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WO1999018030A3 - Diamond-based composites with high thermal conductivity - Google Patents

Diamond-based composites with high thermal conductivity Download PDF

Info

Publication number
WO1999018030A3
WO1999018030A3 PCT/US1998/020828 US9820828W WO9918030A3 WO 1999018030 A3 WO1999018030 A3 WO 1999018030A3 US 9820828 W US9820828 W US 9820828W WO 9918030 A3 WO9918030 A3 WO 9918030A3
Authority
WO
WIPO (PCT)
Prior art keywords
diamond
thermal conductivity
high thermal
based composites
conductivity
Prior art date
Application number
PCT/US1998/020828
Other languages
French (fr)
Other versions
WO1999018030A2 (en
WO1999018030A9 (en
Inventor
Andrzej K Drukier
Original Assignee
Biotraces Inc
Andrzej K Drukier
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Biotraces Inc, Andrzej K Drukier filed Critical Biotraces Inc
Priority to AU16982/99A priority Critical patent/AU1698299A/en
Publication of WO1999018030A2 publication Critical patent/WO1999018030A2/en
Publication of WO1999018030A3 publication Critical patent/WO1999018030A3/en
Publication of WO1999018030A9 publication Critical patent/WO1999018030A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3732—Diamonds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Carbon And Carbon Compounds (AREA)

Abstract

A diamond based composite comprising diamond powder distributed in a non-metallic matrix material, the filling factor being between about 15 % and about 75 % and the conductivity of the comprising being substantially greater than the conductivity of the matrix material without diamond. The composite is dielectric and can include magnetic or fibrous materials. It can be used in biochips, electronic devices, and residential and industrial materials where thermal load management is critical.
PCT/US1998/020828 1997-10-02 1998-10-02 Diamond-based composites with high thermal conductivity WO1999018030A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU16982/99A AU1698299A (en) 1997-10-02 1998-10-02 Diamond-based composites with high thermal conductivity

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US94263597A 1997-10-02 1997-10-02
US6087397P 1997-10-02 1997-10-02
US08/942,635 1997-10-02
US60/060,873 1997-10-02

Publications (3)

Publication Number Publication Date
WO1999018030A2 WO1999018030A2 (en) 1999-04-15
WO1999018030A3 true WO1999018030A3 (en) 1999-05-20
WO1999018030A9 WO1999018030A9 (en) 1999-06-24

Family

ID=26740446

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/020828 WO1999018030A2 (en) 1997-10-02 1998-10-02 Diamond-based composites with high thermal conductivity

Country Status (1)

Country Link
WO (1) WO1999018030A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1794224A1 (en) * 2004-09-30 2007-06-13 Honeywell International Inc. Thermally conductive composite and uses for microelectronic packaging
EP1794223A1 (en) * 2004-09-30 2007-06-13 Honeywell International Inc. Thermally conductive composite and uses for microelectronic packaging
US8814861B2 (en) 2005-05-12 2014-08-26 Innovatech, Llc Electrosurgical electrode and method of manufacturing same
KR100818273B1 (en) 2006-09-04 2008-04-01 삼성전자주식회사 Method for reducing the temperature difference between substrates and fluid reaction apparatus using the same
US9574080B1 (en) * 2011-02-18 2017-02-21 The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration Diamond-dispersed fiber-reinforced composite for superior friction and wear properties in extreme environments and method for fabricating the same
AU2015213471B2 (en) 2014-02-06 2018-02-01 Gelion Technologies Pty Ltd Gelated ionic liquid film-coated surfaces and uses thereof
EP3179482A1 (en) * 2015-12-10 2017-06-14 ABB Schweiz AG Conductor arrangement with insulation for an electrical machine
CN110915107A (en) * 2017-06-09 2020-03-24 Abb瑞士股份有限公司 Electrical machine having a conductor arrangement and an insulation for the conductor arrangement
EP4050070A4 (en) * 2019-10-24 2023-11-29 Sekisui Chemical Co., Ltd. Resin composition and heat dissipation member

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0379773A1 (en) * 1989-01-27 1990-08-01 Digital Equipment Corporation Thermally conductive electrically resistive diamond filled epoxy adhesive
US5334330A (en) * 1990-03-30 1994-08-02 The Whitaker Corporation Anisotropically electrically conductive composition with thermal dissipation capabilities
JPH0922618A (en) * 1995-07-05 1997-01-21 Fujitsu Ltd Thermal conductive resin insulation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0379773A1 (en) * 1989-01-27 1990-08-01 Digital Equipment Corporation Thermally conductive electrically resistive diamond filled epoxy adhesive
US5334330A (en) * 1990-03-30 1994-08-02 The Whitaker Corporation Anisotropically electrically conductive composition with thermal dissipation capabilities
JPH0922618A (en) * 1995-07-05 1997-01-21 Fujitsu Ltd Thermal conductive resin insulation

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Section Ch Week 9713, Derwent World Patents Index; Class A85, AN 97-142513, XP002097410 *

Also Published As

Publication number Publication date
WO1999018030A2 (en) 1999-04-15
WO1999018030A9 (en) 1999-06-24

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