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WO2002007490A2 - Ensemble comportant un element de support structure et un substrat en liaison active avec cet element de support - Google Patents

Ensemble comportant un element de support structure et un substrat en liaison active avec cet element de support Download PDF

Info

Publication number
WO2002007490A2
WO2002007490A2 PCT/DE2001/002600 DE0102600W WO0207490A2 WO 2002007490 A2 WO2002007490 A2 WO 2002007490A2 DE 0102600 W DE0102600 W DE 0102600W WO 0207490 A2 WO0207490 A2 WO 0207490A2
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
carrier
carrier element
assembly according
sections
Prior art date
Application number
PCT/DE2001/002600
Other languages
German (de)
English (en)
Other versions
WO2002007490A3 (fr
Inventor
Norbert Martin
Stefan Mueller
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2002007490A2 publication Critical patent/WO2002007490A2/fr
Publication of WO2002007490A3 publication Critical patent/WO2002007490A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385—Shape, e.g. interlocking features

Definitions

  • the invention relates to an assembly with a structured carrier element and a substrate operatively connected to it, in particular with a semiconductor wafer, according to the preamble of claim 1.
  • a semiconductor wafer substrate
  • a metal carrier element which is also referred to as “the pad”
  • the carrier element can be part of a larger conductor comb, which is also known under the name "lead frame”.
  • thermomechanical voltages are induced in the semiconductor wafer after the assembly has cooled to room temperature, so that the functionality of the semiconductor wafer or the assembly can be adversely affected.
  • semiconductor structure for example in the form of a sandwich structure with connecting layers made of adhesive material, can further adversely affect the integrity of such a multi-layer assembly, particularly with regard to its geometrical extent, by thermomechanical stresses.
  • thermomechanically induced stresses in the semiconductor wafer or corresponding undesirable deformations thereof can occur.
  • the semiconductor wafer is, according to the prior art, attached to a plurality of smaller carrier sections distributed over its entire area on the carrier element by means of an adhesive connection or attached a solder joint.
  • the carrier sections are operatively connected to one another by means of connecting webs in such a way that a structured, lattice-shaped Support element is obtained.
  • This known embodiment of a carrier element ensures a reliable and stable operative connection extending over the entire substrate surface between the semiconductor wafer (substrate) and carrier element by means of an adhesive or soldered connection, but it is not suitable. To reduce an undesired elastic and / or plastic deformation of the semiconductor wafer to a minimum due to thermomechanically induced voltages.
  • the assembly of the type mentioned at the outset is characterized in that the carrier element has a plurality of spaced-apart carrier sections, by means of which the substrate is operatively connected to the carrier element.
  • a carrier element designed in this way is characterized in that, owing to the spacing of the carrier sections from one another, a connection region of the substrate for establishing an active connection with the carrier element can be defined or selected without restriction. A geometrically favorable and preferably slight deformation of the substrate, owing to thermomechanical stresses, can thus be achieved after the active connection has been established with the carrier element by suitable determination and / or arrangement of the connection area or areas.
  • the carrier sections can be operatively connected to one another by means of suitably designed connecting elements.
  • the carrier sections advantageously lie exclusively in an outer edge region of the substrate. This ensures that there is an active connection between the substrate and the carrier element only in an outer edge region of the substrate and not additionally in a central region thereof, so that thermomechanical stresses can only be induced in the substrate in the outer edge region. In this way, a uniform and relatively low elastic and / or plastic deformation of the substrate is obtained, in contrast to a deformation of the substrate extending in a wave-like manner over the substrate when there are a plurality of active connections between the carrier element distributed over the entire substrate surface (central region and outer edge region) and substrate.
  • the carrier element is in a plurality of both in In a central region and also in an outer edge region of the substrate, carrier sections are disadvantageously characterized by a relatively high deformation stiffness, while a carrier element of an assembly according to the invention has a relatively low deformation stiffness or a relatively high deformation resilience.
  • the weight of the support element can be reduced effectively since no support sections are provided in the central area thereof. Due to the comparatively high resilience of the support element according to the invention, when the assembly cools down to room temperature, it undergoes a favored elastic deformation, so that only slight thermo-mechanical stresses are induced in the outer edge region of the substrate and thus correspondingly lower elastic and / or plastic deformations of the substrate occur. This also results in less stress on the active connection, for example in the form of an adhesive layer, so that more types of adhesive material, such as so-called "soft" adhesives, can be used.
  • the carrier sections each advantageously lie in a corner region of the essentially rectangular substrate. This makes it possible to design the support element in a particularly flexible manner in order to achieve a desired elastic deformation thereof, since the support sections each lie in a corner region of the support element and the central region and a large part of the edge area empire of the support element can be freely designed. Furthermore, any thermomechanical stresses are only induced in the corner region of the substrate by the respective active connection, so that the uniform curvature of the substrate that results as a result of an elastic and / or plastic deformation of the same, in particular in the middle region, in which there is no active connection between the substrate and carrier element is present, is relatively small.
