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WO2000046841A1 - Procede et dispositif pour nettoyer des substrats - Google Patents

Procede et dispositif pour nettoyer des substrats Download PDF

Info

Publication number
WO2000046841A1
WO2000046841A1 PCT/EP2000/000484 EP0000484W WO0046841A1 WO 2000046841 A1 WO2000046841 A1 WO 2000046841A1 EP 0000484 W EP0000484 W EP 0000484W WO 0046841 A1 WO0046841 A1 WO 0046841A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
cleaning
tilted
guide roller
cleaning element
Prior art date
Application number
PCT/EP2000/000484
Other languages
German (de)
English (en)
Inventor
Jürgen LOHMÜLLER
Original Assignee
Steag Microtech Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Steag Microtech Gmbh filed Critical Steag Microtech Gmbh
Priority to KR1020017009875A priority Critical patent/KR20010101997A/ko
Priority to JP2000597829A priority patent/JP2002536830A/ja
Priority to EP00909093A priority patent/EP1153418A1/fr
Publication of WO2000046841A1 publication Critical patent/WO2000046841A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Definitions

  • the present invention relates to a method and a device for cleaning substrates, in particular semiconductor wafers, with at least one rotatable cleaning element.
  • Such cleaning devices are known, for example, in the semiconductor industry for cleaning wafers after chemical mechanical planarization (CMP).
  • CMP chemical mechanical planarization
  • Such cleaning devices use, for example, double-sided brush cleaners which are arranged on opposite sides of a semiconductor wafer. In these cleaning devices, the brush cleaners are arranged so that the semiconductor wafer to be cleaned lies either horizontally or vertically between the brushes.
  • a brush cleaning device for wafers is known from JP6-326066.
  • the device has a retaining ring which surrounds the wafer and which is rotatable in order to position the wafer for the cleaning process at a predetermined angle with respect to a horizontal.
  • the present invention is therefore based on the object of providing a method and a device with which the cleaning of substrates can be carried out more efficiently and in a liquid-saving manner.
  • this object is achieved by a method according to the preamble of claim 1 in that the substrate is tilted during cleaning.
  • the process conditions can be adapted to the cleaning requirements.
  • the dwell time of a rinsing liquid on the substrate can be changed and optimally adjusted during cleaning.
  • the substrate is preferably tilted from a substantially vertical position into a substantially horizontal position and / or vice versa, as a result of which the advantages of both vertical cleaning and horizontal cleaning can be realized during cleaning.
  • the substrate can also be tilted into any other arbitrary intermediate position and held there in order to optimally set the process conditions.
  • the loading and unloading of the substrate is preferably carried out in a horizontal position, since the handling of the substrate is easiest in this position.
  • At least one side of the substrate is brushed for cleaning the same.
  • the substrate is preferably tilted by moving at least one brush in order to provide a simple tilting mechanism.
  • the substrate is pressed against and rotated by at least one guide roller during the cleaning process.
  • the guide roller ensures guidance and thus good positioning of the substrate within the cleaning device. It also allows the substrate to rotate for even cleaning.
  • the substrate is preferably rotated by active rotation of the at least one guide roller.
  • the substrate is removed by passive rotation of the at least one guide roller, i.e. rotated by pressing the substrate against the roller with a tangential component.
  • the substrate is tilted by a movement of the at least one guide roller.
  • the substrate is tilted by tilting the entire device.
  • a liquid is preferably applied to the substrate during cleaning in order to promote the cleaning action of the cleaning elements.
  • the liquid is applied to the substrate via brushes during cleaning, thereby ensuring that the brushes are always adequately wetted with liquid.
  • the liquid is applied directly to the substrate via nozzles.
  • the pressure exerted by the cleaning elements on the substrate is advantageously changed
  • the above-mentioned object is also achieved by a device in which the substrate can be tilted.
  • the advantages already mentioned are achieved by tilting the substrate.
  • Brush cleaners in the form of rollers or cup brushes are preferably used as cleaning elements.
  • a device for applying a liquid to the substrate has lines within at least one cleaning element, thereby ensuring uniform wetting of a substrate surface.
  • guide elements are provided in one embodiment of the invention.
  • the guide elements are advantageously movable in order to enable the cleaning element to move towards and away from the substrate.
  • the method according to the invention and the device according to the invention are particularly suitable for cleaning flat objects, such as semiconductor wafers, thin panes such as photo masks, glass substrates, compact discs, Fiat panel displays, etc.
