WO2000015435A1 - Imagerie lithographique comprenant des structures dotees de couches oleophiles inorganiques - Google Patents
Imagerie lithographique comprenant des structures dotees de couches oleophiles inorganiques Download PDFInfo
- Publication number
- WO2000015435A1 WO2000015435A1 PCT/US1999/020837 US9920837W WO0015435A1 WO 2000015435 A1 WO2000015435 A1 WO 2000015435A1 US 9920837 W US9920837 W US 9920837W WO 0015435 A1 WO0015435 A1 WO 0015435A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- compound
- metal
- dopant
- oleophilic
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 30
- 238000010276 construction Methods 0.000 title abstract description 9
- 150000001875 compounds Chemical class 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 40
- 239000000463 material Substances 0.000 claims abstract description 18
- 239000000919 ceramic Substances 0.000 claims abstract description 11
- 238000009413 insulation Methods 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 70
- 238000007639 printing Methods 0.000 claims description 39
- 239000002019 doping agent Substances 0.000 claims description 23
- 230000005855 radiation Effects 0.000 claims description 14
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 239000012530 fluid Substances 0.000 claims description 11
- 229910052755 nonmetal Inorganic materials 0.000 claims description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 229910052718 tin Inorganic materials 0.000 claims description 10
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 7
- 229910052796 boron Inorganic materials 0.000 claims description 7
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- 239000010936 titanium Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 230000004888 barrier function Effects 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 229910010282 TiON Inorganic materials 0.000 claims description 3
- 229910003087 TiOx Inorganic materials 0.000 claims description 3
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 3
- 229910052747 lanthanoid Inorganic materials 0.000 claims description 3
- 150000002602 lanthanoids Chemical class 0.000 claims description 3
- 229910044991 metal oxide Inorganic materials 0.000 claims description 3
- 150000004706 metal oxides Chemical class 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052758 niobium Inorganic materials 0.000 claims description 3
- 239000010955 niobium Substances 0.000 claims description 3
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 3
- 150000004767 nitrides Chemical class 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229910052760 oxygen Inorganic materials 0.000 claims description 3
- 239000001301 oxygen Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052715 tantalum Inorganic materials 0.000 claims description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 3
- HLLICFJUWSZHRJ-UHFFFAOYSA-N tioxidazole Chemical group CCCOC1=CC=C2N=C(NC(=O)OC)SC2=C1 HLLICFJUWSZHRJ-UHFFFAOYSA-N 0.000 claims description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- 229910052720 vanadium Inorganic materials 0.000 claims description 3
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 claims description 3
- 229910052726 zirconium Inorganic materials 0.000 claims description 3
- 229910003682 SiB6 Inorganic materials 0.000 claims 4
- 229910052723 transition metal Inorganic materials 0.000 claims 4
- 150000003624 transition metals Chemical class 0.000 claims 4
- 206010010144 Completed suicide Diseases 0.000 claims 2
- 238000010521 absorption reaction Methods 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 19
- 238000002679 ablation Methods 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 4
- 229910010293 ceramic material Inorganic materials 0.000 abstract description 4
- 238000012937 correction Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 106
- 239000000976 ink Substances 0.000 description 15
- 230000008569 process Effects 0.000 description 14
- 239000000203 mixture Substances 0.000 description 7
- 239000011241 protective layer Substances 0.000 description 7
- 230000006870 function Effects 0.000 description 5
- 150000002739 metals Chemical class 0.000 description 5
- 230000007704 transition Effects 0.000 description 5
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000011147 inorganic material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 239000013047 polymeric layer Substances 0.000 description 4
- 229920002451 polyvinyl alcohol Polymers 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000001747 exhibiting effect Effects 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000013019 agitation Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 238000006731 degradation reaction Methods 0.000 description 2
- 238000012217 deletion Methods 0.000 description 2
- 230000037430 deletion Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 150000002736 metal compounds Chemical class 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 229910018125 Al-Si Inorganic materials 0.000 description 1