  • the carrier element preferably has straight connecting webs which form a closed frame and by means of which the carrier sections are connected to one another.
  • a support element designed in this way allows a stable operative connection to be made to a substrate and is further characterized by an increased flexibility in the case of a correspondingly thin design of the connecting webs, in particular with regard to a desired longitudinal expansion of the connecting webs.
  • the use of materials for producing a carrier element can also be reduced to a minimum.
  • the support sections each lie in a corner region of the substantially rectangular, frame-shaped support element.
  • This enables an active connection to be established between the substrate and the carrier element only in a corresponding corner region thereof, so that a deformation-compliant design of the carrier element can be implemented in order to achieve a favorable and reduced deformation of the substrate.
  • the preferably pure elastic deformation of the carrier element takes place in the form of an expansion or compression of the connecting webs.
  • each connecting web connecting two carrier sections in each case has a geometric structuring which favors a spring-elastic bending deformation.
  • a bending stress on the connecting webs a greater flexibility of the carrier element can be achieved in relation to a tensile or compressive stress in the longitudinal direction thereof.
  • an undesirable elastic and / or plastic deformation of the substrate, in particular in the central region thereof, is reduced to a minimum size by means of a more flexible carrier element.
  • the geometric structuring advantageously has in each case at least one corner or an arch connecting webs in the longitudinal direction.
  • Such connecting webs are particularly suitable for producing a resilient bending deformation by means of a linear expansion or shrinking movement thereof. In this way, an increased flexibility of the carrier element is obtained compared to straight connecting webs in the longitudinal direction.
  • the carrier element has at least one cross strut which is operatively connected at the end to connecting webs in a connecting region outside the carrier sections.
  • the cross struts are operatively connected at the end to the connecting webs in a respective connection area which lies outside the support sections, so that when the support element is deformed in a longitudinal direction, the cross struts allow a spring-elastic bending deformation of the connection webs in corresponding connection areas and thus ensure greater flexibility of the support element ,
  • no straight connecting line can be drawn between two support sections, which runs completely through a cross strut, but all the connecting lines lead at least once into a space between the cross struts and / or the connecting webs while favoring a corresponding bending deformation.
  • connecting regions between the connecting webs and / or the cross struts advantageously have rounded connecting corners.
  • Rounded connecting corners ensure that the bending deformation of the carrier element essentially takes place in an elastic deformation region and that the notch effect is significantly reduced compared to a pointed corner.
  • the connecting webs and the cross struts advantageously have an essentially constant and equally large wall thickness. It turns out by an essentially uniform elastic bending deformation or expansion or compression in the connecting webs and transverse struts, so that the substrate is also deformed uniformly and as little as possible due to the induced thermomechanical stresses.
  • the carrier sections are preferably essentially rectangular.
  • the corner regions of the substrate can be used particularly effectively completely by means of rectangular carrier sections for producing an operative connection with the carrier element, for example by means of an adhesive connection and a soldered connection.
  • a reliable operative connection between the substrate and the carrier element can thus be implemented, taking advantage of the advantages mentioned above.
  • the carrier element is advantageously made of metal and is operatively connected to the substrate by means of an adhesive or solder connection on the carrier sections.
  • the carrier element can be produced from copper and the substrate from silicon.
  • An adhesive or soldered connection is particularly suitable for ensuring a reliable and precise operative connection between the carrier element and the substrate by means of flat carrier sections.
  • Figure 1 is a schematic bottom view of a carrier element according to the invention according to a first embodiment
  • FIG. 2 shows a schematic bottom view of an assembly according to the invention consisting of the carrier element of FIG. 1 and a substrate operatively connected to it;
  • Figure 3 is a schematic cross section along the line III-III of Figure 2;
  • FIG. 4 shows a schematic bottom view of a carrier element according to the invention in accordance with a second, alternative embodiment
  • Figure 5 is a schematic bottom view of an assembly according to the invention consisting of the carrier element of Figure 4 and a substrate operatively connected thereto;
  • Figure 7 is a schematic bottom view of an assembly according to the invention according to a further alternative embodiment. Description of the invention
  • FIGS. 2 and 3 show a first embodiment of an assembly, generally designated 10, consisting of a carrier element 11 and a substrate 12, which is operatively connected to the latter in particular by means of an adhesive or soldered connection.
  • FIG. 1 shows the carrier element 11 of FIG. 2 in the unmounted state.
  • the carrier element 11 has a plurality of carrier sections 13 spaced apart from one another and lying exclusively in an outer edge region of the substrate 12, to which the substrate 12 is operatively connected to the carrier element 11, preferably by means of an adhesive or soldered connection.
