WO1998029467A1 - Waterborne curing agent composition, comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures - Google Patents
Waterborne curing agent composition, comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures Download PDFInfo
- Publication number
- WO1998029467A1 WO1998029467A1 PCT/EP1997/007343 EP9707343W WO9829467A1 WO 1998029467 A1 WO1998029467 A1 WO 1998029467A1 EP 9707343 W EP9707343 W EP 9707343W WO 9829467 A1 WO9829467 A1 WO 9829467A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- curing agent
- group
- compound
- surfactant
- water borne
- Prior art date
Links
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 223
- 239000000203 mixture Substances 0.000 title claims abstract description 198
- 239000004094 surface-active agent Substances 0.000 title claims abstract description 157
- 229920000647 polyepoxide Polymers 0.000 title claims description 100
- 239000003822 epoxy resin Substances 0.000 title claims description 64
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 125
- 150000001875 compounds Chemical class 0.000 claims abstract description 108
- 229920000768 polyamine Polymers 0.000 claims abstract description 77
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 56
- 150000002989 phenols Chemical class 0.000 claims abstract description 56
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 51
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 29
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 25
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 18
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 claims abstract description 10
- 239000007790 solid phase Substances 0.000 claims abstract description 9
- 239000012071 phase Substances 0.000 claims abstract description 8
- -1 phenolic acid compound Chemical class 0.000 claims description 108
- 238000006243 chemical reaction Methods 0.000 claims description 69
- 239000004593 Epoxy Substances 0.000 claims description 43
- 239000007787 solid Substances 0.000 claims description 40
- 125000003118 aryl group Chemical group 0.000 claims description 36
- 125000000217 alkyl group Chemical group 0.000 claims description 24
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 23
- 150000003077 polyols Chemical group 0.000 claims description 23
- 125000003107 substituted aryl group Chemical group 0.000 claims description 22
- 150000002118 epoxides Chemical group 0.000 claims description 20
- 229920005862 polyol Polymers 0.000 claims description 19
- 239000001257 hydrogen Substances 0.000 claims description 18
- 229910052739 hydrogen Inorganic materials 0.000 claims description 18
- 150000003141 primary amines Chemical group 0.000 claims description 18
- 125000001931 aliphatic group Chemical group 0.000 claims description 17
- 150000003335 secondary amines Chemical class 0.000 claims description 16
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 14
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 13
- 229910052757 nitrogen Inorganic materials 0.000 claims description 13
- 150000007965 phenolic acids Chemical class 0.000 claims description 13
- 150000001721 carbon Chemical group 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 10
- 239000004615 ingredient Substances 0.000 claims description 9
- 239000003999 initiator Substances 0.000 claims description 9
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 9
- 125000000466 oxiranyl group Chemical group 0.000 claims description 9
- 125000002843 carboxylic acid group Chemical group 0.000 claims description 8
- 125000005842 heteroatom Chemical group 0.000 claims description 8
- 229920003986 novolac Polymers 0.000 claims description 8
- 229960001124 trientine Drugs 0.000 claims description 8
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 claims description 6
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical group OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 claims description 6
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 5
- WNISWKAEAPQCJQ-UHFFFAOYSA-N 2-[(2-nonylphenoxy)methyl]oxirane Chemical compound CCCCCCCCCC1=CC=CC=C1OCC1OC1 WNISWKAEAPQCJQ-UHFFFAOYSA-N 0.000 claims description 5
- CUFXMPWHOWYNSO-UHFFFAOYSA-N 2-[(4-methylphenoxy)methyl]oxirane Chemical compound C1=CC(C)=CC=C1OCC1OC1 CUFXMPWHOWYNSO-UHFFFAOYSA-N 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 5
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 5
- 150000008064 anhydrides Chemical class 0.000 claims description 5
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 229910052760 oxygen Inorganic materials 0.000 claims description 5
- 239000001301 oxygen Substances 0.000 claims description 5
- SFJRUJUEMVAZLM-UHFFFAOYSA-N 2-[(2-methylpropan-2-yl)oxymethyl]oxirane Chemical compound CC(C)(C)OCC1CO1 SFJRUJUEMVAZLM-UHFFFAOYSA-N 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 125000003368 amide group Chemical group 0.000 claims description 4
