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WO2000002730A1 - Improved adhesive material for use with thermal ink jet printers - Google Patents

Improved adhesive material for use with thermal ink jet printers Download PDF

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Publication number
WO2000002730A1
WO2000002730A1 PCT/US1999/015701 US9915701W WO0002730A1 WO 2000002730 A1 WO2000002730 A1 WO 2000002730A1 US 9915701 W US9915701 W US 9915701W WO 0002730 A1 WO0002730 A1 WO 0002730A1
Authority
WO
WIPO (PCT)
Prior art keywords
adhesive composition
ink jet
accordance
group
silane coupling
Prior art date
Application number
PCT/US1999/015701
Other languages
French (fr)
Other versions
WO2000002730A9 (en
Inventor
Girish Shivaji Patil
Original Assignee
Lexmark International, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark International, Inc. filed Critical Lexmark International, Inc.
Priority to AU52111/99A priority Critical patent/AU5211199A/en
Publication of WO2000002730A1 publication Critical patent/WO2000002730A1/en
Publication of WO2000002730A9 publication Critical patent/WO2000002730A9/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • B41J2/17503Ink cartridges
    • B41J2/17559Cartridge manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4085Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2202/00Embodiments of or processes related to ink-jet or thermal heads
    • B41J2202/01Embodiments of or processes related to ink-jet heads
    • B41J2202/03Specific materials used

Definitions

  • the present invention relates to an improved adhesive suitable for use in ink jet printers, and more particularly, to an improved adhesive for attaching ink jet printheads to print cartridge containers.
  • a printhead is bonded to a print cartridge container.
  • the printhead includes an ink-receiving opening and ink supply channels through which ink travels to a plurality of bubble chambers.
  • Each bubble chamber includes a resistor which, when addressed with an energy pulse, momentarily vaporizes the ink and forms a bubble which expels an ink droplet.
  • the printhead typically comprises a heater chip and a nozzle plate having a plurality of discharge orifices formed therein.
  • the container serves as a reservoir for the ink and includes a fluid supply opening which communicates with the ink-receiving opening of the printhead for supplying ink to the bubble chambers in the printhead.
  • an adhesive is used to bond the two elements together.
  • the adhesive also "fixes" the printhead to the print cartridge container such that its location relative to the print cartridge container is known and does not shift during processing or use. Further, the adhesive provides an additional function in serving as a fluid gasket against leakage of ink.
  • the printhead and the print cartridge container typically have dissimilar coefficients of thermal expansion, since the surface of the printhead bonded to the print cartridge container most commonly is silicon and the print cartridge container is, for example, a polymeric material such as a modified phenylene oxide.
  • the adhesive must accommodate both the dissimilar expansions and contractions of the printhead and the print cartridge container and be impermeable to attack by the ink, which is commonly in a vehicle of water and at least one glycol and/or glycol ether plus a colorant, plus substances such as pH modifiers, biocides, etc.
  • Typical adhesive materials comprise an epoxy resin, such as a bisphenol-A based epoxy resin, a cross-linking agent and an initiator. They may also include pigments and modifiers to alter their physical properties. Some conventional adhesives offer good adhesive properties and others offer good chemical resistance to inks. However, none of these conventional adhesives exhibit good adhesion properties while at the same time exhibiting good chemical resistance to inks. Additionally, conventional adhesive materials often comprise anhydride cross-linkers which typically absorb water and result in voids (air pockets) in the adhesive upon curing. Such voids are not desirable because they can, for example, result in a non-homogeneous adhesive having poor adhesion characteristics. They may also cause mixing of inks as a result of channel formation in the adhesive layer. Further, adhesive materials comprising anhydrides typically have poor shelf lives and poor pot lives, and, therefore, are often difficult to work with and store.
  • the present invention is directed to an adhesive composition comprising: (a) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; and (b) at least one non-acrylic silane coupling agent selected from
  • the present invention is directed to an 0 adhesive composition
  • an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer;
  • at least one non-acrylic silane coupling agent selected from the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non-acrylic silane coupling agent s capable of becoming a nucleophile; and
  • an initiator with the proviso that the adhesive composition does not comprise an anhydride.
  • the present invention is directed to an ink jet print cartridge container comprising the novel adhesive compositions of this invention to bond a printhead thereto.
  • the present invention is directed to a method for attaching a printhead to an ink jet print cartridge container.
  • the adhesive compositions of this invention comprise the constituents mentioned above (e.g., the additive and coupling agent), it is within the scope of this invention for the adhesive composition to consist 5 essentially of or consist of the same.
  • Figure 1 is a perspective view of a portion of an ink jet print cartridge; and o Figure 2 is a perspective view of the ink jet cartridge shown in Figure 1 without the printhead (ink jet print cartridge container).
  • the print cartridge 10 which is adapted for use in an ink jet printer (not shown).
  • the print cartridge 10 comprises an ink-filled container 12, a printhead 20, which is adhesively secured to the container 12, and a flexible circuit 30 (also referred to as a TAB circuit).
  • the container 12 is typically formed from a polymeric material such as polyphenylene oxide, which is commercially available from, for example, the General Electric Company under the Trademark "NORYL SE-1".
  • the ink jet print cartridge of Figure 1 before the printhead 20 and the flexible circuit 30 are assembled to the container 12.
  • the adhesive composition of the present invention is typically applied to a printhead-receiving portion 13 on the container 12, which, in the illustrated embodiment, comprises a recessed area. After the adhesive composition has been applied, for example, to the printhead- receiving portion 13, the printhead 20 is positioned in the receiving portion 13 and the adhesive composition of the present invention is typically cured by baking at about 110 degrees Celsius for approximately 45 minutes.
