WO2002019347A1 - Resistance et procede de production associe - Google Patents

Resistance et procede de production associe Download PDF

Info

Publication number: WO2002019347A1
Authority: WO; WIPO (PCT)
Prior art keywords: face electrode; thin film; substrate; resistor; plating
Prior art date: 2000-08-30

Application number

PCT/JP2001/007499

Other languages

English (en)

French (fr)

Inventor

Masato Hashimoto

Akio Fukuoka

Toshiki Matsukawa

Hiroyuki Saikawa

Tsutomu Nakanishi

Original Assignee

Matsushita Electric Industrial Co., Ltd.

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-08-30

Filing date

2001-08-30

Publication date

2002-03-07

2000-09-29 Priority claimed from JP2000300075A external-priority patent/JP2002110401A/ja

2001-03-14 Priority claimed from JP2001072243A external-priority patent/JP4415502B2/ja

2001-03-14 Priority claimed from JP2001072242A external-priority patent/JP2002151302A/ja

2001-08-30 Application filed by Matsushita Electric Industrial Co., Ltd. filed Critical Matsushita Electric Industrial Co., Ltd.

2001-08-30 Priority to US10/362,709 priority Critical patent/US7057490B2/en

2001-08-30 Priority to KR10-2003-7003020A priority patent/KR100501559B1/ko

2002-03-07 Publication of WO2002019347A1 publication Critical patent/WO2002019347A1/ja

Links

238000004519 manufacturing process Methods 0.000 title 1
239000010409 thin film Substances 0.000 abstract 6
238000007747 plating Methods 0.000 abstract 4
239000010408 film Substances 0.000 abstract 3
239000000758 substrate Substances 0.000 abstract 3
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
239000000956 alloy Substances 0.000 abstract 1
229910045601 alloy Inorganic materials 0.000 abstract 1
230000002708 enhancing effect Effects 0.000 abstract 1
229910052759 nickel Inorganic materials 0.000 abstract 1

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/006—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistor chips
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/142—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being coated on the resistive element
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/28—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals
- H01C17/288—Apparatus or processes specially adapted for manufacturing resistors adapted for applying terminals by thin film techniques

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Apparatuses And Processes For Manufacturing Resistors (AREA)
Non-Adjustable Resistors (AREA)
Details Of Resistors (AREA)

PCT/JP2001/007499 2000-08-30 2001-08-30 Resistance et procede de production associe WO2002019347A1 (fr)

Priority Applications (2)

Application Number	Priority Date	Filing Date	Title
US10/362,709 US7057490B2 (en)	2000-08-30	2001-08-30	Resistor and production method therefor
KR10-2003-7003020A KR100501559B1 (ko)	2000-08-30	2001-08-30	저항기 및 그 제조 방법

Applications Claiming Priority (10)

Application Number	Priority Date	Filing Date	Title
JP2000260402		2000-08-30
JP2000-260401		2000-08-30
JP2000-260402		2000-08-30
JP2000260401		2000-08-30
JP2000-300075		2000-09-29
JP2000300075A JP2002110401A (ja)	2000-09-29	2000-09-29	抵抗器およびその製造方法
JP2001-72243		2001-03-14
JP2001072243A JP4415502B2 (ja)	2000-08-30	2001-03-14	抵抗器およびその製造方法
JP2001072242A JP2002151302A (ja)	2000-08-30	2001-03-14	抵抗器およびその製造方法
JP2001-72242		2001-03-14

Related Child Applications (2)

Application Number	Title	Priority Date	Filing Date
US10111823 A-371-Of-International		2001-08-29
US11/361,801 Continuation US7257073B2 (en)	2000-08-31	2006-02-24	Optical disc and physical address format

Publications (1)

Publication Number	Publication Date
WO2002019347A1 true WO2002019347A1 (fr)	2002-03-07

Family

ID=27531644

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
PCT/JP2001/007499 WO2002019347A1 (fr)	2000-08-30	2001-08-30	Resistance et procede de production associe

