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WO2002067033A2 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2002067033A2
WO2002067033A2 PCT/US2002/005497 US0205497W WO02067033A2 WO 2002067033 A2 WO2002067033 A2 WO 2002067033A2 US 0205497 W US0205497 W US 0205497W WO 02067033 A2 WO02067033 A2 WO 02067033A2
Authority
WO
WIPO (PCT)
Prior art keywords
optical
optical module
mount
bonding material
optical component
Prior art date
Application number
PCT/US2002/005497
Other languages
English (en)
Other versions
WO2002067033A3 (fr
Inventor
Steven K. Case
Gregory S. Mowry
Timothy A. Skunes
Patrick J. Garfield
John T. Mcelreath
Craig D. Knighton
Gary A. Lenz
Mark L. Wilson
Original Assignee
Cyberoptics Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/789,185 external-priority patent/US6443631B1/en
Priority claimed from US09/789,125 external-priority patent/US6546173B2/en
Priority claimed from US09/789,317 external-priority patent/US6590658B2/en
Priority claimed from US09/789,124 external-priority patent/US6546172B2/en
Priority claimed from US09/920,366 external-priority patent/US6956999B2/en
Priority to AU2002306579A priority Critical patent/AU2002306579A1/en
Priority to GB0319381A priority patent/GB2390174B/en
Application filed by Cyberoptics Corporation filed Critical Cyberoptics Corporation
Priority to US10/099,920 priority patent/US20020181897A1/en
Priority to US10/099,907 priority patent/US20020154870A1/en
Priority to US10/098,743 priority patent/US20020168147A1/en
Publication of WO2002067033A2 publication Critical patent/WO2002067033A2/fr
Publication of WO2002067033A3 publication Critical patent/WO2002067033A3/fr

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2553—Splicing machines, e.g. optical fibre fusion splicer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G02B6/2555—Alignment or adjustment devices for aligning prior to splicing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3632—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means
    • G02B6/3636—Mechanical coupling means for mounting fibres to supporting carriers characterised by the cross-sectional shape of the mechanical coupling means the mechanical coupling means being grooves
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3873—Connectors using guide surfaces for aligning ferrule ends, e.g. tubes, sleeves, V-grooves, rods, pins, balls
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4225—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements by a direct measurement of the degree of coupling, e.g. the amount of light power coupled to the fibre or the opto-electronic element
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227—Active alignment methods, e.g. procedures and algorithms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment
    • G02B6/4231—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment with intermediate elements, e.g. rods and balls, between the elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/26—Optical coupling means
    • G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3616—Holders, macro size fixtures for mechanically holding or positioning fibres, e.g. on an optical bench
    • G02B6/362—Vacuum holders for optical elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3628—Mechanical coupling means for mounting fibres to supporting carriers
    • G02B6/3648—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures
    • G02B6/3652—Supporting carriers of a microbench type, i.e. with micromachined additional mechanical structures the additional structures being prepositioning mounting areas, allowing only movement in one dimension, e.g. grooves, trenches or vias in the microbench surface, i.e. self aligning supporting carriers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/38—Mechanical coupling means having fibre to fibre mating means
    • G02B6/3807—Dismountable connectors, i.e. comprising plugs
    • G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
    • G02B6/3834—Means for centering or aligning the light guide within the ferrule
    • G02B6/3838—Means for centering or aligning the light guide within the ferrule using grooves for light guides
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4238—Soldering
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material