- 150000002431 hydrogen Chemical group 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 125000005702 oxyalkylene group Chemical group 0.000 claims description 4
- 125000003003 spiro group Chemical group 0.000 claims description 4
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 2
- 125000004185 ester group Chemical group 0.000 claims description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 2
- 239000012948 isocyanate Substances 0.000 claims 1
- 125000004430 oxygen atom Chemical group O* 0.000 claims 1
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 127
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 35
- 239000002253 acid Substances 0.000 description 24
- 239000003054 catalyst Substances 0.000 description 18
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 238000000034 method Methods 0.000 description 16
- 125000002947 alkylene group Chemical group 0.000 description 15
- 150000001412 amines Chemical class 0.000 description 15
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 14
- 239000000047 product Substances 0.000 description 14
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 12
- 239000000126 substance Substances 0.000 description 12
- 230000008569 process Effects 0.000 description 11
- 238000000576 coating method Methods 0.000 description 10
- 229920005989 resin Polymers 0.000 description 10
- 239000011347 resin Substances 0.000 description 10
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 9
- 239000006185 dispersion Substances 0.000 description 9
- 125000003700 epoxy group Chemical group 0.000 description 9
- 235000013824 polyphenols Nutrition 0.000 description 9
- 239000000843 powder Substances 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 8
- 229930195733 hydrocarbon Natural products 0.000 description 8
- 238000011065 in-situ storage Methods 0.000 description 8
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 8
- 239000008096 xylene Substances 0.000 description 8
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical group CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 7
- 239000003607 modifier Substances 0.000 description 7
- 239000011541 reaction mixture Substances 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 239000012855 volatile organic compound Substances 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 6
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000000839 emulsion Substances 0.000 description 6
- 125000000524 functional group Chemical group 0.000 description 6
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 6
- 150000002430 hydrocarbons Chemical class 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 239000000376 reactant Substances 0.000 description 6
- 125000001424 substituent group Chemical group 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 5
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 5
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 5
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 5
- 150000007513 acids Chemical class 0.000 description 5
- 150000001298 alcohols Chemical class 0.000 description 5
- 150000001735 carboxylic acids Chemical class 0.000 description 5
- 150000004985 diamines Chemical class 0.000 description 5
- 238000009826 distribution Methods 0.000 description 5
- 150000002170 ethers Chemical group 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Chemical class 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000004014 plasticizer Substances 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 4
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 4
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000004721 Polyphenylene oxide Substances 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 4
- 125000002723 alicyclic group Chemical group 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 229940106691 bisphenol a Drugs 0.000 description 4
- 238000004581 coalescence Methods 0.000 description 4
- 239000000539 dimer Substances 0.000 description 4
- 239000000945 filler Substances 0.000 description 4
- 230000009477 glass transition Effects 0.000 description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 4
- 125000006353 oxyethylene group Chemical group 0.000 description 4
- 229920000570 polyether Polymers 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 230000009257 reactivity Effects 0.000 description 4
- YXALYBMHAYZKAP-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 7-oxabicyclo[4.1.0]heptane-4-carboxylate Chemical compound C1CC2OC2CC1C(=O)OCC1CC2OC2CC1 YXALYBMHAYZKAP-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 3
