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WO2001078152A3 - Dispositif semi-conducteur du type diode schottky - Google Patents

Dispositif semi-conducteur du type diode schottky Download PDF

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Publication number
WO2001078152A3
WO2001078152A3 PCT/FR2001/001101 FR0101101W WO0178152A3 WO 2001078152 A3 WO2001078152 A3 WO 2001078152A3 FR 0101101 W FR0101101 W FR 0101101W WO 0178152 A3 WO0178152 A3 WO 0178152A3
Authority
WO
WIPO (PCT)
Prior art keywords
layer
schottky
semiconductor device
substrate
diode semiconductor
Prior art date
Application number
PCT/FR2001/001101
Other languages
English (en)
Other versions
WO2001078152A2 (fr
Inventor
Pierre Di Rossel
Frederic Morancho
Nathalie Cezac
Henri Tranduc
Original Assignee
Centre Nat Rech Scient
Mme Rossel Hf
Frederic Morancho
Nathalie Cezac
Henri Tranduc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre Nat Rech Scient, Mme Rossel Hf, Frederic Morancho, Nathalie Cezac, Henri Tranduc filed Critical Centre Nat Rech Scient
Priority to EP01923789A priority Critical patent/EP1273046A2/fr
Priority to AU2001250477A priority patent/AU2001250477A1/en
Priority to US10/239,629 priority patent/US20040046224A1/en
Priority to JP2001574907A priority patent/JP2003530700A/ja
Publication of WO2001078152A2 publication Critical patent/WO2001078152A2/fr
Publication of WO2001078152A3 publication Critical patent/WO2001078152A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions
    • H10D62/107—Buried supplementary regions, e.g. buried guard rings 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/109—Reduced surface field [RESURF] PN junction structures
    • H10D62/111—Multiple RESURF structures, e.g. double RESURF or 3D-RESURF structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D8/00—Diodes
    • H10D8/60—Schottky-barrier diodes 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/102—Constructional design considerations for preventing surface leakage or controlling electric field concentration
    • H10D62/103—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices
    • H10D62/105—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE] 
    • H10D62/106—Constructional design considerations for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse-biased devices by having particular doping profiles, shapes or arrangements of PN junctions; by having supplementary regions, e.g. junction termination extension [JTE]  having supplementary regions doped oppositely to or in rectifying contact with regions of the semiconductor bodies, e.g. guard rings with PN or Schottky junctions

Landscapes

  • Electrodes Of Semiconductors (AREA)

Abstract

Dispositif semi-conducteur du type diode Schottky, comprenant un substrat constitué de première (2) et deuxième (3) couches semi-conductrices d'un même type de conduction superposées dans ledit substrat, la deuxième couche (3) étant plus fortement dopée que la première (2), ledit substrat présentant des première (4) et deuxième (5) surfaces principales en contact avec des première (8) et deuxième (6) électrodes, une barrière de Schottky étant formée entre ladite première électrode (8) et ladite première couche, caractérisé en ce que la pluralité d'îlots (9) de type de conduction opposé à celui de ladite première couche (2) sont disposés en lits espacés dans l'épaisseur de ladite couche (2).
PCT/FR2001/001101 2000-04-10 2001-04-10 Dispositif semi-conducteur du type diode schottky WO2001078152A2 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP01923789A EP1273046A2 (fr) 2000-04-10 2001-04-10 Dispositif semi-conducteur du type diode schottky
AU2001250477A AU2001250477A1 (en) 2000-04-10 2001-04-10 Schottky-diode semiconductor device
US10/239,629 US20040046224A1 (en) 2000-04-10 2001-04-10 Schottky-diode semiconductor device
JP2001574907A JP2003530700A (ja) 2000-04-10 2001-04-10 ショットキーダイオードタイプの半導体装置及びその使用方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR0004583A FR2807569B1 (fr) 2000-04-10 2000-04-10 Perfectionnement apportes aux diodes schottky
FR00/04583 2000-04-10

Publications (2)

Publication Number Publication Date
WO2001078152A2 WO2001078152A2 (fr) 2001-10-18
WO2001078152A3 true WO2001078152A3 (fr) 2002-02-07

Family

ID=8849086

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/FR2001/001101 WO2001078152A2 (fr) 2000-04-10 2001-04-10 Dispositif semi-conducteur du type diode schottky

Country Status (7)

