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WO2001091969A3 - Polishing methods and apparatus for semiconductor and integrated circuit manufacture - Google Patents

Polishing methods and apparatus for semiconductor and integrated circuit manufacture Download PDF

Info

Publication number
WO2001091969A3
WO2001091969A3 PCT/US2001/017774 US0117774W WO0191969A3 WO 2001091969 A3 WO2001091969 A3 WO 2001091969A3 US 0117774 W US0117774 W US 0117774W WO 0191969 A3 WO0191969 A3 WO 0191969A3
Authority
WO
WIPO (PCT)
Prior art keywords
semiconductor
integrated circuit
polishing methods
circuit manufacture
polish
Prior art date
Application number
PCT/US2001/017774
Other languages
French (fr)
Other versions
WO2001091969A2 (en
Inventor
Nelson W Ii White
Albert H Liu
Original Assignee
Philips Semiconductors Inc
Koninkl Philips Electronics Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Semiconductors Inc, Koninkl Philips Electronics Nv filed Critical Philips Semiconductors Inc
Priority to JP2001587967A priority Critical patent/JP2003535462A/en
Priority to EP01948263A priority patent/EP1289713A2/en
Publication of WO2001091969A2 publication Critical patent/WO2001091969A2/en
Publication of WO2001091969A3 publication Critical patent/WO2001091969A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/013—Application of loose grinding agent as auxiliary tool during truing operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

A method of conditioning a polish pad (202) at the point of polish. In one embodiment, the method comprises several steps. In the first step, polishing slurry is received at a CMP machine (200). Next, a polish pad (202) is rotated. Then, the polish pad is conditioned proximately around a location designated for holding a wafer (205).
PCT/US2001/017774 2000-05-31 2001-05-31 Polishing methods and apparatus for semiconductor and integrated circuit manufacture WO2001091969A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001587967A JP2003535462A (en) 2000-05-31 2001-05-31 Polishing method and apparatus for manufacturing semiconductors and integrated circuits
EP01948263A EP1289713A2 (en) 2000-05-31 2001-05-31 Polishing methods and apparatus for semiconductor and integrated circuit manufacture

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US58655500A 2000-05-31 2000-05-31
US09/586,555 2000-05-31

Publications (2)

Publication Number Publication Date
WO2001091969A2 WO2001091969A2 (en) 2001-12-06
WO2001091969A3 true WO2001091969A3 (en) 2002-05-23

Family

ID=24346219

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/017774 WO2001091969A2 (en) 2000-05-31 2001-05-31 Polishing methods and apparatus for semiconductor and integrated circuit manufacture

Country Status (3)

Country Link
EP (1) EP1289713A2 (en)
JP (1) JP2003535462A (en)
WO (1) WO2001091969A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101279819B1 (en) 2005-04-12 2013-06-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스 인코포레이티드 Radial-biased polishing pad

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998008651A1 (en) * 1996-08-28 1998-03-05 Speedfam Corporation Device for conditioning polishing pads utilizing brazed cubic boron nitride technology
US5749771A (en) * 1994-02-22 1998-05-12 Nec Corporation Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost
US5906754A (en) * 1995-10-23 1999-05-25 Texas Instruments Incorporated Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications
US5913714A (en) * 1997-04-04 1999-06-22 Ontrak Systems, Inc. Method for dressing a polishing pad during polishing of a semiconductor wafer
US6007411A (en) * 1997-06-19 1999-12-28 Interantional Business Machines Corporation Wafer carrier for chemical mechanical polishing

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5749771A (en) * 1994-02-22 1998-05-12 Nec Corporation Polishing apparatus for finishing semiconductor wafer at high polishing rate under economical running cost
US5906754A (en) * 1995-10-23 1999-05-25 Texas Instruments Incorporated Apparatus integrating pad conditioner with a wafer carrier for chemical-mechanical polishing applications
WO1998008651A1 (en) * 1996-08-28 1998-03-05 Speedfam Corporation Device for conditioning polishing pads utilizing brazed cubic boron nitride technology
US5913714A (en) * 1997-04-04 1999-06-22 Ontrak Systems, Inc. Method for dressing a polishing pad during polishing of a semiconductor wafer
US6007411A (en) * 1997-06-19 1999-12-28 Interantional Business Machines Corporation Wafer carrier for chemical mechanical polishing

Also Published As

Publication number Publication date
EP1289713A2 (en) 2003-03-12
JP2003535462A (en) 2003-11-25
WO2001091969A2 (en) 2001-12-06

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