Definitions

  • the present invention relates to optical components used in fabricating optical devices . More specifically, the present invention rela-tes to an optical module which carries an optical, optical- electrical or optical mechanic component- Optical devices are being increasingly used in various industries and technologies in order to provide high speed data transfer such as in fiber optic communication equipment. In many applications there is a transition or an incorporation of optical devices where previously only electrical devices were employed.
  • An optical device typically consists of a number of components which must be precisely assembled and aligned for the device to operate and function efficiently.- Example components include fibers, waveguides, lasers, modulators, detectors, gratings, optical amplifiers, lenses, mirrors, prisms, windows, etc.
  • optical devices such as those used in fiber optic telecommunications, .data storage and retrieval, optical inspection, etc. have had little commonality in packaging and assembly methods. This limits the applicability of automation equipment for automating the manufacture of these devices since there is such a disparity in the device designs. To affect high volume automated manufacturing of such devices, parts of each individual manufacturing line have to be custom-designed.
  • Figure 2A is a exploded perspective view of an optical module shown in Figure 1.
  • Figure 8B is a side cross-sectional view showing the bonding material of Figure 8A.
  • Figure 8C is an enlarged view of the bonding material.
  • Figure 8D is an enlarged view of the bonding material which illustrates deformation of the material .after heating.
  • Figure 9 is a perspective view showing an optical module of the present invention which includes a Gradient Index (GRIN) lens.
  • GRIN Gradient Index
  • Figure 13 shows heat dissipation techniques for an optical module.
  • Figures 14, 15 and 16 are views of another fiber holder embodiment.
  • the present invention includes various aspects that reduce or eliminate many of the problems associated with the prior art.
  • the present invention offers an optical component which is prealigned in a standardized optical module.
  • the optical module can be aligned with sub-micron precision with respect to registration features. Registration features on the module can be aligned with matching features on a substrate. This is similar to mounting an electrical component in or on a printed circuit board.
  • Optical devices can be easily fabricated by mounting prealigned optical modules in the optical "circuit board". The prealignment of the optical component can compensate for variations between components to thereby essentially eliminate the effects of component variability.
  • the prealigned optical modules are well suited for automated fabrication of devices.
  • the modules can be fabricated in silicon using techniques which are well' known in the art of silicon processing.
  • any appropriate material can be used. Preferable materials are those which are used with existing electrical or optical components. Further, the invention can be used with active devices such as lasers, modulators, detectors, etc. Electrical conductors can be fabricated on the various layers for coupling to active ⁇ optical components. Electrical circuitry including analog and digital circuitry, can also be fabricated directly on the modules or on the fixed reference mount.
  • the present invention provides an optical module in which an optical component is mounted to an optical component mount.
  • the optical component mount is fixed to a relative reference mount such as a base mounting plate at a desired position and orientation.
  • solder is used to mount the components.
  • the relative reference mount is coupled to a fixed reference mount such as a substrate such that the optical component is maintained at a desired position and orientation relative to the fixed reference mount.
  • the optical component can be pre-aligned to a desired spacial reference and orientation by adjusting the optical component mount relative to the reference mount prior to fixing their relative positions. This can be used to provide general component pre-alignment as well as compensate for the variations which can arise between optical components.
  • the following description sets forth a number of specific examples, however, in various aspects, the present invention is not limited to the specific configurations, components or techniques set forth herein.
  • Figure 1 is a perspective view of an optical device 10.
  • Optical device 10 is shown as a simple optical fiber to optical fiber coupler for purposes of illustrating the present invention. However, the invention is applicable to more complex or other optical devices and other types of optical components .
  • the optical device 10 is fabricated from two optical modules 12A and 12B which include respective optical components 14A and 14B illustrated in this specific example as optical fibers. The fibers are mounted to respective optical component mounts 16A and 16B which are positioned and oriented to achieve a desired position and orientation of optical components 14A and 14B relative to base mounting plates 18A and 18B, respectively.
  • a number of specific examples of this coupling are set forth below in more detail, however, other aspects of the invention are not limited to such examples.
