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WO1999053531A3 - Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique - Google Patents

Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique Download PDF

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Publication number
WO1999053531A3
WO1999053531A3 PCT/US1999/002483 US9902483W WO9953531A3 WO 1999053531 A3 WO1999053531 A3 WO 1999053531A3 US 9902483 W US9902483 W US 9902483W WO 9953531 A3 WO9953531 A3 WO 9953531A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
cleaning station
post
cleaning
cmp
Prior art date
Application number
PCT/US1999/002483
Other languages
English (en)
Other versions
WO1999053531A2 (fr
Inventor
Anand Gupta
Chris Karlsrud
Periya Gopalan
Daniel R Trojan
Jeffrey B Cunnane
Jon R Macernie
Original Assignee
Speedfam Ipec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/058,647 external-priority patent/US6125861A/en
Application filed by Speedfam Ipec Corp filed Critical Speedfam Ipec Corp
Publication of WO1999053531A2 publication Critical patent/WO1999053531A2/fr
Publication of WO1999053531A3 publication Critical patent/WO1999053531A3/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67046—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning By Liquid Or Steam (AREA)

Abstract

La présente invention concerne un appareil de nettoyage pour pièces de semi-conducteurs qui est utilisé après application d'un procédé de polissage chimiomécanique. La pièce est tout d'abord soumise à un grattage qui fait disparaître de sa surface la pâte fluide et autres substances contaminantes. La pièce est ensuite placé dans un bac de nettoyage par décapage chimique dans lequel elle est positionnée horizontalement pour que ses surfaces supérieure et inférieure soient largement exposées. La pièce est ensuite immergée et dans une solution de nettoyage qui est brassée tout autour de ladite pièce, ceci pendant suffisamment longtemps pour retirer une couche suffisante d'oxydation et, par là, faire disparaître des substances contaminantes ainsi que de minuscules rayures superficielles.
PCT/US1999/002483 1998-04-10 1999-02-08 Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique WO1999053531A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/058,647 US6125861A (en) 1998-02-09 1998-04-10 Post-CMP wet-HF cleaning station
US09/058,647 1998-04-10

Publications (2)

Publication Number Publication Date
WO1999053531A2 WO1999053531A2 (fr) 1999-10-21
WO1999053531A3 true WO1999053531A3 (fr) 2000-03-09

Family

ID=22018078

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1999/002483 WO1999053531A2 (fr) 1998-04-10 1999-02-08 Nettoyage par solution de fluorure d'hydrogene apres aplanissement chimiomecanique

Country Status (2)

Country Link
TW (1) TW424272B (fr)
WO (1) WO1999053531A2 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100163078A1 (en) * 2008-12-31 2010-07-01 Taiwan Semiconductor Manufacturing Co., Ltd. Spinner and method of cleaning substrate using the spinner
DE102013100040A1 (de) 2013-01-03 2014-07-03 E-Lead Electronic Co., Ltd. Führungsverfahren einer Rückwärtsparkhilfe

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292373A (en) * 1991-07-10 1994-03-08 Matsushita Electric Industrial Co., Ltd. Apparatus and process for washing wafers
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5487398A (en) * 1993-06-22 1996-01-30 Tadahiro Ohmi Rotary cleaning method with chemical solutions and rotary cleaning apparatus with chemical solutions
US5500081A (en) * 1990-05-15 1996-03-19 Bergman; Eric J. Dynamic semiconductor wafer processing using homogeneous chemical vapors
US5518552A (en) * 1992-05-28 1996-05-21 Tokyo Electron Limited Method for scrubbing and cleaning substrate
JPH08187660A (ja) * 1994-12-28 1996-07-23 Ebara Corp ポリッシング装置
US5571367A (en) * 1994-03-30 1996-11-05 Kabushiki Kaisha Toshiba Apparatus for subjecting a semiconductor substrate to a washing process
US5609719A (en) * 1994-11-03 1997-03-11 Texas Instruments Incorporated Method for performing chemical mechanical polish (CMP) of a wafer
WO1997013590A1 (fr) * 1995-10-13 1997-04-17 Ontrak Systems, Inc. Procede et appareil de distribution de produits chimiques a travers une brosse
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
WO1998001892A1 (fr) * 1996-07-08 1998-01-15 Speedfam Corporation Procedes et dispositif de nettoyage, rinçage et sechage de tranches
US5885138A (en) * 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5500081A (en) * 1990-05-15 1996-03-19 Bergman; Eric J. Dynamic semiconductor wafer processing using homogeneous chemical vapors
US5292373A (en) * 1991-07-10 1994-03-08 Matsushita Electric Industrial Co., Ltd. Apparatus and process for washing wafers
US5518552A (en) * 1992-05-28 1996-05-21 Tokyo Electron Limited Method for scrubbing and cleaning substrate
US5442828A (en) * 1992-11-30 1995-08-22 Ontrak Systems, Inc. Double-sided wafer scrubber with a wet submersing silicon wafer indexer
US5487398A (en) * 1993-06-22 1996-01-30 Tadahiro Ohmi Rotary cleaning method with chemical solutions and rotary cleaning apparatus with chemical solutions
US5885138A (en) * 1993-09-21 1999-03-23 Ebara Corporation Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device
US5571367A (en) * 1994-03-30 1996-11-05 Kabushiki Kaisha Toshiba Apparatus for subjecting a semiconductor substrate to a washing process
US5609719A (en) * 1994-11-03 1997-03-11 Texas Instruments Incorporated Method for performing chemical mechanical polish (CMP) of a wafer
US5655954A (en) * 1994-11-29 1997-08-12 Toshiba Kikai Kabushiki Kaisha Polishing apparatus
JPH08187660A (ja) * 1994-12-28 1996-07-23 Ebara Corp ポリッシング装置
WO1997013590A1 (fr) * 1995-10-13 1997-04-17 Ontrak Systems, Inc. Procede et appareil de distribution de produits chimiques a travers une brosse
WO1998001892A1 (fr) * 1996-07-08 1998-01-15 Speedfam Corporation Procedes et dispositif de nettoyage, rinçage et sechage de tranches

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1996, no. 11 29 November 1996 (1996-11-29) *

Also Published As

Publication number Publication date
TW424272B (en) 2001-03-01
WO1999053531A2 (fr) 1999-10-21

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