WO2000039848A3 - Procede et ensemble de test comportant une microplaquette de test de microplaquette equipee - Google Patents
Procede et ensemble de test comportant une microplaquette de test de microplaquette equipee Download PDFInfo
- Publication number
- WO2000039848A3 WO2000039848A3 PCT/US1999/030916 US9930916W WO0039848A3 WO 2000039848 A3 WO2000039848 A3 WO 2000039848A3 US 9930916 W US9930916 W US 9930916W WO 0039848 A3 WO0039848 A3 WO 0039848A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- die
- test
- product
- circuitry
- testing
- Prior art date
Links
- 238000012360 testing method Methods 0.000 title abstract 23
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000010998 test method Methods 0.000 title 1
- 238000000034 method Methods 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 abstract 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000005192 partition Methods 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 238000000638 solvent extraction Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Automation & Control Theory (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Semiconductor Integrated Circuits (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000591661A JP3754616B2 (ja) | 1998-12-31 | 1999-12-22 | 半導体製品ダイのテスト方法及び同テストのためのテストダイを含むアセンブリ |
EP99968547A EP1141735A2 (fr) | 1998-12-31 | 1999-12-22 | Procede et ensemble de test comportant une microplaquette de test de microplaquette equipee |
KR10-2004-7015516A KR100522070B1 (ko) | 1998-12-31 | 1999-12-22 | 반도체 제품 다이 테스트용 테스트 다이를 포함하는테스트 장치 및 반도체 제품 다이 테스트 방법 |
KR1020037015241A KR100554324B1 (ko) | 1998-12-31 | 1999-12-22 | 반도체 제품 다이 테스트용 테스트 다이를 포함하는테스트 장치 및 반도체 제품 다이 테스트 방법 |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/224,166 US6429029B1 (en) | 1997-01-15 | 1998-12-31 | Concurrent design and subsequent partitioning of product and test die |
US09/224,673 | 1998-12-31 | ||
US09/224,673 US6551844B1 (en) | 1997-01-15 | 1998-12-31 | Test assembly including a test die for testing a semiconductor product die |
US09/224,166 | 1998-12-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000039848A2 WO2000039848A2 (fr) | 2000-07-06 |
WO2000039848A3 true WO2000039848A3 (fr) | 2000-11-23 |
Family
ID=26918470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/030916 WO2000039848A2 (fr) | 1998-12-31 | 1999-12-22 | Procede et ensemble de test comportant une microplaquette de test de microplaquette equipee |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP1141735A2 (fr) |
JP (4) | JP3754616B2 (fr) |
KR (4) | KR100522070B1 (fr) |
TW (1) | TW580744B (fr) |
WO (1) | WO2000039848A2 (fr) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001338953A (ja) * | 2000-05-29 | 2001-12-07 | Mitsubishi Electric Corp | 半導体試験装置、半導体試験方法および半導体装置 |
US6603323B1 (en) | 2000-07-10 | 2003-08-05 | Formfactor, Inc. | Closed-grid bus architecture for wafer interconnect structure |
JP2004317162A (ja) * | 2003-04-11 | 2004-11-11 | Masaki Esashi | プローブカード、プローブピン及びその製造方法 |
US7202687B2 (en) * | 2004-04-08 | 2007-04-10 | Formfactor, Inc. | Systems and methods for wireless semiconductor device testing |
JP4679274B2 (ja) * | 2005-07-07 | 2011-04-27 | 日本電子材料株式会社 | プローブの製造方法 |
JP2007157944A (ja) | 2005-12-02 | 2007-06-21 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
