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WO2001026812A1 - Structures microfluidiques et procedes de fabrication - Google Patents

Structures microfluidiques et procedes de fabrication Download PDF

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Publication number
WO2001026812A1
WO2001026812A1 PCT/SG2000/000159 SG0000159W WO0126812A1 WO 2001026812 A1 WO2001026812 A1 WO 2001026812A1 SG 0000159 W SG0000159 W SG 0000159W WO 0126812 A1 WO0126812 A1 WO 0126812A1
Authority
WO
WIPO (PCT)
Prior art keywords
plastic
substrate
channel
mould
cover
Prior art date
Application number
PCT/SG2000/000159
Other languages
English (en)
Inventor
Fong Yau Sam Li
Cheng Cheng Sharon Chiang
Original Assignee
Ce Resources Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ce Resources Pte Ltd filed Critical Ce Resources Pte Ltd
Priority to AU76985/00A priority Critical patent/AU7698500A/en
Publication of WO2001026812A1 publication Critical patent/WO2001026812A1/fr

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/26—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating electrochemical variables; by using electrolysis or electrophoresis
    • G01N27/416—Systems
    • G01N27/447—Systems using electrophoresis
    • G01N27/44756—Apparatus specially adapted therefor
    • G01N27/44791—Microapparatus
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
    • B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
    • B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
    • B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
    • B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06—Fluid handling related problems
    • B01L2200/0689—Sealing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00—Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/12—Specific details about manufacturing devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0809—Geometry, shape and general structure rectangular shaped
    • B01L2300/0816—Cards, e.g. flat sample carriers usually with flow in two horizontal directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00—Additional constructional details
    • B01L2300/08—Geometry, shape and general structure
    • B01L2300/0887—Laminated structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2400/00—Moving or stopping fluids
    • B01L2400/04—Moving fluids with specific forces or mechanical means
    • B01L2400/0403—Moving fluids with specific forces or mechanical means specific forces
    • B01L2400/0415—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic
    • B01L2400/0421—Moving fluids with specific forces or mechanical means specific forces electrical forces, e.g. electrokinetic electrophoretic flow

