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WO2000021059A2 - Etiquette dotee d'un support d'informations - Google Patents

Etiquette dotee d'un support d'informations Download PDF

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Publication number
WO2000021059A2
WO2000021059A2 PCT/DE1999/003244 DE9903244W WO0021059A2 WO 2000021059 A2 WO2000021059 A2 WO 2000021059A2 DE 9903244 W DE9903244 W DE 9903244W WO 0021059 A2 WO0021059 A2 WO 0021059A2
Authority
WO
WIPO (PCT)
Prior art keywords
label
layer
memory module
carrier
particular according
Prior art date
Application number
PCT/DE1999/003244
Other languages
German (de)
English (en)
Other versions
WO2000021059A3 (fr
Inventor
Konrad Kristen
Original Assignee
Konrad Kristen
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konrad Kristen filed Critical Konrad Kristen
Priority to AU16475/00A priority Critical patent/AU1647500A/en
Priority to DE19982015T priority patent/DE19982015D2/de
Publication of WO2000021059A2 publication Critical patent/WO2000021059A2/fr
Publication of WO2000021059A3 publication Critical patent/WO2000021059A3/fr

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/072—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising a plurality of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a label with an information carrier with information applied in the usual pictorial and written language, wherein the label also contains an electronic memory chip designed as a chip.
  • the information carrier contains e.g. goods-related information, for example information recorded in the visual and written language.
  • the bar code is also widespread. It can encrypt the price, but is manipulable. The state of the art is accordingly exhausted in a yes / no label.
  • a chip offers the possibility of storing more comprehensive information such as price, article, origin and even the possibility of cross-checking.
  • DE-GM 295 14 200 discloses a label with information and signal carriers removed from view. Embedding is an a ⁇ nat.
  • the object of the invention is to construct a multifunctional information label which is advantageous in terms of construction and use.
  • the corresponding, open-sighted assignment of the electronic memory module to the dispensable label can be achieved more easily.
  • the information aspect is in the foreground.
  • the label which is preferably made of paper (no longer plastic) and therefore also more environmentally friendly and can be disposed of again, can be used in the broad field of identification as well as in the area of security, for example theft protection.
  • those who want to steal can optically and visually recognize the corresponding measure of goods security on the label. In any case, he cannot assume that this measure does not exist, as is to be assumed in the case of an embedding that is hidden from view. If he steals, he steals seeing eyes. On the other hand, there is a certain psychological lock.
  • the integrated chip / transponder opens up to non-contact energy and data transmission. Electronic scanning practically takes place. If the adjustment is successful, the signaling takes place.
  • the label can also be provided with individual data, ie information. The chip is assigned neutral and then loaded. The visible assignment does not have to do without mechanical protection. In this regard, the procedure is advantageously such that the electronic memory module is exposed in a depression in the carrier position of the label.
  • Such a depression can be created by embossing or by means of a multilayer structure with glue-free strips.
  • the corresponding depression can be achieved at a depth that corresponds at least to the edge height of the chip or transponder.
  • the partial double-layering is of no importance with regard to the flexibility of the label; the label remains sheet-like.
  • the electronic memory chip occupies only a fraction of the wide area of the label.
  • double-layering is preferred, either with a depression in one of the two carrier layers or, which is preferred here, that the label is formed in such a way that the electronic memory chip (chip or transponder) is in a window of the upper layer is exposed. Visibility and edge protection or stand fixation are best given.
  • a structurally / production-technically advantageous embodiment is achieved by an upper layer which is foldably assigned to the carrier layer. Then there is a structurally advantageous solution due to an accurately fitting upper layer placed on the carrier layer. The latter, acting as a mask, can be punched out separately.
  • Such a structure can be chosen instead of the mentioned foldable assignment of the upper layer if the label body does not contribute the required foldability due to the material.
  • the memory module is arranged with a protrusion with respect to the carrier layer or the surrounding upper layer.
  • the storage This makes the block even more recognizable, even palpable, but on the other hand, the desired fixation is fully preserved through the window surrounding it in the form of a frame.
  • the carrier layer and the upper layer each have a pressure-sensitive adhesive layer and the pressure-sensitive adhesive layers lie against one another. This leads to a highly effective layer combination in a back-to-back system.
