WO1999050368A1 - Radiation curable adhesive for digital versatile disc - Google Patents
Radiation curable adhesive for digital versatile disc Download PDFInfo
- Publication number
- WO1999050368A1 WO1999050368A1 PCT/NL1999/000168 NL9900168W WO9950368A1 WO 1999050368 A1 WO1999050368 A1 WO 1999050368A1 NL 9900168 W NL9900168 W NL 9900168W WO 9950368 A1 WO9950368 A1 WO 9950368A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive composition
- digital versatile
- acrylate
- radiation
- disc
- Prior art date
Links
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 89
- 239000000853 adhesive Substances 0.000 title claims abstract description 88
- 230000005855 radiation Effects 0.000 title claims abstract description 19
- 239000000203 mixture Substances 0.000 claims abstract description 73
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 51
- 239000003085 diluting agent Substances 0.000 claims abstract description 44
- -1 thiol compounds Chemical class 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000000034 method Methods 0.000 claims abstract description 14
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 claims abstract description 6
- 150000001875 compounds Chemical class 0.000 claims description 23
- 239000000178 monomer Substances 0.000 claims description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 9
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 claims description 9
- 238000004528 spin coating Methods 0.000 claims description 6
- 239000005864 Sulphur Substances 0.000 claims description 5
- 239000004615 ingredient Substances 0.000 claims description 5
- 229920003023 plastic Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 5
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 4
- 229960000834 vinyl ether Drugs 0.000 claims description 4
- 239000012965 benzophenone Substances 0.000 claims description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical class C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 claims description 2
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical class C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 claims description 2
- 244000028419 Styrax benzoin Species 0.000 claims description 2
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 2
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 2
- 150000008062 acetophenones Chemical class 0.000 claims description 2
- WURBFLDFSFBTLW-UHFFFAOYSA-N benzil Chemical compound C=1C=CC=CC=1C(=O)C(=O)C1=CC=CC=C1 WURBFLDFSFBTLW-UHFFFAOYSA-N 0.000 claims description 2
- 229960002130 benzoin Drugs 0.000 claims description 2
- 150000008366 benzophenones Chemical class 0.000 claims description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 2
- 235000019382 gum benzoic Nutrition 0.000 claims description 2
- 238000007650 screen-printing Methods 0.000 claims description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical group CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 2
- 229920002554 vinyl polymer Polymers 0.000 abstract description 6
- 239000010410 layer Substances 0.000 description 32
- 229920000515 polycarbonate Polymers 0.000 description 24
- 239000004417 polycarbonate Substances 0.000 description 24
- 150000002009 diols Chemical class 0.000 description 16
- 239000004721 Polyphenylene oxide Substances 0.000 description 15
- 229920000570 polyether Polymers 0.000 description 15
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 13
- 229910052782 aluminium Inorganic materials 0.000 description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 12
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 description 11
- 238000009472 formulation Methods 0.000 description 11
- 229940091853 isobornyl acrylate Drugs 0.000 description 11
- 239000005056 polyisocyanate Substances 0.000 description 11
- 238000012360 testing method Methods 0.000 description 11
- 239000007788 liquid Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 10
- 229920001228 polyisocyanate Polymers 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 150000003254 radicals Chemical class 0.000 description 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 239000004922 lacquer Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 125000000524 functional group Chemical group 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 229920005862 polyol Polymers 0.000 description 7
- 150000003077 polyols Chemical class 0.000 description 7
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 6
- 229920006397 acrylic thermoplastic Polymers 0.000 description 6
- 239000002318 adhesion promoter Substances 0.000 description 6
- 229940106691 bisphenol a Drugs 0.000 description 6
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 6
- 239000004814 polyurethane Substances 0.000 description 6
- 229920002635 polyurethane Polymers 0.000 description 6
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 6
- OXBLVCZKDOZZOJ-UHFFFAOYSA-N 2,3-Dihydrothiophene Chemical compound C1CC=CS1 OXBLVCZKDOZZOJ-UHFFFAOYSA-N 0.000 description 5
- 230000004927 fusion Effects 0.000 description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- 229910052737 gold Inorganic materials 0.000 description 5
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 5
- 239000012948 isocyanate Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 229920000098 polyolefin Polymers 0.000 description 5
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical group [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000000654 additive Substances 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000008199 coating composition Substances 0.000 description 4
- 238000007334 copolymerization reaction Methods 0.000 description 4
- 125000005442 diisocyanate group Chemical group 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000006353 environmental stress Effects 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 150000003573 thiols Chemical class 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 3
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical group C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 3
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 3
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 230000032683 aging Effects 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- 125000002091 cationic group Chemical group 0.000 description 3
- 239000007795 chemical reaction product Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- 229920001021 polysulfide Polymers 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical class S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 3
- 230000004580 weight loss Effects 0.000 description 3
- ZRKMQKLGEQPLNS-UHFFFAOYSA-N 1-Pentanethiol Chemical compound CCCCCS ZRKMQKLGEQPLNS-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- INQDDHNZXOAFFD-UHFFFAOYSA-N 2-[2-(2-prop-2-enoyloxyethoxy)ethoxy]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOCCOC(=O)C=C INQDDHNZXOAFFD-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- DXPPIEDUBFUSEZ-UHFFFAOYSA-N 6-methylheptyl prop-2-enoate Chemical compound CC(C)CCCCCOC(=O)C=C DXPPIEDUBFUSEZ-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- 239000004821 Contact adhesive Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical class [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 238000006136 alcoholysis reaction Methods 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical compound C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 125000002993 cycloalkylene group Chemical group 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- GHLKSLMMWAKNBM-UHFFFAOYSA-N dodecane-1,12-diol Chemical compound OCCCCCCCCCCCCO GHLKSLMMWAKNBM-UHFFFAOYSA-N 0.000 description 2