Country Status (5)

Country	Link
US (1)	US7057490B2 (ja)
KR (1)	KR100501559B1 (ja)
CN (1)	CN1305079C (ja)
TW (1)	TW517251B (ja)
WO (1)	WO2002019347A1 (ja)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3969987B2 (ja) *	2001-10-01	2007-09-05	Ｄｏｗａホールディングス株式会社	セラミックスと合金の接合体
DE10162276C5 (de) *	2001-12-19	2019-03-14	Watlow Electric Manufacturing Co.	Rohrförmiger Durchlauferhitzer und Heizplatte sowie Verfahren zu deren Herstellung
US7122898B1 (en) *	2005-05-09	2006-10-17	International Business Machines Corporation	Electrical programmable metal resistor
US7314786B1 (en) *	2006-06-16	2008-01-01	International Business Machines Corporation	Metal resistor, resistor material and method
US7488682B2 (en) *	2006-10-03	2009-02-10	International Business Machines Corporation	High-density 3-dimensional resistors
JP5287154B2 (ja) *	2007-11-08	2013-09-11	パナソニック株式会社	回路保護素子およびその製造方法
JP5543146B2 (ja) *	2009-07-27	2014-07-09	ローム株式会社	チップ抵抗器およびチップ抵抗器の製造方法
US8179226B2 (en) *	2009-09-04	2012-05-15	Samsung Electro-Mechanics Co., Ltd.	Array type chip resistor
US8530320B2 (en)	2011-06-08	2013-09-10	International Business Machines Corporation	High-nitrogen content metal resistor and method of forming same
US9818512B2 (en) *	2014-12-08	2017-11-14	Vishay Dale Electronics, Llc	Thermally sprayed thin film resistor and method of making
US10083781B2 (en)	2015-10-30	2018-09-25	Vishay Dale Electronics, Llc	Surface mount resistors and methods of manufacturing same
US10020358B2 (en)	2016-04-19	2018-07-10	International Business Machines Corporation	Metal resistors having nitridized dielectric surface layers and nitridized metal surface layers
US9972671B2 (en)	2016-04-19	2018-05-15	International Business Machines Corporation	Metal resistors having varying resistivity
US9985088B2 (en)	2016-04-19	2018-05-29	International Business Machines Corporation	Metal resistors having nitridized metal surface layers with different nitrogen content
US9824967B1 (en)	2016-07-28	2017-11-21	International Business Machines Corporation	Semiconductor resistor structures embedded in a middle-of-the-line (MOL) dielectric
US9831301B1 (en)	2016-09-19	2017-11-28	International Business Machines Corporation	Metal resistor structures with nitrogen content
US9853025B1 (en)	2016-10-14	2017-12-26	International Business Machines Corporation	Thin film metallic resistors formed by surface treatment of insulating layer
US9972672B1 (en)	2017-01-11	2018-05-15	International Business Machines Corporation	Tunable resistor with curved resistor elements
US9991330B1 (en)	2017-01-11	2018-06-05	International Business Machines Corporation	Resistors with controlled resistivity
US10283583B2 (en)	2017-01-11	2019-05-07	International Business Machines Corporation	3D resistor structure with controlled resistivity
CN107275016B (zh) *	2017-06-28	2019-09-20	中国振华集团云科电子有限公司	在电阻器上形成保护层的方法及由该方法制得的电阻器
US10937573B2 (en) *	2017-11-02	2021-03-02	Rohm Co., Ltd.	Chip resistor
US10438729B2 (en)	2017-11-10	2019-10-08	Vishay Dale Electronics, Llc	Resistor with upper surface heat dissipation
CN111416038B (zh) *	2020-04-27	2024-04-30	广东石油化工学院	一种结合能力强、低阻值的GeSbTe相变材料薄膜器件
JP2022189034A (ja)	2021-06-10	2022-12-22	Koa株式会社	チップ抵抗器およびチップ抵抗器の製造方法