  • the active connection between substrate 12 and carrier element 11 is limited to the corner regions of the substantially rectangular substrate 12 and the likewise substantially rectangular carrier element 11.
  • the carrier element 11 has straight connecting webs 14, which together with the carrier sections 13 form a closed frame, by means of which the carrier sections 13 are connected to one another.
  • the carrier sections 13 and the connecting webs 14 thus form a frame-shaped carrier element 11.
  • the carrier element 11 has two cross struts 15 which are arranged in a cross-like manner and are operatively connected at the ends to opposite connecting webs 14 in a connecting region 16 outside the carrier sections 13 or spaced apart therefrom.
  • the connecting areas 16 between the connecting webs 14 and / or the cross struts 15 preferably have rounded connecting corners 17.
  • the connection Extension webs 14 and the cross struts 15 are characterized by an essentially constant and equally large wall thickness.
  • the carrier sections 13 are of rectangular design and are surrounded by a free L-shaped edge 20 which is not used for the operative connection and which projects beyond the substrate 12 to the outside.
  • the edge 20 is used in particular for the reliable and easy-to-use application of an adhesive or solder to the corresponding carrier sections 13.
  • the substrate 12 is operatively connected to the carrier element 11 to form an interposed adhesive layer 18 on the carrier sections 13.
  • a corresponding solder layer can also be provided.
  • the operative connection is limited to the support sections 13 of the support element 11, so that between the support sections 13 the substrate 12 is arranged at a constant distance from the support element 11, forming a free gap 19.
  • the support element 11 is made of metal, preferably copper, and that Substrate 12 is preferably made of silicon.
  • the assembly 10 according to FIGS. 1 to 3 is characterized by a deformation in the form of an expansion or compression in the longitudinal direction of the connecting webs 14 and the cross struts 15, preferably in the elastic range.
  • FIGS. 4, 5 and 6 show an alternative embodiment of a carrier element 11 according to the invention (FIG. 4) or a corresponding assembly 10 (FIGS. 5 and 6).
  • the carrier element 11 is shown as such, while Figures 5 and 6 show the assembled assembly 10.
  • the connecting webs 14 are formed in the shape of a corner in the longitudinal direction in order to implement a geometric structuring of the support element 11 which promotes spring-elastic bending deformation. This means that, for example, when the support element 11 is expanded in a longitudinal direction on account of a thermal stress, the connecting webs 14 are essentially elastically bent and not, or only slightly, elastically stretched.
  • the carrier element 11 Due to the bending deformation of the connecting webs 14, the carrier element 11 is characterized with a greater flexibility compared to an expansion or compression of the connecting webs 14, so that the carrier element 11 adapts relatively well to the respective geometrical deformation (expansion or compression in the longitudinal direction) of the substrate 12 can. In this way, an undesired elastic and / or plastic deformation of the substrate 12 is avoided or significantly reduced, and due to the increased flexibility of the support element 11, an unavoidable deformation of the assembly 10 is advantageously transferred in particular to the support element 11.
  • the deformation of the carrier element 11 should take place in the elastic range as much as possible, while the substrate 12 should be deformed as little as possible.
  • the geometric structuring of the carrier element 11 which favors a spring-elastic bending deformation is obtained in that, as shown in FIG. 6, a straight connecting line between two carrier sections 13 has at least one times leads from the material of the support element 11 into a free space (space), so that no continuous material connection can be obtained by connecting webs 14 and / or cross struts 15 by means of a straight connecting line between two support sections 13.
  • the geometrical structuring of the carrier element 11 is not limited to connecting webs 14 which each form a corner in the longitudinal direction, but the same can each form, for example, a uniformly curved arch.
  • the further structural design of the alternative embodiment according to FIGS. 4 to 6 corresponds to that of the first embodiment of FIGS. 1 to 3. Therefore, the same structural elements and sections of the assembly 10 of the two embodiments are provided with corresponding reference numerals, so that a further Description in relation to the rest of the construction of the second embodiment is omitted.
  • both the connecting webs 14 and the cross struts 15 of both embodiments should preferably take place in the pure elastic range.
  • FIG. 7 shows a further, alternative embodiment of an assembly 10 according to the invention, which is essentially the same as the assembly 10 according to FIG. 5 (corresponding reference numerals), a further support section 13 being provided in the central region of the support element 11, which has a plurality of Cross struts 15 is operatively connected.
  • the other carrier section 13 arranged centrally to a plane of symmetry (not shown) of the carrier element 11 or the assembly 10.
  • This embodiment of FIG. 7 is also characterized by an increased flexibility of the carrier element 11 and thus by a favorable elastic deformation of the assembly 10.
  • a carrier element 11 can be designed essentially according to FIGS. 1 or 4 and can be provided without cross struts 15.
  • a carrier element 11 with cross struts 15 is, however, easier to manufacture in terms of production technology.
  • the carrier element 11 does not necessarily have to be rectangular.
  • the number and the geometric configuration of the carrier sections 13 can also be different with respect to the figures.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Micromachines (AREA)
  • Led Device Packages (AREA)

