WO2001095352A3 - Appareil et procede ameliorant l'acceleration des electrons - Google Patents
Appareil et procede ameliorant l'acceleration des electrons Download PDFInfo
- Publication number
- WO2001095352A3 WO2001095352A3 PCT/US2001/017190 US0117190W WO0195352A3 WO 2001095352 A3 WO2001095352 A3 WO 2001095352A3 US 0117190 W US0117190 W US 0117190W WO 0195352 A3 WO0195352 A3 WO 0195352A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- voltage
- vhf
- plasma reactor
- wafer chuck
- accelerating electrons
- Prior art date
Links
- 238000000034 method Methods 0.000 title abstract 2
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32697—Electrostatic control
- H01J37/32706—Polarising the substrate
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Drying Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2001265057A AU2001265057A1 (en) | 2000-06-02 | 2001-05-29 | Apparatus and method for improving electron acceleration |
JP2002502799A JP2003536250A (ja) | 2000-06-02 | 2001-05-29 | 電子の加速を改善するための装置及び方法 |
US10/307,484 US20030094239A1 (en) | 2000-06-02 | 2002-12-02 | Apparatus and method for improving electron ecceleration |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US20856800P | 2000-06-02 | 2000-06-02 | |
US60/208,568 | 2000-06-02 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/307,484 Continuation US20030094239A1 (en) | 2000-06-02 | 2002-12-02 | Apparatus and method for improving electron ecceleration |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2001095352A2 WO2001095352A2 (fr) | 2001-12-13 |
WO2001095352A3 true WO2001095352A3 (fr) | 2002-05-30 |
Family
ID=22775074
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/017190 WO2001095352A2 (fr) | 2000-06-02 | 2001-05-29 | Appareil et procede ameliorant l'acceleration des electrons |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2003536250A (fr) |
AU (1) | AU2001265057A1 (fr) |
TW (1) | TW506012B (fr) |
WO (1) | WO2001095352A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4388287B2 (ja) * | 2003-02-12 | 2009-12-24 | 東京エレクトロン株式会社 | プラズマ処理装置及び高周波電力供給装置 |
CN101989525A (zh) * | 2009-08-05 | 2011-03-23 | 中微半导体设备(上海)有限公司 | 具备可切换偏置频率的等离子体处理腔及可切换匹配网络 |
JP7250663B2 (ja) * | 2018-12-19 | 2023-04-03 | 東京エレクトロン株式会社 | プラズマ処理装置及びインピーダンスの整合方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0495524A1 (fr) * | 1991-01-18 | 1992-07-22 | Applied Materials, Inc. | Système de traitement d'un pièce dans un plasma et procédé de génération dudit plasma |
JPH10270419A (ja) * | 1997-03-24 | 1998-10-09 | Hitachi Ltd | プラズマエッチング装置およびプラズマエッチング方法 |
US5846885A (en) * | 1995-08-23 | 1998-12-08 | Fujitsu Limited | Plasma treatment method |
-
2001
- 2001-05-29 TW TW90112955A patent/TW506012B/zh not_active IP Right Cessation
- 2001-05-29 AU AU2001265057A patent/AU2001265057A1/en not_active Abandoned
- 2001-05-29 WO PCT/US2001/017190 patent/WO2001095352A2/fr active Application Filing
- 2001-05-29 JP JP2002502799A patent/JP2003536250A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0495524A1 (fr) * | 1991-01-18 | 1992-07-22 | Applied Materials, Inc. | Système de traitement d'un pièce dans un plasma et procédé de génération dudit plasma |
US5846885A (en) * | 1995-08-23 | 1998-12-08 | Fujitsu Limited | Plasma treatment method |
JPH10270419A (ja) * | 1997-03-24 | 1998-10-09 | Hitachi Ltd | プラズマエッチング装置およびプラズマエッチング方法 |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 01 29 January 1999 (1999-01-29) * |
Also Published As
Publication number | Publication date |
---|---|
TW506012B (en) | 2002-10-11 |
AU2001265057A1 (en) | 2001-12-17 |
JP2003536250A (ja) | 2003-12-02 |
WO2001095352A2 (fr) | 2001-12-13 |
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