the wafer laser interferometer system 80 so that it matches the command value (target position, target speed) given from the main control device 50.
  • the above Y motors 61A and 61B and the X motors 62A and 62B are controlled.
  • FIG. 7 is a block diagram showing a main configuration of a control system of exposure apparatus 10 according to the present embodiment.
  • This control system mainly includes a main controller 50 as a control system including a microcomputer (or a workstation). As shown in this figure, the measurement results of the vibration sensor groups 32 and 33 and the position sensor 77 are output to the main controller 50.
  • Main controller 50 controls the driving of vibration isolation units 16A to 16C and 29 based on the input measurement results.
  • the stage controller 44 controls the Y linear motors 34A and 34B and the X voice coil motor 36 based on the measurement results of the reticle laser interferometer system 38 and wafer laser interferometer system 80.
  • A, 36B, Y voice coil motor 36C, 36D, Y motor 61A, 61B, X motor 62A, 62B, trim motor 72, voice coil motor 73 are controlled.
  • the moving stage 1A moves in the Y direction together with the sample stage 63A (and the wafer W1).
  • Fixed as a counter mass by the reaction force of this movement The child 65 moves relatively on the side surface plate 7 in the direction opposite to the moving direction of the moving stage 1A.
  • the reaction force of the moving stage 1A during acceleration and deceleration in the Y direction is absorbed by the movement of the counter mass 65, the momentum applied to the base plate BP becomes theoretically zero, and the position of the center of gravity in the wafer stage WST becomes Y Substantially fixed in the direction.
  • the same operation is performed when the moving stage 1B moves in the Y direction by operating the Y motor 61B.
  • the stage controller 44 When moving the moving stages 1 A and IB, the stage controller 44 responds to an instruction from the main controller 50 and moves the moving stages 1 A and 1 B based on the measured values of the laser interferometer system 80 and the like. A counterforce that cancels the influence of the change in the center of gravity due to the movement of the air is given to the anti-vibration hood 29 by feed feed, and the air mount and the actuator unit are driven to generate this force. . In addition, when slight vibrations in the six-degree-of-freedom direction of the wafer stage base 22 remain because the friction between the moving stages 1A and 1B and the wafer stage base 22 is not zero, etc. Based on the measurement values of the sensor group 33 and the position sensor 77, the air mount and the actuator unit are feedback-controlled to eliminate the residual vibration.
  • the side plate 7 is biased by the movement of the counter mass 6 5, but a large change in posture does not occur because it is supported by the rigid coil spring 31.
  • the relative displacement with respect to the surface plate 22 is also very small, not more than the above L1.
  • the side plate 7 is distorted by the movement of the counter mass 65, but the relative displacement between the plate 7 and 22 is very small, and the stopper arm 46 and the shaft member 4 7 Are not in contact with each other, the independent states of the surface plates 7 and 22 are maintained, the distortion energy and the vibration are not transmitted to the wafer stage surface plate 22, and the surface accuracy of the sliding surfaces of the moving stages 1A and IB is maintained. .
  • the anti-vibration unit 29 stops functioning or runs away and the relative displacement between the surface plates 7 and 22 becomes large, specifically, the relative displacement in the Z direction becomes If the size exceeds the gap L1 between the shaft member 4 and the shaft member 47, the Y movers 64A, 64B and the stator 65 in the Y motor 61A, 61B Before the contact, the stopper arm 46 and the shaft member 47 come into contact with each other. This allows
  • the shaft member 47 when the wafer stage base 22 is displaced not only in the Z direction but also in the (rotation about the Y axis) direction, when the shaft member 47 When displaced, the gap between the shaft member and the stopper arm 46 is maintained, but the Y movers 64 A, 64 B and the stator 65 may come into contact with each other.
  • the shaft member 47 is provided in two places in the X direction, so that the stopper arm 46 and the shaft member can be moved even when the wafer stage base 22 is relatively displaced in the ⁇ direction.
  • various exposure conditions for scanning and exposing the shot area on the wafer W with an appropriate exposure amount are set in advance.
  • Preparation work such as reticle alignment and baseline measurement using a reticle microscope (not shown) and an off-axis alignment sensor (not shown) is performed, and thereafter, a wafer W finer using the alignment sensor is prepared.
  • the alignment eg, enhanced global alignment
  • the arrangement coordinates of a plurality of shot areas on the wafer W are obtained.