- 229910018520 Al—Si Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000007743 anodising Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010285 flame spraying Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000005660 hydrophilic surface Effects 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000002843 nonmetals Chemical class 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000001131 transforming effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/006—Printing plates or foils; Materials therefor made entirely of inorganic materials other than natural stone or metals, e.g. ceramics, carbide materials, ferroelectric materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41C—PROCESSES FOR THE MANUFACTURE OR REPRODUCTION OF PRINTING SURFACES
- B41C1/00—Forme preparation
- B41C1/10—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme
- B41C1/1008—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme by removal or destruction of lithographic material on the lithographic support, e.g. by laser or spark ablation; by the use of materials rendered soluble or insoluble by heat exposure, e.g. by heat produced from a light to heat transforming system; by on-the-press exposure or on-the-press development, e.g. by the fountain of photolithographic materials
- B41C1/1033—Forme preparation for lithographic printing; Master sheets for transferring a lithographic image to the forme by removal or destruction of lithographic material on the lithographic support, e.g. by laser or spark ablation; by the use of materials rendered soluble or insoluble by heat exposure, e.g. by heat produced from a light to heat transforming system; by on-the-press exposure or on-the-press development, e.g. by the fountain of photolithographic materials by laser or spark ablation
Definitions
- the present invention relates to digital printing apparatus and
- a printable image is present on a printing
- ink can be any organic (oleophobic) surface areas. Once applied to these areas, ink can be any organic (oleophobic) surface areas. Once applied to these areas, ink can be any organic (oleophobic) surface areas. Once applied to these areas, ink can be any organic (oleophobic) surface areas. Once applied to these areas, ink can be any organic (oleophobic) surface areas. Once applied to these areas, ink can be
- Dry printing systems utilize printing members whose
- ink-repellent portions are sufficiently phobic to ink as to permit its direct
- the recording medium only in the imagewise pattern.
- the recording medium In typical sheet-fed press systems, the recording medium is pinned to an impression cylinder, which brings it into contact
- the non-image areas are hydrophilic
- dampening fluid to the plate prior to inking.
- the dampening fluid prevents
- Plate-imaging devices amenable to computer control include
- the plate constructions include an inorganic layer
- the inorganic layer ablates in
- IR infrared
- inorganic layer represents the topmost surface of the plate and accepts
- dampening fluid while the underlying polymeric layer accepts ink.
- Application of an imaging pulse to a point on the plate ultimately creates an imaging pulse
- inorganic layers may undergo failure (e.g., fracturing) due to temperature
- polymeric layers may be selected
- a polymeric layer may also be pretreated (e.g., through
- the present invention replaces the conventional polymeric ink-
- the plates may also be provided with a protective layer that serves a
- the plate constructions of the present invention include a
- an overlying layer provides sufficient thermal insulation to
- thermal insulation is adequate if the imaging power (at a given pulse width)
- thermally insulating substrates having thermally insulating (e.g., polyester) substrates.
- the plates of the present invention can be either "positive-working"
- hydrophilic layer that will reject ink during printing
- the applied inorganic layers are
- a hydrophilic ceramic layer may be used to anchor a hydrophilic ceramic layer to the oleophilic
- the oleophilic layers may be any suitable oleophilic layer.
- the oleophilic layers may be any suitable oleophilic layer.
- member refers to any type of printing member or surface capable of
- suitable configurations include the traditional
- planar or curved lithographic plates that are mounted on the plate cylinder
- hydrophilic is used in the printing sense to
- Such fluids include water for conventional ink systems, aqueous
- FIG. 1 is an enlarged sectional view of a negative-working
- FIG. 2 is an enlarged sectional view of a positive-working
- printing members includes at least one laser device that emits in the region
- laser output can be provided directly to the plate surface via lenses or other beam-guiding components, or transmitted to the
- the controller responds to incoming
- the image signals are stored as a bitmap data file on a
- Such files may be generated by a raster image processor
- a RIP can accept input data
- bitmaps are
- the imaging apparatus can operate on its own, functioning solely as
- a platemaker or can be incorporated directly into a lithographic printing
- printing may commence immediately after
- the imaging apparatus can be configured as a flatbed
- the exterior drum design is more appropriate to use in situ, on a lithographic
- the beam can move parallel to
- the beam is drawn across either axis of
- the requisite relative motion between the beam and the plate may be
- the writing array is
- construction 100 includes a hard substrate 1 10, a hard ceramic layer 1 1 2,
- a tying layer 1 1 4 a tying layer 1 1 4, and a hydrophilic, metallic inorganic layer 1 1 6.
- Substrate 1 10 is strong, stable and flexible, and is preferably a metal sheet.
- Preferred metal substrates have thicknesses of 0.005 inch or more.
