WO2000023230A1 - Appareil de recuperation d'erreurs catastrophiques et procedes associes - Google Patents
Appareil de recuperation d'erreurs catastrophiques et procedes associes Download PDFInfo
- Publication number
- WO2000023230A1 WO2000023230A1 PCT/US1999/024301 US9924301W WO0023230A1 WO 2000023230 A1 WO2000023230 A1 WO 2000023230A1 US 9924301 W US9924301 W US 9924301W WO 0023230 A1 WO0023230 A1 WO 0023230A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- workpieces
- status
- processor
- processing system
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000011084 recovery Methods 0.000 title claims description 44
- 238000012545 processing Methods 0.000 claims abstract description 70
- 238000003860 storage Methods 0.000 claims abstract description 11
- 230000008569 process Effects 0.000 claims description 14
- 238000004891 communication Methods 0.000 claims description 6
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000005498 polishing Methods 0.000 description 18
- 238000004140 cleaning Methods 0.000 description 11
- 238000013507 mapping Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 238000012795 verification Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 230000008901 benefit Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000001934 delay Effects 0.000 description 3
- 230000004044 response Effects 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000013479 data entry Methods 0.000 description 1
- 238000012217 deletion Methods 0.000 description 1
- 230000037430 deletion Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000013024 troubleshooting Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
Definitions
- the present invention relates to a system of determining the status of semiconductor workpieces in a chemical mechanical polishing (CMP) tool upon the sudden shutdown of the tool. More particularly, the present invention relates to an improved system for receiving a number of workpieces, tracking their progress through a plurality of processing stations, and restoring the processing status of each workpiece upon the sudden interruption of the operation of a tool.
- CMP chemical mechanical polishing
- Machines for polishing and cleaning workpieces in the electronics industry are generally well known.
- semiconductor wafers, magnetic disks, and other workpieces often come in the form of flat, substantially planar, circular disks.
- semiconductor workpieces are sliced from a silicon ingot and prepared for further processing. After each workpiece is sliced from the ingot, it must be thoroughly polished, cleaned, rinsed, and dried to remove debris from the surface of the workpiece. Thereafter, a series of steps are performed on the workpiece to build the integrated circuits on the workpiece surface, including applying a layer of microelectronic structures and one or more layers of a dielectric material. Typically, after the layers are fabricated on the workpiece surfaces, the workpieces are planarized to remove excess material and imperfections. After each processing step, it is often desirable to thoroughly clean, rinse, and dry the workpiece to ensure that debris is removed from the workpiece.
- workpiece processing systems contain processors into which workpiece processing information can be loaded and stored.
- Information loaded into these processors often includes user maps (locations of workpieces within the cassettes), the workpiece's queue or recipe (the processing each workpiece is to receive from the system), and other workpiece information.
- this information temporarily exists in the system's processor and is lost upon the catastrophic failure of the system.
- the processing of a workpiece encompasses multiple tasks on multiple workpiece processing systems.
- a workpiece commonly will be processed on 5 workpiece processing systems before it is finished.
- the catastrophic failure of any of these systems can result in the scrapping of all the workpieces on the system.
- CMP systems fail, most of the workpieces are removed from the affected systems and scrapped. Often some of the workpieces removed were not damaged during the catastrophic failure. Scrapping the undamaged workpieces, especially those which have already completed most of the production stages, can significantly increase the unit cost of producing workpieces and disrupts production. When all the workpieces on a workpiece processing system are scrapped, the productive capacity of subsequent systems is also affected.
- UPS Uninterruptable Power Supplies
- workpiece may be located in any number of processing stations within a large system.
- Present systems can not recall the status and location of these workpieces. Therefore, since current systems do not allow a system operator to determine which workpieces were awaiting processing, were processed, or were in the tool at the time the tool catastrophically failed, a system for monitoring the position ' and processing status of a plurality of workpieces within a single or multi-stage tool is needed.
- a non-volatile system for restoring the location and status of all the workpieces within a workpiece processing system which overcomes the noted shortcomings of the prior art. Additionally, the present invention provides a scheme whereby the catastrophic effects of a power loss in a workpiece processing system are reduced.
