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WO2002036703A1 - Film adhesif thermofusible comprenant partiellement une resine eva - Google Patents

Film adhesif thermofusible comprenant partiellement une resine eva Download PDF

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Publication number
WO2002036703A1
WO2002036703A1 PCT/KR2001/001834 KR0101834W WO0236703A1 WO 2002036703 A1 WO2002036703 A1 WO 2002036703A1 KR 0101834 W KR0101834 W KR 0101834W WO 0236703 A1 WO0236703 A1 WO 0236703A1
Authority
WO
WIPO (PCT)
Prior art keywords
hot melt
melt adhesive
adhesive film
films
film
Prior art date
Application number
PCT/KR2001/001834
Other languages
English (en)
Inventor
Jun-Hee Beyun
Jung-Suk Song
Original Assignee
Evex Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Evex Co., Ltd. filed Critical Evex Co., Ltd.
Publication of WO2002036703A1 publication Critical patent/WO2002036703A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/04—Homopolymers or copolymers of ethene
    • C09J123/08—Copolymers of ethene
    • C09J123/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C09J123/0853—Vinylacetate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2423/00—Presence of polyolefin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2431/00—Presence of polyvinyl acetate

Definitions

  • the present invention relates, in general, to EVA resin-based hot melt adhesive films in particular, to hot melt adhesive films formed by mixing the melted EVA resin with melted aliphatic and aromatic hydrocarbon resins for endowing hot melt adhesive films with an adhesion force, on the surface of which an wax emulsion is deposited.
  • Hot melt adhesive films are maintained in a solid form having a low adhesion force, and so it is easy to roll the adhesive film and store the adhesive film without a further release of the substance, but when required for use, the adhesion force of hot melt adhesive films is increased by melting the film by application of heat thereto.
  • hot melt adhesives have advantages in stability, working condition, and economy of energy use over conventional solvent-type adhesives, thereby rapidly expanding their applications.
  • base resins hot melt adhesives are classified into five categories: polyethylene, polyamide, polyester, acryl, and reactive-type.
  • Polyethylene-based adhesives are usually exemplified by PE, EVE, and EEA, of which EVE is predominantly used.
  • polyamide-based adhesives show strong adhesive forces and excellent heat resistance.
  • polyester-based adhesives can be applied to various adherends, including automotive parts, electric parts, and food packing materials.
  • Acryl-based adhesives exhibit various physical properties, and ethylene/acrylic acid ethylene copolymers are found in the bonding of adherends such as nylon, polypropylene, etc.
  • hot melt adhesives may be classified into a solution-type, and a block and chip-type according to their forms.
  • a solution-type hot melt adhesive which is produced by dissolving a hot melt composition in an organic solvent, easily forms into liquid-type adhesives and is convenient for working.
  • the liquid-type adhesive is limitedly used because of its high price and the toxicity of the organic solvent.
  • Block and chip-type hot melt adhesives produced by molding hot melt compositions to blocks or small chips, must be melted before application for the bonding of two adherends.
  • a block and chip-type hot melt adhesive is melted by heating in a melter, and the melted hot melt adhesive is coated on at least one side of an adherend, against which another adherend is pressed by use of a press to give a laminate structure. Therefore, block and chip-type hot melt adhesives suffer from the disadvantage of requiring complicated apparatuses such as a melter, consuming a large quantity of energy for preheating the melter, and being not uniform in coating thickness throughout the surface of the adherend.
  • hot melt adhesives in the shape of films.
  • hot melt adhesive compositions comprising EVA resin, which itself is somewhat adhesive, plus hydrocarbon resin for improving adhesion force, are difficult to mold into films.
  • the films even if molded, are difficult to store.
  • conventional hot melt adhesive films should be provided with release paper or films lest the hot melt adhesive films stick to themselves when rolled for storage.
  • release paper or films requires complicated winders, which increases the price, and leaves the disposal problem of the release paper or films .
  • hot melt adhesive films which, in solid form, have an adhesion force sufficiently low for storage and, in molten form, have an adhesion force sufficiently large to bond adherends .
  • an EVA resin-based hot melt adhesive film comprising 60 to 85 wt% of EVA resin containing 20 to 46 wt% of vinyl acetate, and 15 to 40 wt% of C5 to C9 hydrocarbon resin with a softening temperature of 80 to 130 ° C, on the surface of which a wax emulsion is deposited.
