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WO1999033109A1 - Connecteur bga muni de moyens de connexion et de deconnexion actives a chaud - Google Patents

Connecteur bga muni de moyens de connexion et de deconnexion actives a chaud Download PDF

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Publication number
WO1999033109A1
WO1999033109A1 PCT/US1998/027066 US9827066W WO9933109A1 WO 1999033109 A1 WO1999033109 A1 WO 1999033109A1 US 9827066 W US9827066 W US 9827066W WO 9933109 A1 WO9933109 A1 WO 9933109A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
bga
conductive
heat
connector
Prior art date
Application number
PCT/US1998/027066
Other languages
English (en)
Inventor
Atsuhito Noda
Masato Okano
Hiroyuki Fujii
Original Assignee
Molex Incorporated
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Molex Incorporated filed Critical Molex Incorporated
Priority to EP98964132A priority Critical patent/EP0970522A1/fr
Publication of WO1999033109A1 publication Critical patent/WO1999033109A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0212—Printed circuits or mounted components having integral heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09772—Conductors directly under a component but not electrically connected to the component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1115—Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/162—Testing a finished product, e.g. heat cycle testing of solder joints
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3494—Heating methods for reflowing of solder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • the present invention relates generally to a ball grid array (“BGA”) connector used in connecting circuit boards to BGA packages having soldering balls arranged in the form of a lattice, and more particularly, to an improved BGA connector having a heat-activated connection and disconnection means.
  • BGA ball grid array
  • IC integrated circuits
  • packages may have their leads formed on two sides, such as in DIPs or on four sides, such as in QFPs or TCPs.
  • the number of leads connecting to such semiconductors and ICs have been increasing and accordingly, the distance, or pitch, between the leads has been reduced.
  • the reduction of spacing between the leads increases the difficulty with which the closely spaced leads are soldered to a printed circuit board.
  • the leads cannot be easily soldered to a circuit board because of the close lead-to-lead distance.
  • a lattice-array or grid-array of electrically conductive raised lands are formed on the bottom surface of the semiconductor package in place of the conventional leads on the four sides of the package. These lands typically have balls of soldering material or metal physically connected to them and are referred to in the art as BGA.
  • BGA sockets are known in semiconductor arts.
  • a conventional BGA connector used to connect a BGA package to a circuit board having soldering balls arranged in the form of lattice includes an insulating board, includes an insulating board, or an insulative connector base.
  • the connector base typically has a series of metal spring contacts arranged thereon in one-to-one correspondence with the soldering balls of the BGA package as demonstrated in Japanese Patent Application Laid-Open No. 8-
  • a selectively releasable electrical connection is made between the soldering balls of the
  • Another object of the present invention is to provide a BGA connector which requires no
  • pressing means for pushing the connector against a BGA package, thus guaranteed to be free of damaging the soldering balls of the BGA package.
  • Another object of the present invention is to provide a BGA connector whose profile is
  • yet another object of the present invention is to provide an
  • improved BGA connector having a heat-activated means for selectively connecting
  • Yet another object of the present invention is to provide an improved BGA connector having a heat-activated connection and disconnection means that eliminates the need for a
  • the heat-activated means being disposed on a surface of the BGA connector and further being arranged in a pattern
  • a low-profiled BGA connector uses a high-resistance heater
  • solder balls partially melting a series of solder balls, or preforms, arranged on a contact surface of a BGA package when current is passed through the heater, so that the solder balls are put in a
  • the BGA connector of the present invention is the BGA connector of the present invention.
  • invention includes a planar, insulated connector base having a plurality of electrically conductive
  • a plurality of conductive metal balls are provided in association with the rear (bottom) surface of the connector base, such that single balls are provided on single conductive pads.
  • a high-resistance heating means is provided on one surface of the connector, and preferably the front (or top surface) so that the heating means extends on the front surface in
  • a BGA connector according to the present invention may also include a plate-like