- One advantage of the present invention is to provide a system for recalling the status and location of a plurality of workpieces within a workpiece polishing, cleaning, and drying system upon the cessation of operations of the system for any reason. Recalling the status and location of these workpieces allows a system operator to precisely determine which workpieces can be salvaged and which must be scrapped.
- Another advantage of the present invention is to provide a real-time system for recalling the status of a plurality of workpieces within an appropriate system at any time upon input by an operator. This feature allows an operator to determine the processing status of any given workpiece at any time without having to interrupt the operation of the system.
- the present invention also provides a system for storing and reconstructing user maps for workpiece runs still within cassettes. Storing and recovering the user maps allows the operator to quickly resume the processing of salvageable workpieces without having to reload the workpiece information into the system.
- the user maps may contain detailed information about which runs are remaining for each workpiece within a plurality of cassettes.
- Another aspect of the present invention is the storage and reconstruction of the workpiece queue.
- This information contains the recipes which were programmed to be run on each of a plurality of workpieces. Storing and reconstructing this information drastically reduces the restoral time of the system following a catastrophic error.
- Another advantage of the invention is that it provides a technique for monitoring and tracking the status of a plurality of workpieces as they are processed by the individual stations within a workpiece processing system.
- the ability to perform real-time updates of the recovered information is an additional feature of this invention. Real-time updating by the operator of the tool ensures the tracking system is synchronized with the activities and decisions of the operator. Should an operator, for any reason, decide to remove an additional workpiece or continue processing upon workpieces, this feature allows the operator to update the status information retained by the present invention to reflect the current state of the tool and the workpieces therein.
- the present invention may also incorporate an operator interface such as a flat panel touch screen.
- the touch screen preferably presents status information of virtually every relevant aspect of the system and the workpieces therein to facilitate operation, maintenance, trouble-shooting, and the like.
- a catastrophic error recovery system which stores, updates, and restores information for a plurality of workpieces within a workpiece processing system having a workpiece processing tool, a suitable processor for controlling the tool, and a non-volatile, real-time workpiece information storage and retrieval device which receives, updates, and restores workpiece information upon query.
- Figure 1 is a top schematic plan view of an exemplary embodiment of an integrated machine for polishing, washing, rinsing, spin-drying, and unloading workpieces for which the present invention stores and retrieves workpiece status information;
- Figure 2 is a block diagram showing the interface of a workpiece processing system with a suitable processor within which catastrophic error recovery is stored, processed, and retrieved; and
- Figure 3 is a flow diagram of an exemplary error recovery process that may be implemented by the present invention.
- an exemplary tool for which the present invention stores and retrieves status information is a tool 10 suitably configured to perform Chemical Mechanical Polishing (CMP), cleaning, rinsing, and drying of semiconductor workpieces.
- CMP Chemical Mechanical Polishing
- FIG. 1 An exemplary tool for which the present invention stores and retrieves status information is a tool 10 suitably configured to perform Chemical Mechanical Polishing (CMP), cleaning, rinsing, and drying of semiconductor workpieces.
- CMP Chemical Mechanical Polishing
- cleaning cleaning, rinsing, and drying of semiconductor workpieces.
- the tool 10 includes a load and unload station 12 configured to accommodate a plurality of workpiece cassettes 13 to permit substantially continuous operation of the tool 10.
- a sensor assembly or workpiece mapping system is suitably configured throughout the tool 10.
- the workpiece mapping system includes a plurality of sensors and the associated hardware necessary to track the location and status of multiple workpieces within the tool 10.
- the workpiece mapping system Upon the loading of a cassette into the tool 10 at the load and unload station 12, the workpiece mapping system initially determines which locations within a cassette 13 contain workpieces. The operator is then presented with this information on a suitable display. The operator then loads workpiece processing information into the tool by an appropriate data entry device such as a touch screen display, alphanumeric keyboard, or the like.
- a robot arm 14 individually selects workpieces contained within a cassette 13.
- the robot arm 14 removes a workpiece from a cassette 13 and inserts the selected workpiece through an air knife 16 into the index station 18.