  • reference substrate 20 is illustrated as a planar substrate which can be thought of as an optical "circuit board" which receives optical modules to form an optical, opto- electrical or opto-mechanical device.
  • Figure 2A is an exploded perspective view of optical module 12.
  • optical component mount or holder 16 comprises upper component mount or holder 24 and lower component mount or holder 26.
  • Figure 2 ⁇ illustrates one example mounting technique coupling optical component mount 16 to base mounting plate 18.
  • a bonding material 30 is carried on a top surface of base mount plate 18.
  • Material 30 preferably has at least two states. In one state, material 30 does not interfere or contact mount 16.
  • material 30 comprises a heat or chemically responsive (or activated) material such as solder or other bonding material.
  • solder can comprise any type of solder including plated solder, solder preforms, solder balls, solder paste, solder bumps, etc. including those types of solders used in flip chip electronic packages.
  • other materials such as adhesives which dry, chemically react, or are activated by other means or other attachment techniques can be used.
  • the attachment technique allows some relative movement between the optical component mount 16 and the base mounting plate 18 prior to fixedly attaching the two.
  • heating elements can be provided to heat the material 30.
  • heating elements are provided which are activated through the application of electrical energy through contact pads 34. This can be by electrically contacting pads 34 and applying a current therethrough.
  • other heating techniques can be used.
  • other techniques to change the state of bonding material can be used such as application of a curing component such as radiation or a' chemical.
  • Any appropriate adhesives including brazing, welding, bonding or other technique can be used.
  • the bond can be activated using a technique including exposure to air, heat, chemicals, heat radiation (including light and UV) , etc.
  • Figure 2B is a bottom plan view of optical component mount 16 and lower mount 26 and shows bonding pads 40 which are arranged to mate with material 30 shown in Figure 2A.
  • Pads 40 can comprise, for example, a metal deposited on lower mount 26'.
  • bonding pads 40 also include integral heating elements and electrical contact pads are provided to energize the heating elements. A reduction in the bonding time may be obtained by heating both bonding pads 40 and bonding material 30.
  • each registration feature ' 50 is a protrusion which is configured to mate with reference substrate 20 as discussed below.
  • Figure 3 also shows a component registration feature 60 formed in lower component mount 26 and a component registration feature 62 in upper component mount 24.
  • component registration features 60 and 62 comprise V-grooves which are configured to receive an optical component such as optical component 14.
  • the optical element 14 can be coupled to the optical component mount using, for example, an adhesive or solder.
  • Optical component 14 is preferably fixed to component mount 16 to maintain alignment relative to registration features 50 of relative reference mount 18.
  • Figure 4 is a bottom plan view of optical module 12 which shows base mounting .plate 18 and a portion of lower optical component mount 26 of optical component mount 16. Pads 54 on base mounting plate 18 can bond with bonding material 72.
  • the bottom plan view of Figure 4 illustrates an interface surface 64 of optical component mount 16. Interface surface 64 is an input, output or input/output face for the optical component 14 shown in Figure 3.
  • the interface surfaces of adjacent optical modules are in abutting contact.
  • a refractive index optical matching material fills any gap between adjacent interface faces to provide improved coupling and reduce reflections.
  • the optical matching material may be in a solid, gel or liquid form.
  • interface surface 64 is a plane which forms an angle relative to a plane perpendicular to the direction of propagation of optical fiber 14. For example, this can be eight degrees.
  • An angled surface 64 of the optical component 14 can be preferable because it reduces the amount of reflected light which is coupled back into an optical fiber. If two modules are in close proximity or in abutting contact, the adjacent optical component mount would have a complimentary angle.
  • interface surface 64 can be shaped or formed using an appropriate process such as a lapping process, chemically machining, machining, etc., or an additive process, to achieve the desired configuration.
  • the surface 64 can be lapped to achieve the desired angle or surface finish. Such techniques can also be used to ensure that a face of the optical component is flush with the interface surface 64. However, in some embodiments, it may be desirable to have the optical component 14 either recessed or protruding from interface surface 64.
  • bonding pads 54 on the bottom of base mounting plate 18 may also include integral heating elements and electrical contact pads may be provided to energize these heating elements. A reduction in the bonding time may be obtained by heating both bonding pads and bonding material 72.
  • Figure 6 is a cross-sectional view showing optical module 12 mounted taken along the line labeled 6—6 in Figure 4 and including substrate 20. This view shows the assembled configuration in which the optical module 12 is coupled to the reference substrate 20 and component holder 16 is coupled to base mounting plate 18.