Definitions

  • the present invention relates to microfluidic structures.
  • the present invention relates to a geometric microstructure defining a liquid flow system.
  • TAS micro total analysis system
  • Chips with such planar structures have been developed in which a number of trenches or channels are fabricated in parallel.
  • a planar structure is produced by etching trenches into a semiconductor substrate, such as a Silicon wafer, and then covering the etched surface by a cover plate to complete the channels.
  • Such structures are, however, rather expensive to produce.
  • the etched substrate is most often opaque, the material per se is unsuitable for direct observation of channels or for optical detection of samples. Therefore, other substrate materials like glass, polydimethylsiloxane (PDMS) and polymethylmethacrylate (PMMA) are utilised.
  • PDMS polydimethylsiloxane
  • PMMA polymethylmethacrylate
  • the most widely used substrate for the substrate and microchip is glass.
  • the glass substrate is bonded to a glass cover plate.
  • bonding methods including thermally cured gluing agent (Clinical Chemistry 44:11 , 2249-2255, 1998), anodic bonding ( J Appl Phy 54(5), May 1983) and thermal bonding (Anal Chem, 1996,68,2044-2053) are utilised to make the contact surfaces form permanent bonds.
  • Polymers, eg. PDMS and PMMA (US5858188) are also used as chip substrate material. Permanent bonding was achieved via oxygen plasma (Anal Chem, 1998, 70,4974-4984).
  • Microfluidic glass structure permits extremely small conduit dimensions of a few microns in dimension.
  • such chips do not have to be permanently bonded together but may be repeatedly brought apart and placed together.
  • proper adhesion has to be achieved such that fluids in the channels do not leak out of the plates when fluids are pushed into the channels.
  • PDMS is often the preferred choice of material.
  • PDMS chips are often made by using a Si or a glass mould on which the PDMS prepolymer is being casted.
  • PMMA Injection-moulded plastic
  • Electrodes For analytical and/or separation purposes, it would be advantageous to incorporate electrodes in such chips.
  • a current method used to insert electrodes into sample/buffer wells could be found in a recent publication by SC Jacobson et al (Anal Chem 1994, 66, 1 107-1113). Others may include sputtering of metal onto chips and selectively removing portions of it by photolithography and metal etching to obtain metal lines that act as electrodes. These metal lines on the chips lead from wells to metal pads and can be connected to electrical power supply ( Anal Chem 1997, 69, 3153-3160).
  • Figure 1A-E show the structures formed during the various steps of the substrate fabrication process according to one embodiment of the present invention.
  • Fig.lA and 1 B are the perspective view and cross- sectional view along line A-A' of a negative relief pre-mould respectively.
  • Fig. 1C and 1 D are the perspective view and cross-sectional view along line A-A' of a positive relief mould respectively.
  • Fig.l E is a substrate formed by this process.
  • Figure 2 is a positive relief mould formed using another method of substrate fabrication according to the present invention.
  • Figure 3A shows an intermediate step in the fabrication process of electrodes on the substrate.
  • Figures 3B and 3C are schematic drawings of substrates fabricated according to the process shown in Fig. 3A.
  • Figure 4 is a schematic drawing to show a chip and its internal features produced according to the present invention.
  • Figure 5A and 5B show the various layers laminated together to form two chips according to the present invention.
  • Figure 5C shows another chip produced according to the present invention.
  • the present invention provides, in one aspect, microfluidic structures with at least one internal channel for fluid retention.
  • the microfluidic structure is a card-like chip comprising a substrate and a cover laminated thereon.
  • the substrate is preferably a thin planar structure with at least one fluid channel formed on at least one side.
  • a flexible chip is produced when a thin glass plate is used as the substrate.
  • the chip is an integral piece of plastic containing internal channels for fluid retention. This plastic chip may be provided with access holes for external access to the channels, and electrically conductive electrodes to allow electrical connection between fluid in the channel and the exterior.
  • the plastic chip may be made of thermoplastic or thermoset resin.
  • thermoset plastic substrate with formed features on at least one side is made using a mould with a positive relief pattern.
  • a cover made from a similar thermoset plastic is then placed on the substrate and the two structures cured together using either a layer of uncured plastic of the similar kind or a curing agent suitable for curing both structures.
  • the substrate and the cover are made from thermoplastic, and the two pieces are bonded together under the appropriate temperature and pressure. The resulting chip forms an integral piece of plastic with internal channels formed therein.
  • a plastic mould with a positive relief pattern is produced from a pre-mould containing a negative relief pattern.
  • the pre-mould is produced by conventional methods such as photolithography.
  • the substrate can then be formed using the plastic mould.
  • a thermoset plastic substrate from the same thermoset plastic mould a layer of metal is first provided on the mould, followed by additional of uncured thermoset resin to produce the substrate.
  • a piece of thermoplastic material is heat pressed at the appropriate temperature and pressure onto the mould to form the substrate with the desired features.
  • a chip refers to a planar structure containing microfluid channels.
  • a chip typically comprises a substrate bonded to a cover.
  • a substrate refers to the planar structure on which channels are formed.
  • the cover is typically a sheet or plate that may be bonded to one or both sides of the substrate.
  • a negative relief mould refers to a mould with the identical features as the substrate.
  • a positive relief mould refers to a mould with the complementary features as the substrate. Thus, for a substrate with recessed channels, a negative relief mould contains the identical recessed features, while a positive relief mould contains the complementary raised features.
  • Thermoplastics refer to a plastic that can be repeatedly softened by heating and hardened by cooling through a temperature range that is characteristic of the plastic and that in the softened state can be shaped into an article by moulding under apropriate conditions.
  • Thermoset plastics refer to plastics that contain reactive resins that can be cross-linked by a curing agent to form a cured rigid or flexible polymer.
  • the channels are generally for chemical and biological uses, such an diagnostic and purification apparatus.
  • the channels may be of any size, but typically are above 1 ⁇ m in diameter and preferably below 1 mm in diameter. For microfluidic applications, the channels may also be above 1 mm in diameter.
  • Figures 1A to E show one method of producing a substrate according to the present invention.
  • a pre-mould 1 2 with negative relief pattern 10 is used.
  • the pre-mould may be made of materials like Si, plastic materials, e.g. PMMA or any other suitable materials.
  • PDMS prepolymer is poured onto the pre-mould 10 and allowed to cure at a temperature of between about 25 to 80°C for a duration of between about 10min to 24 hours. After curing, the cured PDMS mould 18 is peeled off from the pre-mould. PDMS mould 18 to form a will have positive relief pattern 14 complementary to the one required in the final substrate.
  • FIG. 1 E shows PDMS substrate 22 with feature formed on one side.
  • another embodiment of the present invention uses a PMMA positive relief mould 24 with the complementary raised feature 26 to produce a PDMS substrate.
