WO2000074110A3 - Structures constructionnelles et procedes de fabrication pour ensembles cartes a sondes pour circuits integres sur plaquettes - Google Patents
Structures constructionnelles et procedes de fabrication pour ensembles cartes a sondes pour circuits integres sur plaquettes Download PDFInfo
- Publication number
- WO2000074110A3 WO2000074110A3 PCT/US2000/014164 US0014164W WO0074110A3 WO 2000074110 A3 WO2000074110 A3 WO 2000074110A3 US 0014164 W US0014164 W US 0014164W WO 0074110 A3 WO0074110 A3 WO 0074110A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- spring
- integrated circuit
- probe card
- structures
- Prior art date
Links
- 239000000523 sample Substances 0.000 title abstract 15
- 230000000712 assembly Effects 0.000 abstract 4
- 238000000429 assembly Methods 0.000 abstract 4
- 238000012360 testing method Methods 0.000 abstract 3
- 238000004519 manufacturing process Methods 0.000 abstract 2
- 239000010409 thin film Substances 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 230000035515 penetration Effects 0.000 abstract 1
- 239000011253 protective coating Substances 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020017015188A KR100707044B1 (ko) | 1999-05-27 | 2000-05-23 | 집적회로 웨이퍼 프로브카드 조립체의 구조물 및 그 제조방법 |
JP2001500317A JP2004500699A (ja) | 1999-05-27 | 2000-05-23 | 集積回路ウェーハのプローブカード組立体の構造および製造方法 |
AU51563/00A AU5156300A (en) | 1999-05-27 | 2000-05-23 | Construction structures and manufacturing processes for integrated circuit waferprobe card assemblies |
US10/870,095 US7349223B2 (en) | 2000-05-23 | 2004-06-16 | Enhanced compliant probe card systems having improved planarity |
US10/888,761 US20050068054A1 (en) | 2000-05-23 | 2004-07-09 | Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies |
US11/133,021 US7382142B2 (en) | 2000-05-23 | 2005-05-18 | High density interconnect system having rapid fabrication cycle |
US11/350,049 US7579848B2 (en) | 2000-05-23 | 2006-02-07 | High density interconnect system for IC packages and interconnect assemblies |
US11/552,110 US7952373B2 (en) | 2000-05-23 | 2006-10-23 | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US11/858,064 US7872482B2 (en) | 2000-05-23 | 2007-09-19 | High density interconnect system having rapid fabrication cycle |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13663699P | 1999-05-27 | 1999-05-27 | |
US60/136,636 | 1999-05-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2000074110A2 WO2000074110A2 (fr) | 2000-12-07 |
WO2000074110A3 true WO2000074110A3 (fr) | 2001-09-27 |
Family
ID=22473698
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/014164 WO2000074110A2 (fr) | 1999-05-27 | 2000-05-23 | Structures constructionnelles et procedes de fabrication pour ensembles cartes a sondes pour circuits integres sur plaquettes |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2004500699A (fr) |
KR (1) | KR100707044B1 (fr) |
AU (1) | AU5156300A (fr) |
WO (1) | WO2000074110A2 (fr) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6812718B1 (en) | 1999-05-27 | 2004-11-02 | Nanonexus, Inc. | Massively parallel interface for electronic circuits |
US7382142B2 (en) | 2000-05-23 | 2008-06-03 | Nanonexus, Inc. | High density interconnect system having rapid fabrication cycle |
US7349223B2 (en) | 2000-05-23 | 2008-03-25 | Nanonexus, Inc. | Enhanced compliant probe card systems having improved planarity |
US7247035B2 (en) | 2000-06-20 | 2007-07-24 | Nanonexus, Inc. | Enhanced stress metal spring contactor |
US7952373B2 (en) | 2000-05-23 | 2011-05-31 | Verigy (Singapore) Pte. Ltd. | Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
US7579848B2 (en) | 2000-05-23 | 2009-08-25 | Nanonexus, Inc. | High density interconnect system for IC packages and interconnect assemblies |
TWI286209B (en) * | 2006-01-27 | 2007-09-01 | Mjc Probe Inc | Integrated circuit probe card |
KR100701498B1 (ko) * | 2006-02-20 | 2007-03-29 | 주식회사 새한마이크로텍 | 반도체 검사용 프로브핀 조립체 및 그 제조방법 |
JP5024861B2 (ja) * | 2006-08-01 | 2012-09-12 | 日本電子材料株式会社 | プローブカード |
US7604486B2 (en) * | 2006-12-21 | 2009-10-20 | Intel Corporation | Lateral force countering load mechanism for LGA sockets |
CN101889338B (zh) * | 2007-10-08 | 2012-10-24 | Amst株式会社 | 用于晶圆测试的方法以及用于该方法的探针卡 |
KR102035998B1 (ko) * | 2013-10-25 | 2019-10-24 | 가부시키가이샤 어드밴티스트 | 인터페이스 장치, 제조 방법 및 시험 장치 |