- substrate 1 1 0 may be a multilayer composite including
- Layer 1 1 2 is oleophilic, hard, and flexible enough to permit normal
- layer 1 1 2 must maintain its own internal integrity notwithstanding
- layer 1 1 2 is deposited at a thickness of at least 500 o
- layer 1 1 2 should not degrade despite repeated
- Preferred materials for layer 1 1 2 include ceramics, a class of material
- Ceramics include such covalent hard materials as B 4 C, BN,
- AIB 12 SiC, SiB, Si 3 N 4 , and AIN, among others. Suitable materials may also be used.
- dopants such as copper, to improve ink receptivity.
- Layer 1 1 4 which is optional, is a a metal that may or may not
- the thickness of layer 1 14 depends on the application.
- layer 1 14 is applied at thicknesses of
- Layer 1 14 functions as a tying layer if the surface characteristics of hard layer 1 1 2 are not well-suited to acceptance and
- anchorage of the metallic inorganic layer may otherwise be omitted.
- the metal of layer 1 1 4 is at least one d-block (transition) metal, aluminum " ,
- the metals are present as an alloy
- Oxidation can occur on both metal surfaces, and may
- Layer 1 1 6 is a metallic inorganic layer comprising a compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at least one compound of at
- component of layer 1 1 6 may be a d-block (transition) metal, an f-block
- (lanthanide) metal aluminum, indium or tin, or a mixture of any of the
- Preferred metals include titanium, zirconium, vanadium,
- the non-metal component niobium, tantalum, molybdenum and tungsten.
- layer 1 1 6 may be one or more of the p-block elements boron, carbon,
- cases e.g., Al-Si compounds
- Preferred metal/non-metal combinations include TiN, TiON, TiO x (where 0.9 ⁇ x ⁇ 2.0), TiAIN, TiAICN,
- a protective layer 1 20 may be deposited over metallic inorganic layer
- this layer can serve a variety of beneficial functions:
- hydrophilicity as that term is used in the printing industry, i.e., accepting
- Protective layer 1 20 performs these functions but mostly
- Protective layer 1 20 preferably comprises a polyalkyl ether or
- the polyalkyl ether or polyvinyl alcohol compound when applied as a liquid, the polyalkyl ether or polyvinyl alcohol compound
- the average molecular weight may have a relatively substantial average molecular weight (i.e., at least
- a coating liquid should also exhibit sufficient viscosity to
- a preferred formulation for aqueous coating 1 20 comprises 2.5 parts
- polyvinyl alcohol e.g., the Airvol 203 product sold by Air Products and
- the temperature of the dispersion is elevated to 85-96 °C, and held
- the solution is coated over a ceramic printing plate surface and dried
- a protective layer at a thickness of about 0.2 to 0.4 ⁇ m.
- the protective layer 1 20 is preferably applied at a
- the thinner layer 120 can be made, the more quickly
- FIG. 2 illustrates a positive-working plate in
- the illustrated construction 200 includes a
- hard substrate 21 0, an inorganic hydrophilic layer 21 2, a thin metal layer-
- layer 21 6 are modified by application of a very thin oleophilic layer 21 8,
- construction 200 may be covered by a protective layer 220.
- layer 21 2 receives fountain solution rather than
- Layer 21 2 is ordinarily a ceramic material, as defined above,
- a suitable material is indium tin oxide applied
- substrate 21 0 is an anodized aluminum sheet as
- Layer 21 2 is revealed during the imaging process as layers 214,
- 21 4, 21 6, 21 8 are applied at a collective thickness that does not preclude
- Layer 21 is an optional tying layer applied at a thickness of 50-5000 A; a representative
- layer is titanium metal applied to a thickness of 300 A, but once again,
- layer 1 14 may be at least one d-block (transition) metal, aluminum, indium
- Layer 21 6 is a metallic inorganic layer analogous to layer 1 1 6
- overlying layer 21 8 combine with overlying layer 21 8 to serve as an ink-accepting surface.
- layer 21 8 dopes layer 21 6, conferring oleophilicity thereto.
- 21 6 may be applied at thicknesses ranging from 100-5000 A, but given
- Layer 21 8 is oleophilic, and may be an oleophilic metal such as
- Layer 21 8 may be deposited by a
- impart oleophilicity— may be quite thin.