- KIDHWZJUCRJVML-UHFFFAOYSA-N Putrescine Natural products NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000013019 agitation Methods 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 229920001400 block copolymer Polymers 0.000 description 3
- 239000003153 chemical reaction reagent Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000007859 condensation product Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000009408 flooring Methods 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 239000004005 microsphere Substances 0.000 description 3
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 3
- 238000005191 phase separation Methods 0.000 description 3
- 239000000049 pigment Substances 0.000 description 3
- 230000009974 thixotropic effect Effects 0.000 description 3
- STMDPCBYJCIZOD-UHFFFAOYSA-N 2-(2,4-dinitroanilino)-4-methylpentanoic acid Chemical compound CC(C)CC(C(O)=O)NC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O STMDPCBYJCIZOD-UHFFFAOYSA-N 0.000 description 2
- KFUSXMDYOPXKKT-UHFFFAOYSA-N 2-[(2-methylphenoxy)methyl]oxirane Chemical compound CC1=CC=CC=C1OCC1OC1 KFUSXMDYOPXKKT-UHFFFAOYSA-N 0.000 description 2
- YIWUKEYIRIRTPP-UHFFFAOYSA-N 2-ethylhexan-1-ol Chemical compound CCCCC(CC)CO YIWUKEYIRIRTPP-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical group C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 2
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 2
- 238000008947 Amm Methods 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- KFSLWBXXFJQRDL-UHFFFAOYSA-N Peracetic acid Chemical compound CC(=O)OO KFSLWBXXFJQRDL-UHFFFAOYSA-N 0.000 description 2
- AWMVMTVKBNGEAK-UHFFFAOYSA-N Styrene oxide Chemical compound C1OC1C1=CC=CC=C1 AWMVMTVKBNGEAK-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000005864 Sulphur Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 125000003158 alcohol group Chemical group 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000003545 alkoxy group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- 150000001491 aromatic compounds Chemical class 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical compound NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000008199 coating composition Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- DMEGYFMYUHOHGS-UHFFFAOYSA-N cycloheptane Chemical group C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical compound CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- LQZZUXJYWNFBMV-UHFFFAOYSA-N dodecan-1-ol Chemical compound CCCCCCCCCCCCO LQZZUXJYWNFBMV-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000007590 electrostatic spraying Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 229940093476 ethylene glycol Drugs 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 150000004665 fatty acids Chemical class 0.000 description 2
- 238000009730 filament winding Methods 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- VKOBVWXKNCXXDE-UHFFFAOYSA-N icosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCC(O)=O VKOBVWXKNCXXDE-UHFFFAOYSA-N 0.000 description 2
- 150000003949 imides Chemical class 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011968 lewis acid catalyst Substances 0.000 description 2
- 238000013035 low temperature curing Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 150000007522 mineralic acids Chemical class 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- ZWRUINPWMLAQRD-UHFFFAOYSA-N nonan-1-ol Chemical compound CCCCCCCCCO ZWRUINPWMLAQRD-UHFFFAOYSA-N 0.000 description 2
- 239000007764 o/w emulsion Substances 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- QQWAKSKPSOFJFF-UHFFFAOYSA-N oxiran-2-ylmethyl 2,2-dimethyloctanoate Chemical compound CCCCCCC(C)(C)C(=O)OCC1CO1 QQWAKSKPSOFJFF-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001451 polypropylene glycol Polymers 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 230000008439 repair process Effects 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 238000009938 salting Methods 0.000 description 2
- 239000004576 sand Substances 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- QXJQHYBHAIHNGG-UHFFFAOYSA-N trimethylolethane Chemical compound OCC(C)(CO)CO QXJQHYBHAIHNGG-UHFFFAOYSA-N 0.000 description 2
- 229940113165 trimethylolpropane Drugs 0.000 description 2
- HVLLSGMXQDNUAL-UHFFFAOYSA-N triphenyl phosphite Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)OC1=CC=CC=C1 HVLLSGMXQDNUAL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 1
- 125000006702 (C1-C18) alkyl group Chemical group 0.000 description 1
- HCNHNBLSNVSJTJ-UHFFFAOYSA-N 1,1-Bis(4-hydroxyphenyl)ethane Chemical compound C=1C=C(O)C=CC=1C(C)C1=CC=C(O)C=C1 HCNHNBLSNVSJTJ-UHFFFAOYSA-N 0.000 description 1
- ZWVMLYRJXORSEP-UHFFFAOYSA-N 1,2,6-Hexanetriol Chemical compound OCCCCC(O)CO ZWVMLYRJXORSEP-UHFFFAOYSA-N 0.000 description 1