- the workpiece is placed upon one of a plurality of load cups 20 residing on index table 22.
- the index table 22 rotates so that an empty load cup 20 is aligned with the air knife 16.
- the workpieces are transported by a transport assembly (not shown) to the polishing station 24.
- the workpieces are positioned above and in contact with a polishing table 26.
- the workpieces are polished and planarized according to preset recipes.
- the transport assembly Upon completion of the polishing cycle, the transport assembly returns the workpieces to the index station 18 where the workpieces are placed in unload cups 28. Once placed in unload cups 28, a flipper arm 30 removes the polished workpieces from the index station 18 and transfers them to a track in the cleaning station 32. After the workpieces are cleaned, they are then stacked by the robot arm 14 into a cassette 13.
- a plurality of sensors are suitably situated within the tool 10 to track the processing status and location of each workpiece throughout the workpiece processing system. These sensors are preferably located at the robot arm, the load cups, the rinse stages, and the like.
- the tool 10 may be controlled by a suitable processor 40.
- the processor 40 receives the plurality of sensor outputs and controls the operation of the tool 10 as determined by operator input and preprogrammed software or hardware applications.
- the processor may be part of a larger controller or central processing unit.
- the processor may include any number of suitable memory and processing elements adapted to perform the various processes and programs that may be realized in the form of software instructions and the like. The processor may also perform additional functions unrelated to the present invention.
- the processor is also connected to an SEMI Equipment Communications (SECS) interface 42 which converts the instructions and data from the processor 40 into the SEMI format for transfer to an Equipment Virtual Controller (EVC) 44.
- SECS SEMI Equipment Communications
- EVC 44 is preferably a non-volatile storage system appropriately configured to receive, store, and process workpiece position and status information from the tool 10.
- the preferred embodiment of the tool 10 may contain more than 100 workpieces located throughout the tool 10.
- One exemplary embodiment is configured with a 122 workpiece capacity.
- an essential feature of the present invention is the ability to track the location of a plurality of workpieces within the tool 10 and restore the location information after an interruption of workpiece processing in the tool 10.
- the processor 40 Upon restoral of operations of the tool 10 following an interruption, for example from a power failure, the processor 40 is configured such that it queries the EVC 44 for workpiece status data before it continues normal operations.
- the processor 40 continually receives from the workpiece mapping system the current status and position of workpieces within the tool 10.
- Parameters routinely updated within the processor include the specific position of each workpiece within the tool 10. the elapsed processing time for a particular operation of the tool upon a workpiece. and the like. These parameters are utilized by the processor 40 to control the operation of the tool and are provided to the EVC 44 on a continual basis.
- the EVC 44 receives the parameters and updates and stores the workpiece status and position information. Thereby, the EVC 44 contains the current status and position of each workpiece within the tool 10.
- the processor begins receiving workpiece status information upon the insertion of a cassette containing a plurality of workpieces into the tool.
- the cassette name is entered into the processor.
- the workpiece mapping system is preferably utilized to determine the number of workpieces within the cassette and to assign a slot identification to each workpiece. For purposes of the present embodiment, the cassette nominally holds 25 workpieces in 25 slots.
- the mapping information is then sent to the processor.
- the cassette name and slot identification information are then utilized to track and record the position and status of each workpiece.
- the operator may assign a recipe to each workpiece or to a particular batch of workpieces. The recipe designates the processing the workpiece is to receive from the tool. Additional status variables can be assigned to each workpiece and updated as needed.
- These status variables may include: the station identification (initially set to correspond to the slot identification), the state identification, run number, segment number, segment time, elapsed time, and carrier offset. Each of these variables may be periodically sent from the processor to the EVC where they are stored and retrieved upon a catastrophic failure.
- the state identification is preferably a three digit number ranging from 200-222 which represents the current status of an individual workpiece.
- the preferred tool 10 can process a plurality of workpieces at each processing station; thus, multiple workpieces can simultaneously possess the same state identification.
- the index table 22 contains a plurality of load cups 20, each of which may contain a workpiece.