US7615861B2 (en) | 2006-03-13 | 2009-11-10 | Sandisk Corporation | Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards |
US7986146B2 (en) * | 2006-11-29 | 2011-07-26 | Globalfoundries Inc. | Method and system for detecting existence of an undesirable particle during semiconductor fabrication |
WO2008119179A1 (fr) * | 2007-04-03 | 2008-10-09 | Scanimetrics Inc. | Test de circuits électroniques utilisant un circuit intégré de sonde active |
US8717053B2 (en) * | 2011-11-04 | 2014-05-06 | Keithley Instruments, Inc. | DC-AC probe card topology |
KR101378506B1 (ko) * | 2012-02-17 | 2014-03-27 | 주식회사 오킨스전자 | 디스플레이 패널 검사장치 |
US9500675B2 (en) | 2013-07-15 | 2016-11-22 | Mpi Corporation | Probe module supporting loopback test |
TWI493194B (zh) * | 2013-07-15 | 2015-07-21 | Mpi Corp | Probe module with feedback test function |
TWI489113B (zh) * | 2013-07-15 | 2015-06-21 | Mpi Corp | A probe card that switches the signal path |
TWI510798B (zh) * | 2015-02-24 | 2015-12-01 | Powertech Technology Inc | 通用型測試平台及其測試方法 |
KR101913274B1 (ko) | 2016-11-18 | 2018-10-30 | 주식회사 에스디에이 | 프로브 카드의 전기적 특성 측정장치 |
KR102148840B1 (ko) * | 2018-11-27 | 2020-08-28 | 주식회사 에스디에이 | 프로브 카드 |
JP7561563B2 (ja) | 2020-10-05 | 2024-10-04 | 三菱電機エンジニアリング株式会社 | 半導体装置 |
CN115308563A (zh) * | 2021-07-02 | 2022-11-08 | 台湾积体电路制造股份有限公司 | 测试集成电路的方法和测试系统 |
KR102736430B1 (ko) * | 2023-01-20 | 2024-12-02 | 주식회사 이노웰 | 메모리 모듈 검사 방법 및 이를 적용하는 시스템 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0028091A1 (fr) * | 1979-10-18 | 1981-05-06 | Sperry Corporation | Détection de défauts dans des plaquettes à circuit intégré et dans des plaquettes à circuit imprimé et systèmes contenant de telles plaquettes |
EP0670552A1 (fr) * | 1994-03-03 | 1995-09-06 | International Computers Limited | Procédé de mettre au point automatiquement pour circuits électroniques digitaux |
US5497079A (en) * | 1992-09-01 | 1996-03-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor testing apparatus, semiconductor testing circuit chip, and probe card |
US5576554A (en) * | 1991-11-05 | 1996-11-19 | Monolithic System Technology, Inc. | Wafer-scale integrated circuit interconnect structure architecture |
WO1997043656A2 (fr) * | 1996-05-17 | 1997-11-20 | Formfactor, Inc. | Deverminage et essai au niveau plaquette |
US5719449A (en) * | 1996-09-30 | 1998-02-17 | Lucent Technologies Inc. | Flip-chip integrated circuit with improved testability |
EP0845680A1 (fr) * | 1990-02-16 | 1998-06-03 | LEEDY, Glenn J. | Fabrication et test de circuits intégrés avec des points de test de haute densité |
EP0855651A2 (fr) * | 1997-01-22 | 1998-07-29 | Matsushita Electric Industrial Co., Ltd. | Méthode de conception en vue du test et méthode de génération de séquence de test |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0304868A3 (fr) * | 1987-08-28 | 1990-10-10 | Tektronix Inc. | Sonde multiple pour circuits intégrés en forme de galette |
JPH01302850A (ja) * | 1988-05-31 | 1989-12-06 | Toshiba Corp | テスト容易化半導体集積回路の製造方法 |
US5053700A (en) * | 1989-02-14 | 1991-10-01 | Amber Engineering, Inc. | Method for wafer scale testing of redundant integrated circuit dies |
JPH0582605A (ja) * | 1991-09-24 | 1993-04-02 | Mitsubishi Electric Corp | 半導体集積回路素子およびウエハテスト検査方法 |