  • the printhead 20 includes an ink-receiving opening (not shown) and ink supply channels (not shown) through which ink travels to a plurality of bubble chambers (not shown).
  • Each bubble chamber includes a resistor (not shown) which, when addressed with an energy pulse, momentarily vaporizes the ink and forms a bubble which expels an ink droplet.
  • the printhead comprises a heater chip and a nozzle plate having a plurality of discharge orifices formed therein.
  • multifunctional compound is defined to mean any compound having a total of at least two groups, substituents (including moieties) or the like, wherein each independently can become difunctional, act as a leaving group, and/or become a nucleophile.
  • Additives comprising multifunctional compounds for use as component (a) include compounds functionalized with at least two functionalization members selected from the group consisting of an epoxy, cyclic ether, lactone, lactam and triazine group, with epoxy-functionalized compounds, such as epoxy resins, being preferred.
  • the epoxy resins which may be employed in this invention include commercially available resins like bisphenol-A based epoxy resins, including
  • Epon 828, Epon 836 and Epon 1001 all available from Shell Chemical Co., and 3,4-epoxycyclohexylmethyl- 3,4-epoxyhexane carboxylate, available from Union Carbide.
  • Other examples of the epoxy resins which may be employed are epoxy novolacs, such as D.E.N. 431 , D.E.N. 438, and D.E.N. 439, which are available from Dow Chemical.
  • the epoxy resins are often available with or without initiators mixed therein.
  • additives comprising multifunctional compounds include, for example, those, which may be made by art-recognized techniques. Such techniques include reacting functionalized precursors like epichlorohydrin and aromatic precursors like bisphenol-A in the presence of heat, a catalyst or both to thereby cause substitution reactions.
  • the average number molecular weight (M n ) of the multifunctional compounds employed in this invention is limited only to the extent that the compounds are capable of resulting in an adhesive composition. Often, the multifunctional compounds have a M n of greater than about 600, and preferably, greater than 2,000.
  • the non-acrylic silane coupling agents for use as component (b) are silane compounds having at least one difunctional group which is capable of becoming an electrophile or capable of becoming a nucleophile.
  • the non-acrylic silane coupling agents suitable for use in the present invention as component (b) include non-acrylic silane coupling agents represented by the formula: A( .n)-Si-[0(H)p(R) q ln,
  • A is a monovalent organic group having an epoxy, cyclic ether, lactone, lactam, or triazine group
  • R is a C C 6 alkyl or aryl group
  • p is 0, 1 or 2
  • q is 0, 1 or 2, with the proviso that p and q cannot simultaneously be 0, 1 , or 2
  • n is 1 , 2 or 3.
  • non-acrylic silane coupling agents which may be employed in this invention are commercially available. Also, they may be prepared by, for example, reacting a trialkoxysilyl alkanol and halogenated epoxide in the presence of heat, a catalyst, or both to thereby cause a substitution reaction.
  • the most preferred non-acrylic silane coupling agents employed in this invention are those having n as 3, p as 0, q as 1 , R as methyl and A as glycidoxypropyl (3-glycidoxypropyltrimethoxysilane), referred to by the trade designation Z-6040 and commercially available from Dow Chemical.
  • the initiators which may be employed in the present invention are generally classified as low-temperature initiators (i.e., they enhance curing below 120 degrees Celsius). They typically are the resulting addition product of an epoxy and an amine and are often classified as epoxy-amine adducts, including, for example, epoxy-imidazole adducts.
  • the initiators which may be employed in this invention are commercially available.
  • a preferred initiator employed in this invention is Ajicure MY 24 which is available from Ajinomoto USA, Inc.
  • the amount of additive comprising at least one multifunctional compound employed in the adhesive compositions of this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions of this invention comprise from about 55.0 percent to about 98.5 percent, and, preferably, from about 75.0 percent to about 95.0 percent, and, most preferably, from about 80.0 percent to about 90.0 percent by weight of additive comprising at least one multifunctional compound, based on total weight of adhesive composition, and including all ranges subsumed therein.
  • the amount of non-acrylic silane coupling agent employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions of this invention comprise from about 0.5 percent to about 20.0 percent, and, preferably, from about 1.0 percent to about 10.0 percent, and most preferably, from about 2.0 percent to about 5.0 percent by weight of silane, based on total weight of the adhesive composition, and including all ranges subsumed therein.
  • the amount of initiator which may be employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions comprise from about 0.5 percent to about 35.0 percent, and, preferably, from about 1.0 percent to about 20.0 percent, and, most preferably, from about 5.0 percent to about 15.0 percent by weight of initiator, based on total weight of adhesive composition, and including all ranges subsumed therein.
  • the components of the adhesive compositions of this invention are combined. Typically, they are mixed, agitated or stirred via any art-recognized technique, including mixing in a mixing vessel like a beaker.
  • the adhesive composition may be mixed, for example, at atmospheric pressure and ambient temperature or any other temperature or pressure levels that result in an adhesive composition. It is important, however, that the conditions do not cause the adhesive composition to cure in the mixing vessel.
  • additives include colorants like pigments and dyes, and especially, rheology modifiers.
  • rheology modifiers include group IIA carbonates such as calcium carbonate, and transition metal oxides such as titanium dioxide. The most preferred rheology modifier is, however, fumed silica.
  • the amount of rheology modifier employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition.