  • the invention then relates to a label lying on a carrier strip which has a pressure-sensitive adhesive layer on the side facing the carrier strip.
  • this label there is a proposed solution of even independent importance through an electronic memory module which penetrates a window in the carrier strip and is connected to the label by means of the pressure-sensitive adhesive layer. From the back of the backing strip - the so-called masking paper - the storage layer is populated. It is fixed using the exposed adhesive layer.
  • the label is constructed in two parts with the formation of two matching sections connected by a predetermined separating or folding line, with a window being formed in one section of the memory module and in the other section mirror-symmetrically to the predetermined separating or folding line.
  • matching push-through openings be formed mirror-symmetrically in both sections.
  • the label By pulling in a mounting tape, the label can be used as a hanging label.
  • the two layers of pressure-sensitive adhesive come together to fold the layers or sections.
  • the explained hangable label card is available. If this label card is to be fixed to an object, one could use an adhesive on the back.
  • a solution is available which consists in the fact that the upper layer has flags which project beyond the outline of the lower layer.
  • the pressure-sensitive adhesive layer which is present from the outside and which otherwise holds the label on the carrier strip can also be used at the same time for fixing the label to the object.
  • the flags are so adhesive flags. You can by. Schau of guidelines can also be torn off.
  • the label be rectangular, with longer and shorter sides, and that the adhesive flags are formed opposite each other on the shorter or longer sides. They can extend over the entire length of the page or can be cut back slightly at both ends.
  • the invention proposes that two labels are connected to each other via a predetermined dividing line. So there is a double label. This can be used in the sense of an optical-visual affiliation (separation of a picture motif). Accordingly, it is useful if the two labels can be recognized as belonging together by a graphic design after separation. Such logical joining lines can be highlighted in color. It is further proposed that the target dividing line has an individualizing course.
  • Fig. 1 labels on a carrier strip, coming from a supply roll, with the removal point E on the right above an empty roll.
  • Fig. 3 shows the labels on a carrier strip
  • both solutions can be dispensed using standard dispensing devices
  • FIG. 4 shows the top view of a label according to the first exemplary embodiment, with an electronic memory module lying in a depression, with a carrier strip (not shown),
  • FIG. 5 shows the section according to line V-V in FIG. 4 in layer thicknesses which are excessively clear
  • Fig. 6 is a plan view of a label according to the second embodiment, in a window an electronic memory chip that can be accommodated visibly (carrier layer and upper layer still not connected),
  • FIG. 8 shows a section corresponding to FIG. 7 with the layers now connected, forming a card label
  • FIG. 10 shows the top view of a label according to the third exemplary embodiment, with the top layer placed precisely on the carrier layer, leaving a window,
  • FIG. 11 shows the section along line XI-XI in FIG. 10,
  • FIG. 12 is a top view of a label that has not yet been assembled according to the fourth exemplary embodiment, with the memory module nested in a window of the supporting bar,
  • FIG. 16 shows the top view of a label while maintaining the windowing of the carrier strip 1, in the folded version according to FIG. taking into account those that are also arranged on the longer sides,
  • FIG. 17 shows the top view of a label according to the sixth exemplary embodiment, unfolded, with adhesive flags placed on the shorter sides,
  • FIG. 18 shows the top view of two labels connected via a predetermined breaking line, embodying a seventh exemplary embodiment
  • a roll-up carrier strip or carrier strip 1 which can be converted into a zigzag shape contains labels 2 arranged in a row. These are usually held releasably by means of a pressure-sensitive adhesive layer 3 on the carrier strip 1, which is made of film, siliconized paper or the like, for example.
  • the Leporello version can be glued to the next Most zigzag packing in the sense of an endless donation can be conveniently supplemented.
  • connection of the label material with the carrier strip 1 as cover paper depends on the different uses and uses of the labels 2.
  • a permanent adhesive can therefore also be used instead of a releasable adhesive. Measures with regard to temperatures in the minus and plus range can also be taken into account, as can measures with regard to oils, acids and bases. The coordination is reserved for the individual case. Liability could also be through adhesion or dry glue.
  • the label material held ready for dispensing in a removal point E is otherwise punched out on the carrier strip 1; the peripheral waste grid of the labels 2 has already been removed.
  • the carrier film can also be additionally slit or partially die-cut.
  • the transverse lines indicated in FIG. 2 are to be understood as perforation 4.
  • the dispensing in a device takes place by pulling the carrier strip 1 at an acute angle around a ledge edge of the dispenser.