  • Fig. 1 schematically illustrates an apparatus for adhering adherends to each other with the use • of hot melt adhesive films of the present invention.
  • the hot melt adhesive film which can be stored in a roll form without any release paper or films, is formed by molding a mixture of an EVA resin and a hydrocarbon resin into a film and spray-coating a high wax emulsion onto the film.
  • Hot melt adhesive films of the present invention comprise 60 to 85 wt% of the EVA resin as a base polymer and correspondingly 15 to 40 wt% of an aliphatic and aromatic hydrocarbon resin for increasing the adhesion force.
  • the EVA resin contains 20 to 46 wt% of vinyl acetate, and the hydrocarbon resin ranges, in softening temperature, from 80 to 130 ° C.
  • the hydrocarbon resin content is less than 15 wt%, it is easy to form the EVA-hydrocarbon resin mixture into a film, but sufficient adhesion force cannot be obtained in the hot melt adhesive film.
  • the content is more than 40 wt%, the adhesion force is greatly increased, but it is difficult to form the resulting EVA-hydrocarbon resin mixture to a film.
  • the film even if molded, is difficult to store in a roll form because the wound film adheres to itself owing to the increased adhesion force.
  • the EVA resin contains vinyl acetate in an amount of less than 20 wt%, the resulting EVA-hydrocarbon mixture can be easily formed films, but not into ones having sufficient adhesive force.
  • the vinyl acetate content is more than 46 wt%, the adhesion force is sufficiently increased, but not 'only is the film-forming difficult, but also the production cost of the hot melt adhesive film increases.
  • the hydrocarbon resins are used for increasing the adhesion force of the adhesive film, and may be further hydrogenated in order to remove its intrinsic yellow color of the resins and to prevent the resins from yellowing.
  • the adhesive film of the present invention is formed by molding a mixture of an EVA resin and a C5 to C9 hydrocarbon resin into a film and spraying a high wax emulsion onto the film. Serving as a releasing agent, the high wax temporarily reduces the adhesion force of the hot melt adhesive film, so that it is possible to form, wind and store the hot melt adhesive film without additional release substances.
  • Hot melt adhesive films of the invention preferably range from 20 to 100 ⁇ m in thickness. ForDDm in thickness, thickness is less than 20 ⁇ m, it is difficult to forODm, i store the adhesive film, and the amount of the adhesive film is too small to display a sufficient adhesion force. On the other hand, when the thickness is more than 100 ⁇ m, it is easy to form the adhesive film, but the hot melt adhesive film becomes expensive and is unpleasant to the touch, on final products to be applied therewith.
  • a hot melt adhesive film F is unwound from a reel 11 and fed between adherend films M and M' , which are unwound at the same rate as the hot melt adhesive film F from reels 12 and 13, respectively, to form a multilayer film structure in which the adherends M and M' are stuck to either side of the hot melt adhesive film F.
  • the unwound hot melt adhesive film and adherend films are allowed to pass through a hot pressure roll 14 heated at a proper temperature to melt the hot melt adhesive film, thereby bonding the adherend films to each other via the hot melt adhesive film. Cooling is conducted before the integrated film is wound round a take-in roller.
  • a triple film structure can be obtained by allowing the bi-ply film structure to pass through the hot pressure roll, along with a hot melt adhesive film and an adherend film.
  • three adherend films and two adhesive films may be allowed to pass through the hot pressure roll at the same time in the above procedure.
  • VA contained in EVA based on 100 parts by weight of EVA. based on 100 parts by weight of EVA + H. C. resin 3 60 wt% of EVA with a VA content of 41 wt% mixed with 20 wt% of EVA with a VA content of 28 wt% . coated with a wax emulsion
  • the hot melt adhesive film could not be produced because the hydrocarbon resin for increasing the adhesion force of hot melt adhesive films was added in an amount exceeding the upper limit of the preferable range to cause an excessive increase in the adhesion force of the hot melt adhesive film.
  • hot melt adhesive films are advantageous in that equipment for production is simple, productivity and working condition are improved because the wax emulsion layer formed on a surface of hot melt adhesive films acts as a release substance between films, so that it is possible to form, store and use the hot melt adhesive films without a further release substances.
  • the adhesive film of the present invention has a superior adhesion force to