  • the adhesive compositions of this invention comprise from about 1.0 percent to about 25.0 percent, and, preferably, from about 2.0 percent to about 15.0 percent, and, most preferably, from about 3.0 percent to about 10.0 percent by weight of rheology modifier, based on total weight of the adhesive composition, and including all ranges subsumed therein.
  • the viscosities of the adhesive compositions employed in this invention are often from about 5,000 cps to about 200,000 cps, and, preferably, from about 10,000 cps to about 100,000 cps, and, most preferably, from about 35,000 cps to about 50,000 cps, including all ranges subsumed therein. Such viscosities are determined with a Haake Viscometer, No. VT- 500, at ambient temperature and with a PK1-1 spindle.
  • the adhesive compositions of the instant invention may be employed in any applications requiring low-temperature curing adhesives. Often, however, the adhesive compositions of this invention are used in ink jet printer applications. Typically, the adhesive compositions are applied to the printheads or the print cartridge containers (or both) of ink jet printers. The adhesive compositions of this invention are used in ink jet printer applications to primarily bond (fix) the printhead to the print cartridge container and to serve as a barrier or gasket to prevent ink leakage and mixing from a reservoir of the print cartridge container.
  • the print cartridge containers that may be used with the adhesive compositions of this invention include those, for example, having one to three ink reservoirs and molded from commercially available polyphenylene ether compositions.
  • An illustrative example of the print cartridge container which may be employed in the invention is described in United States Patent No. 5,576,750, assigned to Lexmark International, Inc., and incorporated herein by reference.
  • Examples 6 and 7 demonstrate the unexpected and superior adhesion properties of the adhesive compositions of this invention when compared with a commercially available adhesive composition (Example 1 - the "control composition"), as well as other non- inventive compositions (Examples 2-5). Fumed silica was added to all adhesion compositions, where needed, to bring the viscosity to about 40,000 cps.
  • Example 8 demonstrates that the adhesive compositions of this invention cure substantially free of voids.
  • Examples 9-14 demonstrate that while adhesion properties improve when employing the adhesive compositions in accordance with the present invention, resistance to chemical degradation remains substantially unchanged as compared with the control composition.
  • a commercially available adhesive composition having an epoxy-resin (Uniset LA 3032-78 commercially available from Emerson & Cuming) was dispensed onto five flat Noryl SE-1 plates (2"x2").
  • the dispensing was achieved with a dispensing apparatus that forced the adhesive composition out of a tube by delivering compressed air to the tube.
  • the amount of adhesive composition dispensed onto the plates was enough to cover substantially the entire bottom of the silicon chips capable of being used on ink jet print cartridges.
  • On top of the dispensed adhesive composition were placed the ink jet silicon chips. After baking in an oven at 110 degrees Celsius for about 45 minutes, the adhesive composition cured and the silicon chips were bonded to the plates.
  • the plates having the bonded silicon chips were soaked in boiling water for about two hours to test and observe the quality of the bonds. After the soaking, all silicon chips fell off the plates either immediately or with the mere touch of a finger.
  • Example 2 The five flat Noryl SE-1 plates (2"x2") of Example 2 had silicon chips bonded to them in a manner similar to the one described in Example 1 except that 3-(trimethoxysilyl) propyl methacrylate (a commercially available adhesion promoter) was coated onto the sides of the silicon chips that interfaced with the commercially available adhesive. After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger.
  • 3-(trimethoxysilyl) propyl methacrylate a commercially available adhesion promoter
  • Example 3 The five flat Noryl SE-1 plates (2"x2") of Example 3 had silicon chips bonded to them in a manner similar to the one described in Example 2 except that 3-glycidoxypropyltrimethoxysilane was used in lieu of 3-(trimethoxysilyl) propyl methacrylate. After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger.
  • Example 4 The five flat Noryl SE-1 plates (2"x2") of Example 4 had silicon chips bonded to them in a manner similar to the one described in Example 2 except that the adhesion promoter was added directly to the adhesive composition (1 :99 weight ratio with mixing). After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger.
  • EXAMPLE 5
  • Example 5 The five flat Noryl SE-1 plates (2"x2") of Example 5 had silicon chips bonded to them in a manner similar to the one described in Example 4 except that 3-glycidoxypropyltrimethoxysilane was used as the adhesion promoter (1 :99 weight ratio with mixing) in lieu of 3-(trimethoxysilyl) propyl methacrylate. After soaking in boiling water for about two hours, some silicon chips (about 50 percent) were removable when reasonable force was applied with a screwdriver. EXAMPLE 6
  • Example 6 The five flat Noryl SE-1 plates (2"x2") of Example 6 had silicon chips bonded to them in a manner similar to the one describe in Example 5 except that the weight ratio of adhesion promoter to the adhesive composition was 3:97. After soaking in boiling water for about two hours, none of the silicon chips were removable when reasonable force was applied with a screwdriver, thereby demonstrating the superior properties of the adhesive compositions of this invention.
  • EXAMPLE 7 EXAMPLE 7
  • Example 7 The five flat Noryl SE-1 plates (2"x2") of Example 7 had silicon chips bonded to them in a manner similar to the one described in Example 6 except that the plates with the silicon chips bonded thereon were soaked in boiling water for about eight hours. After the soaking, none of the silicon chips were removable when reasonable force was applied with a screwdriver, thereby further demonstrating the superior properties of the adhesive compositions of this invention.
  • Example 6 The adhesive composition used in Example 6 was dispensed onto nine flat Noryl SE-1 plates (about 2"x2"). The adhesive composition was dispensed on the plates in a manner similar to the way the adhesive compositions were dispensed in Examples 1 through 7.