- 229940083957 1,2-butanediol Drugs 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical group NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
- 229940043375 1,5-pentanediol Drugs 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical group CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 1
- ZPANWZBSGMDWON-UHFFFAOYSA-N 1-[(2-hydroxynaphthalen-1-yl)methyl]naphthalen-2-ol Chemical compound C1=CC=C2C(CC3=C4C=CC=CC4=CC=C3O)=C(O)C=CC2=C1 ZPANWZBSGMDWON-UHFFFAOYSA-N 0.000 description 1
- 150000004782 1-naphthols Chemical class 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- VOZKAJLKRJDJLL-UHFFFAOYSA-N 2,4-diaminotoluene Chemical compound CC1=CC=C(N)C=C1N VOZKAJLKRJDJLL-UHFFFAOYSA-N 0.000 description 1
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical compound CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 description 1
- JWTVQZQPKHXGFM-UHFFFAOYSA-N 2,5-dimethylhexane-2,5-diamine Chemical compound CC(C)(N)CCC(C)(C)N JWTVQZQPKHXGFM-UHFFFAOYSA-N 0.000 description 1
- VRHXYAWPPOZFLR-UHFFFAOYSA-N 2,7,8-trioxatricyclo[7.2.2.23,6]pentadeca-1(11),3(15),4,6(14),9,12-hexaene Chemical compound C1=CC(O2)=CC=C1OOC1=CC=C2C=C1 VRHXYAWPPOZFLR-UHFFFAOYSA-N 0.000 description 1
- BBBUAWSVILPJLL-UHFFFAOYSA-N 2-(2-ethylhexoxymethyl)oxirane Chemical compound CCCCC(CC)COCC1CO1 BBBUAWSVILPJLL-UHFFFAOYSA-N 0.000 description 1
- BVDQHCUOVIQIEJ-UHFFFAOYSA-N 2-(hydroxymethyl)-2-methylpropane-1,3-diol;propane-1,2,3-triol Chemical compound OCC(O)CO.OCC(C)(CO)CO BVDQHCUOVIQIEJ-UHFFFAOYSA-N 0.000 description 1
- HHRACYLRBOUBKM-UHFFFAOYSA-N 2-[(4-tert-butylphenoxy)methyl]oxirane Chemical compound C1=CC(C(C)(C)C)=CC=C1OCC1OC1 HHRACYLRBOUBKM-UHFFFAOYSA-N 0.000 description 1
- GFIWSSUBVYLTRF-UHFFFAOYSA-N 2-[2-(2-hydroxyethylamino)ethylamino]ethanol Chemical compound OCCNCCNCCO GFIWSSUBVYLTRF-UHFFFAOYSA-N 0.000 description 1
- AKCRQHGQIJBRMN-UHFFFAOYSA-N 2-chloroaniline Chemical group NC1=CC=CC=C1Cl AKCRQHGQIJBRMN-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- BKOOMYPCSUNDGP-UHFFFAOYSA-N 2-methylbut-2-ene Chemical group CC=C(C)C BKOOMYPCSUNDGP-UHFFFAOYSA-N 0.000 description 1
- JZUHIOJYCPIVLQ-UHFFFAOYSA-N 2-methylpentane-1,5-diamine Chemical compound NCC(C)CCCN JZUHIOJYCPIVLQ-UHFFFAOYSA-N 0.000 description 1
- 150000004786 2-naphthols Chemical class 0.000 description 1
- ZDRSNHRWLQQICP-UHFFFAOYSA-N 2-tert-butyl-4-[2-(3-tert-butyl-4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C1=C(O)C(C(C)(C)C)=CC(C(C)(C)C=2C=C(C(O)=CC=2)C(C)(C)C)=C1 ZDRSNHRWLQQICP-UHFFFAOYSA-N 0.000 description 1
- ZGZVGZCIFZBNCN-UHFFFAOYSA-N 4,4'-(2-Methylpropylidene)bisphenol Chemical compound C=1C=C(O)C=CC=1C(C(C)C)C1=CC=C(O)C=C1 ZGZVGZCIFZBNCN-UHFFFAOYSA-N 0.000 description 1
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- KSYGTCNPCHQRKM-UHFFFAOYSA-N 4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KSYGTCNPCHQRKM-UHFFFAOYSA-N 0.000 description 1
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- NAZODJSYHDYJGP-UHFFFAOYSA-N 7,18-bis[2,6-di(propan-2-yl)phenyl]-7,18-diazaheptacyclo[14.6.2.22,5.03,12.04,9.013,23.020,24]hexacosa-1(23),2,4,9,11,13,15,20(24),21,25-decaene-6,8,17,19-tetrone Chemical compound CC(C)C1=CC=CC(C(C)C)=C1N(C(=O)C=1C2=C3C4=CC=1)C(=O)C2=CC=C3C(C=C1)=C2C4=CC=C3C(=O)N(C=4C(=CC=CC=4C(C)C)C(C)C)C(=O)C1=C23 NAZODJSYHDYJGP-UHFFFAOYSA-N 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- 229910014033 C-OH Inorganic materials 0.000 description 1
- 239000005632 Capric acid (CAS 334-48-5) Substances 0.000 description 1
- 239000005635 Caprylic acid (CAS 124-07-2) Substances 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- XZMCDFZZKTWFGF-UHFFFAOYSA-N Cyanamide Chemical compound NC#N XZMCDFZZKTWFGF-UHFFFAOYSA-N 0.000 description 1
- 229910014570 C—OH Inorganic materials 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 239000004150 EU approved colour Substances 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- ZHNUHDYFZUAESO-UHFFFAOYSA-N Formamide Chemical group NC=O ZHNUHDYFZUAESO-UHFFFAOYSA-N 0.000 description 1
- IWYRWIUNAVNFPE-UHFFFAOYSA-N Glycidaldehyde Chemical compound O=CC1CO1 IWYRWIUNAVNFPE-UHFFFAOYSA-N 0.000 description 1
- 229910004039 HBF4 Inorganic materials 0.000 description 1
- 238000007065 Kolbe-Schmitt synthesis reaction Methods 0.000 description 1
- 239000005639 Lauric acid Substances 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 1
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- SLABEOONBHLKSD-UHFFFAOYSA-N O=S1(=O)C(C=C2)=CC=C2OOC2=CC=C1C=C2 Chemical compound O=S1(=O)C(C=C2)=CC=C2OOC2=CC=C1C=C2 SLABEOONBHLKSD-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical class OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 235000021355 Stearic acid Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-N acetic acid Substances CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 1