- 239000002355 dual-layer Substances 0.000 description 2
- 230000032050 esterification Effects 0.000 description 2
- 238000005886 esterification reaction Methods 0.000 description 2
- JZMPIUODFXBXSC-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.CCOC(N)=O JZMPIUODFXBXSC-UHFFFAOYSA-N 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 230000005923 long-lasting effect Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920001692 polycarbonate urethane Polymers 0.000 description 2
- 239000011253 protective coating Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 150000004756 silanes Chemical class 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 150000003568 thioethers Chemical class 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 238000004383 yellowing Methods 0.000 description 2
- GPHWXFINOWXMDN-UHFFFAOYSA-N 1,1-bis(ethenoxy)hexane Chemical compound CCCCCC(OC=C)OC=C GPHWXFINOWXMDN-UHFFFAOYSA-N 0.000 description 1
- VGHSXKTVMPXHNG-UHFFFAOYSA-N 1,3-diisocyanatobenzene Chemical compound O=C=NC1=CC=CC(N=C=O)=C1 VGHSXKTVMPXHNG-UHFFFAOYSA-N 0.000 description 1
- CDMDQYCEEKCBGR-UHFFFAOYSA-N 1,4-diisocyanatocyclohexane Chemical compound O=C=NC1CCC(N=C=O)CC1 CDMDQYCEEKCBGR-UHFFFAOYSA-N 0.000 description 1
- SBJCUZQNHOLYMD-UHFFFAOYSA-N 1,5-Naphthalene diisocyanate Chemical compound C1=CC=C2C(N=C=O)=CC=CC2=C1N=C=O SBJCUZQNHOLYMD-UHFFFAOYSA-N 0.000 description 1
- ATOUXIOKEJWULN-UHFFFAOYSA-N 1,6-diisocyanato-2,2,4-trimethylhexane Chemical compound O=C=NCCC(C)CC(C)(C)CN=C=O ATOUXIOKEJWULN-UHFFFAOYSA-N 0.000 description 1
- 229940008841 1,6-hexamethylene diisocyanate Drugs 0.000 description 1
- VAKWIIMMZSTGAI-UHFFFAOYSA-N 1-(octyltetrasulfanyl)octane Chemical compound CCCCCCCCSSSSCCCCCCCC VAKWIIMMZSTGAI-UHFFFAOYSA-N 0.000 description 1
- ZDQNWDNMNKSMHI-UHFFFAOYSA-N 1-[2-(2-prop-2-enoyloxypropoxy)propoxy]propan-2-yl prop-2-enoate Chemical compound C=CC(=O)OC(C)COC(C)COCC(C)OC(=O)C=C ZDQNWDNMNKSMHI-UHFFFAOYSA-N 0.000 description 1
- NFDXQGNDWIPXQL-UHFFFAOYSA-N 1-cyclooctyldiazocane Chemical compound C1CCCCCCC1N1NCCCCCC1 NFDXQGNDWIPXQL-UHFFFAOYSA-N 0.000 description 1
- LAYAKLSFVAPMEL-UHFFFAOYSA-N 1-ethenoxydodecane Chemical compound CCCCCCCCCCCCOC=C LAYAKLSFVAPMEL-UHFFFAOYSA-N 0.000 description 1
- AZUHIVLOSAPWDM-UHFFFAOYSA-N 2-(1h-imidazol-2-yl)-1h-imidazole Chemical compound C1=CNC(C=2NC=CN=2)=N1 AZUHIVLOSAPWDM-UHFFFAOYSA-N 0.000 description 1
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 1
- OLQFXOWPTQTLDP-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCO OLQFXOWPTQTLDP-UHFFFAOYSA-N 0.000 description 1
- RWXMAAYKJDQVTF-UHFFFAOYSA-N 2-(2-hydroxyethoxy)ethyl prop-2-enoate Chemical compound OCCOCCOC(=O)C=C RWXMAAYKJDQVTF-UHFFFAOYSA-N 0.000 description 1
- DLYUIZKESZKRBB-UHFFFAOYSA-N 2-(2-methylprop-2-enoyloxymethyl)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(CC)COC(=O)C(C)=C DLYUIZKESZKRBB-UHFFFAOYSA-N 0.000 description 1
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- 229940095095 2-hydroxyethyl acrylate Drugs 0.000 description 1
- 229940044192 2-hydroxyethyl methacrylate Drugs 0.000 description 1
- VHSHLMUCYSAUQU-UHFFFAOYSA-N 2-hydroxypropyl methacrylate Chemical compound CC(O)COC(=O)C(C)=C VHSHLMUCYSAUQU-UHFFFAOYSA-N 0.000 description 1
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 1
- UPTHZKIDNHJFKQ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;propane-1,2,3-triol Chemical compound CC(=C)C(O)=O.CC(=C)C(O)=O.OCC(O)CO UPTHZKIDNHJFKQ-UHFFFAOYSA-N 0.000 description 1
- XAADYWMRAXCFHY-UHFFFAOYSA-N 2-morpholin-4-ylprop-2-enamide Chemical compound NC(=O)C(=C)N1CCOCC1 XAADYWMRAXCFHY-UHFFFAOYSA-N 0.000 description 1
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 1
- DSSAWHFZNWVJEC-UHFFFAOYSA-N 3-(ethenoxymethyl)heptane Chemical compound CCCCC(CC)COC=C DSSAWHFZNWVJEC-UHFFFAOYSA-N 0.000 description 1
- LJPCNSSTRWGCMZ-UHFFFAOYSA-N 3-methyloxolane Chemical compound CC1CCOC1 LJPCNSSTRWGCMZ-UHFFFAOYSA-N 0.000 description 1
- JTHZUSWLNCPZLX-UHFFFAOYSA-N 6-fluoro-3-methyl-2h-indazole Chemical compound FC1=CC=C2C(C)=NNC2=C1 JTHZUSWLNCPZLX-UHFFFAOYSA-N 0.000 description 1
- ZHUWXKIPGGZNJW-UHFFFAOYSA-N 6-methylheptyl 3-sulfanylpropanoate Chemical compound CC(C)CCCCCOC(=O)CCS ZHUWXKIPGGZNJW-UHFFFAOYSA-N 0.000 description 1
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 1
- LVGFPWDANALGOY-UHFFFAOYSA-N 8-methylnonyl prop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C=C LVGFPWDANALGOY-UHFFFAOYSA-N 0.000 description 1
- 238000006596 Alder-ene reaction Methods 0.000 description 1
- GVVABNSCGMIYAE-UHFFFAOYSA-N CO[Si](OC)(OC)SSSSCCC Chemical compound CO[Si](OC)(OC)SSSSCCC GVVABNSCGMIYAE-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- OIFBSDVPJOWBCH-UHFFFAOYSA-N Diethyl carbonate Chemical compound CCOC(=O)OCC OIFBSDVPJOWBCH-UHFFFAOYSA-N 0.000 description 1
- VPIAKHNXCOTPAY-UHFFFAOYSA-N Heptane-1-thiol Chemical compound CCCCCCCS VPIAKHNXCOTPAY-UHFFFAOYSA-N 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- IIGAAOXXRKTFAM-UHFFFAOYSA-N N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C Chemical compound N=C=O.N=C=O.CC1=C(C)C(C)=C(C)C(C)=C1C IIGAAOXXRKTFAM-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical compound C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- LNWBFIVSTXCJJG-UHFFFAOYSA-N [diisocyanato(phenyl)methyl]benzene Chemical compound C=1C=CC=CC=1C(N=C=O)(N=C=O)C1=CC=CC=C1 LNWBFIVSTXCJJG-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000000732 arylene group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000005587 carbonate group Chemical group 0.000 description 1
- MYWGVEGHKGKUMM-UHFFFAOYSA-N carbonic acid;ethene Chemical compound C=C.C=C.OC(O)=O MYWGVEGHKGKUMM-UHFFFAOYSA-N 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- UYFMQPGSLRHGFE-UHFFFAOYSA-N cyclohexylmethylcyclohexane;isocyanic acid Chemical compound N=C=O.N=C=O.C1CCCCC1CC1CCCCC1 UYFMQPGSLRHGFE-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000012973 diazabicyclooctane Substances 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 238000001152 differential interference contrast microscopy Methods 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical group CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 125000001301 ethoxy group Chemical group [H]C([H])([H])C([H])([H])O* 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 238000004442 gravimetric analysis Methods 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- LNMQRPPRQDGUDR-UHFFFAOYSA-N hexyl prop-2-enoate Chemical compound CCCCCCOC(=O)C=C LNMQRPPRQDGUDR-UHFFFAOYSA-N 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 238000007373 indentation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- PBOSTUDLECTMNL-UHFFFAOYSA-N lauryl acrylate Chemical compound CCCCCCCCCCCCOC(=O)C=C PBOSTUDLECTMNL-UHFFFAOYSA-N 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- JVILUIPLJQOKFK-UHFFFAOYSA-N methyl 2-hydroxy-2-thiophen-2-ylacetate Chemical compound COC(=O)C(O)C1=CC=CS1 JVILUIPLJQOKFK-UHFFFAOYSA-N 0.000 description 1
- FTWUXYZHDFCGSV-UHFFFAOYSA-N n,n'-diphenyloxamide Chemical compound C=1C=CC=CC=1NC(=O)C(=O)NC1=CC=CC=C1 FTWUXYZHDFCGSV-UHFFFAOYSA-N 0.000 description 1
- DFENKTCEEGOWLB-UHFFFAOYSA-N n,n-bis(methylamino)-2-methylidenepentanamide Chemical compound CCCC(=C)C(=O)N(NC)NC DFENKTCEEGOWLB-UHFFFAOYSA-N 0.000 description 1
- OVHHHVAVHBHXAK-UHFFFAOYSA-N n,n-diethylprop-2-enamide Chemical compound CCN(CC)C(=O)C=C OVHHHVAVHBHXAK-UHFFFAOYSA-N 0.000 description 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 description 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical compound C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- QNILTEGFHQSKFF-UHFFFAOYSA-N n-propan-2-ylprop-2-enamide Chemical compound CC(C)NC(=O)C=C QNILTEGFHQSKFF-UHFFFAOYSA-N 0.000 description 1
