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WO2001065604A3 - Couvercle fonctionnel pour assemblage de puissance radioelectrique - Google Patents

Couvercle fonctionnel pour assemblage de puissance radioelectrique Download PDF

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Publication number
WO2001065604A3
WO2001065604A3 PCT/US2001/040197 US0140197W WO0165604A3 WO 2001065604 A3 WO2001065604 A3 WO 2001065604A3 US 0140197 W US0140197 W US 0140197W WO 0165604 A3 WO0165604 A3 WO 0165604A3
Authority
WO
WIPO (PCT)
Prior art keywords
circuit component
circuit
lid
component
substrate
Prior art date
Application number
PCT/US2001/040197
Other languages
English (en)
Other versions
WO2001065604A2 (fr
Inventor
Larry Leighton
Bengt Ahl
Thomas Moller
Henrik Hoyer
Original Assignee
Ericsson Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ericsson Inc filed Critical Ericsson Inc
Priority to AU2001253826A priority Critical patent/AU2001253826A1/en
Priority to JP2001564395A priority patent/JP2003526209A/ja
Priority to EP01927368A priority patent/EP1259988A2/fr
Publication of WO2001065604A2 publication Critical patent/WO2001065604A2/fr
Publication of WO2001065604A3 publication Critical patent/WO2001065604A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6644—Packaging aspects of high-frequency amplifiers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49175—Parallel arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/163—Connection portion, e.g. seal
    • H01L2924/16315—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19042—Component type being an inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30107—Inductance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H01L2924/30111—Impedance matching

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Amplifiers (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

L'invention concerne un dispositif de circuit intégré assemblé comportant un substrat, incluant un premier composant de circuit monté sur le substrat, un premier conducteur partant du premier composant de circuit et un couvercle diélectrique. Ce couvercle diélectrique est pourvu d'une surface de montage de composants, d'un second composant de circuit monté sur ladite surface de montage de composants et d'un second conducteur partant du second composant de circuit. Le couvercle diélectrique est adapté afin de s'enclencher avec le substrat, de manière à ce que le premier composant de circuit soit en communication électrique avec le second composant de circuit. Ce second composant de circuit peut posséder un circuit d'adaptation d'impédance. Le dispositif de circuit peut également inclure des moyens de fixation permettant de fixer le couvercle au substrat. Ces moyens de fixation peuvent également être dotés d'un d'adhésif, d'une soudure ou d'un élément rappelé par ressort.
PCT/US2001/040197 2000-02-28 2001-02-28 Couvercle fonctionnel pour assemblage de puissance radioelectrique WO2001065604A2 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2001253826A AU2001253826A1 (en) 2000-02-28 2001-02-28 Functional lid for rf power package
JP2001564395A JP2003526209A (ja) 2000-02-28 2001-02-28 パッケージ化された集積回路デバイス
EP01927368A EP1259988A2 (fr) 2000-02-28 2001-02-28 Couvercle fonctionnel pour assemblage de puissance radioelectrique

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/514,565 US6392298B1 (en) 2000-02-28 2000-02-28 Functional lid for RF power package
US09/514,565 2000-02-28

Publications (2)

Publication Number Publication Date
WO2001065604A2 WO2001065604A2 (fr) 2001-09-07
WO2001065604A3 true WO2001065604A3 (fr) 2002-01-31

Family

ID=24047743

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/040197 WO2001065604A2 (fr) 2000-02-28 2001-02-28 Couvercle fonctionnel pour assemblage de puissance radioelectrique

Country Status (6)

