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WO2000048749A1 - Procede permettant de faire adherer des structures laminees - Google Patents

Procede permettant de faire adherer des structures laminees Download PDF

Info

Publication number
WO2000048749A1
WO2000048749A1 PCT/US2000/003362 US0003362W WO0048749A1 WO 2000048749 A1 WO2000048749 A1 WO 2000048749A1 US 0003362 W US0003362 W US 0003362W WO 0048749 A1 WO0048749 A1 WO 0048749A1
Authority
WO
WIPO (PCT)
Prior art keywords
layer
polymer
recited
plasma
contact surface
Prior art date
Application number
PCT/US2000/003362
Other languages
English (en)
Inventor
Stephan Eufinger
John D. Affinito
Mark E. Gross
Original Assignee
Battelle Memorial Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Battelle Memorial Institute filed Critical Battelle Memorial Institute
Publication of WO2000048749A1 publication Critical patent/WO2000048749A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/62—Plasma-deposition of organic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0008—Electrical discharge treatment, e.g. corona, plasma treatment; wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
    • C08J7/0423—Coating with two or more layers, where at least one layer of a composition contains a polymer binder with at least one layer of inorganic material and at least one layer of a composition containing a polymer binder
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
    • C08J7/04—Coating
    • C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0092—Metallizing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/02—Noble metals
    • B32B2311/08—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
    • C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2433/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Derivatives of such polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Definitions

  • the present invention relates to a method and apparatus for adhering laminate structures. More specifically, the invention relates to a combination of a reactive compound within a monomer and a surface activating plasma to provide an activated surface for adhering a second laminate layer via vacuum deposition to the polymer layer.
  • non-polymer thin films including but not limited to metals, metal-oxides, semiconductors and combinations thereof are placed on polymer thin films in the form of substrates and/or layers.
  • These thin film combinations are prepared in-situ by a number of methods including but not limited to extrusion, flash-evaporation, spraying, blading, plasma enhanced chemical vapor deposition (PECVD), sputtering, evaporation and combinations thereof.
  • PECVD plasma enhanced chemical vapor deposition
  • sputtering evaporation and combinations thereof.
  • the adhesion of these thin film combinations is commonly variable depending upon substrate, deposition method and materials deposited. Therefore treatments such as plasma discharges and/or irradiation with electrons, ultraviolet or laser are routinely employed to activate either the thin film or the polymeric surface or both to promote improved adhesion.
  • FIGURE is a cross section of a reflector made and tested as Example 1.
  • the present invention is a method and apparatus for of adhering a polymer layer to a second layer which rely upon a combination of
  • a contact surface selected from the group consisting of a polymer contact surface, a second layer contact surface and combinations thereof exposed to a surface activating plasma and providing an activated contact surface; and (c) contacting the second layer contact surface to the polymer contact surface in a vacuum, one or the other or both of which is the activated contact surface, thereby adhering the second layer with the polymer layer.
  • the polymer contains an additive that provides one side of a chemical hook that connects with the species provided from the plasma on the second layer contact surface as the other side of the chemical hook.
  • the adhesion is achieved by selection of additive/plasma species combinations. More specifically, the connection is achieved with a donor acceptor reaction, preferably a base-acid reaction.
  • silicone with a plasma containing oxygen and hydrogen provides OH groups that bind to the silicone.
  • Amine functionalities may be useful for other applications.
  • the acid and base be organic.
  • Preferred base has OH, but may have NH or SH groups, for example amines, mercaptans and combinations thereof.
  • One combination is by adding the reactive compound to a monomer as a monomer mixture.
  • the monomer mixture may be placed on a substrate via any method including but not limited to extrusion, flash-evaporation, spraying, blading and combinations thereof then polymerized to provide a polymer surface for receiving the non-polymer.
  • the monomer mixture may be placed upon the second layer then polymerized in-situ on the second layer. In either case, the solid surface is plasma treated prior to contact with the other material.
  • a vacuum is defined herein as having a pressure less than atmospheric pressure wherein processes including but not limited to sputtering, flash evaporation, plasma enhanced chemical vapor deposition, evaporation and combinations thereof may be conducted.
  • the monomer is acrylate or methacrylate.
  • the reactive compound may be acrylated silicone.
  • the amount of reactive compound must be sufficient to provide enough reactive material at a surface to provide a strong bond. It has been found that an effective amount of reactive compound is less than about 10 wt%.
  • the second layer may be another layer of the same polymer composition as the polymer layer. Alternatively, the second layer may be a metal, ceramic or combination thereof. Metal includes but is not limited to silver, copper, nickel, aluminum, iron, and combinations thereof. Ceramic includes metal oxides, metal nitrides, silicon oxides, metal carbides and combinations thereof.
  • the surface activating plasma may be a single compound plasma for example water. However, in some cases water is difficult to maintain as a plasma so a ballast gas may be desired, for example argon. Because it has been found that a combination of hydrogen and oxygen provides good surface activation, a two-compound plasma of hydrogen and oxygen may also be used for forming the OH groups.
  • the particular combination of plasma gases is specific to the additive and to the second contact surface.
  • an argon/water plasma is effective to activate the polymer surface when silicone is the additive.
  • an oxygen/hydrogen plasma has the advantage of avoiding water condensation in the delivery system.
  • the stoichiometric ratio of oxygen to hydrogen is 1 :1. Because it is desired to minimize the amount of gas in the system, it is preferred to operate at or near the stoichiometric amount.
  • Silver reflectors having a laminate composition of PET substrate, flash evaporated acrylate layer 1 , silver layer, and flash evaporated acrylate layer 2 were made.
  • a silver reflector made with no reactive compound and no plasma surface treatment had such poor adhesion that tape pull tests resulted in complete delamination or removal of the top polymer layer from the silver layer. In a subsequent pull test, the silver came off of the bottom polymer layer.
  • a silver reflector made with plasma treated surfaces gave the same delamination/removal results with the pull test as the untreated surfaces.
  • a silver reflector made with reactive compound added to the monomer/polymer gave the same delamination/removal results as the untreated surfaces.
  • a silver reflector 100 was made according to the present invention (FIGURE) with 5 wt% acrylated silicone (Ebecryl 350) as the reactive compound in an acrylate polymer 102.
  • a low intensity argon plasma was used to treat the surface 103 of a PET substrate 104 upon which the first monomer layer was flash evaporated and condensed and subsequently polymerized 102.
  • the polymerized surface 106 was exposed to an argon/water plasma for surface activation prior to putting down the silver layer 108 by sputtering.
  • the top silver surface 110 was further activated with a oxygen/hydrogen plasma with a ratio of oxygen to hydrogen of 1 :1.
  • a second monomer mixture layer 112 was flash evaporated and condensed onto the activated silver layer 110. Tape pull tests, with or without razor cross hatching, resulted in no delamination or removal of any layer.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Inorganic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