  • Figure 8B is a diagram of thin film layers and is not to scale and shows features, such as contacts 34 which are remote from the heater element 80 and near the edge of mounting plate 18.
  • Element 80 is shown electrically coupled to contacts 34 through electrical conductors 82.
  • An electrical insulating layer 87 can optionally be positioned between element 80 and material 30 to increase the amount- of electrical current flowing through element 80.
  • Additional layer or layers 85 can be deposited on insulator 87 to promote adhesion or provide other characteristics or qualities as desired. This is known in the art of metal deposition as "under-bump metallurgy", or UBM.
  • Thermal (and/or electrical) isolation layers 89 can also be applied to reduce the transfer of thermal energy to the surrounding components.
  • the electrical isolation layer 87 is preferably relatively thin and provides high thermal conductivity. Silicon nitride is one example material.
  • the conductors 82 can be any conductive material however, preferable materials include those which are easily deposited such as thick refractory metals, gold or aluminum.
  • the material or materials for pads 54 can be any appropriate material that adheres to the bonding material 30. Examples include, gold, nickel, platinum, etc. The thickness of the various layers should also be selected to reduce the thermal load on the heating element.
  • Pad 40 is shown with layers 40A and 40B. Layers 40A can be of a material suitable for bonding to thermal isolation layer 89. For example, Ti if layer 89 is Si0 2 .
  • Layer 40B is configured to bond with bonding material 30 and may be, for example, gold, nickel, platinum, or other materials.
  • Pads 40 can be constructed of a multilayer thin film structure of titanium, nickel, and gold. The titanium is used as an adhesion layer to silicon. Next, nickel .is deposited on top of the titanium so that solder will make strong intermetallic bonds with the nickel. Finally, gold is deposited on top of the nickel to prevent the nickel from corroding. Other receiver pad metallurgies, or UBM (under bump metallurgies) configurations, may also be used depending on the solder alloy and many other considerations. The pads may also be pre-tinned with a thin layer .of solder to form intermetallics with the under bump metallurgy prior to securing the components.
  • the bonding technique can advantageously use the surface tension developed in the bonding material.
  • the solder or adhesive can be electrically conductive to provide electrical contacts to the optical device between the various layers, or to adjacent electronic circuitry.
  • Thermally conductive materials can be used to help dissipate heat.
  • two bonding materials are used, which can be the same or different and can be applied simultaneously or sequentially. For example, after the solder discussed herein is applied, a second bonding material can fill the gap to provide additional stability. However, shrinkage or other shape changes of the bonding material should be addressed to maintain alignment.
  • roughness or texturing the surfaces using any appropriate technique can be used to promote adhesion of the bonding material.
  • Component 14 can be any type of optical opto-electrical or opto-mechanical element including active or passive elements.
  • optical element 14 is shown as an optical fiber.
  • an optical element 90 is shown which comprises a GRIN lens.
  • Figure 9 is a perspective view showing lens 90 held in component mount 16 which coupled to base mounting plate 18.
  • heat sink 142 can be optionally coupled directly to optical component mount 16, or through a non-stressing heat path such as a copper, gold, aluminum or silver braid.
  • a thermal spreading (thermal diffusing) film or layer can be attached directly to the thermally active devices or various components.
  • Figure 14 shows an exploded perspective view of component holder 216.
  • Fiber end 215 has had the protective buffer layer stripped away so that only the fiber cladding and core remain.
  • fiber end 219 has had the protective buffer layer stripped away so that only the fiber cladding and core remain.
  • the tip of fiber end 215 is cleaved at an angle to reduce the amount of light back reflected into fiber 214 from the tip of fiber end 215.
  • the tips of fiber ends 215 and 219 may also be cleaved, polished, or prepared in a variety of other fashions, such as making a lens on the tip.
  • the optical component can be any type of active or passive optical, opto-electrical or opto-mechanical component and not limited to the specific examples set forth herein.
  • the optical component can be aligned and its orientation fixed using any suitable .or desirable means.
  • the specific components and examples set forth herein are provided to demonstrate various aspects of the invention and do not limit ⁇ the scope of the invention. Other elements, shapes, components, configurations, etc. are within the scope of the invention. Any appropriate material can be used for various components.
  • the relative reference mount and other components are formed from a single crystal material such as silicon.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Information Retrieval, Db Structures And Fs Structures Therefor (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Automobile Manufacture Line, Endless Track Vehicle, Trailer (AREA)
  • Retarders (AREA)
  • Axle Suspensions And Sidecars For Cycles (AREA)
  • Lenses (AREA)