- 230000001154 acute effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 150000001334 alicyclic compounds Chemical class 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000007824 aliphatic compounds Chemical class 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001409 amidines Chemical class 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 150000003868 ammonium compounds Chemical class 0.000 description 1
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- BNIPKPQOXMHMNQ-UHFFFAOYSA-N benzene-1,3-diol;propane-1,2,3-triol Chemical compound OCC(O)CO.OC1=CC=CC(O)=C1 BNIPKPQOXMHMNQ-UHFFFAOYSA-N 0.000 description 1
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 description 1
- IDSLNGDJQFVDPQ-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-yl) hexanedioate Chemical compound C1CC2OC2CC1OC(=O)CCCCC(=O)OC1CC2OC2CC1 IDSLNGDJQFVDPQ-UHFFFAOYSA-N 0.000 description 1
- DJUWPHRCMMMSCV-UHFFFAOYSA-N bis(7-oxabicyclo[4.1.0]heptan-4-ylmethyl) hexanedioate Chemical compound C1CC2OC2CC1COC(=O)CCCCC(=O)OCC1CC2OC2CC1 DJUWPHRCMMMSCV-UHFFFAOYSA-N 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- ULEAQRIQMIQDPJ-UHFFFAOYSA-N butane-1,2-diamine Chemical compound CCC(N)CN ULEAQRIQMIQDPJ-UHFFFAOYSA-N 0.000 description 1
- BMRWNKZVCUKKSR-UHFFFAOYSA-N butane-1,2-diol Chemical compound CCC(O)CO BMRWNKZVCUKKSR-UHFFFAOYSA-N 0.000 description 1
- RGTXVXDNHPWPHH-UHFFFAOYSA-N butane-1,3-diamine Chemical compound CC(N)CCN RGTXVXDNHPWPHH-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000012668 chain scission Methods 0.000 description 1
- 238000001246 colloidal dispersion Methods 0.000 description 1
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000006184 cosolvent Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 150000001912 cyanamides Chemical class 0.000 description 1
- IBAHLNWTOIHLKE-UHFFFAOYSA-N cyano cyanate Chemical compound N#COC#N IBAHLNWTOIHLKE-UHFFFAOYSA-N 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 150000001925 cycloalkenes Chemical class 0.000 description 1
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 1
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 1
- VEIOBOXBGYWJIT-UHFFFAOYSA-N cyclohexane;methanol Chemical compound OC.OC.C1CCCCC1 VEIOBOXBGYWJIT-UHFFFAOYSA-N 0.000 description 1
- AVKNGPAMCBSNSO-UHFFFAOYSA-N cyclohexylmethanamine Chemical compound NCC1CCCCC1 AVKNGPAMCBSNSO-UHFFFAOYSA-N 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- YQLZOAVZWJBZSY-UHFFFAOYSA-N decane-1,10-diamine Chemical compound NCCCCCCCCCCN YQLZOAVZWJBZSY-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- CAMHHLOGFDZBBG-UHFFFAOYSA-N epoxidized methyl oleate Natural products CCCCCCCCC1OC1CCCCCCCC(=O)OC CAMHHLOGFDZBBG-UHFFFAOYSA-N 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- FMMOOAYVCKXGMF-MURFETPASA-N ethyl linoleate Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(=O)OCC FMMOOAYVCKXGMF-MURFETPASA-N 0.000 description 1
- 229940031016 ethyl linoleate Drugs 0.000 description 1
- GELSOTNVVKOYAW-UHFFFAOYSA-N ethyl(triphenyl)phosphanium Chemical class C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 GELSOTNVVKOYAW-UHFFFAOYSA-N 0.000 description 1
- SLAFUPJSGFVWPP-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;iodide Chemical compound [I-].C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 SLAFUPJSGFVWPP-UHFFFAOYSA-M 0.000 description 1
- UPCIBFUJJLCOQG-UHFFFAOYSA-L ethyl-[2-[2-[ethyl(dimethyl)azaniumyl]ethyl-methylamino]ethyl]-dimethylazanium;dibromide Chemical compound [Br-].[Br-].CC[N+](C)(C)CCN(C)CC[N+](C)(C)CC UPCIBFUJJLCOQG-UHFFFAOYSA-L 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-N formic acid Substances OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 125000001475 halogen functional group Chemical group 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 150000003944 halohydrins Chemical class 0.000 description 1
- SXCBDZAEHILGLM-UHFFFAOYSA-N heptane-1,7-diol Chemical compound OCCCCCCCO SXCBDZAEHILGLM-UHFFFAOYSA-N 0.000 description 1
- 125000001072 heteroaryl group Chemical group 0.000 description 1
- 125000004836 hexamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052806 inorganic carbonate Inorganic materials 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N iron oxide Inorganic materials [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 235000013980 iron oxide Nutrition 0.000 description 1
- VBMVTYDPPZVILR-UHFFFAOYSA-N iron(2+);oxygen(2-) Chemical class [O-2].[Fe+2] VBMVTYDPPZVILR-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 description 1
- 229910000464 lead oxide Inorganic materials 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- FMMOOAYVCKXGMF-UHFFFAOYSA-N linoleic acid ethyl ester Natural products CCCCCC=CCC=CCCCCCCCC(=O)OCC FMMOOAYVCKXGMF-UHFFFAOYSA-N 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Natural products C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- XPOXIRBXYPGDNE-UHFFFAOYSA-N methanediamine Chemical compound N[CH]N XPOXIRBXYPGDNE-UHFFFAOYSA-N 0.000 description 1