  • Nine transparent polyetherimide (ULTEM ® ) windows (about the size of an ink jet printhead) were placed on top of the adhesive composition on each plate, and, thereafter, each plate was placed in an oven at about 110 degrees Celsius for approximately 45 minutes to cure the adhesive compositions. After removing the plates from the oven, the cured adhesive compositions were visually inspected through the transparent polyetherimide windows and all 9 cured adhesive compositions had substantially no voids present.
  • EXAMPLE 9-14 Nine transparent polyetherimide (ULTEM ® ) windows (about the size of an ink jet printhead) were placed on top of the adhesive composition on each plate, and, thereafter, each plate was placed in an oven at about 110 degrees Celsius for approximately 45 minutes to cure the adhesive compositions. After removing the plates from the oven
  • test bars dog bones were prepared from the adhesive composition described in Example 1 and three test bars were prepared from the adhesive composition described in Example 6 (all test bars made according to ASTM Standards).
  • the test bars were submerged in sealed vessels filled with water or commercially available dye-based or pigment-based inks.
  • the test bars were placed in an oven set at 60 degrees Celsius for eight weeks. The results are compiled in the table below.
  • the percent decrease in hardness and the percent increase in weight reflect the superior properties of the adhesive compositions of this invention; particularly, their ability to resist chemical degradation caused by ink to a degree similar to that of the control not having a non-acrylic silane coupling agent.
  • a 0.0% change in hardness and weight means a 100.0% resistance to chemical degradation.
  • test bars of Examples 9-11 were prepared from the adhesive composition in Example 1 and the test bars of Examples 12-14 were prepared from the adhesive composition in Example 6.
  • B p commercially available pigment-based black ink
  • W deionized water.
  • D Weight was determined by weighing the test bars on a scale. The values depict an approximate percent average of the increase in weight after eight weeks in comparison to the test bars prior to being exposed to ink.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention relates to a novel adhesive composition that resists chemical degradation from ink components. The adhesive composition is utilized between an ink jet printhead (20) and an ink jet print cartridge container (12). The adhesive composition contains a multifunctional compound comprising a bisphenol-A epoxy resin, a silane non-acrylic silane coupling agent comprising a glycidoxypropyl group, an epoxy amine initiator, and a rheology modifier.

Description

IMPROVED ADHESIVE MATERIAL FOR USE WITH THERMAL INK JET PRINTERS
This application is related to contemporaneously filed United States Patent Application Serial No. 09/113,249, entitled "ADHESIVE MATERIAL WITH FLEXIBILITY MODIFIERS," the disclosure of which is incorporated herein by reference.
FIELD OF THE INVENTION
The present invention relates to an improved adhesive suitable for use in ink jet printers, and more particularly, to an improved adhesive for attaching ink jet printheads to print cartridge containers.
BACKGROUND OF THE INVENTION
In the production of thermal ink jet print cartridges for use in ink jet printers, a printhead is bonded to a print cartridge container. The printhead includes an ink-receiving opening and ink supply channels through which ink travels to a plurality of bubble chambers. Each bubble chamber includes a resistor which, when addressed with an energy pulse, momentarily vaporizes the ink and forms a bubble which expels an ink droplet. The printhead typically comprises a heater chip and a nozzle plate having a plurality of discharge orifices formed therein. The container serves as a reservoir for the ink and includes a fluid supply opening which communicates with the ink-receiving opening of the printhead for supplying ink to the bubble chambers in the printhead.
During assembly of the printhead to the print cartridge container, an adhesive is used to bond the two elements together. The adhesive also "fixes" the printhead to the print cartridge container such that its location relative to the print cartridge container is known and does not shift during processing or use. Further, the adhesive provides an additional function in serving as a fluid gasket against leakage of ink.
However, the printhead and the print cartridge container typically have dissimilar coefficients of thermal expansion, since the surface of the printhead bonded to the print cartridge container most commonly is silicon and the print cartridge container is, for example, a polymeric material such as a modified phenylene oxide. Thus, the adhesive must accommodate both the dissimilar expansions and contractions of the printhead and the print cartridge container and be impermeable to attack by the ink, which is commonly in a vehicle of water and at least one glycol and/or glycol ether plus a colorant, plus substances such as pH modifiers, biocides, etc.
Typical adhesive materials comprise an epoxy resin, such as a bisphenol-A based epoxy resin, a cross-linking agent and an initiator. They may also include pigments and modifiers to alter their physical properties. Some conventional adhesives offer good adhesive properties and others offer good chemical resistance to inks. However, none of these conventional adhesives exhibit good adhesion properties while at the same time exhibiting good chemical resistance to inks. Additionally, conventional adhesive materials often comprise anhydride cross-linkers which typically absorb water and result in voids (air pockets) in the adhesive upon curing. Such voids are not desirable because they can, for example, result in a non-homogeneous adhesive having poor adhesion characteristics. They may also cause mixing of inks as a result of channel formation in the adhesive layer. Further, adhesive materials comprising anhydrides typically have poor shelf lives and poor pot lives, and, therefore, are often difficult to work with and store.
Accordingly, it is seen that a need exists in the art for an improved adhesive suitable for use in ink jet printers, and particularly, for attaching printheads to print cartridge containers.
SUMMARY OF THE INVENTION
This need is met by the present invention, wherein adhesive compositions are provided which exhibit superior adhesion properties while at the same time unexpectedly exhibiting good chemical resistance to inks as well as acceptable pot lives and shelf lives. Moreover, the adhesive compositions of this invention unexpectedly are substantially depleted of voids after curing. In a first embodiment, the present invention is directed to an adhesive composition comprising: (a) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; and (b) at least one non-acrylic silane coupling agent selected from
5 the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non-acrylic silane coupling agent capable of becoming a nucleophile, with the proviso that the adhesive composition does not comprise an anhydride.
