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WO2001034529A1 - Decoupe de verre par laser avec refroidissement par gaz surfondu - Google Patents

Decoupe de verre par laser avec refroidissement par gaz surfondu Download PDF

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Publication number
WO2001034529A1
WO2001034529A1 PCT/US2000/028987 US0028987W WO0134529A1 WO 2001034529 A1 WO2001034529 A1 WO 2001034529A1 US 0028987 W US0028987 W US 0028987W WO 0134529 A1 WO0134529 A1 WO 0134529A1
Authority
WO
WIPO (PCT)
Prior art keywords
super cooled
brittle material
carbon dioxide
cooled gas
glass
Prior art date
Application number
PCT/US2000/028987
Other languages
English (en)
Inventor
Dmitri Nikitin
Thomas Michel
Original Assignee
P.T.G. Precision Technology Center Limited Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by P.T.G. Precision Technology Center Limited Llc filed Critical P.T.G. Precision Technology Center Limited Llc
Priority to AU10967/01A priority Critical patent/AU1096701A/en
Publication of WO2001034529A1 publication Critical patent/WO2001034529A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam

Definitions

  • the present invention pertains to a method of separating brittle materials using controlled thermal stress to produce and propagate a crack to separate the material.
  • the cutting of glass has been done for centuries. The techniques developed many years ago are still in use today and remain fundamentally unchanged. Generally the cutting of glass consists of scribing a line, conforming to the shape desired, onto the surface to be cut with a material that is much harder than the glass itself, and then breaking the glass along the scribe line.
  • the scribing material is typically made from diamond, carbide, sapphire or zirconia. The action of the scribing chips away creates tiny fragments of glass from the glass surface leaving a small groove in its wake.
  • This groove creates a localized area of high stress in the glass. Because of these stresses, the glass tends to fracture along this line when it is stressed beyond its strength threshold. Thus, to break a piece of glass, one first scribes it and then "bends" it until it breaks. The problem with this method is that the break line is somewhat unpredictable because when the scribe chips the glass flakes away, it does so in an unpredictable and irregular geometry. The best way to control the break line predictability is to make the scribe line as narrow and as deep as possible. There are, however, certain practical limitations as to just how narrow and deep the scribe line can be made.
  • scribe point diameter scribe point diameter
  • scribe point geometry scribing pressure
  • homogeneity of the glass substrate material e.g., glass substrate material
  • velocity of the scribing e.g., velocity of the glass substrate material.
  • the practical limits of diamond point diameter, for present day industrial diamond scribes, is in the range of ⁇ ⁇ .0015" (0.00381 cm) radius ⁇ ⁇ .
  • Smaller size points can be made but increased wear factors and higher degrees of point fragility make their use infeasible.
  • the larger point sizes though more robust, create larger glass flake sizes and correspondingly, a larger stressed area and a shallower groove. This condition induces an unpredictable and more irregular break line.
  • the scribe point geometry also influences the break line qualities.
  • FIG. 1 Illustrated in FIG. 1 is an exemplary mechanical scribing process showing some of these problems.
  • Another disadvantage of scribing is that it creates volumes of tiny glass particles. Unless these particles are collected (adding more equipment and expense to the operation) they will find their way into the air and eventually onto a work surface, or more critically, a device surface.
  • thermal ablative cutting can work but has several undesirable characteristics.
  • This new, laser based, glass (or other brittle material) cutting method does not rely on burning or melting the glass in order to cut it.
  • the method which relies on the thermo-physical properties of glass, uses a laser, in a controlled manner, to heat the glass to a specific temperature and then stress it with a cooling jet.
  • the method embodies the creation of controlled sub-surface stresses within the glass which are induced by precise laser heating (or other appropriate energy transfer method) and immediate controlled cooling with a water/cool air mist.
  • the heat capacity of the water/air mist quickly removes the localized heat from the glass surface, which was caused by the laser, and thereby induces high tensile stresses deep in the glass body.
  • the heating and cooling creates stress that generates a micro-crack within the body of the glass with a controlled size (height) which is propagated through the body of the glass, in a plane normal to the glass surface and following the heat/chill path described by the translation of the laser beam/cooling jet across the glasses' surface which follows the outline of, and describes the shape of, the pattern to be cut from the glass.
  • the present invention provides an improvement over Kondratenko.