- HNQIVZYLYMDVSB-UHFFFAOYSA-N methanesulfonimidic acid Chemical compound CS(N)(=O)=O HNQIVZYLYMDVSB-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- HOVAGTYPODGVJG-ZFYZTMLRSA-N methyl alpha-D-glucopyranoside Chemical compound CO[C@H]1O[C@H](CO)[C@@H](O)[C@H](O)[C@H]1O HOVAGTYPODGVJG-ZFYZTMLRSA-N 0.000 description 1
- IZFGRAGOVZCUFB-HJWRWDBZSA-N methyl palmitoleate Chemical compound CCCCCC\C=C/CCCCCCCC(=O)OC IZFGRAGOVZCUFB-HJWRWDBZSA-N 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 125000001802 myricyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- WIBFFTLQMKKBLZ-SEYXRHQNSA-N n-butyl oleate Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCCCC WIBFFTLQMKKBLZ-SEYXRHQNSA-N 0.000 description 1
- SVDVKEBISAOWJT-UHFFFAOYSA-N n-methylbenzenesulfonamide Chemical compound CNS(=O)(=O)C1=CC=CC=C1 SVDVKEBISAOWJT-UHFFFAOYSA-N 0.000 description 1
- KQSABULTKYLFEV-UHFFFAOYSA-N naphthalene-1,5-diamine Chemical group C1=CC=C2C(N)=CC=CC2=C1N KQSABULTKYLFEV-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 238000006902 nitrogenation reaction Methods 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 1
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 1
- 229960002446 octanoic acid Drugs 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 229940006093 opthalmologic coloring agent diagnostic Drugs 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 125000004817 pentamethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 235000009048 phenolic acids Nutrition 0.000 description 1
- WVDDGKGOMKODPV-ZQBYOMGUSA-N phenyl(114C)methanol Chemical compound O[14CH2]C1=CC=CC=C1 WVDDGKGOMKODPV-ZQBYOMGUSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- XKJCHHZQLQNZHY-UHFFFAOYSA-N phthalimide Chemical compound C1=CC=C2C(=O)NC(=O)C2=C1 XKJCHHZQLQNZHY-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 150000004885 piperazines Chemical class 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 229920006295 polythiol Polymers 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000012744 reinforcing agent Substances 0.000 description 1
- 238000009877 rendering Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- CVHZOJJKTDOEJC-UHFFFAOYSA-N saccharin Chemical compound C1=CC=C2C(=O)NS(=O)(=O)C2=C1 CVHZOJJKTDOEJC-UHFFFAOYSA-N 0.000 description 1
- 229940081974 saccharin Drugs 0.000 description 1
- 235000019204 saccharin Nutrition 0.000 description 1
- 239000000901 saccharin and its Na,K and Ca salt Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- BHZOKUMUHVTPBX-UHFFFAOYSA-M sodium acetic acid acetate Chemical compound [Na+].CC(O)=O.CC([O-])=O BHZOKUMUHVTPBX-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 238000001694 spray drying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 239000008117 stearic acid Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- NVKTUNLPFJHLCG-UHFFFAOYSA-N strontium chromate Chemical compound [Sr+2].[O-][Cr]([O-])(=O)=O NVKTUNLPFJHLCG-UHFFFAOYSA-N 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- IIACRCGMVDHOTQ-UHFFFAOYSA-N sulfamic acid Chemical compound NS(O)(=O)=O IIACRCGMVDHOTQ-UHFFFAOYSA-N 0.000 description 1
- NVBFHJWHLNUMCV-UHFFFAOYSA-N sulfamide Chemical compound NS(N)(=O)=O NVBFHJWHLNUMCV-UHFFFAOYSA-N 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 150000003457 sulfones Chemical group 0.000 description 1
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- BJQWBACJIAKDTJ-UHFFFAOYSA-N tetrabutylphosphanium Chemical class CCCC[P+](CCCC)(CCCC)CCCC BJQWBACJIAKDTJ-UHFFFAOYSA-N 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- LMYRWZFENFIFIT-UHFFFAOYSA-N toluene-4-sulfonamide Chemical compound CC1=CC=C(S(N)(=O)=O)C=C1 LMYRWZFENFIFIT-UHFFFAOYSA-N 0.000 description 1
- 150000004998 toluenediamines Chemical group 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- 125000003258 trimethylene group Chemical group [H]C([H])([*:2])C([H])([H])C([H])([H])[*:1] 0.000 description 1
- RIOQSEWOXXDEQQ-UHFFFAOYSA-O triphenylphosphanium Chemical compound C1=CC=CC=C1[PH+](C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-O 0.000 description 1
- MBYLVOKEDDQJDY-UHFFFAOYSA-N tris(2-aminoethyl)amine Chemical compound NCCN(CCN)CCN MBYLVOKEDDQJDY-UHFFFAOYSA-N 0.000 description 1
- 238000005292 vacuum distillation Methods 0.000 description 1
- 239000007762 w/o emulsion Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
Definitions
- This invention is related to a surfactant composition and to water borne, self emulsifiable, stable curing agent compositions for epoxy resins, curable at ambient and sub-ambient temperatures in the absence of external catalysts/accelerators.