  • Figure 1 is a schematic sectional view and a
  • FIG. 2 views according to FIG. 1, the wafer being in a vertical position;
  • FIG. 3 views according to FIG. 1, the wafer being in a position tilted by approximately 45 ° with respect to the horizontal;
  • Figure 4 is a schematic front view of an end wall of the cleaning device according to the invention according to an embodiment of the invention;
  • FIG. 5 shows a schematic front view of the end wall according to FIG. 5.
  • FIG. 1 shows a sectional view and a top view of a cleaning device 1 according to the invention for flat, circular wafers 2.
  • the cleaning device 1 has first and second cleaning brushes 4, 5 in the form of roller brushes, each of which can be rotated about central axes 7, 8 via a device (not shown).
  • the brushes 4.5 are made of a sponge-like material such as PVA or bristles such as nylon.
  • the wafer 2 is accommodated between the brushes 4, 5 and is held in a horizontal position between them in accordance with FIG. 1.
  • the brushes 4, 5 have a length which is greater than the diameter of the wafer 2, so that the brushes 4, 5 protrude beyond the edge of the wafer 2.
  • the brushes can be moved towards and away from one another in order to adjust the pressure applied to the wafer 2.
  • the roller brush 4 is rotated clockwise during a cleaning process, while the roller brush 5 is rotated counterclockwise.
  • the wafer 2 is pressed to the left against a guide roller 10.
  • the guide roller 10 can be rotated via a device, not shown, in order to rotate the wafer 2 around its central axis.
  • the guide roller 10 could also be turned passively, ie by rotating the wafer with a presses a tangential component onto the roller.
  • the tangential component is achieved in that the roller brushes 4, 5 extend only over part of the wafer.
  • FIG. 2 shows the device according to the invention according to FIG. 1, with the wafer 2 in a vertical position
  • FIG. 3 shows the device according to FIG. 1 with the wafer 2 in a position tilted by approximately 45 ° with respect to the horizontal.
  • a rinsing liquid is applied to the wafer via a device (not shown). For example, in several places within the
  • nozzles for spraying the rinsing liquid onto the wafer surfaces may be provided.
  • lines 4.5 can be provided within the brush rollers, via which lines the rinsing liquid is directed onto the wafer surfaces.
  • the tilting of the wafer 2 can be done by tilting the entire device 1, i.e. including the drives, not shown, and the flushing liquid supply.
  • the wafers 2 could be tilted by moving the brush rollers 4, 5, as will be explained below using the exemplary embodiment according to FIG. 4.
  • FIG. 4 shows a schematic front view of a side wall 12 of the cleaning device 1.
  • the brush rollers 4, 5 and the wafer 2 are shown in dotted or dashed lines.
  • the side wall 12 has guide openings 14, 15, in which shafts 17, 18 of the brush rollers 4, 5 are received.
  • the shafts 17, 18 are arranged with sufficient play in the guide openings 14, 15 so that they can be moved towards and away from one another in order to adjust the pressure applied by the brushes and thus the process parameters.
  • the guide openings could also be in elements that can be moved relative to one another, e.g. Plates are designed to allow a relative movement of the waves received therein.
  • the guide openings 14, 15 are curved and each form approximately a quarter of a ring segment.
  • the shafts 17, 18 can be moved within the guide openings 14, 15 from the position shown in FIG. 4 to the position shown in FIG. 5, the shafts 17, 18 and thus the brush rollers 4, 5 being guided symmetrically around a center point of the device.
  • a wafer 2 located between the brush rollers 4, 5 is held horizontally, and in the position shown in FIG. 5, a wafer 2 located between the brush rollers 4, 5 is held in a vertical position.
  • the wafer 2 is tilted between the horizontal and vertical positions.
  • the guide roller 10 (not shown in FIGS. 4 and 5) can, in the same way as the brush rollers 4, 5, within a guide opening in the side wall 12. leads. Instead of actively moving the shafts 17, 18 of the brush rollers 4, 5, the wafer 2 could also be tilted by actively moving the guide roller 10 within the associated guide opening.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention concerne un procédé et un dispositif pour nettoyer des substrats au moyen d'au moins un élément de nettoyage rotatif. Selon l'invention, on fait basculer le substrat pendant le nettoyage, afin d'assurer un nettoyage efficace et de réduire la consommation de liquide de nettoyage.
PCT/EP2000/000484 1999-02-04 2000-01-22 Procede et dispositif pour nettoyer des substrats WO2000046841A1 (fr)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020017009875A KR20010101997A (ko) 1999-02-04 2000-01-22 기판 크리닝 장치 및 방법
JP2000597829A JP2002536830A (ja) 1999-02-04 2000-01-22 基板をクリーニングする方法及び装置
EP00909093A EP1153418A1 (fr) 1999-02-04 2000-01-22 Procede et dispositif pour nettoyer des substrats

