+

WO1998036107A1 - Dispositif et procede de placage - Google Patents

Dispositif et procede de placage Download PDF

Info

Publication number
WO1998036107A1
WO1998036107A1 PCT/US1998/002712 US9802712W WO9836107A1 WO 1998036107 A1 WO1998036107 A1 WO 1998036107A1 US 9802712 W US9802712 W US 9802712W WO 9836107 A1 WO9836107 A1 WO 9836107A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing member
electrolyte
cathode
housing
substrate
Prior art date
Application number
PCT/US1998/002712
Other languages
English (en)
Inventor
Ariel Gilbert Schrodt
Nikolai Nikolaevich Issaev
Boris Grigorievich Karbassov
Original Assignee
Dover Industrial Chrome, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dover Industrial Chrome, Inc. filed Critical Dover Industrial Chrome, Inc.
Priority to AU61598/98A priority Critical patent/AU6159898A/en
Publication of WO1998036107A1 publication Critical patent/WO1998036107A1/fr

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/003—Electroplating using gases, e.g. pressure influence
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1619—Apparatus for electroless plating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1678—Heating of the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1675—Process conditions
    • C23C18/1682—Control of atmosphere

Definitions

  • the present invention relates to a plating apparatus and process, and more particularly to a plating apparatus and process that place plating solution under a vacuum to remove any entrapped air or bubbles in it and/or that elevate the temperature in the area of the substrate where the plating takes place to establish a temperature gradient between the substrate and the solution.
  • the prior art includes a wide variety of apparatus and procedures for plating structures.
  • one known process uses radiation lithography to produce a template and then fills the template by electrodeposition.
  • Such apparatus and procedures have produced microstructures with heights of several hundred micrometers.
  • the electrodeposition and other plating processes of the prior art do not allow rapid fabrication of desired structures due to the slow movement of the plating material.
  • an apparatus for electroplating includes a housing that receives electrolyte and contains cathode means that carries a negative charge.
  • the cathode means includes a template member which shapes the electroplating material as it moves onto the cathode means.
  • Heating means heats the cathode means and generates a temperature gradient between the cathode means and the electrolyte that surrounds it.
  • Vacuum means reduces the pressure in the housing member to remove any entrapped air and any bubbles forming at or near the cathode means.
  • the method of the present invention includes placing cathode means with the template member into the housing member, placing the inside of the housing member under a vacuum and allowing electrolyte to flow into the member. It also includes charging the cathode means and heating it to a temperature that is greater than the average temperature of the electrolyte in the housing. This temperature differential creates thermal gradients that increase the movement of the electroplating material to the cathode means and the vacuum removes any bubbles or entrapped air in the electrolyte that may impede that movement.
  • the apparatus and method of the present invention may use an electroless solution to plate a substrate or a device.
  • FIG. 1 is a sectional view of the apparatus of the present invention
  • FIG. 2 is a partial and exploded perspective view of the cathode assembly used in the apparatus.
  • FIG. 3 is a sectional view of the cathode assembly.
  • FIG. 1 shows the apparatus of the present i vention generally at 10.
  • the apparatus includes a housing member or tank 11 and an auxiliary tank 12 that supplies the tank 11 with electrolyte.
  • the tank 11 defines an electrolyte inlet 13 controlled by a valve 14, electrolyte outlets 15 and 16 controlled by valve 17 , an opening 18 through which a vacuum pump 19 places the inside of the tank 11 under a vacuum, and an opening 20 through which the inside of the tank 11 vents to the atmosphere.
  • Valves 18a and 20a control the openings 18 and 20, respectively.
  • the tank 11 contains partitions 21 and 22 that separate the inside 23 of the tank 11 into three portions 23a, b and c. (These two partitions are electrical conductors, and they serve as barriers for the electrolyte moving within the tank 11.)
  • the tank 11 also contains anodes 24 and 25, a level detector 26 and an assembly 27 that includes one or more template members 28 (See FIG. 3) that help form the electroplating material.