- KKFHAJHLJHVUDM-UHFFFAOYSA-N n-vinylcarbazole Chemical compound C1=CC=C2N(C=C)C3=CC=CC=C3C2=C1 KKFHAJHLJHVUDM-UHFFFAOYSA-N 0.000 description 1
- KZCOBXFFBQJQHH-UHFFFAOYSA-N octane-1-thiol Chemical compound CCCCCCCCS KZCOBXFFBQJQHH-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 125000005702 oxyalkylene group Chemical group 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000921 polyethylene adipate Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000909 polytetrahydrofuran Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229940096522 trimethylolpropane triacrylate Drugs 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/147—Polyurethanes; Polyureas
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/24—Homopolymers or copolymers of amides or imides
- C08L33/26—Homopolymers or copolymers of acrylamide or methacrylamide
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N5/00—Details of television systems
- H04N5/76—Television signal recording
- H04N5/84—Television signal recording using optical recording
- H04N5/85—Television signal recording using optical recording on discs or drums
Definitions
- This invention relates to a radiation- curable adhesive formulation useful for bonding together surfaces of digital versatile discs.
- the technology behind the compact disc has been improved and expanded to meet the increasing storage needs of the computer and entertainment industries, culminating in the creation of digital versatile discs, or DVDs.
- DVDs While compact discs and digital versatile discs store information in the same general manner, the DVD design exploits CD technology to create a superior product .
- Structurally, digital versatile and compact discs are very similar to one another. The information bearing surfaces of both discs are marked with indentations, or pits, arranged in a continuous spiral pattern.
- DVDs store more data than equivalent CDs because, inter alia, the information-carrying pits are smaller and are intimately spaced in tight tracks, as opposed to the wide tracks of CDs .
- DVD players utilize lasers which emit red light at 650nm and 635 nm, which are shorter wavelengths than the infrared light used in conventional CD players. These shorter wavelengths enable DVD players to accurately read the smaller, more densely packed pits of the digital versatile discs.
- the compact and digital versatile discs composed of a core member around which the information bearing surface is symmetrically arranged, are the same diameter (120mm), and the same thickness (1.2mm).
- digital versatile discs are made of two 0.6 mm layers of polycarbonate . This reduces the amount of distance between the surface of the discs and the pits, such that the laser penetrates less plastic in the DVDs than in CDs when accessing information. Consequently, the thinner DVD substrate enhances the read accuracy of the laser.
- the two bonded sides of the DVDs serve to strengthen the discs, preventing warping.
- digital versatile discs have greater capacity and reduced responses to environmental factors than compact discs .
- Digital versatile discs may be created by variations on a few basic processes, as disclosed, for example, by U.S. Patent No. 4,310,919 and U.S. Patent No. 4,423,137.
- a master glass disc with the desired information is created, using a laser beam to record data from the center of the master glass disc to the outer edge of the master glass disc in a spiral pattern.
- the master glass disc is developed by spinning a sodium hydroxide solution over the glass surface, revealing the pits created by the laser.
- the developed master glass disc is then metallized with a coating of silver, followed by a coating of nickel.
- the nickel layer is then separated from the silver-coated master glass disc, forming a nickel reverse image of the data, known as the father copy.
- One or more nickel copies of this father may be generated, which can be used as a stamper in an injection molding machine to mass produce discs.
- Molten polycarbonate is then shot into molds containing the stamper, creating polycarbonate discs carrying the desired information.
- the discs are then removed from the molds with the lacquer layer adhered thereto, and a reflective metal, usually aluminum, is evaporated or sputtered on top of the polycarbonate first layer containing the information.
- a protective coating of lacquer is then applied over the reflective layer and dried or cured, forming a single sided disc.
- the stamped side of the single-sided DVD is backed by a dummy layer, onto which graphics may be applied.
- the basic DVD configuration is usually modified to further enhance the capacity of the discs.
- the capacity of a single sided disc may be almost doubled by applying a semi-reflective data layer zero, comprising, for example, gold, over the reflective aluminum layer one .
- the gold layer may be read by the driver laser on a low power setting, while the aluminum layer may be accessed by increasing the power of the laser. This results in a double layer of information on a single side of a disc, imparting the DVD with currently about 8.5 GB of capacity.
- Two of these single sided, dual layer discs may be bonded together back to back with a thick layer of adhesive, creating double sided, double layer digital versatile discs with currently about 17GB of storage space.
- the first and second disc layers are bonded such that they are parallel to and equidistant from the core member of the disc.
- the adhesive employed must provide high shear strength, while keeping the information layers uniformly equidistant from each other.
- Three technologies are currently employed for DVD bonding, namely contact adhesives, cationic or PSA UV bonding, and free radical UV bonding.
- the formulations must provide adhesion between the aluminum and polycarbonate layers, the gold and polycarbonate layers, and the lacquer and the polycarbonate layers, and various combinations thereof.
- the adhesive coatings must have a high cure speed and must wet the substrate. Following cure, these materials must have high dimensional stability and durability.
- the adhesive is screened onto both the discs, UV irradiated, and then pressed together.
- the bond strengthens with time due to aging, such that after approximately 24 hrs , the disc halves are permanently attached to each other.
- the discs produced by this method are flatter than with other processes, but cationic UV bonding necessitates an additional lacquer coating step. Additionally, the discs must stay in a curing station for a period to ensure complete bonding prior to stacking, requiring an extra stacker, which increases equipment costs.
- free radical UV bonding acrylate lacquer is placed on the leading edge of a disc, after which a second disc is placed on top, and the pair is spun.
- the weight of the second disc promotes the movement of the lacquer toward the inner edge of the metal layer, while the spinning causes the lacquer to move to the outer edge.
- the adhesive is cured via UV irradiation after the spin coating process is completed. Radical UV bonding is prone to bubble formation between the bonded layers. In the dual layer construction, bubbles can impair the ability of the drive laser to read the information-bearing pits. Variations in the aluminum layer prior to bonding can cause uneven curing, which prevents the formation of flat discs. Furthermore, acrylates shrink upon cure, often to substantial degrees, thereby preventing the formation of flat discs. This shrinkage may also reduce the environmental stability of bonded discs.