Country Link
US (1) US20040046224A1 (fr)
EP (1) EP1273046A2 (fr)
JP (1) JP2003530700A (fr)
KR (1) KR20030011820A (fr)
AU (1) AU2001250477A1 (fr)
FR (1) FR2807569B1 (fr)
WO (1) WO2001078152A2 (fr)

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002084745A2 (fr) 2001-04-11 2002-10-24 Silicon Wireless Corporation Dispositifs semi-conducteurs de puissance presentant des zones ecran de base s'etendant lateralement qui empechent de traverser la base et procedes de fabrication associes
US7442629B2 (en) 2004-09-24 2008-10-28 President & Fellows Of Harvard College Femtosecond laser-induced formation of submicrometer spikes on a semiconductor substrate
US7057256B2 (en) 2001-05-25 2006-06-06 President & Fellows Of Harvard College Silicon-based visible and near-infrared optoelectric devices
US7238976B1 (en) * 2004-06-15 2007-07-03 Qspeed Semiconductor Inc. Schottky barrier rectifier and method of manufacturing the same
JP4990140B2 (ja) 2004-08-31 2012-08-01 フリースケール セミコンダクター インコーポレイテッド パワー半導体デバイス
US7737522B2 (en) * 2005-02-11 2010-06-15 Alpha & Omega Semiconductor, Ltd. Trench junction barrier controlled Schottky device with top and bottom doped regions for enhancing forward current in a vertical direction
US7671439B2 (en) * 2005-02-11 2010-03-02 Alpha & Omega Semiconductor, Ltd. Junction barrier Schottky (JBS) with floating islands
DE102005046706B4 (de) 2005-09-29 2007-07-05 Siced Electronics Development Gmbh & Co. Kg JBS-SiC-Halbleiterbauelement
WO2007075996A2 (fr) * 2005-12-27 2007-07-05 Qspeed Semiconductor Inc. Appareil et procédé pour structure de redresseur à rétablissement rapide
US7633135B2 (en) * 2007-07-22 2009-12-15 Alpha & Omega Semiconductor, Ltd. Bottom anode Schottky diode structure and method
US7560355B2 (en) * 2006-10-24 2009-07-14 Vishay General Semiconductor Llc Semiconductor wafer suitable for forming a semiconductor junction diode device and method of forming same
DE102007009227B4 (de) 2007-02-26 2009-01-02 Infineon Technologies Ag Halbleiterbauelement mit gleichrichtenden Übergängen sowie Herstellungsverfahren zur Herstellung desselben
US7750426B2 (en) 2007-05-30 2010-07-06 Intersil Americas, Inc. Junction barrier Schottky diode with dual silicides
TW200847448A (en) * 2007-05-30 2008-12-01 Intersil Inc Junction barrier schottky diode
US8368166B2 (en) * 2007-05-30 2013-02-05 Intersil Americas Inc. Junction barrier Schottky diode
JP2007311822A (ja) * 2007-07-23 2007-11-29 Toshiba Corp ショットキーバリヤダイオード
JP2009076866A (ja) * 2007-08-31 2009-04-09 Sumitomo Electric Ind Ltd ショットキーバリアダイオード
US9102962B2 (en) * 2007-10-16 2015-08-11 Shiu Nan Chen Production method for solid cultured active mushroom mycelium and fruit-body metabolites (AMFM) products thereof
US8212327B2 (en) * 2008-03-06 2012-07-03 Sionyx, Inc. High fill-factor laser-treated semiconductor device on bulk material with single side contact scheme
US7851881B1 (en) * 2008-03-21 2010-12-14 Microsemi Corporation Schottky barrier diode (SBD) and its off-shoot merged PN/Schottky diode or junction barrier Schottky (JBS) diode
US8106487B2 (en) * 2008-12-23 2012-01-31 Pratt & Whitney Rocketdyne, Inc. Semiconductor device having an inorganic coating layer applied over a junction termination extension
US9673243B2 (en) 2009-09-17 2017-06-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US9911781B2 (en) 2009-09-17 2018-03-06 Sionyx, Llc Photosensitive imaging devices and associated methods
US8692198B2 (en) 2010-04-21 2014-04-08 Sionyx, Inc. Photosensitive imaging devices and associated methods
CN106449684B (zh) 2010-06-18 2019-09-27 西奥尼克斯公司 高速光敏设备及相关方法
US9496308B2 (en) 2011-06-09 2016-11-15 Sionyx, Llc Process module for increasing the response of backside illuminated photosensitive imagers and associated methods
CN103946867A (zh) 2011-07-13 2014-07-23 西奥尼克斯公司 生物计量成像装置和相关方法
US8362585B1 (en) 2011-07-15 2013-01-29 Alpha & Omega Semiconductor, Inc. Junction barrier Schottky diode with enforced upper contact structure and method for robust packaging
US9064764B2 (en) 2012-03-22 2015-06-23 Sionyx, Inc. Pixel isolation elements, devices, and associated methods
KR20150130303A (ko) 2013-02-15 2015-11-23 사이오닉스, 아이엔씨. 안티 블루밍 특성 및 관련 방법을 가지는 높은 동적 범위의 cmos 이미지 센서
US9939251B2 (en) 2013-03-15 2018-04-10 Sionyx, Llc Three dimensional imaging utilizing stacked imager devices and associated methods
JP2014236171A (ja) * 2013-06-05 2014-12-15 ローム株式会社 半導体装置およびその製造方法
WO2014209421A1 (fr) 2013-06-29 2014-12-31 Sionyx, Inc. Régions texturées formées de tranchées peu profondes et procédés associés.
US9070790B2 (en) * 2013-08-29 2015-06-30 Infineon Technologies Ag Vertical semiconductor device and method of manufacturing thereof
US9704949B1 (en) * 2016-06-30 2017-07-11 General Electric Company Active area designs for charge-balanced diodes
CN116093164B (zh) * 2023-04-07 2023-07-11 深圳市晶扬电子有限公司 一种带有浮岛型保护环的高压肖特基二极管