Abstract

L'invention concerne un module optique (12) destiné à être utilisé dans un dispositif optique (10). Le module (12) comprend un composant optique (14) et un élément (18) de montage de référence. Le composant optique (14) est fixé spatialement par rapport à une fonction (50) d'enregistrement. La fonction (50) d'enregistrement est configurée de manière à être couplée à un élément (20) de montage de référence fixe.
PCT/US2002/005497 2001-02-20 2002-02-20 Module optique WO2002067033A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
AU2002306579A AU2002306579A1 (en) 2001-02-20 2002-02-20 Optical module
GB0319381A GB2390174B (en) 2001-02-20 2002-02-20 Opticle module
US10/099,920 US20020181897A1 (en) 2001-02-20 2002-03-15 Optical module with electrical signal routing
US10/098,743 US20020168147A1 (en) 2001-02-20 2002-03-15 Optical circuit pick and place machine
US10/099,907 US20020154870A1 (en) 2001-02-20 2002-03-15 Optical module with heat dissipation

Applications Claiming Priority (22)

Application Number Priority Date Filing Date Title
US09/789,125 2001-02-20
US09/789,185 US6443631B1 (en) 2001-02-20 2001-02-20 Optical module with solder bond
US09/789,185 2001-02-20
US09/789,124 US6546172B2 (en) 2001-02-20 2001-02-20 Optical device
US09/789,317 US6590658B2 (en) 2001-02-20 2001-02-20 Optical alignment system
US09/789,125 US6546173B2 (en) 2001-02-20 2001-02-20 Optical module
US09/789,124 2001-02-20
US09/789,317 2001-02-20
US27633601P 2001-03-16 2001-03-16
US27633501P 2001-03-16 2001-03-16
US27632301P 2001-03-16 2001-03-16
US60/276,335 2001-03-16
US09/276,336 2001-03-16
US60/276,323 2001-03-16
US28816901P 2001-05-02 2001-05-02
US60/288,169 2001-05-02
US09/920,366 2001-08-01
US09/920,366 US6956999B2 (en) 2001-02-20 2001-08-01 Optical device
US31839901P 2001-09-10 2001-09-10
US60/318,399 2001-09-10
US34011401P 2001-12-14 2001-12-14
US60/340,114 2001-12-14

Related Child Applications (3)

Application Number Title Priority Date Filing Date
US10/099,920 Continuation-In-Part US20020181897A1 (en) 2001-02-20 2002-03-15 Optical module with electrical signal routing
US10/099,907 Continuation-In-Part US20020154870A1 (en) 2001-02-20 2002-03-15 Optical module with heat dissipation
US10/098,743 Continuation-In-Part US20020168147A1 (en) 2001-02-20 2002-03-15 Optical circuit pick and place machine

Publications (2)

Publication Number Publication Date
WO2002067033A2 true WO2002067033A2 (fr) 2002-08-29
WO2002067033A3 WO2002067033A3 (fr) 2003-10-30

Family

ID=27582758

Family Applications (4)

Application Number Title Priority Date Filing Date
PCT/US2002/005268 WO2002067032A2 (fr) 2001-02-20 2002-02-20 Systeme d'alignement optique
PCT/US2002/005498 WO2002067034A2 (fr) 2001-02-20 2002-02-20 Machine de transfert de circuit optique
PCT/US2002/005497 WO2002067033A2 (fr) 2001-02-20 2002-02-20 Module optique
PCT/US2002/005412 WO2002075415A2 (fr) 2001-02-20 2002-02-20 Dispositif optique

Family Applications Before (2)

Application Number Title Priority Date Filing Date
PCT/US2002/005268 WO2002067032A2 (fr) 2001-02-20 2002-02-20 Systeme d'alignement optique
PCT/US2002/005498 WO2002067034A2 (fr) 2001-02-20 2002-02-20 Machine de transfert de circuit optique

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/US2002/005412 WO2002075415A2 (fr) 2001-02-20 2002-02-20 Dispositif optique

Country Status (4)

Country Link
CN (2) CN1259585C (fr)
AU (2) AU2002306580A1 (fr)
GB (2) GB2387923B (fr)
WO (4) WO2002067032A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007076888A1 (fr) * 2005-12-30 2007-07-12 Fci Dispositif de couplage optique

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102969644A (zh) * 2011-08-29 2013-03-13 华新丽华股份有限公司 对位结构、激光光源模块及光学对位方法
US9983371B2 (en) * 2016-03-08 2018-05-29 Mellanox Technologies, Ltd. Optoelectronic transducer with integrally mounted thermoelectric cooler
CN114929441B (zh) * 2019-11-12 2025-02-28 光明机器公司 用于机器人组装的模块插入系统

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3250496B2 (ja) * 1997-09-19 2002-01-28 日本電気株式会社 光素子実装基板
US5337398A (en) * 1992-11-30 1994-08-09 At&T Bell Laboratories Single in-line optical package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007076888A1 (fr) * 2005-12-30 2007-07-12 Fci Dispositif de couplage optique

Also Published As

Publication number Publication date
CN1493013A (zh) 2004-04-28
GB2387923B (en) 2004-06-02
AU2002306580A1 (en) 2002-09-04
GB2390174A (en) 2003-12-31
WO2002067032A3 (fr) 2003-08-21
WO2002075415A2 (fr) 2002-09-26
AU2002306579A1 (en) 2002-09-04
GB0319381D0 (en) 2003-09-17
WO2002067034A2 (fr) 2002-08-29
WO2002067032A2 (fr) 2002-08-29
CN1502054A (zh) 2004-06-02
WO2002067033A3 (fr) 2003-10-30
WO2002067034A3 (fr) 2003-10-30
GB0319380D0 (en) 2003-09-17
CN1220086C (zh) 2005-09-21
WO2002075415A3 (fr) 2003-08-07
GB2387923A (en) 2003-10-29
CN1259585C (zh) 2006-06-14
GB2390174B (en) 2004-06-09

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