  • uncured PDMS is poured onto PMMA mould 24 and allowed to cure after which the cured PDMS substrate with the formed channel is removed from the PMMA mould 24.
  • This PDMS substrate has identical features to the one shown in Figure 1 E.
  • a flat piece of PMMA can be used as the substrate.
  • Laser writing or other engraving or etching methods is performed on this piece of PMMA substrate to give the desired pattern, similar to the structure obtained in Figure 1 E.
  • the features required are formed on a PMMA substrate by a heating and pressing step.
  • a glass plate with a positive relief pattern is used as a mould whereon a blank piece of PMMA substrate is pressed.
  • the pressing is performed with a pressure loading of at least 10 psi and with heating at a temperature between about 150 to 220°C. This treatment causes the pattern on the glass substrate to be transferred over to the PMMA substrate, giving the desired feature.
  • the substrate is further provided with electrically conductive electrodes such as metallic strips of Au or Pt.
  • electrically conductive electrodes such as metallic strips of Au or Pt.
  • a mask 34 with openings 32 corresponding to the desired electrode patterns is placed on top of a substrate 35 with channels 37.
  • the mask may be made of PMMA, transparencies, plastic sheets, metal or any other suitable material.
  • the substrate may be any polymer like PDMS or PMMA.
  • Metal is then sputtered onto the substrate 35 with the mask 34 placed on top.
  • the mask 34 is then removed after the sputtering to achieve a structure as shown in Figure 3B.
  • Sputtered metals 38 serve as electrodes.
  • the same process may be applied to the fabrication of electrodes on the covers and substrates made of glass.
  • Figure 3C shows a cover 36 which electrodes 38 are formed.
  • a layer of metal is first sputtered onto the substrate after which a layer of photoresist is spin- coated on top of the metal.
  • the photoresist is exposed under UV light using a metal mask with a desired pattern. After exposure, the photoresist is developed and the exposed metal is etched away. The unexposed photoresist is then removed using a suitable solvent, e.g. acetone or chloroform or suitable plasma chemistry like oxygen plasma.
  • a suitable solvent e.g. acetone or chloroform or suitable plasma chemistry like oxygen plasma.
  • the metallic strips are then exposed and the final substrate formed has features similar to the ones shown in Fig.3B and 3C.
  • photoresist can first be spin- coated onto the surface of a blanked substrate.
  • the surface must first be plasma-treated(oxygen plasma) in order to modify the surface to become hydrophilic.
  • the substrate with the photoresist is then exposed under the UV light or other light source of suitable wavelength through a suitable mask and then developed to remove the exposed photoresist.
  • Metal is then sputtered onto the regions of the substrate whereby there is no photoresist and any excess photoresist is then removed using acetone or chloroform or suitable plasma chemistry like oxygen plasma.
  • the final substrate formed is similar to the ones shown in Fig. 3B and 3C.
  • a cover has to be provided to close the channels formed on the substrate.
  • Different methods may be used to provide a leak-proof seal of the channels, depending on the type of material used to make the substrate.
  • holes are first formed on the cover to act as access holes for the channels in the formed chip. The holes may be simply punched in the cover used to close the channels of the substrate.
  • a thin layer of fresh and uncured PDMS is applied onto the featured sur ace 40 of substrate 42.
  • the channels 46 are provided with electrodes 48.
  • the uncured PDMS is spread across the surface 40 evenly by either spin-coating or simply using a ruler to brush across the surface to smoothen and remove the excess PDMS at the same time.
  • Cover 50 containing pre-punched holes 44 is then placed on top of substrate 40 with proper alignment. Compressed gas may be blown through each of the holes 44 to further prevent any blockage of the microchannels from the curing PDMS.
  • the whole system is then placed in the oven to cure at a temperature of between about 25 to 80°C for a duration of between about 10min to 24 hours.
  • a small fresh amount of curing agent can also be applied between substrate 40 and cover 50 to cause bonding.
  • the resulting chip is substantially one integral piece of PDMS plastic chip of a uniform material with internal channels (and, optionally, electrodes) provided therein.
  • the two parts are thermal bonded together under appropriate conditions.
  • some suitable solvent can be used to dissolve a thin layer of PMMA in either the substrate or the cover, and the two structures are then placed together. Thermal bonding will occur when the two structures are allowed to stand either at ambient temperature or at an elevated temperature of between about 150 to 220°C.
  • a chip similar to the one shown in Figure 4 is then formed. The resulting chip is again substantially one integral piece of PMMA plastic chip with internal channels (and, optionally, electrodes) provided therein.
  • a photo-activateable glue is applied to the featured surface of the substrate before the cover is placed thereon.
  • a mask containing the same features is then placed on the cover.
  • a device providing photons in the activation wavelength is then directed at the cover and substrate such that the photo-activateable glue would be cured at the prescribed surfaces.
  • the glue located at the features would not be cured due to the protection of the mask from the activating photons.
  • a suitable solvent is then used to remove the non- activated glue.
  • the cover or substrate should be transparent to the activation wavelength, and may be made from the same material as the glue.
  • the substrate may be either a flexible material such as polymer, thermoplastic or thermoset resin, or of rigid material such as glass and Silica.
  • the substrate 60 with channels 62 are placed between 2 sheets of thermoplastic 64 and 66.
  • the thermoplastic sheet may be of the type commonly used for lamination of cards and paper, such as polyester and MylarTM.
  • the top sheet 64 directly above the channel has holes 68 at appropriate positions to act as openings to the channels. Heat lamination using a conventional lamination machine of the prescribed thermoplastic results in bonding of the three layers.
  • the substrate may be any thickness depending on the requirements of different application. Typically, the thickness is 10-
  • a card size chip is produced.
  • a flexible chip is obtained, even with a substrate is made from a rigid material such as silica or glass.
  • the substrate in the specific example described in Fig.5A is 15 ⁇ m thick.
  • metallic electrodes 70 can be fabricated at the ends of channel 71 on substrate 72 before lamination, as shown in Figure 5B.
  • holes 74 are provided on the plastic cover 76 to coincide with the electrodes, allowing electrodes 70 to connect to external circuitry.
  • substrate 72 is sandwiched between plastic sheets 76 and 78 and bonded together by lamination.
  • a microprocessor 58 can be co-bonded with the chip 60 for controlling the operations of the chip.
  • specific and unique instructions may be programmed into microprocessor 58 to electronically control the entire capillary electrophoresis process within channel 62 and to provide a unique separation procedure to be carried out on the chip.
  • the above discussion gives specific examples of performing the present invention. It is clear, however, that many variations are possible, and different material may be fabricated under different conditions.
  • the curing of PDMS can occur at temperatures of up to 200°C, and the curing time may be any period above 1 minute.
  • the pressing of a blank piece of PMMA onto a positive relief mould to form the desired pattern may occur at any suitable temperature, e.g. 100-200°C, and any suitable pressure, e.g. above 2psi.
  • Polycarbonate may be used as a material for the substrate.