Abstract

L'invention concerne un ensemble (10) qui comprend un élément de support (11) structuré et un substrat (12) en liaison active avec cet élément de support, en particulier un disque de semi-conducteur. Selon l'invention, il est prévu que l'élément de support (11) comporte une pluralité de parties de support (13) espacées les unes des autres et se trouvant, de préférence, dans une zone marginale extérieure du substrat (12), au moyen desquelles le substrat (12) est en liaison active avec l'élément de support (11). Les parties de support (13) se trouvent, de préférence, respectivement dans une zone d'angle du substrat (12), qui est sensiblement de forme rectangulaire, et de l'élément de support (11), qui présente une forme correspondante.
PCT/DE2001/002600 2000-07-18 2001-07-17 Ensemble comportant un element de support structure et un substrat en liaison active avec cet element de support WO2002007490A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10034826.2 2000-07-18
DE2000134826 DE10034826A1 (de) 2000-07-18 2000-07-18 Baugruppe mit einem strukturierten Tärgerelement und einem mit diesem wirkverbundenen Substrat

Publications (2)

Publication Number Publication Date
WO2002007490A2 true WO2002007490A2 (fr) 2002-01-24
WO2002007490A3 WO2002007490A3 (fr) 2002-06-27

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PCT/DE2001/002600 WO2002007490A2 (fr) 2000-07-18 2001-07-17 Ensemble comportant un element de support structure et un substrat en liaison active avec cet element de support

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DE (1) DE10034826A1 (fr)
WO (1) WO2002007490A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9285364B2 (en) 2007-11-10 2016-03-15 The Secretary Of State For Environment, Food And Rural Affairs Mycobacterium antigens

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0422162A (ja) * 1990-05-17 1992-01-27 Hitachi Ltd リードフレームおよびそれを用いた半導体集積回路装置
JP2767404B2 (ja) * 1994-12-14 1998-06-18 アナムインダストリアル株式会社 半導体パッケージのリードフレーム構造
JP2611748B2 (ja) * 1995-01-25 1997-05-21 日本電気株式会社 樹脂封止型半導体装置
SG46955A1 (en) * 1995-10-28 1998-03-20 Inst Of Microelectronics Ic packaging lead frame for reducing chip stress and deformation
JP2892988B2 (ja) * 1996-04-17 1999-05-17 松下電子工業株式会社 リードフレームとそれを用いた半導体装置およびその製造方法
JPH1126680A (ja) * 1997-07-08 1999-01-29 Sony Corp 半導体装置用リードフレーム

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9285364B2 (en) 2007-11-10 2016-03-15 The Secretary Of State For Environment, Food And Rural Affairs Mycobacterium antigens

Also Published As

Publication number Publication date
WO2002007490A3 (fr) 2002-06-27
DE10034826A1 (de) 2002-01-31

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