  • a system i.e. method and apparatus, for cutting a brittle material comprising heating the brittle material along a cut path, and subsequently cooling the brittle material.
  • the brittle material is heated along the cut path using a laser.
  • the brittle material is cooled by a stream of a cooling medium directed at the surface of the brittle material, wherein the cooling medium comprises a super cooled gas.
  • the super cooled gas comprises carbon dioxide, and more preferably the cooling medium comprises a solid powder phase of carbon dioxide, or a slurry comprising finely divided solid phase carbon dioxide.
  • FIG. 1 illustrates a conventional mechanical scribe method of cutting a brittle material.
  • FIG. 2 schematically illustrates an embodiment consistent with the present invention. With reference to FIG. 2, an exemplary brittle material cutting process is illustrated in schematic representation.
  • the brittle material 10 which may be, but is not limited to, mineral glass, silica, metal glasses, crystalline materials, and ceramics, is heated along a desired cut path 12 by the application of radiation, for example from a laser 14.
  • the heating of the brittle material 10 along the cut pat 12 may be accomplished by movement of the laser 14 or tracing the laser beam across the surface of the brittle material 10 or by movement of the brittle material 10 relative to a stationary laser beam.
  • the laser 14 contains appropriate optics to project an elongated, elliptical, or other appropriate heating field 16 on the surface of the brittle material 10.
  • the elongated heating field 16 allows optimum heating along the desired cut path 12 by preheating the brittle material with the less intense periphery of the laser heating field 16 and by increasing the heating duration along the cut path 12 for a given linear sweep speed.
  • Trailing along the cut path 12 behind the heating field 16 of the laser 14 is a cooling jet nozzle 18.
  • the cooling jet nozzle 18 produces a chill jet 20 which impinges the surface of the brittle material 10 behind the laser heating field 16.
  • the pressure and volume flow rate of the chill jet 20 is controlled by the nozzle 18 and by the chill jet control valve 24, wherein the cooling medium is supplied to the control valve 24 from a cooling medium supply (not illustrated).
  • the resultant thermal stress caused by the heating action of the laser 14 and the subsequent cooling of the chill jet produces a very fine and accurate micro-crack 22 in the brittle material 10 along the cut path 12 in a plane perpendicular to the surface of the brittle material 10.
  • the cooling parameter is very critical, and therein the cooling medium used to achieve the cooling of the brittle material 10 is also very critical.
  • the cooling medium must be capable of effecting a rapid heat transfer. In most cases this means that the cooling medium must be cold.
  • the cooling medium preferably is also anhydrous.
  • most specialized semiconductor applications require that there be no water present in the immediate atmosphere.
  • practical considerations must also be considered, such as cost, toxicity, pollution concerns, availability, etc.
  • the preferred cooling medium for use with the present invention is carbon dioxide, although gaseous nitrogen (near its liquefaction point) or air (similarly cooled) is also effective. Carbon dioxide possesses several critical and unique characteristics. First it becomes a very cold gas when decompressed.
  • the solid powder phase C0 2 is then propelled by pressure onto the surface of the brittle material 10 where it mechanically scrubs the surface of the brittle material 10 as it is sublimating and cooling the brittle material, carrying contaminates with it as it is blown away. Since it is a solid, though finely divided, its mass can be substantial. Therefore, it can act as an effective mechanical cleaner. And, since it is a finely divided powder it will impact upon and scrub out very small features on the surface of the brittle material 10. The powder imparts a "scrubbing" action to the area that it cools as it simultaneously sublimates; absorbing the local laser induced heat as it facilitates creation and propagation of the micro-crack.
  • the super cooled C0 2 is an inherently efficient medium for effecting thermal transfer from the brittle material's surface to itself. Its efficiency allows for economical operation and since C0 2 is a commonly used industrial material, it is readily available with good field support.
  • other gases such as super cooled N 2 or liquid air, either in gas or liquid phase, may also be used achieving some or all of the benefits realized with C0 2 .
  • Other gases such as super cooled helium also may be used but is less desirable due to cost and handling issues.
  • the separation of the brittle material 10 along the cut path 12 is found clean and smooth with no ripples or rough edges. While this invention has been disclosed and illustrated with reference to particular embodiments, the principles involved are susceptible for the use in numerous other embodiments. The invention is, therefore, not to be limited by the exemplary embodiments described in detail hereinabove, but only by the claims appended hereto.