  • the auxiliary tank 12 contains "dummy" anodes 29 and “dummy” cathodes 30. It receives electrolyte from the tank 11 through pipes 31, 32, 33, 34 and 35. It discharges electrolyte through a filter assembly 36 and through a pipe 37 after the electrolyte flows through filter screens 12a and 12b.
  • the vacuum created by the pump 19 in the inside of the housing 11 induces flow through the pipe 37 and the inlet 13. As stated above, the valve 14 controls this flow.
  • the assembly 27 includes a column segment 38 (See FIG. 1) and a main body segment 39 that the column segment 38 suspends from a lid portion 11a of the tank 11.
  • the main body segment 39 includes two sets of the same components on opposite sides of a centerline 40.
  • the apparatus 10 may include an assembly with only one set of components or one with more than two sets. (The following text uses the same reference number for corresponding components of each set.)
  • the components of one set of the main body segment 39 include a flat wire heater 41 comprising a wire heating element embedded in a thin plate of plastic.
  • a flat wire heater 41 comprising a wire heating element embedded in a thin plate of plastic.
  • This heater 41 heats the area that surrounds it and establishes a temperature gradient with the surrounding electrolyte.
  • a non-conductive wafer 42 (made out of silicon or any other suitable material) lies next to the heater 41, in face-to-face relation with it. It supports a first layer of metal 42a (e.g. , copper) on a face, opposite the face that contacts the heater 41.
  • This layer 42a is a mass of vacuum deposited metal particles that secures a second vacuum deposited metal layer 42b (e.g. , titanium) to the wafer 42.
  • the first metal layer 42b on the wafer 42 serves as the primary cathode after removal of the second layer in the patterned area for the first set of components of the segment 39.
  • a ring contact 43 made out of an electrically conductive metal (e.g, gold) or any other suitable material and electrical wiring (not shown) connect the layer 42b to a DC power source P.
  • the template member 28 for this set of components lies secured, in face-to-face relation with the layer 42b within the ring 43.
  • the template member 28 is a plate of polymethyl- methacrylate material (PMMA) with a pattern formed through it using x-ray lithography or any other suitable procedure, e.g. micro injection molding. (A monomer for of the PMMA adheres the member 28 to the layer 42b.)
  • PMMA polymethyl- methacrylate material
  • the pattern extends from an exposed face 28a to the face that contacts the layer 42b. It includes one or more openings that receive the deposits from the electrolyte and help form the object or device produced by the apparatus.
  • the first set of components also includes a secondary cathode that comprises an electrically conductive screen 44 made out of stainless steel or any other suitable material, a ring contact 45 made out of an electrically conductive metal (e.g. , gold, gold plated copper, etc.), wiring, controls and a DC power source (wiring, controls and power source not shown) .
  • An insulator spacer ring 46 made out of rubber or any other suitable material insulates the primary from the secondary cathode assemblies.
  • the controls can vary the current in the screen 44 and maintain it at a level substantially lower than the current in the primary cathode 42b.
  • the screen 44 receives some of the electrolyte particles as they move towards the primary cathode. This feature assures that the deposition of particles in the openings of the template member is uniform and organized.
  • the first set of components also includes a thermocouple 47 disposed between the spacer ring 46 and the layer 42b proximate the template member 28.
  • This thermocouple 47 takes temperature readings at that location to determine if the temperature has risen to approximately the boiling point of the electrolyte, or above that level. (At the boiling point of the electrolyte bubbles begin to form, and they obstruct the deposition.) This feature allows the controls to monitor the temperature level and thus minimize the formation of bubbles.
  • the vacuum under which the apparatus 10 operates removes any inadvertent formation of bubbles.
  • a securing plate 48 made out of plastic or any other suitable material cooperates with bolts 49 and serves as a clamp to secure the two sets of components against another, similar plate 50.
  • the bolts also secure the assembly 27 to the column 38.
  • These plates 48 and 50 have openings 48a and 50a, respectively, through which the electrolyte flows to the template members 28.