On a découvert que l'association d'un composé réactif contenu dans un polymère et d'un plasma d'activation de surface de contact permet d'obtenir une résistance maximale de laminage dans un laminé de type polymère/seconde couche obtenu par laminage sous vide. Ceci est vrai si la seconde couche est placée sur la couche polymère ou si le monomère est placé sur la seconde couche puis polymérisé sous vide de manière à produire le polymère.
PCT/US2000/003362 1999-02-18 2000-02-08 Procede permettant de faire adherer des structures laminees WO2000048749A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US25290499A 1999-02-18 1999-02-18
US09/252,904 1999-02-18

Publications (1)

Publication Number Publication Date
WO2000048749A1 true WO2000048749A1 (fr) 2000-08-24

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Country Status (1)

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Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004016560A3 (fr) * 2002-08-17 2004-04-08 3M Innovative Properties Co Film electroconducteur flexible
US6818291B2 (en) 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
US6929864B2 (en) 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
US7186465B2 (en) 1998-11-02 2007-03-06 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US7215473B2 (en) 2002-08-17 2007-05-08 3M Innovative Properties Company Enhanced heat mirror films
US7535017B2 (en) 2003-05-30 2009-05-19 Osram Opto Semiconductors Gmbh Flexible multilayer packaging material and electronic devices with the packaging material
US9428834B2 (en) 2003-03-10 2016-08-30 Osram Oled Gmbh Ceramic barrier layers
US9822454B2 (en) 2006-12-28 2017-11-21 3M Innovative Properties Company Nucleation layer for thin film metal layer formation
CN107383250A (zh) * 2016-05-17 2017-11-24 鹏鼎控股(深圳)股份有限公司 导电聚合物与电路板及两者相应的制作方法、复合材料