- the object of the current invention is a an adhesive that strongly binds sputter-coated metallized or siliconized, polycarbonate substrates, and UV-cured lacquer surfaces, is stable following exposure to elevated temperature and humidity, possesses excellent mechanical properties, has suitable viscosity, acceptable shrinkage and has a low degree of volatility post-cure.
- the result is an adhesive that imparts impact resistance and superior shear strength to bonded digital versatile discs or to other substrates.
- the object of the invention is achieved by a UV or radiation-curable composition for use as an adhesive material comprising the combination of the following pre-mixture ingredients:
- the present invention provides for the production of an improved adhesive for bonding digital versatile discs, methods for bonding disc components together, and discs with improved impact resistance due to the enhanced bonding properties of the adhesive compound.
- the radical forming sulphur compound generally will be a thiol compound or a polysulphide compound.
- thiol compound usually it is referred to thiol compound, but this is just as an example.
- Acrylate oligomers are well known in field of adhesives. According to the invention, it is supposed, that co-polymerization of thiol and non- acrylate functional compounds (sometimes mentioned as "ene") with urethane acrylates creates a urethane- acrylate-thiol-ene hybrid adhesive coating with superior properties to urethane acrylate coatings lacking the thiol-ene system.
- the non-acrylate functional compound can e.g. be an acrylamide or an N- vinyl group comprising compound.
- the thiol-ene systems appear to allow copolymerization of non-acrylate functional moieties with acrylate moieties. In the absence of thiols, copolymerization of, for example, N- vinyl compounds is slow. Thiol compounds act as chain transfer agents, which may reduce cure speed. In contrast, thiol-ene systems in acrylate compounds enhance cure speed and reduce shrinkage of cured adhesives during cure of adhesive films.
- Figure 1 relates adhesive thickness, plotted on the ordinate, with spin speeds, plotted on the abscissa.
- Figure 2 relates the degree of cure (% unreacted acrylate unsaturation) , measured by Fourier Transform Infrared Spectroscopy (FITR) , with the amount of UV energy to which the adhesive is exposed.
- FITR Fourier Transform Infrared Spectroscopy
- Figure 3 shows the thermal stability of the cured adhesive composition, measured by Thermal
- DVD bonding optical adhesive needs to adhere well to these surfaces and to polycarbonate, from which the discs are made.
- Substrate layers bonded together in various combinations according to the invention include, but are not limited to, plastics, metallics and ceramics.
- the optical adhesive must not corrode the surfaces in hot and/or humid environments. Additional requirements for DVD bonding adhesive include complete edge cure, high cure rate in air and optical clarity for DVD-9, DVD-18 or other sizes.
- Radiation curable adhesive formulations based on hybrid acrylate-thiol-ene copolymerization are unexpectedly advantageous DVD adhesives.
- the adhesives bond strongly to, for example, aluminized surfaces of the polycarbonate substrates of a DVD, cure well in air and have good edge cure characteristics. Such formulations also do not corrode the aluminum surface.
- acrylate oligomer non-acrylate functional reactive diluent, acrylate functional reactive diluents, thiol compounds and additives may be adjusted according to the ultimate use of the product.
- the composition may be tailored to maximize the adhesiveness, reduce the viscosity, shorten cure speed, and the like of the cured material.
- acrylate functional reactive diluent and optionally silane compounds may be added at varying effective concentrations to achieve improved viscosity and adhesion, respectively.
- other desirable properties including high optical transparency, good hardness, chemical resistance, and abrasion resistance, may be promoted.
- the exact combinations selected for the use in radiation-curable adhesive coating compositions may vary, depending upon the other components of the composition and the light source used to cure the composition. Components should be excluded from the formulation which, prior to cure, cause insoluble salts to form, which may impair the optical properties of the bonded disc .
- the radiation-curable compositions can be cured by conventional means.
- the radiation source can be a conventional light source, such as, for example, UV lamps available from Fusion Systems Corp.
- low-, medium- and high- pressure mercury lamps, superactinic fluorescent tubes or pulse lamps are suitable.
- Radiation-cure is preferably by actinic radiation and more preferably by UV radiation. When using the preferred UV cure of the adhesive compositions, proper control of light intensity is important to help control shrinkage of the polymerized material.
- the radiation-curable oligomer (A) can be any radiation-curable oligomer used in radiation- curable, adhesive coating compositions.
- An example of a suitable radiation-curable oligomer includes an urethane oligomer having a molecular weight of at least about 500 and containing at least one ethylenically unsaturated group that can be polymerized through actinic radiation.
- the ethylenically unsaturated group can be the reactive terminus of the oligomer to which the reactive diluent is bound when the composition is cured.
- the oligomer has two terminal radiation-curable functional groups, one at each end of the oligomer.
- oligomers are disclosed in, for example, 4,932,750.
- the radiation-curable oligomer is generally present in an amount of about 5% or more, preferably in an amount of about 10% or more, and more preferably, about 15 wt . % or more.
- the acrylate oligomer generally is present in an amount of about 80% or less, preferably about 75 wt . % or less, and more preferably about 60 wt . % or less.
- suitable radiation-curable functional groups which can be present on the oligomer include ethylenically unsaturated groups like acrylate or methacrylate, or mixtures thereof.
- the radiation-curable group in the oligomer is an acrylate group.
- the radiation-curable oligomer includes an oligomer backbone, at least two radiation-curable groups, and linking groups which link the radiation- curable groups to the oligomer backbone.
- the oligomer preferably, but not necessarily, has a linear structure, and can include block or random copolymeric structures. Oligomers having urethane linkages and acrylate radiation-curable groups are preferred.
- the oligomer backbone can be, for example, based on a polyether, polyolefin, polyester, polycarbonate, acrylic, hydrocarbon, polyolefin, or copolymers thereof.
- the oligomer backbone comprises urethane units.
- the radiation-curable oligomer can be an acrylic oligomer comprising at least one radiation- curable (meth) acrylate group, and preferably, at least one acrylate group. These are known in the art as acrylated acrylics.
- Oligomer synthetic routes for acrylated acrylics can, for example, involve an esterification of a hydroxyl-functional acrylic oligomer with (meth) acrylic acid, or the reaction of an epoxy- functional acrylic oligomer with (meth) acrylic acid.
- These acrylated acrylics can include urethane linkages .
- Preferred acrylated acrylic oligomers include species of at least n 5,000.
- Preferred acrylated urethane acrylics are described in EP-A-858470.
- Acrylated acrylics can be prepared by known synthetic methods including, for example, partial esterification of acrylic polymers having pendant carboxylic acid group with hydroxyethyl acrylate or glycidyl methacrylate, or in the alternative, acrylation of glycidyl methacrylate terpolymer with acrylic acid.
- the acrylic oligomer typically will have a copolymeric backbone. The Tg of the oligomer can be lowered by decreasing the content of methyl methacrylate .
- the oligomer backbone can comprise one or more oligomeric blocks coupled with each other via, for example, urethane linkages.
- one or more types of polyol prepolymers can be linked by methods known in the art .
