WO1999053531A3 - Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique - Google Patents
Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique Download PDFInfo
- Publication number
- WO1999053531A3 WO1999053531A3 PCT/US1999/002483 US9902483W WO9953531A3 WO 1999053531 A3 WO1999053531 A3 WO 1999053531A3 US 9902483 W US9902483 W US 9902483W WO 9953531 A3 WO9953531 A3 WO 9953531A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- cleaning station
- post
- cleaning
- cmp
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
La présente invention concerne un appareil de nettoyage pour pièces de semi-conducteurs qui est utilisé après application d'un procédé de polissage chimiomécanique. La pièce est tout d'abord soumise à un grattage qui fait disparaître de sa surface la pâte fluide et autres substances contaminantes. La pièce est ensuite placé dans un bac de nettoyage par décapage chimique dans lequel elle est positionnée horizontalement pour que ses surfaces supérieure et inférieure soient largement exposées. La pièce est ensuite immergée et dans une solution de nettoyage qui est brassée tout autour de ladite pièce, ceci pendant suffisamment longtemps pour retirer une couche suffisante d'oxydation et, par là, faire disparaître des substances contaminantes ainsi que de minuscules rayures superficielles.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/058,647 US6125861A (en) | 1998-02-09 | 1998-04-10 | Post-CMP wet-HF cleaning station |
US09/058,647 | 1998-04-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO1999053531A2 WO1999053531A2 (fr) | 1999-10-21 |
WO1999053531A3 true WO1999053531A3 (fr) | 2000-03-09 |
Family
ID=22018078
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/002483 WO1999053531A2 (fr) | 1998-04-10 | 1999-02-08 | Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique |
Country Status (2)
Country | Link |
---|---|
TW (1) | TW424272B (fr) |
WO (1) | WO1999053531A2 (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100163078A1 (en) * | 2008-12-31 | 2010-07-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Spinner and method of cleaning substrate using the spinner |
DE102013100040A1 (de) | 2013-01-03 | 2014-07-03 | E-Lead Electronic Co., Ltd. | Führungsverfahren einer Rückwärtsparkhilfe |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5292373A (en) * | 1991-07-10 | 1994-03-08 | Matsushita Electric Industrial Co., Ltd. | Apparatus and process for washing wafers |
US5442828A (en) * | 1992-11-30 | 1995-08-22 | Ontrak Systems, Inc. | Double-sided wafer scrubber with a wet submersing silicon wafer indexer |
US5487398A (en) * | 1993-06-22 | 1996-01-30 | Tadahiro Ohmi | Rotary cleaning method with chemical solutions and rotary cleaning apparatus with chemical solutions |
US5500081A (en) * | 1990-05-15 | 1996-03-19 | Bergman; Eric J. | Dynamic semiconductor wafer processing using homogeneous chemical vapors |
US5518552A (en) * | 1992-05-28 | 1996-05-21 | Tokyo Electron Limited | Method for scrubbing and cleaning substrate |
JPH08187660A (ja) * | 1994-12-28 | 1996-07-23 | Ebara Corp | ポリッシング装置 |
US5571367A (en) * | 1994-03-30 | 1996-11-05 | Kabushiki Kaisha Toshiba | Apparatus for subjecting a semiconductor substrate to a washing process |
US5609719A (en) * | 1994-11-03 | 1997-03-11 | Texas Instruments Incorporated | Method for performing chemical mechanical polish (CMP) of a wafer |
WO1997013590A1 (fr) * | 1995-10-13 | 1997-04-17 | Ontrak Systems, Inc. | Procede et appareil de distribution de produits chimiques a travers une brosse |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
WO1998001892A1 (fr) * | 1996-07-08 | 1998-01-15 | Speedfam Corporation | Procedes et dispositif de nettoyage, rinçage et sechage de tranches |
US5885138A (en) * | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
-
1999
- 1999-02-08 WO PCT/US1999/002483 patent/WO1999053531A2/fr active Search and Examination
- 1999-02-09 TW TW88101929A patent/TW424272B/zh not_active IP Right Cessation
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5500081A (en) * | 1990-05-15 | 1996-03-19 | Bergman; Eric J. | Dynamic semiconductor wafer processing using homogeneous chemical vapors |
US5292373A (en) * | 1991-07-10 | 1994-03-08 | Matsushita Electric Industrial Co., Ltd. | Apparatus and process for washing wafers |
US5518552A (en) * | 1992-05-28 | 1996-05-21 | Tokyo Electron Limited | Method for scrubbing and cleaning substrate |
US5442828A (en) * | 1992-11-30 | 1995-08-22 | Ontrak Systems, Inc. | Double-sided wafer scrubber with a wet submersing silicon wafer indexer |
US5487398A (en) * | 1993-06-22 | 1996-01-30 | Tadahiro Ohmi | Rotary cleaning method with chemical solutions and rotary cleaning apparatus with chemical solutions |
US5885138A (en) * | 1993-09-21 | 1999-03-23 | Ebara Corporation | Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
US5571367A (en) * | 1994-03-30 | 1996-11-05 | Kabushiki Kaisha Toshiba | Apparatus for subjecting a semiconductor substrate to a washing process |
US5609719A (en) * | 1994-11-03 | 1997-03-11 | Texas Instruments Incorporated | Method for performing chemical mechanical polish (CMP) of a wafer |
US5655954A (en) * | 1994-11-29 | 1997-08-12 | Toshiba Kikai Kabushiki Kaisha | Polishing apparatus |
JPH08187660A (ja) * | 1994-12-28 | 1996-07-23 | Ebara Corp | ポリッシング装置 |
WO1997013590A1 (fr) * | 1995-10-13 | 1997-04-17 | Ontrak Systems, Inc. | Procede et appareil de distribution de produits chimiques a travers une brosse |
WO1998001892A1 (fr) * | 1996-07-08 | 1998-01-15 | Speedfam Corporation | Procedes et dispositif de nettoyage, rinçage et sechage de tranches |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 11 29 November 1996 (1996-11-29) * |
Also Published As
Publication number | Publication date |
---|---|
TW424272B (en) | 2001-03-01 |
WO1999053531A2 (fr) | 1999-10-21 |
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