  • the label 2 runs freely over the edge in the conveying direction and is thus released. Only the dispenser bar is shown and labeled Sp.
  • the punching can also be carried out while leaving the most varied spacing areas between the individual labels 2 and also on masking paper.
  • Each label 2 has an information carrier 5 on its side facing away from the PSA layer 3.
  • The contains the usual graphic information, for example wise in picture and / or written language. This can be comprehensive information about the origin, goods class, packaging and expiry dates, as well as weight and price information, which details would have to be continued.
  • a field for example a magnetic strip relating to a hologram or kinegram, is declared 5 '. This can be printed on one or both sides in screen printing.
  • each label 2 also contains an electronic element, for example in the form of a chip or a transponder, hereinafter referred to as electronic memory module 6, which is spaced from the edge. It is assigned to a film so that it can be removed in a row. The latter has spiked roller holes near the edge. Chip and transponder are assigned to label 2 so that they are visible to the viewer.
  • electronic memory module 6 for example in the form of a chip or a transponder, hereinafter referred to as electronic memory module 6, which is spaced from the edge. It is assigned to a film so that it can be removed in a row. The latter has spiked roller holes near the edge. Chip and transponder are assigned to label 2 so that they are visible to the viewer.
  • the electronic memory module 6 is a flat part. Its integration is carried out in a protected manner despite free visibility. According to the proposal, this is basically done in two ways: according to one version (FIG. 5) by way of a depression 7 in the carrier layer 8 which forms the basic body of the label 2, applied to the first exemplary embodiment.
  • the depression 7 appears as a depression which starts from the visible side of the label 2, that is to say its one broad area. Such an indentation can be made at the same time when the label 2 is manufactured, and this can be populated with the information carrier 5 present or absent and the same.
  • the depression 7 is of such a vertical depth (reference: horizontal position according to FIG. 5) that the edge 6 ' of the platelet-shaped electronic memory module 6 disappears behind a kind of cover.
  • the corresponding inner edge 9 of the depression 7 extends like a protective wall, but at least as a base fixation close to the base around said edge 6 '.
  • the upper side of the electronic memory module 6 facing the viewer is at least level with the visible side of the information carrier 5, which is shown in the drawing in section as a vertically hatched layer.
  • the visible side of the electronic memory module 6 can, however, also lie somewhat lower than the plateau-shaped surroundings of the label 2, above all if a transparent protective cover is superimposed as a further layer, forming an excess height.
  • a full-walled opening is used to create an accommodation space for the electronic memory module 6.
  • this solution looks such that the label 2 is constructed in multiple layers and the electronic memory chip (chip or transponder) is exposed in a window 10 of an upper layer 11 of the label 2.
  • the window-forming opening comprises both the information carrier 5 entered in the drawing as a layer and the pressure-sensitive adhesive layer 3 (cf. FIG. 7).
  • the carrier layer 8, which has the electronic memory module 6, is added to the upper layer 11 containing the window 10.
  • the pressure-sensitive adhesive layer 3 which is present anyway is used, which at the same time also serves as a binding element of the electronic memory module 6 on the carrier layer 8.
  • the solution according to the first exemplary embodiment provides for a special pressure-sensitive adhesive layer, which is denoted by 12 in FIG. 5.
  • FIG. 7 it is also possible to work in one piece with respect to the layers 8 and 11.
  • the outline of the corresponding blank is shown in FIG. 6.
  • the border zone between the two layers 8 and 11 is designed to form a hinge.
  • the corresponding hinge point 13 is based on a transverse fold or the formation of a predetermined separation or crease line 18 of the elongated or on the elongated two-layer label die cut or on the die cut.
  • the upper layer 11 foldably assigned to the carrier layer 8 basically has the same outline as the carrier layer 8. The exception is explained further below. Folding the carrier layer 8 against the back of the upper layer 11 integrates the electronic memory module 6 of the upper layer 11, ie it pivots into the window 10 from below.
  • the folding direction is indicated in Figure 7 by arrow x.
  • the reference numerals of the first exemplary embodiment are, as far as is necessary for understanding, correspondingly transferred, in some cases without repeated text.
  • the pressure-sensitive adhesive layer 3 also ensures the cohesion of the layers 8, 11 folded against one another on the back like a book cover.