- the oligomer backbone is a polyether
- the resulting adhesives can have a low glass transition temperature and good mechanical properties. If the oligomer backbone is a polyolefin, the resulting adhesives can have a further improved water resistance. Polycarbonate-based oligomers can provide for good stability. Polyether backbones are preferred.
- Oligomers with repeating urethane units can be, for example, prepared by reaction of (i) an oligomer polyol, (ii) a di- or poly-isocyanate and (iii) a hydroxy functional ethylenically unsaturated monomer such as, for example hydroxyalkyl (meth) - acrylate .
- an oligomer backbone polyol is used, preferably it has on average at least about 2 hydroxyl groups.
- the oligomer backbone polyol may have, on average, more than 2 hydroxyl groups.
- oligomer diol examples include polyether diols, polyolefin diols, polyester diols, polycarbonate diols, and mixtures thereof. Polyether and polycarbonate diols, or combinations thereof, are preferred.
- the polyether is a substantially non-crystalline polyether.
- the polyether comprises repeating units of one or more of the following monomer units :
- polyether polyol that can be used is the polymerization product of 20 percent by weight of 3 -methyltetrahydrofuran and 80 percent by weight of tetrahydrofuran, both of which have undergone a ring opening polymerization.
- This polyether copolymer contains both branched and non-branched oxyalkylene repeating units and is marketed as PTGL 1000TM (Hodogaya
- polyether which can be used is polyarylicdiol , like ethoxylated or propoxylated bisphenol-A or bisphenol-F.
- polycarbonate diols are those conventionally produced by the alcoholysis of diethylene carbonate with a diol.
- the diol can be, for example, an alkylene diol having about 2 to about 12 carbon atoms, such as, 1,4 -butane diol, 1,6-hexane diol, 1, 12-dodecane diol, and the like. Mixtures of these diols can also be utilized.
- the polycarbonate diol can contain ether linkages in the backbone in addition to carbonate groups.
- polycarbonate copolymers of alkylene oxide monomers and the previously described alkylene diols can be used. Admixtures of the polycarbonate diols and polycarbonate copolymers can also be utilized.
- Polycarbonate diols include, for example, DURACARB 122TM (PPG Industries) and PERMANOL KM10-1733TM (Permuthane, Inc., Ma.).
- DURACARB 122TM is produced by the alcoholysis of diethylcarbonate with hexane diol.
- Suitable polyolefin polyols preferably comprise hydrogenated polybutadiene, and in particular, 1,2- and 1,4 copolymerized butadiene.
- Any organic polyisocyanate (ii) can be used as the polyisocyanate.
- the polyisocyanate compounds which are employed in forming the urethane acrylate oligomers can be any organic isocyanate compound having at least two free isocyanate groups. Included are aliphatic, cycloaliphatic , and aromatic polyisocyanates . Polyisocyanates such as alkyl and alkylene polyisocyanates, cycloalkyl and cycloalkylene polyisocyanates, aryl and arylene polyisocyanates, and combinations such as alkylene, cycloalkylene and alkylene arylene polyisocyanates, can be used.
- a product is obtained which is end-capped with the reaction product from the isocyanate/ethylenically unsaturated monomer reaction on at least one end of the molecule.
- End-capped means that a functional group caps one of the two ends of the oligomer diol.
- the isocyanate/hydroxy functional monomer reaction product attaches to the oligomer backbone (i) diol via a urethane linkage.
- the urethane reactions can take place in the presence of a catalyst .
- Catalysts for the urethane reaction include, for example, dibutyl-tin dilaurate, diazabicyclooctane crystals and the like.
- the polyisocyanate (ii) is a diisocyanate .
- diisocyanates (ii) include isophorone diisocyanate (IPDI) , tetramethylxylene diisocyanate (TMXDI) , toluene diisocyanate (TDI) , diphenylmethylene diisocyanate, hexamethylene diisocyanate, cyclohexylene diisocyanate, methylene dicyclohexane diisocyanate, 2 , 2 , 4-trimethyl hexamethylene diisocyanate, m-phenylene diisocyanate, 4-chloro-l, 3-phenylene diisocyanate, 4 , 4 ' -biphenylene diisocyanate, 1 , 5-naphthylene diisocyanate, 1,4- tetramethylene diisocyanate, 1 , 6 -hexamethylene diisocyanate
- the compound providing a reactive terminus (iii) is an olefinically unsaturated compound employed for the preparation of the present urethane acrylate oligomers, and may be monomeric or polymeric and is characterized by the presence of a moiety which can react with isocyanate such as an active hydrogen group.
- the active hydrogen group is hydroxy.
- unsaturated polymerizable monomeric organic compounds having an isocyanate reactive active hydrogen group are 2 -hydroxyethyl acrylate, 2 -hydroxyethyl methacrylate, 2 -hydroxypropyl acrylate, 2 -hydroxypropyl methacrylate, diethylene glycol monoacrylate , diethylene glycol monomethacrylate, glycerine dimethacrylate, dimethylol propane dimethacrylate, reaction products of polyester glycols of acrylic or methacrylic acid and the like.
- the polyol used to prepare the urethane oligomer generally has a molecular weight of about 200 g/mol to about 5,000 g/mol, and preferably, about 500 g/mol to about 4,000 g/mol, and more preferably, about 1,000 g/mol to about 3,000 g/mol.
- the urethane oligomer with radiation curable groups generally has a number average molecular weight of about 1,000 to about 10,000, and preferably about 1,500 to about 5,000.
- Suitable syntheses of urethane oligomers are disclosed in, for example, U.S. Patent Nos. 5,336,563 and 5,409,740. Mixtures of oligomers can be used.
- a preferred urethane acrylate oligomer is CN 966-J75 obtained from Sartomer, Inc. (Pennsylvania), which is an aliphatic polyurethane acrylate.
- the composition according to the invention comprises at least two reactive diluents.
- the reactive diluents can be used to adjust the viscosity of the adhesive composition.
- the reactive diluents can each be a low viscosity monomer containing at least one functional group capable of polymerization when exposed to actinic radiation.
- At least one non-acrylate functional (or -ene) reactive diluents and one acrylate functional reactive diluent is used.
- the reactive diluents are preferably added in such an amount that the viscosity of the coating composition is in the range of about 100 to about
- Suitable amounts of the reactive diluents have been found to be about 5 wt% to about 80 wt%, and more preferably about 10 % to about 75% by weight.
- the reactive diluents preferably have a molecular weight of not more than about 550 or a viscosity at room temperature of less than about 500 mPas (measured as 100% diluent) .
- the functional group present on the reactive diluents may be of the same nature as that used in the radiation-curable oligomer.
- the radiation-curable functional group present in the reactive diluent is capable of copolymerizing with the radiation-curable functional group present on the radiation-curable oligomer.
- the non-acrylate functional reactive diluent (B) comprises a group capable of radical polymerisation, not being an acrylate or methacrylate group. Suitable non-acrylate functional groups include acrylamide, methacrylamide , N-vinyl, vinylether, vinylester and the like. In a first embodiment of this invention, the non-acrylate functional reactive diluent (B) comprises a vinyl group.
- Such vinyl reactive diluent preferably has a vinylether or N-vinyl functional group. More preferably, N-vinyl is used. Suitable examples of vinyl monomers are laurylvinyl ether, 2-ethylhexylvinyl ether, hexanedioldivinylether, N-vinyl formamide and derivatives thereof, N-vinyl carbazole, N-vinyl- caprolactam, N-vinylpyrrolidone and the like.