  • the stage controller 44 measures the wafer laser interferometer system 80 based on the alignment result in accordance with the instruction from the main controller 50. While monitoring the values, control the Y motors 61A and 61B and the X motors 62A and 62B to move the moving stage 1 to the scanning start position for the exposure of the first shot of the wafer W. .
  • the stage controller 44 starts running in the Y direction between the reticle stage RST and the wafer stage WST via the reticle driver 37 and the wafer driver 39 in response to an instruction from the main controller 50.
  • both stages RST and WST reach their respective target scanning speeds, the pattern area of reticle R is illuminated by illumination light IL.
  • running exposure is started.
  • the moving speed of the reticle stage RST in the Y-axis direction and the moving speed of the wafer stage WST in the Y-axis direction, particularly during the above-mentioned scanning exposure, are determined by the projection magnification of the projection optical system PL (1 Z 5 times).
  • the reticle stage RST and the wafer stage WST (moving stage 1) are synchronously controlled so as to maintain the speed ratio according to (or 1/4 times).
  • the different areas of the pattern area of the reticle R are sequentially illuminated with the illumination light IL, and the illumination of the entire pattern area is completed, whereby the scanning exposure of the first shot on the wafer W ends.
  • the pattern of the reticle R is reduced and transferred to the first shot via the projection optical system PL.
  • the stage controller 44 moves the moving stage 1 in the X and Y axis directions via the wafer drive unit 39 in accordance with the instruction of the main controller 50. It is moved step by step and moved to the running start position for the exposure of the second shot. At the time of this stepping, the stage controller 44 measures the position displacement of the moving stage 1 in the X, ⁇ , and ⁇ directions in real time based on the measurement value of the wafer laser interferometer system 80. Based on the measurement result, the stage control device 44 controls the position of the moving stage 1 by controlling the wafer driving unit 39 so that the positional displacement becomes a predetermined state.
  • the stage controller 44 Based on the instruction of the main controller 50, the stage controller 44 performs the same running exposure on the second shot as described above. In this way, the scanning exposure of the shot on the wafer W and the stepping operation for the next shot exposure are repeatedly performed, and the pattern of the reticle R is sequentially transferred to all the exposure target shots on the wafer W. That is, the exposure of the step-and-scan method is performed as described above. Subsequently, the parallel processing by the two moving stages 1 # and 1 # will be described. In the present embodiment, for example, while exposing wafer W 1 on moving stage 1 1 (that is, sample stage 63 A) through projection optical system PL, wafer changing is performed on moving stage 1 B. After the wafer exchange, an alignment operation and autofocus / autoleveling are performed.
  • the wafer stage that has been completed first enters the waiting state, and moves when both operations are completed. Stages 1A and IB are controlled for movement.
  • the exposure sequence is performed under the projection optical system PL.
  • the independent state of the side surface plate 7 with respect to the wafer stage surface 22 is released in accordance with the relative displacement between the wafer stage surface 22 and the side surface plate 7, It is possible to avoid a situation in which the Y movers 64 A, 64 B and the stator 65 come into contact with each other and are damaged. Therefore, there is no need to increase the gap between the Y movers 64 A and 64 B and the stator 65 and to shorten the drive stroke of the vibration isolating unit 29, which reduces the thrust of the motor and reduces the vibration isolation performance. It is possible to prevent the drop.
  • the self-weight of the side platen 7 is supported by the coil springs 31, so that the actuators support the self-weight of the side platen 7, as in the case where the self-weight of the side platen 7 is supported.
  • the generation of heat can be prevented.
  • the coil springs 31 are arranged at three points forming the vertices of the triangle, it is also possible to stably support the side surface plate 7 in a planar manner.
  • FIGS. 8 to 11 are views showing a second embodiment of the stage apparatus and the exposure apparatus of the present invention.
  • the same elements as those of the first embodiment shown in FIGS. 1 to 7 are denoted by the same reference numerals, and description thereof will be omitted.
  • the difference between the second embodiment and the first embodiment is that the side platen 7 is driven in the Z direction. That is, we have established an actuator.
  • an actuator (third drive device) 49 such as a voice coil motor is provided between the side surface plate 7 and the base plate BP.
  • the actuator 49 is adjacent to the coil spring 31 in the X direction so as to be paired with the coil spring 31, and, like the coil spring 31, has a vertex of a triangle.