In a second embodiment, the present invention is directed to an 0 adhesive composition comprising: (a) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; (b) at least one non-acrylic silane coupling agent selected from the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non-acrylic silane coupling agent s capable of becoming a nucleophile; and (c) an initiator, with the proviso that the adhesive composition does not comprise an anhydride.
In a third embodiment, the present invention is directed to an ink jet print cartridge container comprising the novel adhesive compositions of this invention to bond a printhead thereto. 0 In a fourth embodiment, the present invention is directed to a method for attaching a printhead to an ink jet print cartridge container.
While the adhesive compositions of this invention comprise the constituents mentioned above (e.g., the additive and coupling agent), it is within the scope of this invention for the adhesive composition to consist 5 essentially of or consist of the same.
BRIEF DESCRIPTION OF THE DRAWINGS
Figure 1 is a perspective view of a portion of an ink jet print cartridge; and o Figure 2 is a perspective view of the ink jet cartridge shown in Figure 1 without the printhead (ink jet print cartridge container). DETAILED DESCRIPTION OF THE INVENTION
Referring now to Figure 1 , there is shown an ink jet print cartridge 10 which is adapted for use in an ink jet printer (not shown). The print cartridge 10 comprises an ink-filled container 12, a printhead 20, which is adhesively secured to the container 12, and a flexible circuit 30 (also referred to as a TAB circuit). The container 12 is typically formed from a polymeric material such as polyphenylene oxide, which is commercially available from, for example, the General Electric Company under the Trademark "NORYL SE-1".
Referring now to Figure 2, there is shown the ink jet print cartridge of Figure 1 before the printhead 20 and the flexible circuit 30 are assembled to the container 12. The adhesive composition of the present invention is typically applied to a printhead-receiving portion 13 on the container 12, which, in the illustrated embodiment, comprises a recessed area. After the adhesive composition has been applied, for example, to the printhead- receiving portion 13, the printhead 20 is positioned in the receiving portion 13 and the adhesive composition of the present invention is typically cured by baking at about 110 degrees Celsius for approximately 45 minutes.
The printhead 20 includes an ink-receiving opening (not shown) and ink supply channels (not shown) through which ink travels to a plurality of bubble chambers (not shown). Each bubble chamber includes a resistor (not shown) which, when addressed with an energy pulse, momentarily vaporizes the ink and forms a bubble which expels an ink droplet. The printhead comprises a heater chip and a nozzle plate having a plurality of discharge orifices formed therein. A discussion of a printhead 20 and a flexible circuit 30 which may form part of the print cartridge 10 is set out in U.S. Patent Application Serial No. 08/827,140, entitled "A Process for Joining a Flexible Circuit to a Polymeric Container and for Forming a Barrier Layer over Sections of the Flexible Circuit and other Elements using an Encapsulant Material", the disclosure of which is incorporated herein by reference.
As used herein, the term "multifunctional compound" is defined to mean any compound having a total of at least two groups, substituents (including moieties) or the like, wherein each independently can become difunctional, act as a leaving group, and/or become a nucleophile. Additives comprising multifunctional compounds for use as component (a) include compounds functionalized with at least two functionalization members selected from the group consisting of an epoxy, cyclic ether, lactone, lactam and triazine group, with epoxy-functionalized compounds, such as epoxy resins, being preferred.
The epoxy resins which may be employed in this invention include commercially available resins like bisphenol-A based epoxy resins, including
Epon 828, Epon 836 and Epon 1001 , all available from Shell Chemical Co., and 3,4-epoxycyclohexylmethyl- 3,4-epoxyhexane carboxylate, available from Union Carbide. Other examples of the epoxy resins which may be employed are epoxy novolacs, such as D.E.N. 431 , D.E.N. 438, and D.E.N. 439, which are available from Dow Chemical. The epoxy resins are often available with or without initiators mixed therein.
Other additives comprising multifunctional compounds, which may be employed in this invention, include, for example, those, which may be made by art-recognized techniques. Such techniques include reacting functionalized precursors like epichlorohydrin and aromatic precursors like bisphenol-A in the presence of heat, a catalyst or both to thereby cause substitution reactions.
The average number molecular weight (Mn) of the multifunctional compounds employed in this invention is limited only to the extent that the compounds are capable of resulting in an adhesive composition. Often, the multifunctional compounds have a Mn of greater than about 600, and preferably, greater than 2,000.
The non-acrylic silane coupling agents for use as component (b) are silane compounds having at least one difunctional group which is capable of becoming an electrophile or capable of becoming a nucleophile. The non-acrylic silane coupling agents suitable for use in the present invention as component (b) include non-acrylic silane coupling agents represented by the formula: A( .n)-Si-[0(H)p(R)qln,
wherein A is a monovalent organic group having an epoxy, cyclic ether, lactone, lactam, or triazine group; R is a C C6 alkyl or aryl group; p is 0, 1 or 2, and q is 0, 1 or 2, with the proviso that p and q cannot simultaneously be 0, 1 , or 2; and n is 1 , 2 or 3.