  • insulative connector base having a plurality of electrically conductive pads provided on opposing
  • a plurality of metal balls are provided on the bottom surface of the connector base, with a single
  • heating means preferably in the form of a high-resistance, heat-generating wire is arranged in a
  • a BGA package that abut the conductive pads of the front surface of the connector base may
  • the high-resistance heating means is
  • BGA package may be easily removed from their contact with the conductive pads when the wire
  • the high resistance heater may include one or more high resistance heating wires, such as Nichrome wire, that is stretched close to the front surface of the connector base.
  • One or more coatings of high-resistance heating material may also be applied to the front surface of the connector base. Such coatings can be formed by a suitable vacuum-coating process such as vaporizing or sputtering, or may be formed by way of printing or photolithography.
  • soldering balls may be of a conventional soldering material or of copper or any other
  • connector base may be of ceramic material, BT resin or any other synthetic resin, or a composite
  • the BGA connector structure of the present invention can therefore be fixed to and
  • the invention prevents the soldering
  • soldering balls would be subjected.
  • the ball-to-pad soldering assures that the
  • the connector-to-package distance can be set equal to the thickness of the connector
  • FIG. 1. is an enlarged sectional view of a fragment of a BGA connector according to the
  • FIG. 2 is a perspective view of the BGA connector, partly in section.
  • the present invention finds its greatest utility in providing
  • the semiconductor body, or package 10 has a plurality of conductive raised portions, or preforms 100, formed in a pattern on a lower surface 102 thereof.
  • the preforms 100 are illustrated in FIGS. 1 & 2 as raised hemispherical balls 11 and are formed
  • a BGA connector 1 comprises a plate-like connector base 2 of
  • insulating material having a plurality of electrically conductive pads, or lands 3 a and 3b, arranged
  • electrically conductive pads 3 a and 3b of the connector are electrically connected in one-to-one
  • Nichrome wire 6 is extended over the front surface 2a of the plate-like connector base 2 in a
  • the wire 6 is used as a high- resistance heater 7, and is supplied with electric current from a power source (not shown) to generate heat in the vicinity of the surface 2a of the connector base 2.
  • the wire as shown, passes through holes in the connector base 2 so as to permit it to run through pairs of adjacent
  • the BGA connector 1 when used, is laid over or on a circuit member
  • circuit board 8 which may be the base circuit board of an IC testing socket for testing the BGA package 10.
  • the circuit board 8 has a corresponding plurality of electrically
  • soldering balls 5 are soldered to the electrically conductive pads 9.
  • the high-resistance heater 7 is energized to generate heat in the vicinity of the surface 2a of the connector base 2 and, more importantly, in the vicinity of the BGA soldering balls 11. (FIG. 1.)
  • the soldering balls 11 of the BGA package 10 will at least
  • the interior conductive plating 101 of the via holes 4 provides a connection to the second
  • soldering balls 11 of the BGA package 10 are again partially melted to permit the removal and disconnection of the BGA package 10 from the BGA connector 1.
  • the surface tension of the solder balls 11 keeps them from substantially losing their shape when melted and facilitates repeated connections in this manner.
  • the high-resistance heater 7 may be formed from a Nichrome wire, as illustrated in the FIG. 2, but it may also be formed from tantalum wire or any other appropriate high-resistance heating wire.
  • the heating means may take the form of a conductive high-resistance coating, which may be formed on the front surface 2a of the connector base 2 by a vacuum-
  • connector base 2 by way of a photolithography process or by acid-resist etching. In these latter
  • FIG. 1 can be advantageously effected simultaneously with the forming of conductive pads 3 a on
  • conductive pads 3 a may further pass through openings 106 formed in the circuit board 8 at
  • soldering balls 5 on the rear side 2b of the connector base 2 can be of copper or any
  • the connector base 2 may be made of a thin, planar sheet of tough insulating material, such as a BT resin used in the field of plastic BGA connectors, a composite resin-containing glass
  • the connector base 2 of such a composite resin may also have a laminated structure
  • the electrically conductive pads 3 a and 3 b are illustrated as being provided in the form of a lattice having distinct rows 104, but it will be understood that these conductive pads 3 a and 3b can be provided on the top surface 2a of the connector base 2 in a concentric or radial pattern.
  • invention has a high-resistance heater provided on the front (or top) surface of its base, thereby