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Electrochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Hematology (AREA)
  • Clinical Laboratory Science (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne des structures microfluidiques possédant au moins un canal interne destiné à la rétention de fluide. Dans une réalisation, la structure microfluidique est un circuit de type carte comprenant un substrat protégé par une couverture laminée. Le substrat est constitué, de préférence, d'une structure plane dotée d'au moins un canal pour fluide sur au moins un côté. On peut produire un circuit souple lorsque l'on utilise, comme substrat, une plaque de verre mince. Dans une autre réalisation, le circuit est constitué d'une pièce unique de matière plastique contenant des canaux internes destinés à la rétention de fluide. Ce circuit en matière plastique peut être doté de trous destinés à permettre un accès extérieur aux canaux, ainsi que d'électrodes électriquement conductrices permettant une connexion électrique entre un fluide dans le canal et l'extérieur. Ce circuit peut être réalisé en matière plastique thermoplastique ou thermodurcissable.
PCT/SG2000/000159 1999-10-14 2000-09-20 Structures microfluidiques et procedes de fabrication WO2001026812A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU76985/00A AU7698500A (en) 1999-10-14 2000-09-20 Microfluidic structures and methods of fabrication

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SG9905167 1999-10-14
SG9905167-4 1999-10-14

Publications (1)

Publication Number Publication Date
WO2001026812A1 true WO2001026812A1 (fr) 2001-04-19

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AU (1) AU7698500A (fr)
WO (1) WO2001026812A1 (fr)