- the invention is also directed to methods of application and manufacture, as well as to the cured products made thereby.
- VOC's volatile organic compounds
- the curing agent should be readily compatible with a water borne epoxy resin in order to make a coating having good mechanical properties and weatherabiiity .
- a water borne curing agent that does not have good compatibility with the epoxy resin will not coalesce well when applied onto a substrate.
- the problem of compatibility is more acute where the curing agent primary amine groups have been converted to secondary amine groups to reduce the blooming or hazing phenomena .
- the self emulsifiable curing agent should contain little or no VOC's, that is, be dispersed in water or other non- VOC, without the need to use co-solvents to solubilize the curing agent.
- the surfactant used to disperse the curing agent should be effective to disperse large quantities of the curing agent to provide a high solids level.
- the water borne curing agent should also be stable, at least long enough to mix, store, ship and apply.
- the water borne curing agent cure water borne epoxy resins at ambient temperatures, preferably without the use of external accelerators or catalysts. This would reduce the overall cost of the system and avoid the potential for migration of catalyst from the coating.
- the curing agent should be sufficiently reactive so that accelerators are not needed for room temperature cure, but not excessively reactive that on loses the pot life needed for applying or working with the system.
- the water borne curing agent composition of the invention is a solid phase dispersed in a continuous phase, the continuous phase comprising water, the solid phase comprising a curing agent composition and a surfactant composition.
- the dispersion can be a suspension, emulsion, or a colloidal dispersion.
- the aqueous continuous phase can contain other liquids in admixture, but is preferably free of any VOC s and free of any cosolvents.
- an continuous phase that is essentially free of VOC's is meant that 5 wt% or less of the water borne curing agent composition is a VOC.
- the aqueous dispersion of the invention is also stable, meaning that there is no evidence to the naked eye that the solid and liquid phases have phase separated into discrete layers at 30 days of storage at 23 °C without agitation or disturbance.
- the water borne compositions do not exhibit phase separation even at 2 months, more preferably at 6 months of storage .
- the water borne curing agent of the invention can be made stable without the use of plasticizers or organic acids typically used to make salt the curing agent, that are usually present in water borne compositions.
- the water borne curing agent composition of the invention is self emulsifiable, meaning that the curing agent has the capacity to stably disperse in water at a solids level of at least 40 wt%, preferably 50 wt% or more, in the absence of solvents, plasticizers, or salting organic acids .
- a further attribute of the invention is that the water borne compositions of the invention cure well and are compatible with water borne epoxy resins at ambient temperatures in the absence of external cure accelerators.
- the specular gloss readings taken from samples of the water borne curing agent compositions of the invention reacted with water borne epoxy resins indicate that the curing agent compositions of the invention sufficiently cured the epoxy resin component at ambient temperature.
- the surfactant composition comprises the reaction product of an a) a phenolic compound, substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1 carbon atom, b) a polyamine compound having at least two primary amine groups, c) a reactive surfactant, and optionally d) a monoglycidyl, monocarboxylic acid or monoisocyanate capping agent.
- said surfactant composition comprises a reaction product of the components a) , b) , c) and optionally d) and in addition a polyepoxide compound e) .
- said surfactant composition comprises the reaction product of a substituted aryl amidopolyamine, a d) monoglycidyl or monocarboxylic acid capping agent, and a c) reactive surfactant, said substituted aryl amidoamine comprising the reaction product of: a) a phenolic compound substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1 carbon atom, and b) a polyamine compound having at least two primary amine groups; said reactive surfactant comprising a functional moiety reactive with secondary amines and a hydrophilic moiety of a nature and length effective to disperse the curing agent in water.
- the functional moiety in the reactive surfactant comprises an epoxide group, a carboxylic acid group or anhydrides thereof, an isocyanate group, or mixtures thereof; and the hydrophilic moiety in the reactive surfactant comprises a polyoxyalkylene monool or polyol residue.
- the reactive surfactant comprises a compound represented by one of the following formulas:
- X represents an initiator molecule residue, the initiator having a functionality of from 1 to 8;
- Y represents an oxygen or nitrogen atom;
- each of the R' s independently represent a hydrogen, an C ⁇ -C ⁇ g alkyl, aryl, or alkaryl group, provided that at least one R is a hydrogen;
- R' represents an epoxy resin residue comprising a divalent aliphatic group, a divalent cyclo- aliphatic group, a divalent aryl group, a divalent arylaliphatic group, or a divalent alkaryl group, each having from 2 to 1000 carbon atoms;
- m represents a real number from 1 to 8;
- n and p represent the number of repeating units of oxyalkylene groups effective to stably disperse the curing agent composition in water and ranging from 0 to 20;
- w represents the number of epoxy glycidyl ether units, ranging from 0 to 20.