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne un film adhésif thermofusible, sur la surface duquel une émulsion de cire est déposée, présentant une épaisseur comprise de 20 à 100 νm et comprenant de 60 à 85 % en poids de résine EVA contenant de 20 à 46 % en poids d'acétate de vinyle, et comprenant de 15 à 40 % en poids de résines hydrocarbonées présentant une température de ramollissement de 80 à 130 °C. Ledit film adhésif thermofusible présente les avantages suivants ; l'équipement requis pour sa production est simple ; la productivité et l'environnement de travail sont améliorés parce que la couche d'émulsion de cire formée sur la surface dudit film adhésif thermofusible agit comme agent de libération entre les films, de façon qu'il soit possible de former, de stocker et d'utiliser ledit film adhésif thermofusible sans faire appel à un agent de libération supplémentaire.
PCT/KR2001/001834 2000-10-30 2001-10-30 Film adhesif thermofusible comprenant partiellement une resine eva WO2002036703A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR2000/0064038 2000-10-30
KR10-2000-0064038A KR100408222B1 (ko) 2000-10-30 2000-10-30 이브이에이 수지를 이용한 핫멜트 접착필름

Publications (1)

Publication Number Publication Date
WO2002036703A1 true WO2002036703A1 (fr) 2002-05-10

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2001/001834 WO2002036703A1 (fr) 2000-10-30 2001-10-30 Film adhesif thermofusible comprenant partiellement une resine eva

Country Status (2)

Country Link
KR (1) KR100408222B1 (fr)
WO (1) WO2002036703A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003039860A1 (fr) * 2001-10-22 2003-05-15 Exxonmobil Chemical Patents Inc. Films protecteurs
US7323239B2 (en) 2001-10-22 2008-01-29 Exxonmobil Chemical Patents Inc. Protective films
US7495048B2 (en) 2002-10-09 2009-02-24 Exxonmobil Chemical Patents Inc. Heat sealable compositions and uses thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100865692B1 (ko) 2007-11-23 2008-10-28 서광티피유 주식회사 핫멜트 필름 및 그 제조방법
KR101146147B1 (ko) * 2010-02-26 2012-05-16 (주)이네이쳐 친환경 동색 알루미늄 테이프

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57158276A (en) * 1981-03-26 1982-09-30 Sekisui Chem Co Ltd Hot-melt adhesive composition
JPH05320021A (ja) * 1992-05-22 1993-12-03 G C:Kk 歯科用ワックス組成物
JPH07247468A (ja) * 1994-03-09 1995-09-26 Daicel Chem Ind Ltd ホットメルト接着剤組成物
US6106939A (en) * 1996-03-06 2000-08-22 Hercules Incorporated Aliphatic petroleum-based resins having controlled softening points and molecular weights and hot melt pressure sensitive adhesive containing same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57158276A (en) * 1981-03-26 1982-09-30 Sekisui Chem Co Ltd Hot-melt adhesive composition
JPH05320021A (ja) * 1992-05-22 1993-12-03 G C:Kk 歯科用ワックス組成物
JPH07247468A (ja) * 1994-03-09 1995-09-26 Daicel Chem Ind Ltd ホットメルト接着剤組成物
US6106939A (en) * 1996-03-06 2000-08-22 Hercules Incorporated Aliphatic petroleum-based resins having controlled softening points and molecular weights and hot melt pressure sensitive adhesive containing same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003039860A1 (fr) * 2001-10-22 2003-05-15 Exxonmobil Chemical Patents Inc. Films protecteurs
US7323239B2 (en) 2001-10-22 2008-01-29 Exxonmobil Chemical Patents Inc. Protective films
US7495048B2 (en) 2002-10-09 2009-02-24 Exxonmobil Chemical Patents Inc. Heat sealable compositions and uses thereof

Also Published As

Publication number Publication date
KR100408222B1 (ko) 2003-12-01
KR20020033869A (ko) 2002-05-08

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