- the non-acrylate functional reactive diluent (B) comprises an acrylamide group such as an alkyl acrylamide, an alkylmethacrylamide, or an aryl acrylamide.
- the photopolymerizable amide comprises an alkyl acrylamide, such as N,N-dimethyl acrylamide, N-isopropyl acrylamide, N,N-diethyl acrylamide, N, N-dimethylamino propylacrylamide, and morpholinoacrylamide .
- the non-acrylate functional reactive diluent (B) preferably is present in an amount of about 3 wt . % or more, and more in particular in about 5 wt . % or more.
- Suitable amounts of the reactive acrylate functional diluent system (C) have been found to be about 10 wt% to about 80 wt%, and preferably, about 10 wt . % to about 70 wt . % , and more preferably, about 25 wt . % to about 60 wt.%. If more than one reactive diluent is present, the amounts of reactive diluent are added together to determine the amount of the diluent system.
- the reactive diluent system comprises monomers having an acrylate functionality and an C 4 -C 20 alkyl or polyether moiety.
- examples of such reactive diluents are hexyl acrylate, 2-ethylhexyl acrylate, isobornyl acrylate, decyl acrylate, lauryl acrylate, stearyl acrylate, ethoxyethoxy-ethyl crylate, isodecyl acrylate, and isooctyl acrylate.
- Another preferred type of reactive diluent is a compound including an aromatic group.
- diluents having an aromatic group include: ethyleneglycolphenyletheracrylate, polyethyleneglycolphenyletheracrylate , polypropyleneglycolphenyletheracrylate, and alkyl - substituted phenyl derivatives of the above monomers, such as polyethyleneglycolnonylphenyletheracrylate .
- a preferred acrylate monomer diluent is isobornyl acrylate, or isooctylacrylate .
- the reactive diluents can contain two groups capable of polymerization using actinic radiation.
- a diluent having three or more of such reactive groups can be present as well. Examples of such monomers include:
- C3-C 1 8 hydrocarbontrioltriacrylates the polyether analogues thereof, and the like, such as 1,6- hexanedioldiacrylate, trimethylolpropanetriacrylate, triethyleneglycoldiacrylate , pentaeritritoltriacrylate , and tripropyleneglycol diacrylate, alkoxylated bisphenol A diacrylate, or dimethacrylate, like ethoxylated or propoxylated bisphenol-A-dimethacrylate.
- Properties of reactive diluents and UV- cured urethane acrylates are described in " . App . Polym . Sci . , 32 : 162 1 - 163 6 (1995) .
- the composition further comprises a radical forming sulphur compound (D) .
- radical forming is ment, that in radical polymerization, the sulphur compounds is coreacted for at least 50%.
- Radical forming sulphur compounds are for example thiol or polysulphide comprising compounds. It is preferred to use alkanethiol, alkylesterthiol or dialkylpolysulphide compounds.
- the reactive diluent forms thioether linkages during radiation-cure. Such thioether linkages can be formed by thiol-ene reactions.
- Aliphatic thiol compounds such as C5-C30, preferably C5-C 2 0 alkanethiol compounds, are suitable reactants.
- alkanethiols examples include 1- pentanethiol , l-hexanethiol , 1-heptanethiol , 1- octanethiol, l-decanethiol, 1-dodecane-thiol , and the like.
- Compounds comprising a plurality of mercapto groups can be used, including di- and tri-mercapto compounds.
- a suitable alkylesterthiol is e.g. methylthiolglycolate or isooctyl-3 -mercapto propionate .
- Suitable polysulphides include di- and tetrasulphides such as di-octyltetrasulphide .
- Preferred examples of compounds (D) are compounds that also comprise a trialkoxy silane group, such as for example ⁇ -mercaptopropyltrimethoxysilane and ⁇ -mercaptopropyltriethoxysilane and trimethoxysilylpropyl tetrasulphide .
- a trialkoxy silane group such as for example ⁇ -mercaptopropyltrimethoxysilane and ⁇ -mercaptopropyltriethoxysilane and trimethoxysilylpropyl tetrasulphide .
- the composition may optionally further comprise at least one photoinitiator .
- the photoinitiator is required for fast UV cure.
- Conventional photoinitiators can be used. Examples include benzophenones, acetophenone derivatives, such as alpha-hydroxyalkylphenylketones , benzoin alkyl ethers and benzil ketals, monoacylphosphine oxides, and bisacylphosphine oxides.
- a preferred photoinitiator is 2 hydroxy-2-methyl-l-phenyl-propan-l-one (DAROCURE 1700TM, Ciba Geigy).
- Another preferred example is 2,2- dimethoxy-2-phenyl acetophenone (IRGACURE 651TM, Ciba Geigy) .
- Other suitable photosensitizers include mercaptobenzothiazoles , mercaptobenzooxazoles and hexaryl bisimidazole .
- mixtures of photoinitiators provide a suitable balance of properties .
- the photoinitiator should be present in sufficient quantity to provide fast cure speed, reasonable cost, good surface, through cure and lack of yellowing upon aging. Typical amounts can be, for example, about 0.1 wt . % to about 15 wt . % .
- UV absorbers typically those of the benzotriazole , benzophenone or oxanilide type, or sterically hindered amine type (HALS) may be added as light stabilizers.
- HALS sterically hindered amine type
- Further customary additives as used in the art include fillers, chain transfer agents, plasticizers , wetting agents, stabilizers, adhesion promoters or leveling agents.
- Mercaptosilanes as described above, are preferred adhesion promoters. When thiol compounds other than mercaptosilanes are used, it is preferred to use silane adhesion promoters.
- silane adhesion promoters are known in the art. Examples include isocyanotoalkyltrialkoxysilanes, methacrylylalkyltrialkoxysilanes , amino alkyltrialkoxysilanes and epoxyalkyltrialkoxy silanes.
- the alkyl group generally is propyl, and as the alkoxy group, methoxy or ethoxy is preferred.
- Another suitable silane adhesion promoter is vinyltrimethoxysilane .
- Mercaptosilanes such as mercaptopropyltrimethoxysilane and mercaptopropyltriethoxysilane, are particularly preferred.
- Thermal antioxidants may be used to improve thermal and oxidative stability. Other polymers and oligomers can be added to the compositions as needed.
- Cure speed can be measured by dose-modulus curves as known in the art . Cure speed can be taken as the dose required to effect 95% of the maximum modulus.
- UV cure speed is preferably about 1.0 J/cm 2 , more preferably about 0.7 j/cm2or less at 95% of maximum attainable modulus.
- density at 25°C is about 1.02 g/ml.
- Elongation (cured film elongation at break) is preferably at least 20% or more, and more preferably, about 50% or more and in particular about 100% or more.
- the weight loss of the cured adhesive at 100°C for 40 min should be ⁇ 5%, and shrinkage upon cure should be ⁇ 10%, with respect to the density of cured material.
- Bond strength is preferably rated about 4 to about 5. Shear strength is preferably about 10 lbs to about 100 lbs.
- Cured adhesive bonds are preferably stable under exposure to about 85°C at about 95% relative humidity for at least 250 hrs, more preferably for at least 2,000 hrs.
- the present invention provides a UV-curable composition with good adherence to plastic, metallic, and ceramic substrates, a low viscosity and excellent optical and elongation properties.