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136316A (ja) * 1986-11-28 1988-06-08 Hitachi Ltd 磁気記録体
EP0547550A1 (fr) * 1991-12-16 1993-06-23 Matsushita Electric Industrial Co., Ltd. Procédé pour fabriquer un film adsorbé chimiquement
EP0590467A1 (fr) * 1992-09-26 1994-04-06 Röhm Gmbh Procédé pour la formation des couches d'oxyde de silicium résistant au rayage sur des matières en plastique par revêtement de plasma
WO1995010117A1 (fr) * 1993-10-04 1995-04-13 Catalina Coatings, Inc. Materiau de revetement a base d'acrylate reticule utile pour former des dielectriques de condensateur et des barrieres a l'oxygene
US5576101A (en) * 1992-12-18 1996-11-19 Bridgestone Corporation Gas barrier rubber laminate for minimizing refrigerant leakage
JPH08325713A (ja) * 1995-05-30 1996-12-10 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
JPH0959763A (ja) * 1995-08-25 1997-03-04 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
WO1997022631A1 (fr) * 1995-12-19 1997-06-26 Talison Research Reseaux de films deposes par plasma
EP0787826A1 (fr) * 1996-01-30 1997-08-06 Becton, Dickinson and Company Tube de prélèvement du sang
WO1998018852A1 (fr) * 1996-10-31 1998-05-07 Delta V Technologies, Inc. Procedes d'application d'un revetement d'acrylate
EP0931850A1 (fr) * 1998-01-26 1999-07-28 Leybold Systems GmbH Procédé de traitement des surfaces des substrats en plastique

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63136316A (ja) * 1986-11-28 1988-06-08 Hitachi Ltd 磁気記録体
EP0547550A1 (fr) * 1991-12-16 1993-06-23 Matsushita Electric Industrial Co., Ltd. Procédé pour fabriquer un film adsorbé chimiquement
EP0590467A1 (fr) * 1992-09-26 1994-04-06 Röhm Gmbh Procédé pour la formation des couches d'oxyde de silicium résistant au rayage sur des matières en plastique par revêtement de plasma
US5576101A (en) * 1992-12-18 1996-11-19 Bridgestone Corporation Gas barrier rubber laminate for minimizing refrigerant leakage
WO1995010117A1 (fr) * 1993-10-04 1995-04-13 Catalina Coatings, Inc. Materiau de revetement a base d'acrylate reticule utile pour former des dielectriques de condensateur et des barrieres a l'oxygene
EP0722787A2 (fr) * 1993-10-04 1996-07-24 Catalina Coatings, Inc. Procédé pour fabriquer un revêtement en acrylate
JPH08325713A (ja) * 1995-05-30 1996-12-10 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
JPH0959763A (ja) * 1995-08-25 1997-03-04 Matsushita Electric Works Ltd 有機質基材表面への金属膜形成方法
WO1997022631A1 (fr) * 1995-12-19 1997-06-26 Talison Research Reseaux de films deposes par plasma
EP0787826A1 (fr) * 1996-01-30 1997-08-06 Becton, Dickinson and Company Tube de prélèvement du sang
WO1998018852A1 (fr) * 1996-10-31 1998-05-07 Delta V Technologies, Inc. Procedes d'application d'un revetement d'acrylate
EP0931850A1 (fr) * 1998-01-26 1999-07-28 Leybold Systems GmbH Procédé de traitement des surfaces des substrats en plastique

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* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 012, no. 396 (P - 774) 21 October 1988 (1988-10-21) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 04 30 April 1997 (1997-04-30) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) *

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7186465B2 (en) 1998-11-02 2007-03-06 3M Innovative Properties Company Transparent conductive oxides for plastic flat panel displays
US7276291B2 (en) 1998-11-02 2007-10-02 3M Innovative Properties Company Transparent conductive articles and methods of making same
US7261950B2 (en) 2002-08-17 2007-08-28 3M Innovative Properties Company Flexible, formable conductive films
US6933051B2 (en) 2002-08-17 2005-08-23 3M Innovative Properties Company Flexible electrically conductive film
US6929864B2 (en) 2002-08-17 2005-08-16 3M Innovative Properties Company Extensible, visible light-transmissive and infrared-reflective film and methods of making and using the film
US7215473B2 (en) 2002-08-17 2007-05-08 3M Innovative Properties Company Enhanced heat mirror films
WO2004016560A3 (fr) * 2002-08-17 2004-04-08 3M Innovative Properties Co Film electroconducteur flexible
US6818291B2 (en) 2002-08-17 2004-11-16 3M Innovative Properties Company Durable transparent EMI shielding film
US7351479B2 (en) 2002-08-17 2008-04-01 3M Innovative Properties Company Durable EMI shielding film
US7393557B2 (en) 2002-08-17 2008-07-01 3M Innovative Properties Flexible electrically conductive film
US9428834B2 (en) 2003-03-10 2016-08-30 Osram Oled Gmbh Ceramic barrier layers
US7535017B2 (en) 2003-05-30 2009-05-19 Osram Opto Semiconductors Gmbh Flexible multilayer packaging material and electronic devices with the packaging material
US9822454B2 (en) 2006-12-28 2017-11-21 3M Innovative Properties Company Nucleation layer for thin film metal layer formation
CN107383250A (zh) * 2016-05-17 2017-11-24 鹏鼎控股(深圳)股份有限公司 导电聚合物与电路板及两者相应的制作方法、复合材料

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