EP3304110A4 (fr) * | 2015-05-29 | 2019-01-23 | R&D Circuits Inc. | Performance transitoire amélioré d'alimentation électrique (intégrité électrique) pour un ensemble carte sonde dans un environnement de test de circuit intégré |
CN107665848B (zh) * | 2016-07-29 | 2020-08-25 | 上海微电子装备(集团)股份有限公司 | 一种解键合调平装置及解键合方法 |
JP7262990B2 (ja) | 2018-12-13 | 2023-04-24 | 株式会社日本マイクロニクス | 電気的接続装置 |
CN111880067B (zh) * | 2019-04-15 | 2023-05-05 | 台湾中华精测科技股份有限公司 | 晶片测试组件及其电性连接模块 |
KR20210058641A (ko) * | 2019-11-12 | 2021-05-24 | 화인인스트루먼트 (주) | 프로브 어레이 및 그를 이용한 프로브 카드의 프로브 헤드 제조 방법 |
CN113406481A (zh) * | 2021-07-08 | 2021-09-17 | 陈清梅 | 一种集成电路输入端测试装置 |
US20230238234A1 (en) * | 2022-01-24 | 2023-07-27 | Texas Instruments Incorporated | Automated overlay removal during wafer singulation |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0369112A1 (fr) * | 1988-11-12 | 1990-05-23 | MANIA GmbH & Co. | Adaptateur pour appareil électronique de contrôle des circuits imprimés et équipement semblable |
US5030109A (en) * | 1990-08-24 | 1991-07-09 | Amp Incorporated | Area array connector for substrates |
FR2680284A1 (fr) * | 1991-08-09 | 1993-02-12 | Thomson Csf | Dispositif de connexion a tres faible pas et procede de fabrication. |
US5436568A (en) * | 1994-01-25 | 1995-07-25 | Hughes Aircraft Company | Pivotable self-centering elastomer pressure-wafer probe |
EP0701136A2 (fr) * | 1994-09-09 | 1996-03-13 | Tokyo Electron Limited | Sonde de test électrique |
WO1996015458A1 (fr) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Kit et ensemble carte de controle, et leurs procedes d'utilisation |
WO1998021597A1 (fr) * | 1996-11-12 | 1998-05-22 | Charmant Beheer B.V. | Adaptateur d'essai, son procede de fabrication et procede servant a controler des cartes a circuits imprimes |
US5821763A (en) * | 1992-10-19 | 1998-10-13 | International Business Machines Corporation | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6453429A (en) * | 1987-08-24 | 1989-03-01 | Mitsubishi Electric Corp | Device for testing semiconductor chip |
JP2966671B2 (ja) * | 1991-11-18 | 1999-10-25 | 東京エレクトロン株式会社 | プローブカード |
JP2995134B2 (ja) * | 1993-09-24 | 1999-12-27 | 東京エレクトロン株式会社 | プローブ装置 |
US5923180A (en) * | 1997-02-04 | 1999-07-13 | Hewlett-Packard Company | Compliant wafer prober docking adapter |
US6578264B1 (en) * | 1999-06-04 | 2003-06-17 | Cascade Microtech, Inc. | Method for constructing a membrane probe using a depression |
JP5728437B2 (ja) * | 2012-07-17 | 2015-06-03 | 長野計器株式会社 | 物理量測定装置及び物理量測定装置の製造方法 |
-
2000
- 2000-05-23 AU AU51563/00A patent/AU5156300A/en not_active Abandoned
- 2000-05-23 WO PCT/US2000/014164 patent/WO2000074110A2/fr active IP Right Grant
- 2000-05-23 KR KR1020017015188A patent/KR100707044B1/ko not_active Expired - Fee Related
- 2000-05-23 JP JP2001500317A patent/JP2004500699A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0369112A1 (fr) * | 1988-11-12 | 1990-05-23 | MANIA GmbH & Co. | Adaptateur pour appareil électronique de contrôle des circuits imprimés et équipement semblable |
US5030109A (en) * | 1990-08-24 | 1991-07-09 | Amp Incorporated | Area array connector for substrates |
FR2680284A1 (fr) * | 1991-08-09 | 1993-02-12 | Thomson Csf | Dispositif de connexion a tres faible pas et procede de fabrication. |
US5821763A (en) * | 1992-10-19 | 1998-10-13 | International Business Machines Corporation | Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof |
US5436568A (en) * | 1994-01-25 | 1995-07-25 | Hughes Aircraft Company | Pivotable self-centering elastomer pressure-wafer probe |
EP0701136A2 (fr) * | 1994-09-09 | 1996-03-13 | Tokyo Electron Limited | Sonde de test électrique |
WO1996015458A1 (fr) * | 1994-11-15 | 1996-05-23 | Formfactor, Inc. | Kit et ensemble carte de controle, et leurs procedes d'utilisation |
WO1998021597A1 (fr) * | 1996-11-12 | 1998-05-22 | Charmant Beheer B.V. | Adaptateur d'essai, son procede de fabrication et procede servant a controler des cartes a circuits imprimes |
Also Published As
Publication number | Publication date |
---|---|
WO2000074110A2 (fr) | 2000-12-07 |
JP2004500699A (ja) | 2004-01-08 |
AU5156300A (en) | 2000-12-18 |
KR20030085142A (ko) | 2003-11-05 |
KR100707044B1 (ko) | 2007-04-13 |
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