JPH05267405A (ja) * | 1992-03-19 | 1993-10-15 | Data Puroobu:Kk | プローブカード |
US5461573A (en) * | 1993-09-20 | 1995-10-24 | Nec Usa, Inc. | VLSI circuits designed for testability and methods for producing them |
JP3821171B2 (ja) * | 1995-11-10 | 2006-09-13 | オー・エイチ・ティー株式会社 | 検査装置及び検査方法 |
JP2940483B2 (ja) * | 1996-08-28 | 1999-08-25 | 日本電気株式会社 | Mcm検査治具 |
-
1999
- 1999-12-22 KR KR10-2004-7015516A patent/KR100522070B1/ko not_active Expired - Fee Related
- 1999-12-22 JP JP2000591661A patent/JP3754616B2/ja not_active Expired - Fee Related
- 1999-12-22 KR KR1020037015241A patent/KR100554324B1/ko not_active Expired - Fee Related
- 1999-12-22 EP EP99968547A patent/EP1141735A2/fr not_active Withdrawn
- 1999-12-22 KR KR1020057009730A patent/KR100580405B1/ko not_active Expired - Fee Related
- 1999-12-22 WO PCT/US1999/030916 patent/WO2000039848A2/fr active IP Right Grant
- 1999-12-22 KR KR1020017008297A patent/KR100548103B1/ko not_active Expired - Fee Related
- 1999-12-28 TW TW088123147A patent/TW580744B/zh not_active IP Right Cessation
-
2004
- 2004-06-16 JP JP2004178019A patent/JP2005049336A/ja active Pending
-
2007
- 2007-01-23 JP JP2007013166A patent/JP2007201471A/ja active Pending
-
2010
- 2010-05-06 JP JP2010106806A patent/JP2010249824A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0028091A1 (fr) * | 1979-10-18 | 1981-05-06 | Sperry Corporation | Détection de défauts dans des plaquettes à circuit intégré et dans des plaquettes à circuit imprimé et systèmes contenant de telles plaquettes |
EP0845680A1 (fr) * | 1990-02-16 | 1998-06-03 | LEEDY, Glenn J. | Fabrication et test de circuits intégrés avec des points de test de haute densité |
US5576554A (en) * | 1991-11-05 | 1996-11-19 | Monolithic System Technology, Inc. | Wafer-scale integrated circuit interconnect structure architecture |
US5497079A (en) * | 1992-09-01 | 1996-03-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor testing apparatus, semiconductor testing circuit chip, and probe card |
EP0670552A1 (fr) * | 1994-03-03 | 1995-09-06 | International Computers Limited | Procédé de mettre au point automatiquement pour circuits électroniques digitaux |
WO1997043656A2 (fr) * | 1996-05-17 | 1997-11-20 | Formfactor, Inc. | Deverminage et essai au niveau plaquette |
US5719449A (en) * | 1996-09-30 | 1998-02-17 | Lucent Technologies Inc. | Flip-chip integrated circuit with improved testability |
EP0855651A2 (fr) * | 1997-01-22 | 1998-07-29 | Matsushita Electric Industrial Co., Ltd. | Méthode de conception en vue du test et méthode de génération de séquence de test |
Also Published As
Publication number | Publication date |
---|---|
KR20030096418A (ko) | 2003-12-24 |
WO2000039848A2 (fr) | 2000-07-06 |
JP2007201471A (ja) | 2007-08-09 |
JP2005049336A (ja) | 2005-02-24 |
JP3754616B2 (ja) | 2006-03-15 |
KR100554324B1 (ko) | 2006-02-24 |
JP2002533738A (ja) | 2002-10-08 |
TW580744B (en) | 2004-03-21 |
KR100580405B1 (ko) | 2006-05-16 |
KR20040094894A (ko) | 2004-11-10 |
KR20010100002A (ko) | 2001-11-09 |
EP1141735A2 (fr) | 2001-10-10 |
JP2010249824A (ja) | 2010-11-04 |
KR100522070B1 (ko) | 2005-10-18 |
KR100548103B1 (ko) | 2006-02-02 |
KR20050063812A (ko) | 2005-06-28 |
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