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2361750A1 (fr) * 1976-08-09 1978-03-10 Philips Nv Dispositif semi-conducteur a jonction redresseuse metal-semi-conducteur
JPH06275816A (ja) * 1993-03-18 1994-09-30 Shindengen Electric Mfg Co Ltd ショットキバリヤダイオ−ド
US5747841A (en) * 1994-12-20 1998-05-05 U.S. Philips Corporation Circuit arrangement, and junction field effect transistor suitable for use in such a circuit arrangement
JPH10117003A (ja) * 1996-10-14 1998-05-06 Hitachi Ltd 定電圧ダイオード及びその製造方法
WO1999053550A1 (fr) * 1998-04-08 1999-10-21 Siemens Aktiengesellschaft Element de terminaison marginal haute tension pour structures de type planar

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4837227B1 (fr) * 1968-12-20 1973-11-09
US6037632A (en) * 1995-11-06 2000-03-14 Kabushiki Kaisha Toshiba Semiconductor device
DE19943143B4 (de) * 1999-09-09 2008-04-24 Infineon Technologies Ag Halbleiterbauelement für hohe Sperrspannungen bei gleichzeitig niedrigem Einschaltwiderstand und Verfahren zu dessen Herstellung
DE10061528C1 (de) * 2000-12-11 2002-07-25 Infineon Technologies Ag Mittels Feldeffekt steuerbares Halbleiterbauelement

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2361750A1 (fr) * 1976-08-09 1978-03-10 Philips Nv Dispositif semi-conducteur a jonction redresseuse metal-semi-conducteur
JPH06275816A (ja) * 1993-03-18 1994-09-30 Shindengen Electric Mfg Co Ltd ショットキバリヤダイオ−ド
US5747841A (en) * 1994-12-20 1998-05-05 U.S. Philips Corporation Circuit arrangement, and junction field effect transistor suitable for use in such a circuit arrangement
JPH10117003A (ja) * 1996-10-14 1998-05-06 Hitachi Ltd 定電圧ダイオード及びその製造方法
WO1999053550A1 (fr) * 1998-04-08 1999-10-21 Siemens Aktiengesellschaft Element de terminaison marginal haute tension pour structures de type planar

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 018, no. 684 (E - 1650) 22 December 1994 (1994-12-22) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 10 31 August 1998 (1998-08-31) *

Also Published As

Publication number Publication date
WO2001078152A2 (fr) 2001-10-18
JP2003530700A (ja) 2003-10-14
AU2001250477A1 (en) 2001-10-23
FR2807569B1 (fr) 2004-08-27
EP1273046A2 (fr) 2003-01-08
KR20030011820A (ko) 2003-02-11
FR2807569A1 (fr) 2001-10-12
US20040046224A1 (en) 2004-03-11

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