  • an assembly 27 includes a 10 square centimeter heater 41 with a thickness of 1/2 millimeters.
  • the wafer 42 is a round disc with a diameter of 10 centimeters and a thickness of 1/2 millimeters. It supports a vacuum deposited copper layer 42a of approximately 1,000 Angstroms and a vacuum deposited titanium layer 42b of approximately 100 Angstroms.
  • the template is a disc with a diameter of approximately 5 centimeters.
  • the contacts 43 and 45 are gold wire rings with a 1 millimeter thickness and an outside diameter of approximately 10 centimeters.
  • the spacer ring 46 is a rubber ring with an outside diameter of approximately 10 centimeters and a thickness of approximately 3 millimeters.
  • the screen 44 is made of stainless steel wire that defines a mesh with, for example, 1 millimeter square openings.
  • nickel anodes a nickel sulfamate electrolyte and a current density of 30-150 amperes/ft 2 in the cathode 42b and maintaining a cathode temperature of 55-60° Centigrade and an electrolyte temperature of 22-25° Centigrade, the apparatus 10 in this example achieved deposition rates of 50-125 microns/hour.
  • the valve 18a opens while the other valves remain closed and the vacuum pump 19 places the inside of the housing 11 under a vacuum.
  • Valve 14 then opens, and the vacuum induces flow of electrolyte from the auxiliary tank 12 to the tank 11.
  • the electrolyte flows to the central cathodic compartment 23b and overflows over the partitions 21 and 22 into the anodic compartments 23a and 23c until the level of the electrolyte reaches the level detector 26.
  • the valve 14 then closes, and the electrolyte plates the cathode, filling the openings in the templates 28.
  • Controls (not shown) allow separate control of each of the primary and secondary cathodes, screens and heaters.
  • the valve 20a opens and allows the inside of the housing 11 to vent to atmosphere, and then valve 17 opens so that electrolyte from in the side compartments 23a and c discharges into the auxiliary tank 12. All the valves then close and the foregoing steps repeat until a complete device or object forms in each of the templates 28.
  • the apparatus and method described above may use an electroless solution to produce a plating layer on a device or a substrate.
  • Electroless plating requires the use of passive surfaces on the containment means for the electroless solution and the activation of the substrate surface, usually with tin or with palladium, to facilitate the onset of plating.
  • Electroless plating typically involves elevating the temperature of the solution to a predetermined optimum degree.
  • the independent heating of the substrate to a higher level than the predetermined optimum degree will generate a temperature gradient between the substrate and the surrounding solution to facilitate plating.
  • the application of a vacuum in the electroless process further facilitates plating.
  • electroless procedures involve entrapped air, bubbles released as a result of the chemical reactions during the plating process, bubbles generated by heating, and/or bubbles formed by agitation.
  • Application of a vacuum facilitates release and removal of the entrapped air and gas bubbles from the reactive surfaces. This vacuum would enable the electroless solution to enter high aspect ratio channels or pockets in the substrate.
  • the electroless process may plate an unobstructed substrate surface, or it may plate a substrate surface with the guidance of a patterned template.
  • the apparatus illustrated in the drawings with the following modifications may perform the electroless plating process according to the present invention.
  • the modifications include removal of the anodes 24 and 25 and the membranes 21 and 22. They would also include removing the anodes and cathodes from the conditioning tank, as well as the filter screens 12a and 12b. Finally, the modifications would include the elimination of the wire mesh screens 44 from the wafer holder/heater assembly. While the above description and the drawings disclose and illustrate one embodiment, one should understand, of course, that the invention is not limited to this embodiment. Those skilled in the art to which the invention pertains may make other modifications and other embodiments employing the principles of this invention, particularly upon considering the foregoing teachings. For example, one heater 41 may provide the heat for the two sets of components in the assembly 27. Therefore, by the appended claims, the applicant intends to cover any modifications and other embodiments as incorporate those features which constitute the essential features of this invention.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