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003046542A3 (fr) * 2001-11-27 2003-12-18 Lab901 Ltd Appareil et procedes pour des applications microfluidiques
KR100425536B1 (ko) * 2001-07-16 2004-03-30 학교법인 포항공과대학교 유체 마이크로칩용 브레드보드
KR100442413B1 (ko) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 표면에 금속 미세 패턴을 가진 플라스틱 기판의 제조방법
WO2004075241A1 (fr) * 2003-02-19 2004-09-02 Åmic AB Gicleurs pour ionisation par electronebulisation et procedes de fabrication de ces gicleurs
US7007710B2 (en) 2003-04-21 2006-03-07 Predicant Biosciences, Inc. Microfluidic devices and methods
EP1642645A1 (fr) * 2004-09-30 2006-04-05 Lifescan, Inc. Procédé de fabrication d'un module d'analyse avec plots de contact éléctroconducteurs accessibles pour un système microfluidique d'analyse
EP1642646A1 (fr) * 2004-09-30 2006-04-05 Lifescan, Inc. Système microfluidique d'analyse avec plots de contact éléctroconducteurs accessibles
WO2006104460A1 (fr) * 2005-03-30 2006-10-05 Agency For Science, Technology And Research Procede et appareils pour la formation continue de dispositifs microfluidiques
US7122093B1 (en) * 2002-05-14 2006-10-17 The Ohio State University Gas-assisted resin injection technique for bonding and surface modification in micro-fluidic devices
CN1293202C (zh) * 2003-07-29 2007-01-03 中国科学院电子学研究所 聚二甲基硅氧烷夹心式微流体生物芯片
WO2008021465A2 (fr) * 2006-08-17 2008-02-21 Massachusetts Institute Of Technology Procédé et dispositif pour injection microfluidique
US7391020B2 (en) 2004-09-21 2008-06-24 Luc Bousse Electrospray apparatus with an integrated electrode
EP2329884A1 (fr) * 2009-11-04 2011-06-08 Boehringer Ingelheim microParts GmbH Procédé de durcissement d'une colle
US8012430B2 (en) * 2004-03-04 2011-09-06 National Institute Of Advanced Industrial Science And Technology Methods for producing microchannel chips, microchannel chips, methods for separating biomolecules using the microchannel chips, and electrophoretic apparatus having the microchannel chips
US8143337B1 (en) 2005-10-18 2012-03-27 The Ohio State University Method of preparing a composite with disperse long fibers and nanoparticles
CN101430299B (zh) * 2008-12-19 2012-09-05 清华大学 一种用于生物医学流体的微型可逆密封结构和制作方法
CN103055985A (zh) * 2012-12-31 2013-04-24 兰州大学 一种基于金属丝热压法的聚合物微流控芯片批量制造工艺
CN103055981A (zh) * 2012-12-31 2013-04-24 苏州汶颢芯片科技有限公司 一种聚二甲基硅氧烷微流控芯片及其制备方法
US8501305B2 (en) 2007-01-16 2013-08-06 Agilent Technologies, Inc. Laminate
US8507568B2 (en) 2008-05-28 2013-08-13 The Ohio State University Suspension polymerization and foaming of water containing activated carbon-nano/microparticulate polymer composites
CN103723676A (zh) * 2013-12-26 2014-04-16 浙江清华长三角研究院萧山生物工程中心 一种微流体通道的制备方法
US8900531B2 (en) 2003-12-18 2014-12-02 Nanoentek Inc. Method for bonding plastic micro chip
CN105214747A (zh) * 2015-11-11 2016-01-06 东南大学 一种夹片式微流控器件及制造方法
CN106531646A (zh) * 2016-12-26 2017-03-22 中国科学院长春光学精密机械与物理研究所 一种微流控芯片的封装方法
CN109409486A (zh) * 2018-10-31 2019-03-01 江苏恒宝智能系统技术有限公司 一种智能卡及其加工方法
CN119143078A (zh) * 2024-11-20 2024-12-17 深圳大学 微流控芯片的制造方法
US12302505B2 (en) 2019-12-10 2025-05-13 Singapore University Of Technology And Design Thin film-based microfluidic electronic device, method of forming thereof, and skin and tissue adhesive applications

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WO1998039645A1 (fr) * 1997-03-07 1998-09-11 Beckman Coulter, Inc. Nouveau capillaire
DE19816224A1 (de) * 1997-04-14 1998-10-15 Olympus Optical Co Zur Fluidanalyse Verwendetes Mikrokanalelement
WO1999029497A1 (fr) * 1997-12-10 1999-06-17 Caliper Technologies Corporation Fabrication de circuits microfluidiques par le biais de techniques d'impression

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Publication number Priority date Publication date Assignee Title
WO1991016966A1 (fr) * 1990-05-10 1991-11-14 Pharmacia Biosensor Ab Structure microfluidique et procede pour sa fabrication
WO1998039645A1 (fr) * 1997-03-07 1998-09-11 Beckman Coulter, Inc. Nouveau capillaire
DE19816224A1 (de) * 1997-04-14 1998-10-15 Olympus Optical Co Zur Fluidanalyse Verwendetes Mikrokanalelement
WO1999029497A1 (fr) * 1997-12-10 1999-06-17 Caliper Technologies Corporation Fabrication de circuits microfluidiques par le biais de techniques d'impression

Cited By (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100425536B1 (ko) * 2001-07-16 2004-03-30 학교법인 포항공과대학교 유체 마이크로칩용 브레드보드
KR100442413B1 (ko) * 2001-08-04 2004-07-30 학교법인 포항공과대학교 표면에 금속 미세 패턴을 가진 플라스틱 기판의 제조방법
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