Country Link
US (1) US6392298B1 (fr)
EP (1) EP1259988A2 (fr)
JP (1) JP2003526209A (fr)
AU (1) AU2001253826A1 (fr)
TW (1) TW495811B (fr)
WO (1) WO2001065604A2 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6903447B2 (en) * 2002-05-09 2005-06-07 M/A-Com, Inc. Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching
US6828658B2 (en) * 2002-05-09 2004-12-07 M/A-Com, Inc. Package for integrated circuit with internal matching
US20040080917A1 (en) * 2002-10-23 2004-04-29 Steddom Clark Morrison Integrated microwave package and the process for making the same
US7129577B2 (en) * 2003-02-27 2006-10-31 Power-One, Inc. Power supply packaging system
US7956451B2 (en) * 2004-12-18 2011-06-07 Agere Systems Inc. Packages for encapsulated semiconductor devices and method of making same
US7250675B2 (en) * 2005-05-05 2007-07-31 International Business Machines Corporation Method and apparatus for forming stacked die and substrate structures for increased packing density
JP4575247B2 (ja) * 2005-07-11 2010-11-04 株式会社東芝 高周波パッケージ装置
US7569927B2 (en) * 2005-09-21 2009-08-04 Microsemi Corporation RF power transistor package
DE102011088617A1 (de) 2011-12-14 2013-06-20 Forschungsverbund Berlin E.V. Elektrisch abstimmbares Impedanzanpassnetzwerk eines HF-Leistungstransistors
JP2015041757A (ja) * 2013-08-23 2015-03-02 住友電工デバイス・イノベーション株式会社 半導体装置
FR3112897B1 (fr) * 2020-07-27 2022-12-23 St Microelectronics Grenoble 2 Dispositif de regulation de tension
EP3958301A1 (fr) * 2020-08-21 2022-02-23 Siemens Aktiengesellschaft Module de puissance pourvu d'au moins un semi-conducteur de puissance et d'un substrat

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62165958A (ja) * 1986-01-17 1987-07-22 Hitachi Vlsi Eng Corp 半導体装置の電気特性測定用ソケツト
JPS63226948A (ja) * 1987-03-16 1988-09-21 New Japan Radio Co Ltd 混成集積装置
JPH05114776A (ja) * 1991-10-16 1993-05-07 Fujitsu Ltd ベアチツプｌｓｉの実装構造
US5237204A (en) * 1984-05-25 1993-08-17 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electric potential distribution device and an electronic component case incorporating such a device
EP0713252A2 (fr) * 1994-11-16 1996-05-22 Nec Corporation Montage d'éléments de circuit
EP0778617A2 (fr) * 1995-12-05 1997-06-11 Lucent Technologies Inc. Empaquetage pour dispositif électronique encapsulé par un médium pliant, confiné latéralement par un cadre en plastique
JPH1093012A (ja) * 1996-09-19 1998-04-10 Mitsubishi Electric Corp 高周波集積回路装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2159588B (en) 1984-05-29 1987-09-30 Acs Ind Inc Seal construction and method
JPS6258883A (ja) * 1985-09-04 1987-03-14 Hitachi Ltd 駆動装置
JPH03266596A (ja) * 1990-03-15 1991-11-27 Brother Ind Ltd モニタディスプレイ付き音楽再生装置
JP2938344B2 (ja) * 1994-05-15 1999-08-23 株式会社東芝 半導体装置
JPH08247585A (ja) * 1995-03-09 1996-09-27 Hitachi Ltd 冷蔵庫等の冷凍サイクル

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5237204A (en) * 1984-05-25 1993-08-17 Compagnie D'informatique Militaire Spatiale Et Aeronautique Electric potential distribution device and an electronic component case incorporating such a device
JPS62165958A (ja) * 1986-01-17 1987-07-22 Hitachi Vlsi Eng Corp 半導体装置の電気特性測定用ソケツト
JPS63226948A (ja) * 1987-03-16 1988-09-21 New Japan Radio Co Ltd 混成集積装置
JPH05114776A (ja) * 1991-10-16 1993-05-07 Fujitsu Ltd ベアチツプｌｓｉの実装構造
EP0713252A2 (fr) * 1994-11-16 1996-05-22 Nec Corporation Montage d'éléments de circuit
EP0778617A2 (fr) * 1995-12-05 1997-06-11 Lucent Technologies Inc. Empaquetage pour dispositif électronique encapsulé par un médium pliant, confiné latéralement par un cadre en plastique
JPH1093012A (ja) * 1996-09-19 1998-04-10 Mitsubishi Electric Corp 高周波集積回路装置

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 007 (E - 571) 9 January 1988 (1988-01-09) *
PATENT ABSTRACTS OF JAPAN vol. 013, no. 023 (E - 705) 19 January 1989 (1989-01-19) *
PATENT ABSTRACTS OF JAPAN vol. 017, no. 476 (E - 1424) 30 August 1993 (1993-08-30) *
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09 31 July 1998 (1998-07-31) *

Also Published As

Publication number Publication date
TW495811B (en) 2002-07-21
EP1259988A2 (fr) 2002-11-27
WO2001065604A2 (fr) 2001-09-07
AU2001253826A1 (en) 2001-09-12
JP2003526209A (ja) 2003-09-02
US6392298B1 (en) 2002-05-21

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