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WO2000003219A3 - Pressure sensor arrangement, especially for detecting pressure in a pressurised area of a vehicle transmission which is impinged upon by oil - Google Patents

Pressure sensor arrangement, especially for detecting pressure in a pressurised area of a vehicle transmission which is impinged upon by oil Download PDF

Info

Publication number
WO2000003219A3
WO2000003219A3 PCT/DE1999/001906 DE9901906W WO0003219A3 WO 2000003219 A3 WO2000003219 A3 WO 2000003219A3 DE 9901906 W DE9901906 W DE 9901906W WO 0003219 A3 WO0003219 A3 WO 0003219A3
Authority
WO
WIPO (PCT)
Prior art keywords
pressure sensor
impinged
sensor arrangement
oil
pressure
Prior art date
Application number
PCT/DE1999/001906
Other languages
German (de)
French (fr)
Other versions
WO2000003219A2 (en
Inventor
Helmut Gander
Herbert Roedig
Original Assignee
Siemens Ag
Helmut Gander
Herbert Roedig
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag, Helmut Gander, Herbert Roedig filed Critical Siemens Ag
Publication of WO2000003219A2 publication Critical patent/WO2000003219A2/en
Publication of WO2000003219A3 publication Critical patent/WO2000003219A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16H—GEARING
    • F16H61/00—Control functions within control units of change-speed- or reversing-gearings for conveying rotary motion ; Control of exclusively fluid gearing, friction gearing, gearings with endless flexible members or other particular types of gearing
    • F16H61/0003—Arrangement or mounting of elements of the control apparatus, e.g. valve assemblies or snapfittings of valves; Arrangements of the control unit on or in the transmission gearbox
    • F16H61/0006—Electronic control units for transmission control, e.g. connectors, casings or circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Control Of Transmission Device (AREA)

Abstract

A pressure sensor arrangement is provided with a pressure sensor element (9) with a physical pressure detector (12) and integrated electronic wiring, a support (4) for the pressure sensor element (9) and an electronic circuit (22) which is located on the support (4). Said support is configured as a dividing wall between the pressurised area (2) and the electronics compartment (5). The sensor element (9) is located in a passage (10) in the support (4), said passage (10) being hermetically sealed.
PCT/DE1999/001906 1998-07-08 1999-07-01 Pressure sensor arrangement, especially for detecting pressure in a pressurised area of a vehicle transmission which is impinged upon by oil WO2000003219A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19830538A DE19830538A1 (en) 1998-07-08 1998-07-08 Pressure sensor arrangement, in particular for pressure detection in an oil-loaded pressure area of a motor vehicle transmission
DE19830538.9 1998-07-08

Publications (2)

Publication Number Publication Date
WO2000003219A2 WO2000003219A2 (en) 2000-01-20
WO2000003219A3 true WO2000003219A3 (en) 2002-09-26

Family

ID=7873362

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE1999/001906 WO2000003219A2 (en) 1998-07-08 1999-07-01 Pressure sensor arrangement, especially for detecting pressure in a pressurised area of a vehicle transmission which is impinged upon by oil

Country Status (2)

Country Link
DE (1) DE19830538A1 (en)
WO (1) WO2000003219A2 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001060736A2 (en) * 2000-02-18 2001-08-23 Motorola, Inc. Methods and apparatus for a vertically-integrated sensor structure
DE10059813A1 (en) * 2000-12-01 2002-06-13 Hahn Schickard Ges Pressure measurement, especially differential pressure measurement between two fluids, in which gluing of support and pressure sensor is used
DE10327476A1 (en) * 2003-06-18 2005-01-05 Conti Temic Microelectronic Gmbh Pressure sensor assembly
AT412815B (en) * 2003-11-24 2005-07-25 Siemens Ag Oesterreich CONTROL DEVICE FOR A GEARBOX IN A MOTOR VEHICLE
DE102004011203B4 (en) * 2004-03-04 2010-09-16 Robert Bosch Gmbh Method for mounting semiconductor chips and corresponding semiconductor chip arrangement
US7243552B2 (en) * 2005-05-09 2007-07-17 Delphi Technologies, Inc. Pressure sensor assembly
DE102007001855B4 (en) 2007-01-12 2013-08-22 Continental Automotive Gmbh Housing connection for pressure sensors
DE102007042449B4 (en) 2007-09-06 2021-11-18 Vitesco Technologies GmbH Integrated sensor module for mechatronics, process for manufacturing the integrated sensor module and use of the integrated sensor module
DE102010029868A1 (en) * 2010-06-09 2011-12-15 Zf Friedrichshafen Ag Transmission control unit for use in motor car, has pressure sensor permanently arranged at support plate without carrier housing portion using support member, where support member is contacted with through-hole of support plate
DE102012205280A1 (en) 2012-03-30 2013-10-02 Zf Friedrichshafen Ag Pressure sensor assembly for detecting pressure in pressure chamber of motor vehicle transmission, has plate elements, on which printed circuit board is supported and pressure sensor is formed in housing, particularly in form of cavity
DE102017220059A1 (en) * 2017-11-10 2019-05-16 Conti Temic Microelectronic Gmbh Connection unit for transmission oil pressure sensors
DE102017223177A1 (en) 2017-12-19 2019-06-19 Conti Temic Microelectronic Gmbh Pressure measuring unit and connection unit for a motor vehicle transmission.

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58107681A (en) * 1981-12-21 1983-06-27 Mitsubishi Electric Corp Semiconductor pressure detecting device
WO1998005935A1 (en) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Method for packaging microsensors

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06132545A (en) * 1992-10-19 1994-05-13 Mitsubishi Electric Corp Pressure detector
US5686698A (en) * 1994-06-30 1997-11-11 Motorola, Inc. Package for electrical components having a molded structure with a port extending into the molded structure
US5889211A (en) * 1995-04-03 1999-03-30 Motorola, Inc. Media compatible microsensor structure and methods of manufacturing and using the same
JPH09210828A (en) * 1996-01-31 1997-08-15 Tokin Corp Pressure sensor and its adjusting method
JPH09243492A (en) * 1996-03-06 1997-09-19 Matsushita Electric Works Ltd Pressure sensor
DE19612964A1 (en) * 1996-04-01 1997-10-02 Bosch Gmbh Robert Pressure sensor and method for manufacturing a pressure sensor
DE19637763A1 (en) * 1996-09-16 1998-03-19 Trw Fahrzeugelektrik Pressure sensor unit, especially for automotive engineering

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58107681A (en) * 1981-12-21 1983-06-27 Mitsubishi Electric Corp Semiconductor pressure detecting device
WO1998005935A1 (en) * 1996-08-08 1998-02-12 Integrated Sensing Systems, Inc. Method for packaging microsensors

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 007, no. 214 (E - 199) 21 September 1983 (1983-09-21) *

Also Published As

Publication number Publication date
DE19830538A1 (en) 2000-01-20
WO2000003219A2 (en) 2000-01-20

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