  • the main control unit (control unit) 50 drives the side surface plate 7 in the Z direction (see Fig. 10).
  • the actuator 49 is connected to and connected to the side surface plate 7 so as to be movable when its driving is stopped.
  • the coil spring 31 is set to a relatively low panel constant that can simply support the weight of the side platen 7 without considering the rigidity against the movement of the center of gravity accompanying the movement of the counter mass 65.
  • a position sensor 78 (not shown in FIG. 8, see FIG. 10) for detecting the position of the side platen 7 in the Z direction is provided, and the detection result is determined by the main controller. 50 is output.
  • Main controller 50 controls the driving of actuator 49 based on the detection results of position sensors 77, 78.
  • the main controller 50 controls the actuator 49 so that the side plate 7 follows the position of the wafer stage base 22. Drive. Therefore, it is not necessary to constantly drive the actuator 49, and it is possible to suppress heat generation due to the driving.
  • the actuator unit 49 is activated according to (the difference between) the detection results of the position sensors 77, 78.
  • the actuator 49 By driving and causing the side surface plate 7 to follow the position of the wafer stage surface plate 22, contact between the Y movers 64 A and 64 B and the stator 65 can be avoided.
  • the control device 50 turns off the power of the actuator 49 to stop its driving, and supports the side platen 7 only with the coil spring 31.
  • the side surface plate 7 is restrained by the release device 45 (that is, the stopper arm 46 and the shaft member 47) so that the side surface plate 7 does not separate more than a predetermined distance (L2—L1).
  • a predetermined distance L2—L1
  • Contact between the stators 64A and 64B and the stator 65 can be avoided. The above operation is the same when both the vibration isolation unit 29 and the actuator 49 fall into a function stop state or a runaway state.
  • the spring constant of the coil spring 31 is set to be relatively large so as to withstand the movement of the center of gravity of the force center 65, so that the release device 45 resists the urging force of the coil spring 31.
  • the actuator 49 compensates for the movement of the center of gravity of the cowl terminus 65, so that the coil spring 31 Since the spring constant of the wafer stage can be kept low, the force for distorting the wafer stage base 22 when the independent state is released can be significantly reduced.
  • the paired coil spring 31 and the actuator 49 are arranged adjacent to each other.
  • the actuator 49 it is necessary to arrange the actuator 49 on the same axis for controlling the driving of the actuator 49.
  • an AC servomotor 52 for Z-direction driving and a ball screw mechanism 53 are provided as a third driving device in a bellows tube 51 as an elastic member.
  • a configuration can be adopted. In this case, it is preferable to set a large screw lead so that the side surface plate 7 can move in the Z direction when the driving is stopped.
  • a gear structure can be used instead of the ball screw mechanism.
  • the actuator 49 is driven based on the difference between the measurement results of the position sensors 77, 78.
  • the Y movers 64A, 64B and the stator 6 are driven. It is also possible to provide a sensor for measuring the gap amount between the actuator and the actuator 5 and drive the actuator 49 based on the measurement result of this sensor.
  • the stopper arm 46 is connected to the wafer stage base 22
  • the shaft member 47 is provided on the side surface plate 7 .On the contrary, the stopper arm 46 is provided on the side surface plate 7, and the shaft member 47 is provided on the wafer stage surface 22.
  • a configuration may be provided. Also in this case, it is desirable that the shaft member 47 be provided at two places (plurality) along the X direction.
  • the number of the vibration isolating units 29 and the coil springs 31 is not limited to three places, but may be four or more places if they are not arranged on a straight line.
  • not only a coil spring but also an air spring / air cylinder can be used as the elastic member supporting the weight of the side surface plate 7.
  • a voice coil motor / linear motor can be used as the actuator 49.
  • the stage apparatus of the present invention is applied to the wafer stage WST of the exposure apparatus 10.
  • the present invention is not limited to this, and can be applied to the reticle stage RST.
  • the side platen for the reticle stage may be provided separately from the side platen for the wafer stage, or may be integrally supported by the same column or the like.
  • the stage apparatus of the present invention is applied to the wafer stage of the exposure apparatus.
  • precision measurement such as a transfer mask drawing apparatus, a mask pattern position coordinate measuring apparatus, etc. It is also applicable to equipment.