- the composition may therefore be useful for bonding single-sided digital versatile discs together or bonding the individual layers comprising a single-sided disc.
- Other substrates may also be bonded by the adhesive composition.
- Unexpectedly superior adhesiveness is achieved with this composition, providing an excellent material to meet adhesion requirements for digital versatile disc manufacture.
- the compounds forming the radiation curable adhesive composition were mixed together and coated on one surface of each of two polycarbonate substrates forming the DVD, which surfaces were already coated with an aluminum, gold or other layer encoded with audio, video or other information.
- the adhesive was coated on the substrates by spin coating or other method known in the art.
- the adhesive was then cured with ultraviolet radiation. Radiation-cure was effected using a fusion lamp equipped with a "D" bulb from
- the "D" lamp emits radiation of about 200 to about 470 nanometers with the peak radiation being at about 380 nanometers.
- the substrates were superimposed on each other with the adhesive bonding the substrate layers together, thereby forming a single DVD having one or preferably two layers of encoded audio or video information which may be read in a DVD player.
- Substrate layers which may be bonded by the invention in various combinations comprise plastics, metallics and ceramics.
- the adhesive composition may be applied to the disc layers by spin coating, capillary gap dispensing or screen printing. Curing preferably is effected to obtain at least about 80% of the maximum attainable modulus, more preferably at least about 90% of said modulus.
- Cured compositions can be examined for crystalline inclusions by optical microscopic methods. Conventional methods can be used to examine for these effects, although increasingly more stringent, high resolution analysis is required. Aging of cured films at, for example, 125°C, or at 95°C/95% relative humidity can be carried out to test for crystallization effects. Phase behavior can also be examined with use of a Polaroid camera, in a reflected light using differential interference contrast microscopy and a Leitz microscope. Magnifications of, for example, 200X or 500X can be used to determine crystallization and phase behavior effects. The production of and useful characteristics for optical disc adhesives are discussed in, for example, U.S. Patent Nos. 4,861,637, 4,906,675 and 5,213,947.
- Optical disc production is described in, for example, Network Formation by Chain Crosslinking Photopolymerization and its Applications in Electronics, by J.G. Kloosterboer in ADV. POLYM. SCI., 1988, 84., PP- 1-61.
- Example 1 A solution containing a polycarbonate urethane diacrylate oligomer (Tg 14°C Desotech) ; N- vinylpyrolidone (NVP) , isobornylacrylate (IBOA) , a thiol additive adhesion promoter, ⁇ - mercaptotrimethoxysilane and the photoinitiator DAROCURE 1700TM (Ciba Geigy) was prepared utilizing the proportions listed in Table 1. The reagents were heated for 1 hr at 60°C, after which the components were mixed by shaking until homogeneous. The resulting material had a viscosity of 330 mPas , as measured by a PhysicaTM LC3 viscometer. This low viscosity permitted easy use of the material during spin coating. The polymer was subsequently tested for adhesive properties on DVDs.
- NDP N- vinylpyrolidone
- IBOA isobornylacrylate
- IBOA isoborny
- NVP N-vinylpyrrolidone
- IBOA is isobornylacrylate
- DarocureTM 1700 is a photoinitiator.
- An aluminum disc was spin coated with a protective coating at 5,000 rpm for 5s, then cured at IJ/cm 2 using a Fusion D lamp. Thereafter, the protected aluminum disc was spin coated with an adhesive layer at 5,000 rpm for 10s. Very thin layers of the adhesive can be achieved (about 15 ⁇ m thick) when a spin speed of 5,000 rpm is employed.
- a polycarbonate disc was placed on the adhesive-coated aluminum disc, and the two substrate discs were pressed together, avoiding the inclusion of any air bubbles. The adhesive between the discs was cured at IJ/cm using a Fusion D lamp (300W/inch) .
- Example 2 Formulations for Examples 2 and 3 were made and tested according to the methodology for Example 1.
- the compositions and test results of Example 2 and Example 3 are listed in Table 3.
- the epoxylated bisphenol A polyurethane acrylate is characterized by Mn 1, 000 and Tg 24°C. Table 3
- Example 2 disc failure occurred at a shear strength of 25 lbs., measured @ 25°C, and 30 lbs., measured @ 25°C after environmental stress exposure (85° C/85% RH, 72 hrs) .
- Examples 4-7 The compounds as shown in table 4 and 5 forming the radiation curable adhesive composition are mixed together and coated on one surface of each of two polycarbonate substrates forming the DVD, as in the previous examples .
- inventive formulations used as adhesives for bonded DVD discs, in particular, the urethane acrylate formulations, withstand an environment of at least 80 °C and 85% relative humidity, preferably at least 85°C and 95% relative humidity.
- Acrylated acrylics tend to delaminate under extreme temperature and high humidity conditions, and thus urethane acrylate formulations are better suited for these circumstances.
- Viscosity of the formulations is preferably in a range from about 100 mPas to about 1,000 mPas at 25°C. Bond strength and drop test results (after 6 days curing) are satisfactory, as is visual inspection.
- bond strength is from about 10 lbs to about 100 lbs.
- Coat speeds and coat time indicate the properties of the adhesive compositions during spin coating .
- the adhesives of the invention are not tacky to touch after curing.
- Figure 1 relates adhesive thickness, plotted on the ordinate, with spin speeds, plotted on the abscissa.
- a desired adhesive thickness can be obtained by selecting the appropriate spin speed, spin time and acceleration.
- Figure 2 relates the degree of cure (% unreacted acrylate unsaturation) , measured by FITR, with the amount of UV energy to which the adhesive is exposed.
- the data show that the adhesive composition undergoes exceptionally high conversion of liquid to solid at a relatively low level of UV energy.
- Figure 3 shows the thermal stability of the cured adhesive composition, measured by TGA.
- the high conversion of the composition during curing generates a thermally stable DVD bonding adhesive.
- the data also indicate that the composition undergoes extremely low weight loss (about 2%) at a test temperature of 100°C.
- test results were obtained using the following test methods .
- the viscosity was measured using a PHYSICA MC10 Viscometer. The test samples were examined and if an excessive amount of bubbles was present, steps were taken to remove most of the bubbles. Not all bubbles need to be removed at this stage, because the act of sample loading introduces some bubbles.
- the instrument was set up for the conventional Z3 system, which was used.
- the samples were loaded into a disposable aluminum cup by using the syringe to measure out 17 cc .
- Samples in the cup were examined for excessive amounts of bubbles, which if noted, were removed by a direct means such as centrifugation. Alternatively, enough time was allowed to elapse so as to let the bubbles escape from the bulk of the liquid. Bubbles at the top surface of the liquid were acceptable.
- the bob was gently lowered into the liquid in the measuring cup, and the cup and bob were installed in the instrument.
- the sample temperature was allowed to equilibrate with the temperature of the circulating liquid by waiting five minutes. Then, the rotational speed was set to a desired value which produced the desired shear rate.
- the desired value of the shear rate is easily determined by one of ordinary skill in the art from an expected viscosity range of the sample.
- the instrument panel read out a viscosity value, and if the viscosity value varied only slightly (less than 2% relative variation) for 15 seconds, the measurement was complete. If the reading varied, the temperature may not have reached an equilibrium value, or the material may have changed due to shearing. In the latter case, further testing at different shear rates was be needed to define the sample's viscous properties. The results reported are the average viscosity values of three test samples.