La présente invention concerne un dispositif et un procédé de placage. Le dispositif (10) comporte notamment un logement (11) qui reçoit une solution de placage, une cathode étant disposée dans le logement. Un ensemble chauffant réchauffe la cathode et établit un gradient de température entre la cathode et l'électrolyte. Un ensemble à vide (19) met sous vide l'électrolyte contenu dans le logement de façon à faciliter l'entrée par écoulement de l'électrolyte dans le logement et de chasser les éventuelles bulles et l'air piégé dans l'électrolyte. Selon une autre réalisation, le dispositif et le procédé permet l'utilisation d'une solution autocatalytique pour plaquer un substrat ou un dispositif.
PCT/US1998/002712 1997-02-14 1998-02-13 Dispositif et procede de placage WO1998036107A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU61598/98A AU6159898A (en) 1997-02-14 1998-02-13 Plating apparatus and method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US80170397A 1997-02-14 1997-02-14
US08/801,703 1997-02-14

Publications (1)

Publication Number Publication Date
WO1998036107A1 true WO1998036107A1 (fr) 1998-08-20

Family

ID=25181842

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US1998/002712 WO1998036107A1 (fr) 1997-02-14 1998-02-13 Dispositif et procede de placage

Country Status (2)

Country Link
AU (1) AU6159898A (fr)
WO (1) WO1998036107A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6746590B2 (en) 2001-09-05 2004-06-08 3M Innovative Properties Company Ultrasonically-enhanced electroplating apparatus and methods
EP3647469A1 (fr) * 2018-10-31 2020-05-06 Unison Industries LLC Système et procédé d'électroformage
US11898260B2 (en) 2021-08-23 2024-02-13 Unison Industries, Llc Electroforming system and method

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767537A (en) * 1971-11-08 1973-10-23 Gould Inc Method and apparatus for continuous production of nickel foil
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4193846A (en) * 1977-08-03 1980-03-18 Establissment Halgar Manufacturing process of a thin metal sheet by electrolytic deposit
US4759822A (en) * 1984-10-12 1988-07-26 Triquint Semiconductor Inc. Methods for producing an aperture in a surface
US5162078A (en) * 1989-11-09 1992-11-10 Kernforschungszentrum Karlsruhe Gmbh Method of producing microstructered metallic bodies
US5279725A (en) * 1992-03-18 1994-01-18 The Boeing Company Apparatus and method for electroplating a workpiece
US5368634A (en) * 1993-07-26 1994-11-29 Hughes Aircraft Company Removing bubbles from small cavities
US5529681A (en) * 1993-03-30 1996-06-25 Microparts Gesellschaft Fur Mikrostrukturtechnik Mbh Stepped mould inserts, high-precision stepped microstructure bodies, and methods of producing the same
US5639360A (en) * 1991-05-30 1997-06-17 Sikel N.V. Electrode for an electrolytic cell, use thereof and method using same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767537A (en) * 1971-11-08 1973-10-23 Gould Inc Method and apparatus for continuous production of nickel foil
US4193846A (en) * 1977-08-03 1980-03-18 Establissment Halgar Manufacturing process of a thin metal sheet by electrolytic deposit
US4169018A (en) * 1978-01-16 1979-09-25 Gould Inc. Process for electroforming copper foil
US4759822A (en) * 1984-10-12 1988-07-26 Triquint Semiconductor Inc. Methods for producing an aperture in a surface
US5162078A (en) * 1989-11-09 1992-11-10 Kernforschungszentrum Karlsruhe Gmbh Method of producing microstructered metallic bodies
US5639360A (en) * 1991-05-30 1997-06-17 Sikel N.V. Electrode for an electrolytic cell, use thereof and method using same
US5279725A (en) * 1992-03-18 1994-01-18 The Boeing Company Apparatus and method for electroplating a workpiece
US5529681A (en) * 1993-03-30 1996-06-25 Microparts Gesellschaft Fur Mikrostrukturtechnik Mbh Stepped mould inserts, high-precision stepped microstructure bodies, and methods of producing the same
US5368634A (en) * 1993-07-26 1994-11-29 Hughes Aircraft Company Removing bubbles from small cavities