  • Examples of the substrate of the present embodiment include not only semiconductor wafers W, Wl, and W2 for semiconductor devices, but also glass substrates for liquid crystal display devices, ceramic wafers for thin-film magnetic heads, or masks used in exposure apparatuses. Alternatively, a reticle master (synthetic quartz, silicon wafer) or the like is applied.
  • the exposure apparatus 10 is a step-and-scan type scanning exposure apparatus (scanning stepper; US Pat. No. 5,473,410) in which a reticle R and a wafer W are synchronously moved to scan and expose a reticle scale pattern.
  • the present invention can be applied to a step-and-repeat type projection exposure apparatus (stepper) that exposes the pattern of the reticle R while the reticle R and the wafer W are stationary and sequentially moves the wafer W. it can.
  • the present invention partially separates at least two patterns on the wafer W. It can also be applied to a step-and-stitch type exposure apparatus that transfers images in a superimposed manner. ⁇
  • the type of the exposure apparatus 10 is not limited to an exposure apparatus for manufacturing a semiconductor element for exposing a semiconductor element pattern onto a wafer W, but may be an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, and an imaging apparatus.
  • the present invention can be widely applied to an exposure apparatus for manufacturing a device (CCD) or a reticle or a mask.
  • emission lines g-line (436 nm), h-line (404.nm), i-line (365 nm)
  • KrF excimer laser 248 nm
  • electrostatic particle beams such as an electron beam or an ion beam.
  • the electron gun in the case of using an electron beam, thermionic emission type Kisaborai bets to lanthanum (L a B 6), can be used tantalum (T a).
  • harmonics such as a YAG laser or a semiconductor laser may be used.
  • a single-wavelength laser in the infrared or visible range emitted from a DFB semiconductor laser or fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and yttrium (Yb)) and nonlinearly amplified.
  • a harmonic converted to ultraviolet light using an optical crystal may be used as exposure light.
  • the oscillation wavelength of the single-wavelength laser is in the range of 1.544 to 1.553 m, the 8th harmonic in the range of 193 to 194 nm, that is, almost the same wavelength as the ArF excimer laser If the oscillation wavelength is within the range of 1.57-1.58 ⁇ , the 10th harmonic within the range of 157-158 nm, that is, almost the same wavelength as the F 2 laser Is obtained.
  • a soft X-ray region having a wavelength of about 5 to 50 nm generated from a laser plasma light source or SOR, for example, EUV (Extreme Ultra Violet) light having a wavelength of 13.411111 or 11.511111 is used as exposure light.
  • EUV exposure apparatus uses a reflection type reticle, and the projection optical system is a reduction system including only a plurality of (for example, about 3 to 6) reflection optical elements (one mirror).
  • the magnification of the projection optical system PL is not limited to the reduction system, but can be any Good. Further, as the projection optical system PL, when far ultraviolet rays such as an excimer laser are used, a material which transmits far ultraviolet rays such as quartz or fluorite is used as a glass material, and when a F 2 laser or X-ray is used, a catadioptric system is used. An optical system of a refraction system (a reticle R of a reflection type is also used), and when an electron beam is used, an electron optical system including an electron lens and a deflector may be used as the optical system. It goes without saying that the optical path through which the electron beam passes is in a vacuum state.
  • each stage WST, RST may be a type that moves along a guide, or may be a guideless type without a guide.
  • the Y motors 61A and 6IB and the X motors 62A and 62B either may be provided with or without a guide.
  • each stage WST, RST is a magnet unit (permanent magnet) with a two-dimensionally arranged magnet and an armature unit with a two-dimensionally arranged coil, and each stage WST, RS ⁇ ⁇ ⁇ May be used.
  • one of the magnet unit and the armature cut is connected to the stage WST, RST, and the other of the magnet unit and the armature unit is provided on the moving surface side (base) of the stage WST, RST. I just need.
  • the exposure apparatus 10 performs various types of subsystems including each component listed in the claims of the present application with predetermined mechanical accuracy, electrical accuracy, and optical accuracy.
  • the air system is adjusted to achieve electrical accuracy.
  • the process of assembling the exposure apparatus from various subsystems includes mechanical connections, wiring connections of electric circuits, and piping connections of pneumatic circuits among the various subsystems. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus. The assembly process of the various subsystems into the exposure equipment has been completed. Therefore, comprehensive adjustment is performed, and various precisions of the entire exposure apparatus are secured. It is desirable to manufacture the exposure equipment in a clean room where the temperature and cleanliness are controlled.