The non-acrylic silane coupling agents which may be employed in this invention are commercially available. Also, they may be prepared by, for example, reacting a trialkoxysilyl alkanol and halogenated epoxide in the presence of heat, a catalyst, or both to thereby cause a substitution reaction. The most preferred non-acrylic silane coupling agents employed in this invention are those having n as 3, p as 0, q as 1 , R as methyl and A as glycidoxypropyl (3-glycidoxypropyltrimethoxysilane), referred to by the trade designation Z-6040 and commercially available from Dow Chemical.
The initiators which may be employed in the present invention are generally classified as low-temperature initiators (i.e., they enhance curing below 120 degrees Celsius). They typically are the resulting addition product of an epoxy and an amine and are often classified as epoxy-amine adducts, including, for example, epoxy-imidazole adducts. The initiators which may be employed in this invention are commercially available. A preferred initiator employed in this invention is Ajicure MY 24 which is available from Ajinomoto USA, Inc.
The amount of additive comprising at least one multifunctional compound employed in the adhesive compositions of this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions of this invention comprise from about 55.0 percent to about 98.5 percent, and, preferably, from about 75.0 percent to about 95.0 percent, and, most preferably, from about 80.0 percent to about 90.0 percent by weight of additive comprising at least one multifunctional compound, based on total weight of adhesive composition, and including all ranges subsumed therein.
The amount of non-acrylic silane coupling agent employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions of this invention comprise from about 0.5 percent to about 20.0 percent, and, preferably, from about 1.0 percent to about 10.0 percent, and most preferably, from about 2.0 percent to about 5.0 percent by weight of silane, based on total weight of the adhesive composition, and including all ranges subsumed therein.
The amount of initiator which may be employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Often, however, the adhesive compositions comprise from about 0.5 percent to about 35.0 percent, and, preferably, from about 1.0 percent to about 20.0 percent, and, most preferably, from about 5.0 percent to about 15.0 percent by weight of initiator, based on total weight of adhesive composition, and including all ranges subsumed therein.
There generally is no limitation with respect to how the components of the adhesive compositions of this invention are combined. Typically, they are mixed, agitated or stirred via any art-recognized technique, including mixing in a mixing vessel like a beaker. The adhesive composition may be mixed, for example, at atmospheric pressure and ambient temperature or any other temperature or pressure levels that result in an adhesive composition. It is important, however, that the conditions do not cause the adhesive composition to cure in the mixing vessel.
It is also within the scope of this invention to combine any of the art- recognized additives to the adhesive compositions. Such additives include colorants like pigments and dyes, and especially, rheology modifiers. An illustrative list of the rheology modifiers which may be used in this invention include group IIA carbonates such as calcium carbonate, and transition metal oxides such as titanium dioxide. The most preferred rheology modifier is, however, fumed silica.
The amount of rheology modifier employed in this invention is limited only to the extent that the resulting composition is capable of being employed as an adhesive composition. Generally, the adhesive compositions of this invention comprise from about 1.0 percent to about 25.0 percent, and, preferably, from about 2.0 percent to about 15.0 percent, and, most preferably, from about 3.0 percent to about 10.0 percent by weight of rheology modifier, based on total weight of the adhesive composition, and including all ranges subsumed therein. Moreover, the viscosities of the adhesive compositions employed in this invention are often from about 5,000 cps to about 200,000 cps, and, preferably, from about 10,000 cps to about 100,000 cps, and, most preferably, from about 35,000 cps to about 50,000 cps, including all ranges subsumed therein. Such viscosities are determined with a Haake Viscometer, No. VT- 500, at ambient temperature and with a PK1-1 spindle.
There is generally no limitation with respect to the use of the adhesive compositions of the instant invention. In fact, the adhesive compositions of this invention may be employed in any applications requiring low-temperature curing adhesives. Often, however, the adhesive compositions of this invention are used in ink jet printer applications. Typically, the adhesive compositions are applied to the printheads or the print cartridge containers (or both) of ink jet printers. The adhesive compositions of this invention are used in ink jet printer applications to primarily bond (fix) the printhead to the print cartridge container and to serve as a barrier or gasket to prevent ink leakage and mixing from a reservoir of the print cartridge container.
The print cartridge containers that may be used with the adhesive compositions of this invention include those, for example, having one to three ink reservoirs and molded from commercially available polyphenylene ether compositions. An illustrative example of the print cartridge container which may be employed in the invention is described in United States Patent No. 5,576,750, assigned to Lexmark International, Inc., and incorporated herein by reference.
The following examples are to facilitate and further illustrate the understanding of this invention. Therefore, the examples are not intended as a restriction on the scope of the invention.
Referring to Examples 1 through 7, Examples 6 and 7 demonstrate the unexpected and superior adhesion properties of the adhesive compositions of this invention when compared with a commercially available adhesive composition (Example 1 - the "control composition"), as well as other non- inventive compositions (Examples 2-5). Fumed silica was added to all adhesion compositions, where needed, to bring the viscosity to about 40,000 cps. Example 8 demonstrates that the adhesive compositions of this invention cure substantially free of voids. Examples 9-14 demonstrate that while adhesion properties improve when employing the adhesive compositions in accordance with the present invention, resistance to chemical degradation remains substantially unchanged as compared with the control composition.