- the workpieces in the load cups, while awaiting transport to the polishing station, can each be assigned a particular state identification.
- state identification 204 may represent "waiting to be picked up by the carrier".
- Other state identifications may signify the following states: waiting for a polishing event to begin or end; waiting for a cleaning event to begin or end; waiting to move to the cleaning station: and the like.
- the state identification indicates the last known status of each workpiece.
- the run number is used to designate the workpiece by processing batch. This number is workpiece dependent and does not change as the workpiece is processed by the tool.
- the segment number is a sequential number representing a particular intermediate step during primary polishing and final polishing of a workpiece.
- the polishing of a workpiece commonly consists of multiple segments which may include different down forces, pressures, time spans, and/or the like.
- the segment number preferentially identifies a particular segment with predetermined down forces, pressures, and similar variables.
- the segment time represents the cumulative time a workpiece spends in a segment or group of independent sections of a workpiece processing recipe in seconds.
- the elapsed time represents the actual time spent in a segment in seconds.
- the carrier offset represents the down force the carrier applies to each workpiece. Such downforce is applied to facilitate polishing of the workpieces upon the rotating polishing pad.
- variables allow the operator to precisely know at which stage of polishing, cleaning, drying, storing, or the like a particular workpiece was at when a catastrophic failure occurred.
- These variables are updated in the EVC at an interval sufficient to allow recovery of workpiece status and position information on an as needed basis.
- the variables are preferably updated at least once every 3 seconds and, most preferably, at least once every 100 milliseconds.
- Figure 3 shows the process flow the processor 40 and EVC 44 follow in recovering workpiece status and position information.
- the processor 40 instructs the SECS interface (block 52) to establish a communications link between the EVC and the SECS interface.
- the processor may wait a predetermined period of time for the link to be established. If the link is not established, the processor alerts the operator of the unavailability of recovery information from the EVC. If the link is established, setup continues.
- the SECS interface establishes a communications link by sending a "21" (request for recovery information) message to the EVC.
- the EVC will preferably send a reply if the link is established.
- the processor preferably waits 30 seconds to receive a "51" (recovery' information available) reply status message from the SECS interface.
- the SECS interface preferably generates the "51" reply status message upon receipt of a reply from the EVC. If the "51" reply status message is not received by the processor within the 30 second time limit, the processor increments a counter and resends the "21" request. After sending three consecutive "21" requests without receiving a "51" reply status message, the processor sets the EVC status flag to unavailable, alerts the operator to the lack of response from the EVC. and continues startup without recovery information.
- the EVC will respond to the "21"- query and the SECS interface will preferably send a "51" status message to the processor.
- the processor sets an EVC status flag to "communicating " .
- the processor Upon the establishment of a communications link between the processor and the EVC, the processor examines the response from the EVC (block 58). If recovery data is not available (block 60), the processor notifies the operator of the unavailability of recovery data (block 56). If recovery data is available, setup continues (block 62). For the preferred embodiment, if recovery data is not available the setup of the tool continues without recovery data. If recovery data is available, the processor preferably awaits receipt of a "1 L" (recovery data) message from the SECS interface and starts a timeout counter. During this time, the SECS interface will await the EVC recovery data and upon receipt convert it into a format suitable for the processor. If recovery data is not received from the EVC within the preferred time interval, set up will continue without recovery data.
- a "1 L" recovery data
- recovery data is received it is sent to the processor where it is decoded (block 62) and validated (block 64). If the data is not valid, the processor increments a retry counter (block 66). If the retry counter indicates a predetermined number of retries have occurred (block 68), the processor notifies the operator (block 56) that recovery data is not available and setup continues without recovery data. If the predetermined number of retries have not occurred (block 68), the EVC is queried for recovery data (block 58).
- the processor Upon the receipt of valid data (block 64), the processor will preferably send a message to the EVC which notifies the EVC that valid data has been received (block 70).
- the data sent to, stored, and received from the EVC is in the format of a table wherein each row signifies a distinct workpiece and each column provides information relative to that workpiece.