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE19904548A DE19904548C2 (de) 1999-02-04 1999-02-04 Verfahren und Vorrichtung zum Reinigen von Substraten
DE19904548.8 1999-02-04

Publications (1)

Publication Number Publication Date
WO2000046841A1 true WO2000046841A1 (fr) 2000-08-10

Family

ID=7896442

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2000/000484 WO2000046841A1 (fr) 1999-02-04 2000-01-22 Procede et dispositif pour nettoyer des substrats

Country Status (5)

Country Link
EP (1) EP1153418A1 (fr)
JP (1) JP2002536830A (fr)
KR (1) KR20010101997A (fr)
DE (1) DE19904548C2 (fr)
WO (1) WO2000046841A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6748961B2 (en) * 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same
WO2006111193A1 (fr) 2005-04-20 2006-10-26 Freescale Semiconductor, Inc. Appareil pour le nettoyage de substrats de circuits

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60033811T2 (de) 2000-09-08 2007-11-15 Qimonda Dresden Gmbh & Co. Ohg Wafer-Reinigungsvorrichtung

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326066A (ja) * 1993-05-12 1994-11-25 Sony Corp ブラシスクラブ装置
WO1998001892A1 (fr) * 1996-07-08 1998-01-15 Speedfam Corporation Procedes et dispositif de nettoyage, rinçage et sechage de tranches

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06326066A (ja) * 1993-05-12 1994-11-25 Sony Corp ブラシスクラブ装置
WO1998001892A1 (fr) * 1996-07-08 1998-01-15 Speedfam Corporation Procedes et dispositif de nettoyage, rinçage et sechage de tranches

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1995, no. 02 31 March 1995 (1995-03-31) *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6748961B2 (en) * 2001-03-30 2004-06-15 Lam Research Corporation Angular spin, rinse, and dry module and methods for making and implementing the same
WO2006111193A1 (fr) 2005-04-20 2006-10-26 Freescale Semiconductor, Inc. Appareil pour le nettoyage de substrats de circuits
US8752228B2 (en) 2005-04-20 2014-06-17 Freescale Semiconductor, Inc. Apparatus for cleaning of circuit substrates

Also Published As

Publication number Publication date
DE19904548C2 (de) 2001-07-05
EP1153418A1 (fr) 2001-11-14
KR20010101997A (ko) 2001-11-15
DE19904548A1 (de) 2000-08-17
JP2002536830A (ja) 2002-10-29

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