Citations (2)

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Publication number	Priority date	Publication date	Assignee	Title
JPH07312302A (ja) *	1994-05-18	1995-11-28	Rohm Co Ltd	チップ状電子部品
JPH0864460A (ja) *	1994-08-23	1996-03-08	Matsushita Electric Ind Co Ltd	チップ型電子部品およびその製造方法

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US4792781A (en) *	1986-02-21	1988-12-20	Tdk Corporation	Chip-type resistor
US5680092A (en) *	1993-11-11	1997-10-21	Matsushita Electric Industrial Co., Ltd.	Chip resistor and method for producing the same
US5783082A (en) *	1995-11-03	1998-07-21	University Of North Carolina	Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants
JP3637124B2 (ja) *	1996-01-10	2005-04-13	ローム株式会社	チップ型抵抗器の構造及びその製造方法
EP0810614B1 (en) *	1996-05-29	2002-09-04	Matsushita Electric Industrial Co., Ltd.	A surface mountable resistor
US5907274A (en) *	1996-09-11	1999-05-25	Matsushita Electric Industrial Co., Ltd.	Chip resistor
JP3060966B2 (ja) *	1996-10-09	2000-07-10	株式会社村田製作所	チップ型サーミスタおよびその製造方法
US6636143B1 (en) *	1997-07-03	2003-10-21	Matsushita Electric Industrial Co., Ltd.	Resistor and method of manufacturing the same
JPH1126204A (ja) *	1997-07-09	1999-01-29	Matsushita Electric Ind Co Ltd	抵抗器およびその製造方法
TW424245B (en) *	1998-01-08	2001-03-01	Matsushita Electric Ind Co Ltd	Resistor and its manufacturing method
JP3852649B2 (ja) *	1998-08-18	2006-12-06	ローム株式会社	チップ抵抗器の製造方法
KR100328255B1 (ko) *	1999-01-27	2002-03-16	이형도	칩 부품 및 그 제조방법

2001
- 2001-08-30 US US10/362,709 patent/US7057490B2/en not_active Expired - Fee Related
- 2001-08-30 TW TW090121488A patent/TW517251B/zh not_active IP Right Cessation
- 2001-08-30 CN CNB018149502A patent/CN1305079C/zh not_active Expired - Fee Related
- 2001-08-30 WO PCT/JP2001/007499 patent/WO2002019347A1/ja active IP Right Grant
- 2001-08-30 KR KR10-2003-7003020A patent/KR100501559B1/ko not_active Expired - Fee Related

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPH07312302A (ja) *	1994-05-18	1995-11-28	Rohm Co Ltd	チップ状電子部品
JPH0864460A (ja) *	1994-08-23	1996-03-08	Matsushita Electric Ind Co Ltd	チップ型電子部品およびその製造方法

Also Published As

Publication number	Publication date
KR100501559B1 (ko)	2005-07-18
US7057490B2 (en)	2006-06-06
US20040027234A1 (en)	2004-02-12
CN1449570A (zh)	2003-10-15
TW517251B (en)	2003-01-11
KR20030024924A (ko)	2003-03-26
CN1305079C (zh)	2007-03-14

Legal Events

Date	Code	Title	Description
2002-03-07	AK	Designated states	Kind code of ref document: A1 Designated state(s): CN KR US
2002-05-16	DFPE	Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
2003-02-28	WWE	Wipo information: entry into national phase	Ref document number: 1020037003020 Country of ref document: KR Ref document number: 018149502 Country of ref document: CN
2003-03-26	WWP	Wipo information: published in national office	Ref document number: 1020037003020 Country of ref document: KR
2003-08-05	WWE	Wipo information: entry into national phase	Ref document number: 10362709 Country of ref document: US
2005-05-26	WWG	Wipo information: grant in national office	Ref document number: 1020037003020 Country of ref document: KR

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