- the operator of the preferred embodiment can display the received data in the tabular format, in a graphical presentation, or some combination of graphical and alphanumerical presentation. Regardless of the format selected, the data can be presented on a suitable monitor, printer, or the like.
- the data is preferably presented in a graphical presentation on a display monitor suitably located to allow the operator to observe and control the tool.
- the processor reconstructs (block 72) the workpiece position information obtained from the recovered tabular data and preferably displays the workpiece position information on a graphical workpiece verification screen (block 74).
- a preferred embodiment of a workpiece verification screen graphically displays the various locations within the tool a workpiece could be situated, and indicates the identity and status of each workpiece therein. The operator can then verify the accuracy of the recovery data versus the actual location of workpieces within the tool and decide whether to modify the workpiece positions shown on the workpiece verification screen (block 76). Modifications could be necessary when the operator manually removes workpieces from the tool, when workpieces are not positioned consistently with recovery data, and the like.
- the workpiece recovery data obtained from the EVC is modified (block 78), reconstructed by the processor (block 72), and redisplayed (block 74).
- the operator during this verification phase can preferably display workpiece positions anywhere within the tool including the input and output cassettes. Additionally, for the preferred embodiment the operator can preferably verify the cassette maps, workpiece status variables, and the like to achieve any desired workpiece position and status configuration. Once the recovered data matches the desired configuration and additional modifications to the recovered data are not required (block 76), workpiece verification can be exited (block 80).
- the modified workpiece recovery data contained within the processor is sent to the EVC to update the EVC data (block 82). During the previous steps the workpiece recovery data had been modified within the processor. Block 82 sends this modified data to the EVC for updating and storage. If the EVC data can not be successfully updated (block 84) the operator is notified of the lack of response from the EVC and setup continues without recovery data (block 86). For the preferred embodiment, the processor awaits a predetermined time period for the EVC to signal receipt of the updated recovery data. If the timeout period elapses, the processor may attempt to resend the data a predetermined number of times.
- the EVC upon receipt of the recovery data verifies the received data is in the proper format and is valid data. If the updated recover ⁇ ' data is not valid, the EVC signals the processor to resend the updated recovery data. If after a predetermined number of tries the EVC has not received valid updated recovery data, the operator will be notified and set up will continue without recovery data. If the EVC update is successful (block 84), the processor preferably displays an auto unload screen (block 88) or similarly queries the operator on whether the processor should commence the unloading of workpieces identified by software and operator inspection. Upon operator direction, the tool will then unload the designated workpieces (block 90). Upon unloading the designated workpieces.
- the tool preferably proceeds to process the workpiece process information (block 92).
- This process information includes the desired recipe for each workpiece. the run time, and the like.
- the processor displays the run main polish screen (block 94).
- the run main polish screen preferably displays the processes to be applied to each workpiece. For workpieces which had not left their respective input cassette prior to the tools shutdown, these parameters will not change. For other workpieces, the processing time may change, the remaining processing steps may vary, and the like.
- the operator preferably presses a start button or the like (block 96) which directs the processor to resume processing the workpieces according to the recovery data (block 100). Thereafter, workpiece processing continues under normal operating conditions (block 102). If the displayed information is incorrect, the start button is not pressed (block 96), workpiece processing proceeds without recovery information (block 98) and normal operations resume (block 102).
- the tool inserts the workpiece into an output cassette.
- the associated workpiece information is purged from the processor and can be purged from the EVC.
- all workpiece information is preferably purged from the EVC upon the removal from the tool of the cassette containing the workpiece.
- the present invention can be adopted to permanently store such workpiece information, or to provide such workpiece information to subsequent tools as the need arises.
- the tool 10 contains a touch screen display (not shown) suitably employed to allow the operator to monitor, reconfigure, troubleshoot, and otherwise update workpiece position and status information.
- a touch screen display may be configured to display, preferably in three dimensions, a graphical representation of the various operational features of the tool 10 and the location and status of workpieces therein.
- touch screen buttons may be included which may locate workpiece positions, load default recovery information, exit/save changes to recovery information, open the load door, open the unload door, open the process door, select a cassette map, increment, decrement, clear, and set entries. These buttons allow the operator to enter and reconfigure the workpiece position and status as necessary.