EXAMPLE 1
A commercially available adhesive composition having an epoxy-resin (Uniset LA 3032-78 commercially available from Emerson & Cuming) was dispensed onto five flat Noryl SE-1 plates (2"x2"). The dispensing was achieved with a dispensing apparatus that forced the adhesive composition out of a tube by delivering compressed air to the tube. The amount of adhesive composition dispensed onto the plates was enough to cover substantially the entire bottom of the silicon chips capable of being used on ink jet print cartridges. On top of the dispensed adhesive composition were placed the ink jet silicon chips. After baking in an oven at 110 degrees Celsius for about 45 minutes, the adhesive composition cured and the silicon chips were bonded to the plates. The plates having the bonded silicon chips were soaked in boiling water for about two hours to test and observe the quality of the bonds. After the soaking, all silicon chips fell off the plates either immediately or with the mere touch of a finger. EXAMPLE 2
The five flat Noryl SE-1 plates (2"x2") of Example 2 had silicon chips bonded to them in a manner similar to the one described in Example 1 except that 3-(trimethoxysilyl) propyl methacrylate (a commercially available adhesion promoter) was coated onto the sides of the silicon chips that interfaced with the commercially available adhesive. After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger. EXAMPLE 3 The five flat Noryl SE-1 plates (2"x2") of Example 3 had silicon chips bonded to them in a manner similar to the one described in Example 2 except that 3-glycidoxypropyltrimethoxysilane was used in lieu of 3-(trimethoxysilyl) propyl methacrylate. After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger.
EXAMPLE 4
The five flat Noryl SE-1 plates (2"x2") of Example 4 had silicon chips bonded to them in a manner similar to the one described in Example 2 except that the adhesion promoter was added directly to the adhesive composition (1 :99 weight ratio with mixing). After soaking in boiling water for about two hours, all silicon chips fell off the plates either immediately or with the mere touch of the finger. EXAMPLE 5
The five flat Noryl SE-1 plates (2"x2") of Example 5 had silicon chips bonded to them in a manner similar to the one described in Example 4 except that 3-glycidoxypropyltrimethoxysilane was used as the adhesion promoter (1 :99 weight ratio with mixing) in lieu of 3-(trimethoxysilyl) propyl methacrylate. After soaking in boiling water for about two hours, some silicon chips (about 50 percent) were removable when reasonable force was applied with a screwdriver. EXAMPLE 6
The five flat Noryl SE-1 plates (2"x2") of Example 6 had silicon chips bonded to them in a manner similar to the one describe in Example 5 except that the weight ratio of adhesion promoter to the adhesive composition was 3:97. After soaking in boiling water for about two hours, none of the silicon chips were removable when reasonable force was applied with a screwdriver, thereby demonstrating the superior properties of the adhesive compositions of this invention. EXAMPLE 7
The five flat Noryl SE-1 plates (2"x2") of Example 7 had silicon chips bonded to them in a manner similar to the one described in Example 6 except that the plates with the silicon chips bonded thereon were soaked in boiling water for about eight hours. After the soaking, none of the silicon chips were removable when reasonable force was applied with a screwdriver, thereby further demonstrating the superior properties of the adhesive compositions of this invention. EXAMPLE 8
The adhesive composition used in Example 6 was dispensed onto nine flat Noryl SE-1 plates (about 2"x2"). The adhesive composition was dispensed on the plates in a manner similar to the way the adhesive compositions were dispensed in Examples 1 through 7. Nine transparent polyetherimide (ULTEM®) windows (about the size of an ink jet printhead) were placed on top of the adhesive composition on each plate, and, thereafter, each plate was placed in an oven at about 110 degrees Celsius for approximately 45 minutes to cure the adhesive compositions. After removing the plates from the oven, the cured adhesive compositions were visually inspected through the transparent polyetherimide windows and all 9 cured adhesive compositions had substantially no voids present. EXAMPLE 9-14
Three test bars (dog bones) were prepared from the adhesive composition described in Example 1 and three test bars were prepared from the adhesive composition described in Example 6 (all test bars made according to ASTM Standards). The test bars were submerged in sealed vessels filled with water or commercially available dye-based or pigment-based inks. The test bars were placed in an oven set at 60 degrees Celsius for eight weeks. The results are compiled in the table below. The percent decrease in hardness and the percent increase in weight reflect the superior properties of the adhesive compositions of this invention; particularly, their ability to resist chemical degradation caused by ink to a degree similar to that of the control not having a non-acrylic silane coupling agent. A 0.0% change in hardness and weight means a 100.0% resistance to chemical degradation.
TABLE
ExampleA lnkB Hardness0 Weight0
9 W 3.2% 3.0%
10 D 5.10% 3.2%
11 P 2.3% 4.1%
12 W 4.6% 4.6%
13 D 6.0% 5.0%
14 P 5.4% 3.6%
A The test bars of Examples 9-11 were prepared from the adhesive composition in Example 1 and the test bars of Examples 12-14 were prepared from the adhesive composition in Example 6.
B p= commercially available pigment-based black ink; D = commercially available dye-based magenta ink (P= commercially available in the Lexmark International, Inc. 7000 ink jet printer and D = commercially available in the Lexmark International, Inc. 2050 ink jet printer); W = deionized water.
C Hardness was analyzed on three points of the test bar with a durometer. The values depict an approximate percent average of the decrease in hardness after eight weeks in comparison to the test bars prior to being exposed to ink.
D Weight was determined by weighing the test bars on a scale. The values depict an approximate percent average of the increase in weight after eight weeks in comparison to the test bars prior to being exposed to ink.

Claims

WHAT IS CLAIMED IS:
1. An adhesive composition, comprising:
(a) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; and (b) at least one non-acrylic silane coupling agent selected from the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non-acrylic silane coupling agent capable of becoming a nucleophile, with the proviso that the adhesive composition does not comprise an anhydride.
2. The adhesive composition in accordance with Claim 1 , wherein said adhesive composition further comprises an initiator.
3. The adhesive composition in accordance with Claim 1 , wherein said multifunctional compound includes compounds functionalized with at least two functionalization members selected from the group consisting of an epoxy, cyclic ether, lactone, lactam and triazine group.