  • the procedure is such that the upper layer 11 has the outlines of the lower layer, here formed by the carrier layer 8, outwardly projecting flags 14. They are adhesive flags. These are also taken into account when punching. Their practical application is shown in FIG. 9. Said adhesive flags can be folded down to the side of the longitudinal edges of the layer 8 and assigned to a flat surface of an object 15 in order to impart adhesion. In this way, a separate, i.e. additional adhesive equipment on the underside of the double-layer labels 2.
  • the pit-forming depression 7 can also be produced by milling, which is preferably used with thick-walled labels 2.
  • a multifunctional information label has been implemented. This can be manufactured as an inexpensive mass product.
  • the label 2 is recognizable without contact. The need for information in the context of meet.
  • the visual element 6 of the electronic element 6 has a better pre-warning effect than a chip that is elaborately hidden in a laminate. The psychological barrier to theft is increased.
  • plastic foils can also be used as label material, even sheet-forming materials such as Starch, gelatin. It (2) can also be multi-layer and copying.
  • the information carrier can also be implemented as a magnetic tape in addition to a chip, transponder.
  • the information carriers on the label material are connected by means of adhesives, heat sealing, embedding in lacquer layers or appropriately punched out flexible foils.
  • the positioning of the various, also combinable information media on the label material is not defined and can be selected by the user.
  • the third exemplary embodiment (FIGS. 10 and 11) provides for a free layer addition instead of the folding solution providing adhesive flags 14.
  • the starting point here is also a carrier layer 8 which is bonded to the carrier strip 1.
  • the pressure-sensitive adhesive layer 3 on the underside of the carrier layer 8 is firmly connected to the carrier layer 8.
  • the carrier layer 8 can here have a second top-side pressure-sensitive adhesive layer 3, which forms the fastening base for the electronic memory module 6 there.
  • the upper layer 11 is fitted precisely onto the carrier layer 8, also taking into account the window 10 formed in the upper layer 11 here If the pressure-sensitive adhesive layer 3 were arranged on the underside of the top layer 11 placed thereon, the pressure-sensitive adhesive layer 3 would not have been punched out in the outline field of the window 10. It would span the window cavity like a membrane.
  • an adhesive-free longitudinal strip of the width of the window 10 could also be provided and the memory module 6 could have its own pressure-sensitive adhesive layer.
  • the information carriers 5, 5 'shown in the previous exemplary embodiments are omitted here.
  • the third exemplary embodiment ff. Is also printed.
  • the electronic memory module 6 is arranged with a protrusion with respect to the carrier layer 8 or the window-forming, surrounding upper layer 11, which not only supports the conspicuous visibility, but also forms a tactile projection, for example.
  • the protrusion is generally below half the height of the memory module 6. It preferably protrudes by a third of its height.
  • the fourth exemplary embodiment again provides a hinged connection between the two label-forming layers.
  • the carrier layer 8 in the intermediate stage, that is to say in the fold state not yet forming double layers, is located at the top in relation to the carrier strip 1 which is also present there.
  • the actual so-called upper layer 11 then connects at the same level via a hinge point 13.
  • Both the carrier layer 8 and the upper layer 11 each have a pressure-sensitive adhesive layer 3. This faces the carrier strip 1 and can be detached therefrom according to appropriate equipment (wax paper, paper impregnated with silicone, etc.). Converted into the label form, the two pressure-sensitive adhesive layers 3 come together as inner layers of a sandwich-like label 2, practically inseparably adhesive. Reference is made to FIG. 15.
  • the label die-cut lying on the carrier strip 1 is not only coated with the pressure-sensitive adhesive layer 3 in the manner described on the side facing the carrier strip 1, but is also prepared with regard to the assignment of the electronic memory module 6.
  • Another window 17 serves this purpose. However, this lies in the carrier strip 1. It thus allows the placement of the memory module 6 practically from the back of the carrier strip 1 holding the punched-out label blanks on the other side.
  • the carrier strip 1 can be turned over again, for example for the printing to be able to make the visible sides of the later label. It is expedient to work in the rotary printing process. Window punching also takes place in this way.
  • the memory module 6 is held by the pressure-sensitive adhesive layer 3 described.
  • the other, or designated 11, upper layer has the window 10, which has already been explained in detail and which, in the manner described, provides the framing, but in any case fixes the position of the adhesive memory module 6.
  • a two-part label 2 can thus be seen here overall.
  • the two sections are connected via a predetermined dividing or kinking line 18 crossing in the shortest way.
  • the latter also defines a mirror-symmetrical structure of the two-part system.
  • the congruent outline sections are also positively controlled during the folding process via the hinge effect of the line 13/18 mentioned. This and the corresponding positioning of window 10 in the so-called upper layer 11 and memory module 6 under the carrier layer 8 results in the laminate-like label 2 in the blink of an eye.