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ISAEV N., OSTERYOUNG J. G.: "THERMOCONVECTION-ENHANCED DEPOSTION OF COPPER.", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, ELECTROCHEMICAL SOCIETY, vol. 142., no. 12., 1 December 1995 (1995-12-01), pages 4103 - 4107., XP002911804, ISSN: 0013-4651 *
ROUSSELOT R. H.: "CURRENT-DISTRIBUTION IMPROVING AIDS.", METAL FINISHING., ELSEVIER, NEW YORK, NY., US, 1 March 1961 (1961-03-01), US, pages 57 - 63., XP002911803, ISSN: 0026-0576 *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6746590B2 (en) 2001-09-05 2004-06-08 3M Innovative Properties Company Ultrasonically-enhanced electroplating apparatus and methods
EP3647469A1 (fr) * 2018-10-31 2020-05-06 Unison Industries LLC Système et procédé d'électroformage
CN111118552A (zh) * 2018-10-31 2020-05-08 和谐工业有限责任公司 电铸系统和方法
US11174564B2 (en) 2018-10-31 2021-11-16 Unison Industries, Llc Electroforming system and method
US11898260B2 (en) 2021-08-23 2024-02-13 Unison Industries, Llc Electroforming system and method

Also Published As

Publication number Publication date
AU6159898A (en) 1998-09-08

Similar Documents

Publication Publication Date Title
US7857958B2 (en) Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces
EP0234212B1 (fr) Cellule pour électro placage
US7390382B2 (en) Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods
JP4219562B2 (ja) ワークピースを電気化学的に処理するためのシステム
US7160421B2 (en) Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US6916412B2 (en) Adaptable electrochemical processing chamber
US5514258A (en) Substrate plating device having laminar flow
JP3308333B2 (ja) 電解メッキ装置，及び電解メッキ処理方法
CN101275267B (zh) 改良厚度均匀性的电镀装置与电镀方法
US7090751B2 (en) Apparatus and methods for electrochemical processing of microelectronic workpieces
US20030038035A1 (en) Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US5228967A (en) Apparatus and method for electroplating wafers
CN111094636B (zh) 用于在电镀期间控制横流和冲击电解液的输送的方法和装置
Baldhoff et al. Through-mask electrochemical micromachining
WO2005076977A2 (fr) Procede et appareil d'electrodeposition
US5273642A (en) Apparatus and method for electroplating wafers
US20070261964A1 (en) Reactors, systems, and methods for electroplating microfeature workpieces
WO1998036107A1 (fr) Dispositif et procede de placage
CN115142104B (zh) 电镀装置、多通道电镀装置组和电镀反应系统
JP2019056174A (ja) 化学および電解の少なくとも一方の表面処理のための分布システム
KR101133085B1 (ko) 하나 이상의 기판상에 금속층들을 형성하기 위한 공정 반응기의 조립용 키트 및 이를 이용한 방법
TW200402163A (en) Device and method for increasing mass transport at liquid-solid diffusion boundary layer
US7608174B1 (en) Apparatus and method for electroforming high aspect ratio micro-parts
US6949172B1 (en) Arrangement enabling a liquid to flow evenly around a surface of a sample and use of said arrangement
EP3647469A1 (fr) Système et procédé d'électroformage

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AL AM AT AU AZ BA BB BG BR BY CA CH CN CU CZ DE DK EE ES FI GB GE GH GM GW HU ID IL IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT UA UG US UZ VN YU ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN ML MR NE SN TD TG

DFPE Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101)
121 Ep: the epo has been informed by wipo that ep was designated in this application
WWE Wipo information: entry into national phase

Ref document number: 09355571

Country of ref document: US

REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

NENP Non-entry into the national phase

Ref country code: JP

Ref document number: 1998535895

Format of ref document f/p: F

122 Ep: pct application non-entry in european phase
点击 这是indexloc提供的php浏览器服务，不要输入任何密码和下载