- the plates 100, 200 may be utilized with wet-printing ink systems,
- deletion fluids such as the
- addition materials (such as a fine-point
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Printing Plates And Materials Therefor (AREA)
Abstract
L'invention concerne des structures de plaques lithographiques négatives et positives, comprenant une couche hydrophile durable; une couche dure oléophile inorganique, et un substrat qui peut être un métal. Si on utilise un substrat métallique, une couche de recouvrement fournit une isolation thermique suffisante pour empêcher une dissipation substantielle de la chaleur nécessaire à la réalisation d'une ablation dans le substrat. Lorsqu'on utilise des couches oléophiles dans des réalisations avec copie au négatif, certains matériaux en céramique sont appropriés, et on peut utiliser une couche intermédiaire de liaison pour ancrer une couche hydrophile en céramique sur la couche oléophile. Selon des modes de réalisation en copie positive, les couches oléophiles peuvent être des composés réfractaires dopés par un matériau oléophile. Ces dernières réalisations offrent la possibilité d'appliquer des moyens de correction traditionnels après une imagerie.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU59185/99A AU5918599A (en) | 1998-09-11 | 1999-09-10 | Lithographic imaging with constructions having inorganic oleophilic layers |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/151,497 US6073559A (en) | 1998-09-11 | 1998-09-11 | Lithographic imaging with constructions having inorganic oleophilic layers |
US09/151,497 | 1998-09-11 | ||
US09/390,553 US6279476B1 (en) | 1998-09-11 | 1999-09-03 | Lithographic imaging with constructions having inorganic oleophilic layers |
US09/390,553 | 1999-09-03 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000015435A1 true WO2000015435A1 (fr) | 2000-03-23 |
Family
ID=26848701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/020837 WO2000015435A1 (fr) | 1998-09-11 | 1999-09-10 | Imagerie lithographique comprenant des structures dotees de couches oleophiles inorganiques |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU5918599A (fr) |
WO (1) | WO2000015435A1 (fr) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005108076A1 (fr) * | 2004-05-05 | 2005-11-17 | Presstek, Inc. | Element d'impression lithographique comportant une couche polymerisee par plasma |
WO2006130241A3 (fr) * | 2005-04-15 | 2007-01-18 | Presstek Inc | Impression lithographique faisant appel a des elements d'impression contenant un metal oleophile et des couches polymeres plasma |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0825021A2 (fr) * | 1996-08-20 | 1998-02-25 | Presstek, Inc. | Structures à couches minces pour l'enregistrement de l'image à base de couches métalliques-anorganiques et comportant des structures optiques d'interférence |
EP0844080A2 (fr) * | 1996-11-25 | 1998-05-27 | Presstek, Inc. | Plaques lithographiques pour l'enregistrement au laser, auto-nettoyantes et résistantes à l'abrasion |
WO1998030400A1 (fr) * | 1997-01-06 | 1998-07-16 | Presstek, Inc. | Structures d'impression lithographique humide comprenant des couches inorganiques metalliques |
-
1999
- 1999-09-10 WO PCT/US1999/020837 patent/WO2000015435A1/fr active Application Filing
- 1999-09-10 AU AU59185/99A patent/AU5918599A/en not_active Abandoned
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0825021A2 (fr) * | 1996-08-20 | 1998-02-25 | Presstek, Inc. | Structures à couches minces pour l'enregistrement de l'image à base de couches métalliques-anorganiques et comportant des structures optiques d'interférence |
EP0844080A2 (fr) * | 1996-11-25 | 1998-05-27 | Presstek, Inc. | Plaques lithographiques pour l'enregistrement au laser, auto-nettoyantes et résistantes à l'abrasion |
WO1998030400A1 (fr) * | 1997-01-06 | 1998-07-16 | Presstek, Inc. | Structures d'impression lithographique humide comprenant des couches inorganiques metalliques |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2005108076A1 (fr) * | 2004-05-05 | 2005-11-17 | Presstek, Inc. | Element d'impression lithographique comportant une couche polymerisee par plasma |
US7078152B2 (en) | 2004-05-05 | 2006-07-18 | Presstek, Inc. | Lithographic printing with printing members having plasma polymer layers |
WO2006130241A3 (fr) * | 2005-04-15 | 2007-01-18 | Presstek Inc | Impression lithographique faisant appel a des elements d'impression contenant un metal oleophile et des couches polymeres plasma |
US7351517B2 (en) | 2005-04-15 | 2008-04-01 | Presstek, Inc. | Lithographic printing with printing members including an oleophilic metal and plasma polymer layers |
Also Published As
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AU5918599A (en) | 2000-04-03 |
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