  • a perforation can be used to pull through a ribbon (not shown). In terms of construction, this is achieved in that matching through openings 19 are formed in both sections. They can also be brought into their congruent position from the hinge effect of the predetermined separating or folding line 18.
  • the fifth exemplary embodiment takes up the idea of the flags 14 explained in the second exemplary embodiment in the form of adhesive flags 14. The adhesive flags that extend from the upper layer 11 and overlap the outline of the lower layer, that is to say carrier layer 8, are now longer than in the case of the object according to FIG. 6. There, the adhesive flags jump back significantly in relation to the convexly rounded corner zones of the label 2.
  • the label 2 which also has a rectangular base in FIG. 16, has two longer and two shorter sides.
  • the flags 14 or adhesive flags are located opposite one another on the longer sides of the label 2 or the lower layer in adhesive assignment.
  • the pressure-sensitive adhesive 3 that is present from home can be used to fix the label 2 to the object 15.
  • the adhesive flags can also be struck under the carrier layer 8.
  • a tear-off option can also be used. This consists of a perforation line 20 which defines the root of the protrusion of the adhesive flags 14.
  • FIG. 17 shows that there is a waste-saving positioning of the label die cuts.
  • jump-like niches 21 arise in front of the corresponding shorter sides of the carrier layer 8.
  • a seventh exemplary embodiment is presented in FIG. It is a kind of double label.
  • the two labels each have the reference number 2. They are connected by a predetermined breaking line 24 that divides them into the same area.
  • the assignment of a memory module 6 is carried out in one of the ways described. Textual repetitions should therefore be avoided. Only the reference numbers, as far as necessary for understanding, are transferred accordingly.
  • the target dividing line 24 takes over a kind of key formation.
  • the two labels 2 can be recognized as related individual labels, for example, by a printing design after separation. Screen printing is also preferred here.
  • a physical tap can also be the basis here. This is realized by male protrusions 25 on one label 2, which engage in matching die recesses 26 of the other label 2 in a manner that is suitable for joining. A high rate of variation can be achieved here. The goes so far that the target dividing line 24 takes an individualizing course by varying the engagement contour along the dividing line.
  • the target dividing line 24 is implemented in a structure comparable to an irregular tin silhouette. You could also call it an irregular meandering structure.
  • FIGS. 18-20 illustrate a further development in that 2 conductor tracks 27 are formed on the visible side of the labels. These are three such conductor tracks 27 that run parallel to one another and connect the electronic memory modules 6 to one another electrically.
  • the connection that can be achieved in terms of printing technology results from FIG. 19, there in a largely schematic representation. The printing can be carried out there before the memory modules 6 are assigned.
  • FIG. 20 shows double labels attached to one another in the manner of arches and stripes, which, with a long rectangular layout, are connected by their free, shorter sides, here too using the predetermined dividing line mentioned. A waste grid is not shown.
  • the last, eighth embodiment corresponds structurally to the third (FIG. 11).
  • this tag 2 is assigned the transponder 28 mentioned. The latter will activated and only reflected by the reading source. This happens without contact.
  • the window 10 of the upper layer 11 is given a contoured shape. This circular electronic element can also protrude above the top of the upper layer 11 in the manner shown.
  • the pressure-sensitive adhesive layer 3 can also be used here or an adhesive layer given to the element from the start. A foot-side support in the form of the stand fixation takes place over the edge 28 'of the transponder 28 on the inner wall 9 of the window 10.
  • All electronic elements can be covered with a protective layer.
  • the label 2 can be covered with a transparent film or provided with a varnish to protect it against mechanical loads or against chemical (also oil-containing substances) influences.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne une étiquette (2) dotée d'un support d'informations (5) comprenant des informations figurant sous forme d'images et d'écriture. L'étiquette (2) contient également un module électronique de mémoire (6) conçu sous forme de puce (6). L'invention est caractérisée en ce que la puce est intégrée dans l'étiquette (2) de manière à être visible pour l'observation. Le module de mémoire peut être avantageusement conçu comme transpondeur.
PCT/DE1999/003244 1998-10-05 1999-10-05 Etiquette dotee d'un support d'informations WO2000021059A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU16475/00A AU1647500A (en) 1998-10-05 1999-10-05 Label with an information carrier
DE19982015T DE19982015D2 (de) 1998-10-05 1999-10-05 Etikett mit einem Informationsträger