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Connecting Device With Holders (AREA)
  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

On décrit un ensemble connecteur (1) particulièrement utile pour tester des dispositifs à semi-conducteurs d'une structure de réseau de grille à globules (BGA) (10), et à la surface duquel plusieurs globules de soudure (11) sont formés. Les globules (11) sont placés au contact de parties conductrices opposées (3a) de l'ensemble connecteur. Un élément calogène (7), tel qu'un fil, est disposé à proximité des parties conductrices (3a) de l'ensemble connecteur et peut être alimenté sélectivement pour générer de la chaleur et faire fondre partiellement les globules de soudure (11). Des connexions fiables sont ainsi réalisées.
PCT/US1998/027066 1997-12-19 1998-12-18 Connecteur bga muni de moyens de connexion et de deconnexion actives a chaud WO1999033109A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP98964132A EP0970522A1 (fr) 1997-12-19 1998-12-18 Connecteur bga muni de moyens de connexion et de deconnexion actives a chaud

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP9/365125 1997-12-19
JP9365125A JPH11204173A (ja) 1997-12-19 1997-12-19 Ｂｇａ用コネクタ

Publications (1)

Publication Number Publication Date
WO1999033109A1 true WO1999033109A1 (fr) 1999-07-01

Family

ID=18483492

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/027066 WO1999033109A1 (fr) 1997-12-19 1998-12-18 Connecteur bga muni de moyens de connexion et de deconnexion actives a chaud

Country Status (4)

Country Link
EP (1) EP0970522A1 (fr)
JP (1) JPH11204173A (fr)
CN (1) CN1252894A (fr)
WO (1) WO1999033109A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2796497A1 (fr) * 1999-07-13 2001-01-19 Thomson Csf Detexis Interconnexion perfectionnee entre un composant electronique et une carte
EP1207727A3 (fr) * 2000-11-16 2003-08-13 International Business Machines Corporation Connecteur laminé flexible

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010055681A (ko) * 1999-12-11 2001-07-04 이형도 인쇄회로기판의 비 지 에이기판 결합장치
JP2004356569A (ja) 2003-05-30 2004-12-16 Shinko Electric Ind Co Ltd 半導体装置用パッケージ
CN102621466B (zh) * 2012-03-22 2015-02-11 上海华力微电子有限公司 一种老化测试板及制作该板的方法
CN102707219A (zh) * 2012-06-21 2012-10-03 上海华岭集成电路技术股份有限公司 用于半导体器件测试的测试装置
CN107732488A (zh) * 2016-08-10 2018-02-23 泰科电子(上海)有限公司 连接件
CN108834304A (zh) * 2018-07-17 2018-11-16 盛世瑶兰（深圳）科技有限公司 一种印刷电路板及其维修方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4813128A (en) * 1988-01-13 1989-03-21 Cray Research, Inc. High density disposable printed circuit inter-board connector
US5093987A (en) * 1990-12-21 1992-03-10 Amp Incorporated Method of assembling a connector to a circuit element and soldering component for use therein
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4813128A (en) * 1988-01-13 1989-03-21 Cray Research, Inc. High density disposable printed circuit inter-board connector
US5093987A (en) * 1990-12-21 1992-03-10 Amp Incorporated Method of assembling a connector to a circuit element and soldering component for use therein
US5615824A (en) * 1994-06-07 1997-04-01 Tessera, Inc. Soldering with resilient contacts
US5691041A (en) * 1995-09-29 1997-11-25 International Business Machines Corporation Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2796497A1 (fr) * 1999-07-13 2001-01-19 Thomson Csf Detexis Interconnexion perfectionnee entre un composant electronique et une carte
EP1207727A3 (fr) * 2000-11-16 2003-08-13 International Business Machines Corporation Connecteur laminé flexible

Also Published As

Publication number Publication date
JPH11204173A (ja) 1999-07-30
CN1252894A (zh) 2000-05-10
EP0970522A1 (fr) 2000-01-12

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