4. The adhesive composition in accordance with Claim 1 , wherein said multifunctional compound is a polymer comprising an epoxy-functionalized resin.
5. The adhesive composition in accordance with Claim 4, wherein said epoxy-functionalized resin is a bisphenol-A based epoxy resin.
6. The adhesive composition in accordance with Claim 1 , wherein said non-acrylic silane coupling agent has the formula,
A(4-n)-Si-[O(H)p(R)q]n,
wherein A is a monovalent organic group having an epoxy, cyclic ether, lactone, lactam or triazine group; R is a C1-6 alkyl or aryl group; p is 0, 1 or 2 and q is 0, 1 or 2, with the proviso that p and q cannot simultaneously be 0, 1 or 2; and n is 1 , 2 or 3.
7. The adhesive composition in accordance with Claim 6, wherein n is 3, p is 0, q is 1 , R is a methyl group and A is a glycidoxypropyl group.
8. The adhesive composition in accordance with Claim 2, wherein said initiator is an epoxy-amine adduct.
9. The adhesive composition in accordance with Claim 1 , wherein said adhesive composition further comprises a rheology modifier selected from the group consisting of group HA carbonates, transition metal oxides and fumed silica.
10. The adhesive composition in accordance with Claim 1 , wherein said adhesive composition comprises from about 55.0 percent to about 98.5 percent by weight of said multifunctional compound.
11. The adhesive composition in accordance with Claim 1 , wherein s said adhesive composition comprises from about 0.5 percent to about 20.0 percent by weight of said non-acrylic silane coupling agent.
12. The adhesive composition in accordance with Claim 2, wherein said adhesive composition comprises from about 0.5 percent to about 35.0 percent by weight of said initiator.
o 13. The adhesive composition in accordance with Claim 1 , wherein said adhesive composition has a viscosity from about 5,000 cps to about 200,000 cps.
14. A method for bonding an ink jet printhead to a print cartridge container, comprising the steps of: (a) applying an adhesive composition to an ink jet printhead or an ink jet print cartridge container or both, said adhesive composition comprising:
(i) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; and
(ii) at least one non-acrylic silane coupling agent selected from the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non- acrylic silane coupling agent capable of becoming a nucleophile, with the proviso that the adhesive composition does not comprise an anhydride;
(b) placing the ink jet printhead on the print cartridge container; and (c) curing the adhesive composition.
15. The method for bonding an ink jet printhead to an ink jet print cartridge container in accordance with Claim 14, wherein said ink jet print cartridge container comprises a receiving portion for said printhead to be placed thereon.
16. The method for bonding an ink jet printhead to an ink jet print cartridge container in accordance with Claim 14, wherein said adhesive composition further comprises an initiator.
17. The method for bonding an ink jet printhead to an ink jet print cartridge container in accordance with Claim 14, wherein said adhesive composition is cured by heating the adhesive composition.
18. The method for bonding an ink jet printhead to an ink jet print cartridge container in accordance with Claim 14, wherein said multifunctional compound is a polymer comprising an epoxy-functionalized resin.
19. The method for bonding an ink jet printhead in accordance with Claim 14, wherein said non-acrylic silane coupling agent has the formula,
A(4-n)-Si-[O(H)p(R)q]n,
wherein A is a monovalent organic group having an epoxy, cyclic ether, lactone, lactam or triazine group; R is a C╬╣-6 alkyl or aryl group; p is 0, 1 or 2 and q is 0, 1 or 2, with the proviso that p and q cannot simultaneously be 0, 1 or 2; and n is 1 , 2 or 3.
20. An ink jet print cartridge container comprising a printhead bonded thereon with an adhesive composition comprising: (a) an additive comprising at least one multifunctional compound selected from the group consisting of a monomer, oligomer and polymer; and
(b) at least one non-acrylic silane coupling agent selected from the group consisting of a non-acrylic silane coupling agent capable of becoming an electrophile and a non-acrylic silane coupling agent capable of becoming a nucleophile, with the proviso that the adhesive composition does not comprise an anhydride.
PCT/US1999/015701 1998-07-10 1999-07-09 Improved adhesive material for use with thermal ink jet printers WO2000002730A1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012168121A1 (en) 2011-06-06 2012-12-13 Olivetti S.P.A. Ink jet print head comprising a layer made by a curable resin composition
EP3099496A4 (en) * 2014-01-29 2017-12-13 Hewlett-Packard Development Company L.P. Fluid directing assembly

Citations (2)

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US5013383A (en) * 1989-07-11 1991-05-07 Hewlett-Packard Company Epoxy adhesive for use with thermal ink-jet printers
US5430112A (en) * 1992-10-22 1995-07-04 Ajinomoto Co., Inc. Epoxy resin and polythiol composition

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US5013383A (en) * 1989-07-11 1991-05-07 Hewlett-Packard Company Epoxy adhesive for use with thermal ink-jet printers
US5430112A (en) * 1992-10-22 1995-07-04 Ajinomoto Co., Inc. Epoxy resin and polythiol composition

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012168121A1 (en) 2011-06-06 2012-12-13 Olivetti S.P.A. Ink jet print head comprising a layer made by a curable resin composition
US9028037B2 (en) 2011-06-06 2015-05-12 Sicpa Holding Sa Ink-jet print head comprising a layer made by a curable resin composition
EP3099496A4 (en) * 2014-01-29 2017-12-13 Hewlett-Packard Development Company L.P. Fluid directing assembly

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