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  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

L'invention se rapporte à un procédé et à un appareil de découpe d'un matériau cassant. Ledit procédé consiste à chauffer le matériau cassant le long d'un chemin de découpe, puis à refroidir ce matériau cassant à l'aide d'un flux de gaz surfondu dirigé à la surface du matériau cassant. De préférence, le gaz surfondu comporte du dioxyde de carbone en phase pulvérulente solide, ou une suspension épaisse comportant du dioxyde de carbone en phase solide finement divisée.
PCT/US2000/028987 1999-11-12 2000-10-19 Decoupe de verre par laser avec refroidissement par gaz surfondu WO2001034529A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU10967/01A AU1096701A (en) 1999-11-12 2000-10-19 Laser glass cutting with super cooled gas chill

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US16510099P 1999-11-12 1999-11-12
US60/165,100 1999-11-12

Publications (1)

Publication Number Publication Date
WO2001034529A1 true WO2001034529A1 (fr) 2001-05-17

Family

ID=22597428

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2000/028987 WO2001034529A1 (fr) 1999-11-12 2000-10-19 Decoupe de verre par laser avec refroidissement par gaz surfondu

Country Status (3)

Country Link
AU (1) AU1096701A (fr)
TW (1) TW458837B (fr)
WO (1) WO2001034529A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1806202A4 (fr) * 2004-10-25 2009-05-06 Mitsuboshi Diamond Ind Co Ltd Procede et dispositif pour former une fissure
CN113023644A (zh) * 2021-04-21 2021-06-25 南京艾尔普再生医学科技有限公司 一种生物实验用加热式全自动安瓿瓶开瓶装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5765421B2 (ja) * 2011-06-28 2015-08-19 株式会社Ihi 脆性的な部材を切断する装置、方法、および切断された脆性的な部材

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2139615A (en) * 1983-05-13 1984-11-14 Glaverbel Forming holes in vitreous sheets
WO1997007927A1 (fr) * 1995-08-31 1997-03-06 Corning Incorporated Procede et appareil servant a briser des materiaux cassants

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2139615A (en) * 1983-05-13 1984-11-14 Glaverbel Forming holes in vitreous sheets
WO1997007927A1 (fr) * 1995-08-31 1997-03-06 Corning Incorporated Procede et appareil servant a briser des materiaux cassants

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1806202A4 (fr) * 2004-10-25 2009-05-06 Mitsuboshi Diamond Ind Co Ltd Procede et dispositif pour former une fissure
US7726532B2 (en) 2004-10-25 2010-06-01 Mitsuboshi Diamond Industrial Co., Ltd. Method and apparatus for forming cracks
CN113023644A (zh) * 2021-04-21 2021-06-25 南京艾尔普再生医学科技有限公司 一种生物实验用加热式全自动安瓿瓶开瓶装置

Also Published As

Publication number Publication date
TW458837B (en) 2001-10-11
AU1096701A (en) 2001-06-06

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