- the bond strength of bonded digital versatile discs bonded with a cured adhesive was measured via a drop testing method.
- the cured, bonded discs were dropped a vertical distance of 3 feet to a concrete surface, such that the outer edges of the bonded discs impacted the concrete .
- the impact resistance of cured sample adhesive compositions was qualitatively rated as noted hereinbelow.
- Shear Strength The shear strength of the bonded discs were tested using a universal testing instrument INSTRONTM model 4201, equipped with a personal computer. Discs bonded with the adhesive compositions of the invention were subjected to opposing shearing forces. The force causing failure of the bonded discs was measured, and was denoted the shear strength of the bond. Adhesive failure caused the adhesive to delaminate, whereas disc failure occurred when the applied force caused the discs to break.
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- Polymers & Plastics (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
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Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP99912156A EP1082398A1 (en) | 1998-03-27 | 1999-03-24 | Radiation curable adhesive for digital versatile disc |
KR1020007010715A KR20010042211A (en) | 1998-03-27 | 1999-03-24 | Radiation curable adhesive for digital versatile disc |
JP2000541258A JP2002509977A (en) | 1998-03-27 | 1999-03-24 | Radiation-curable adhesive for digital versatile discs |
US09/379,781 US6472451B2 (en) | 1998-03-27 | 1999-08-24 | Radiation curable adhesive for digital versatile disc |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US4898198A | 1998-03-27 | 1998-03-27 | |
US4898098A | 1998-03-27 | 1998-03-27 | |
US09/048,980 | 1998-03-27 | ||
US09/048,981 | 1998-03-27 |
Publications (1)
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WO1999050368A1 true WO1999050368A1 (en) | 1999-10-07 |
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ID=26726746
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/NL1999/000168 WO1999050368A1 (en) | 1998-03-27 | 1999-03-24 | Radiation curable adhesive for digital versatile disc |
Country Status (6)
Country | Link |
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EP (1) | EP1082398A1 (en) |
JP (1) | JP2002509977A (en) |
KR (1) | KR20010042211A (en) |
CN (1) | CN1303422A (en) |
TW (1) | TW530187B (en) |
WO (1) | WO1999050368A1 (en) |
Cited By (6)
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WO2000020517A2 (en) * | 1999-01-19 | 2000-04-13 | Dsm N.V. | Radiation-curable compositions comprising maleimide compounds and method for producing a substrate with a cured layer |
WO2002039442A2 (en) * | 2000-11-13 | 2002-05-16 | Dsm N.V. | Radiation-curable compositions for optical media |
JP2003277696A (en) * | 2002-03-27 | 2003-10-02 | Jsr Corp | Radiation curable resin composition for adhesive |
WO2013152251A1 (en) * | 2012-04-05 | 2013-10-10 | 3M Innovative Properties Company | Radiation-cured adhesive composition and laminate using the same |
EP3927755A1 (en) * | 2019-02-20 | 2021-12-29 | Adhesives Research, Inc. | Uv light curable adhesive and device with uv light curable adhesive |
US11254841B2 (en) | 2015-12-29 | 2022-02-22 | 3M Innovative Properties Company | Additive manufacturing methods for adhesives and adhesive articles |
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JP4932300B2 (en) * | 2006-03-28 | 2012-05-16 | 電気化学工業株式会社 | Temporary fixing composition and member temporary fixing method using the same |
TWI522742B (en) * | 2011-07-04 | 2016-02-21 | Photocurable resin composition and use thereof | |
CN103305178B (en) * | 2012-03-06 | 2014-11-26 | 上海佑威新材料科技有限公司 | Low-modulus optical adhesive composition |
JP6343909B2 (en) * | 2013-05-22 | 2018-06-20 | 東洋インキScホールディングス株式会社 | Resin composition, active energy ray-polymerizable adhesive, and laminate |
JP6291773B2 (en) * | 2013-10-03 | 2018-03-14 | 東洋インキScホールディングス株式会社 | Resin composition, active energy ray-polymerizable adhesive, and laminate |
KR101771774B1 (en) * | 2014-03-21 | 2017-08-28 | 주식회사 엘지화학 | Light curing resin composition for adhesive film and adhesive layer |
CN108467684B (en) * | 2018-03-20 | 2020-12-25 | 北京雅士安能新材料科技有限公司 | Adhesive composition and preparation method and application thereof |
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WO1998045344A1 (en) * | 1997-04-08 | 1998-10-15 | Dsm N.V. | Radiation-curable binder compositions having high elongation and toughness after cure |
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1999
- 1999-03-24 WO PCT/NL1999/000168 patent/WO1999050368A1/en not_active Application Discontinuation
- 1999-03-24 EP EP99912156A patent/EP1082398A1/en not_active Withdrawn
- 1999-03-24 CN CN99806662A patent/CN1303422A/en active Pending
- 1999-03-24 KR KR1020007010715A patent/KR20010042211A/en not_active Application Discontinuation
- 1999-03-24 JP JP2000541258A patent/JP2002509977A/en active Pending
- 1999-03-25 TW TW088104877A patent/TW530187B/en not_active IP Right Cessation
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WO1998036325A1 (en) * | 1997-02-13 | 1998-08-20 | Dsm N.V. | Photocurable resin composition |
WO1998045344A1 (en) * | 1997-04-08 | 1998-10-15 | Dsm N.V. | Radiation-curable binder compositions having high elongation and toughness after cure |
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WO2000020517A2 (en) * | 1999-01-19 | 2000-04-13 | Dsm N.V. | Radiation-curable compositions comprising maleimide compounds and method for producing a substrate with a cured layer |
WO2000020517A3 (en) * | 1999-01-19 | 2000-08-24 | Dsm Nv | Radiation-curable compositions comprising maleimide compounds and method for producing a substrate with a cured layer |
WO2002039442A2 (en) * | 2000-11-13 | 2002-05-16 | Dsm N.V. | Radiation-curable compositions for optical media |
WO2002039442A3 (en) * | 2000-11-13 | 2002-08-08 | Dsm Nv | Radiation-curable compositions for optical media |
JP2003277696A (en) * | 2002-03-27 | 2003-10-02 | Jsr Corp | Radiation curable resin composition for adhesive |
WO2013152251A1 (en) * | 2012-04-05 | 2013-10-10 | 3M Innovative Properties Company | Radiation-cured adhesive composition and laminate using the same |
US11254841B2 (en) | 2015-12-29 | 2022-02-22 | 3M Innovative Properties Company | Additive manufacturing methods for adhesives and adhesive articles |
US11279853B2 (en) | 2015-12-29 | 2022-03-22 | 3M Innovative Properties Company | Additive manufacturing methods for adhesives and adhesive articles |
EP3927755A1 (en) * | 2019-02-20 | 2021-12-29 | Adhesives Research, Inc. | Uv light curable adhesive and device with uv light curable adhesive |
US11608452B2 (en) | 2019-02-20 | 2023-03-21 | Adhesives Research, Inc. | UV light curable adhesive and device with UV light curable adhesive |
Also Published As
Publication number | Publication date |
---|---|
CN1303422A (en) | 2001-07-11 |
EP1082398A1 (en) | 2001-03-14 |
TW530187B (en) | 2003-05-01 |
JP2002509977A (en) | 2002-04-02 |
KR20010042211A (en) | 2001-05-25 |
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