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19845847.9 1998-10-05
DE1998145847 DE19845847A1 (de) 1998-10-05 1998-10-05 Etikett mit einem Informationsträger

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WO2000021059A2 true WO2000021059A2 (fr) 2000-04-13
WO2000021059A3 WO2000021059A3 (fr) 2000-07-13

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PCT/DE1999/003244 WO2000021059A2 (fr) 1998-10-05 1999-10-05 Etiquette dotee d'un support d'informations

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AU (1) AU1647500A (fr)
DE (2) DE19845847A1 (fr)
WO (1) WO2000021059A2 (fr)

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US8028445B2 (en) 2005-06-23 2011-10-04 Hills Numberplate Holdings Limited Supports and signs
CN114973917A (zh) * 2022-05-17 2022-08-30 通通印标签(苏州)有限公司 一种立体揭开式数码防伪标签

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DE10151241B4 (de) * 2001-10-17 2006-08-31 Infineon Technologies Ag Siegel
DE10156038A1 (de) * 2001-11-15 2003-06-05 Joergen Brosow Verfahren zur Sicherung des Luftverkehrs
DE10323168A1 (de) * 2003-05-22 2004-12-09 Conti Temic Microelectronic Gmbh Elektronisches Bauteil mit einem Kennzeichnungselement
DE10334576B4 (de) * 2003-07-28 2007-04-05 Infineon Technologies Ag Verfahren zum Herstellen eines Halbleiterbauelements mit einem Kunststoffgehäuse
DE102010001794A1 (de) * 2010-02-11 2011-08-11 Kreutz, Kerry Wilhelm, 51109 Verfahren und Vorrichtung zur Herstellung von Etiketten
DE102020213032B4 (de) * 2020-10-15 2022-06-09 Leoni Bordnetz-Systeme Gmbh Vorrichtung, Steckverbinder und Verfahren zur Erkennung einer erstmaligen Trennung einer Steckverbindung

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Publication number Priority date Publication date Assignee Title
FR2716281B1 (fr) * 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
DE19615980C2 (de) * 1996-04-22 1999-02-04 Fraunhofer Ges Forschung Datenträgerkarte mit einem Kartenzwischenerzeugnis
FR2760209B1 (fr) * 1997-03-03 1999-05-21 Ier Procede et systeme d'emission d'etiquettes d'identification

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8028445B2 (en) 2005-06-23 2011-10-04 Hills Numberplate Holdings Limited Supports and signs
CN114973917A (zh) * 2022-05-17 2022-08-30 通通印标签(苏州)有限公司 一种立体揭开式数码防伪标签

Also Published As

Publication number Publication date
DE19845847A1 (de) 2000-04-13
WO2000021059A3 (fr) 2000-07-13
DE19982015D2 (de) 2001-09-13
AU1647500A (en) 2000-04-26

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