- the present invention is not to be construed as being limited to only a touch sensitive screen. Any sort of instruction input means, whether it be designated keys, alphanumeric keyboard entries, or the like are covered by the present invention.
- the present invention has been described in conjunction with appended drawing figures, it will be appreciated that the invention is not so limited. Various additions, deletions, substitutions, and rearrangement of parts and processing steps may be made in the design and implementation of the error recovery system without departing from the spirit and scope of the present invention, as set forth more particularly in the appended claims.
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Abstract
L'invention concerne un appareil et un procédé, permettant de restaurer les informations de position et d'état de chaque pièce d'une pluralité, dans un système de traitement de pièces. Lorsque les pièces sont chargées, traitées, et déchargées d'un système de traitement de pièces, un ensemble de capteurs suit la trace de l'implantation et de l'état de chaque pièce. Cet ensemble de capteurs fournit les informations d'implantation et d'état à un processeur. Le processeur permet à un opérateur de réécrire et d'entrer de nouvelles informations d'implantation et d'état, tout en envoyant ces informations à un système de mémorisation non volatil. Lorsque le fonctionnement d'un système de traitement de pièces est interrompu, de manière catastrophique, et lorsque toutes les variables antérieurement introduites sont effacées du processeur, l'invention permet à un opérateur de rappeler les données antérieures périodiquement mises à jour du système de mémorisation non volatil, et de restaurer les paramètres du processeur. L'opérateur peut également déterminer quelles pièces sont récupérables, et peut renouveler le traitement des pièces récupérées. L'invention permet, en outre, à l'opérateur de rappeler à n'importe quel moment l'emplacement et l'état d'une pièce.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US17515298A | 1998-10-19 | 1998-10-19 | |
US09/175,152 | 1998-10-19 |
Publications (1)
Publication Number | Publication Date |
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WO2000023230A1 true WO2000023230A1 (fr) | 2000-04-27 |
Family
ID=22639138
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/024301 WO2000023230A1 (fr) | 1998-10-19 | 1999-10-18 | Appareil de recuperation d'erreurs catastrophiques et procedes associes |
Country Status (2)
Country | Link |
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TW (1) | TW454225B (fr) |
WO (1) | WO2000023230A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002301989B2 (en) * | 2001-11-28 | 2004-04-22 | Hoya Corporation | Episulfide compound, method for producing the same and optical product comprising the same |
JP2012080042A (ja) * | 2010-10-06 | 2012-04-19 | Mat Inc | 表面加工装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4569956B2 (ja) * | 2005-01-24 | 2010-10-27 | 東京エレクトロン株式会社 | 基板処理装置の復旧処理方法,基板処理装置,プログラム |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996002355A1 (fr) * | 1994-07-15 | 1996-02-01 | Speedfam Corporation | Procede et dispositif de polissage de plaquettes |
WO1999013498A2 (fr) * | 1997-09-10 | 1999-03-18 | Speedfam-Ipec Corporation | Appareil combine de traitement au plasma hyperfrequence(cmp) et de nettoyage de plaquette, et procedes associes |
-
1999
- 1999-10-18 WO PCT/US1999/024301 patent/WO2000023230A1/fr active Search and Examination
- 1999-10-29 TW TW88118027A patent/TW454225B/zh active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996002355A1 (fr) * | 1994-07-15 | 1996-02-01 | Speedfam Corporation | Procede et dispositif de polissage de plaquettes |
WO1999013498A2 (fr) * | 1997-09-10 | 1999-03-18 | Speedfam-Ipec Corporation | Appareil combine de traitement au plasma hyperfrequence(cmp) et de nettoyage de plaquette, et procedes associes |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU2002301989B2 (en) * | 2001-11-28 | 2004-04-22 | Hoya Corporation | Episulfide compound, method for producing the same and optical product comprising the same |
JP2012080042A (ja) * | 2010-10-06 | 2012-04-19 | Mat Inc | 表面加工装置 |
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TW454225B (en) | 2001-09-11 |
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