  • a micro device such as a semiconductor device has a step 201 for designing the function and performance of the micro device, a step 202 for fabricating a mask (reticle) based on this design step, and Manufacturing wafer from silicon material Step 203, exposure processing step 204 for exposing the reticle pattern to the wafer using the exposure apparatus of the above-described embodiment, device assembling step (Dicing process, bonding process, package process It is manufactured through 205 and the inspection step 206.
  • the supporting portion for supporting the stator is provided independently of the base, even if the stator moves due to the reaction force accompanying the movement of the stage main body, it is caused by the movement of the stator. Strain energy ⁇ vibration can be prevented from being transmitted to the base.
  • the independent state of the base and the support is released, and the base and the support are subordinate to each other. It is possible to prevent the gap between the movable element and the movable element from becoming smaller than a predetermined value, thereby preventing damage due to contact.
  • the gap between the stator and the mover is made unnecessarily large to reduce the thrust of the first drive unit, and the stroke of the second drive unit for driving the base in the first direction is reduced and prevented.
  • the reaction force due to the movement of the stage body can be processed without lowering the vibration performance.

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Abstract

Un dispositif de platine comprend un corps principal de platine (1A) porté mobile par une base (22) présentant une surface de mouvement, et une première unité d'entraînement (61A) présentant un élément fixe (65) ainsi qu'un élément mobile (64A) disposés dans le corps principal de platine (1A) pour entraîner ledit corps principal de platine (1A). L'élément fixe (65) est disposé dans une partie de support (7), laquelle est indépendante de la base (22). Un dispositif d'annulation (45) annule l'état indépendant de la partie de support (7) de la base (22) en réponse à un déplacement relatif entre la base (22) et la partie de support (7) dans un premier sens sensiblement orthogonal à la surface de mouvement.
PCT/JP2003/000267 2002-01-21 2003-01-15 Dispositif de platine et dispositif d'exposition WO2003063212A1 (fr)

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Cited By (14)

* Cited by examiner, † Cited by third party
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WO2005098911A1 (fr) 2004-04-09 2005-10-20 Nikon Corporation Méthode d’entraînement pour corps mobile, dispositif d’étage et dispositif d’exposition
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI384340B (zh) * 2008-04-15 2013-02-01 Ind Tech Res Inst 加工機台
CN105824200B (zh) * 2016-05-31 2017-08-29 京东方科技集团股份有限公司 一种基板支撑结构及曝光机
NL2021219A (en) * 2017-08-08 2019-02-18 Asml Netherlands Bv Vibration isolation system and lithographic apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001023896A (ja) * 1999-07-13 2001-01-26 Nikon Corp ステージ装置及び露光装置
US20010027595A1 (en) * 2000-04-11 2001-10-11 Nikon Corporation Stage device, exposure apparatus incorporating the stage device, and method of using the same
JP2001345256A (ja) * 2000-06-01 2001-12-14 Nikon Corp ステージ装置および露光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001023896A (ja) * 1999-07-13 2001-01-26 Nikon Corp ステージ装置及び露光装置
US20010027595A1 (en) * 2000-04-11 2001-10-11 Nikon Corporation Stage device, exposure apparatus incorporating the stage device, and method of using the same
JP2001345256A (ja) * 2000-06-01 2001-12-14 Nikon Corp ステージ装置および露光装置

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US9146474B2 (en) 2003-04-09 2015-09-29 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger and different linear polarization states in an on-axis area and a plurality of off-axis areas
US8675177B2 (en) 2003-04-09 2014-03-18 Nikon Corporation Exposure method and apparatus, and method for fabricating device with light amount distribution having light larger in first and second pairs of areas
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US9140990B2 (en) 2004-02-06 2015-09-22 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US20130271945A1 (en) 2004-02-06 2013-10-17 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
US10241417B2 (en) 2004-02-06 2019-03-26 Nikon Corporation Polarization-modulating element, illumination optical apparatus, exposure apparatus, and exposure method
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US7852034B2 (en) 2004-04-09 2010-12-14 Nikon Corporation Drive method of moving body, stage unit, and exposure apparatus
JP2006086442A (ja) * 2004-09-17 2006-03-30 Nikon Corp ステージ装置及び露光装置
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