- the surfactant composition comprises a compound represented by at least one of the following formulas :
- R ⁇ is a branched or unbranched, substituted or unsubstituted, monovalent hydrocarbyl group having at least on carbon atom;
- R2 and R4 each independently represent a branched or unbranched, substituted or unsubstituted, divalent hydrocarbyl group having 2-24 carbon atoms, or
- Rg represents a branched or unbranched, substituted or unsubstituted, divalent hydrocarbyl group having 2-24 carbon atoms;
- R3 is a branched or unbranched, substituted or unsubstituted, monovalent hydrocarbyl having 1-24 carbon atoms, an aryl group, an alkaryl group, or an aralkyl group;
- R7 is the residue of said e) polyepoxide compound;
- R5 and R9 are each independently hydrogen, or a branched or unbranched, substituted or unsubstituted, alkyl group or alkaryl group or cycloaliphatic group, or the residue of said d) reactive surfactant;
- Rg is the residue of said d) reactive surfactant;
- c represents an integer from 1-10; and
- k represents an integer from 0-10; provided that at least one R5 group is said the residue of said c) reactive surfactant.
- the surfactant composition comprises a compound represented by at least one the following formulas:
- R]__ is a branched or unbranched, substituted or unsubstituted, monovalent hydrocarbyl group having at least one carbon atom;
- R]_2 and R]_ each independently represent a branched or unbranched, substituted or unsubstituted, divalent hydrocarbyl group having 2-24 carbon atoms, or
- Rg represents a branched or unbranched, substituted or unsubstituted, divalent hydrocarbyl group having 2-24 carbon atoms
- R]_3 is a branched or unbranched, substituted or unsubstituted, monovalent hydrocarbyl having 1-24 carbon atoms, an aryl group, an alkaryl group, or an aralkyl group
- c represents an integer from 0-10
- the phenolic acid compound is reacted with the polyepoxide compound to produce a substituted aromatic glycidyl ester compound, wherein the substituted aromatic glycidyl ester compound is reacted with the polyamine compound to make a sub- situted aromatic glycidyl ester - amine adduct, followed by i) combining and reacting the d) capping agent with said substituted aromatic glycidyl ester - amine adduct to form a capped substituted aromatic glycidyl ester-amine adduct, followed by combining and reacting the c) reactive surfactant, or ii) combining and reacting the substituted aromatic glycidyl ester-amine adduct with the c) reactive surfactant .
- the curable two component systems can be cured to form coatings and in flooring, casting, crack or defect repair, moulding, adhesives, potting, filament winding, encapsulation, structural and electrical laminates, composites and the like.
- the surfactant composition is made by reacting an a) substituted aryl amidopolyamine with a d) monoglycidyl capping agent and a c) reactive surfactant.
- the substituted aryl amidopolyamine is made by reacting an ai) phenolic compound substituted with at least one carboxyl group and at least one hydrocarbyl group having at least 1, and preferably 12 or more, more preferably 14 or more carbon atoms, and an aii) an aliphatic polyamine compound having at least two primary amine groups .
- the structure of the phenolic compound is an aromatic ring to which is covalentiy bonded at least one hydroxyl group, at least one hydrocarbyl group, and at least one carboxyl group.
- the structure of the phenolic compound will contain only one hydroxyl group and one carboxyl group bonded to the aromatic ring.
- Commercially available phenolic compounds usually contain a mixture of species, such as mono and di carboxyl substituted phenolics.
- the preferable embodiment is one in which the phenolic compound contains only one of each group bonded to the aromatic ring
- this embodiment includes a phenolic which contains a mixture of species in which the predominant (>70 mole percent) species has only one carboxyl group and one hydroxyl group bonded to the aromatic ring.
- One of the substituents on the aromatic ring of the phenolic compound is the hydrocarbyl group. While the hydrocarbyl group can comprise a wide variety of structures and atoms, it must have a predominantly hydrocarbon character.
- hydrocarbyl group Included within the meaning of a hydrocarbyl group are the alkyl or alkenyl groups, the aliphatic substituted aromatic or alicyclics, or the aromatic or alicyclic substituted alkyls or alkenyls. Each of these groups may be branched or unbranched.
- the phenolic compound preferably contains at least 50 mole% species which have only one hydrocarbyl substituent.
- the substituent on the substituted aryl amidopolyamine is at least one hydrocarbyl group having at least one carbon atom.
- Longer chain hydrocarbyl groups are preferred. All else remaining equal, a curing agent having longer chain hydrocarbyl substituents, i.e. 8 or more and preferably greater than 12, most preferably 14 or more, tend to be more hydrophobic than the curing agents having short chain hydrocarbyl groups on the order of 1-7 carbon atoms.
- the hydrophobic character of the hydrocarbyl substituent is desirable to improve the compatibility of the curing agent with the epoxy resin component.
- long chain hydrocarbyl substituents are somewhat more flexible than their shorter chain counterparts, thus lowering the glass transition temperature of the curing agent.
- the most preferred hydrocarbyl groups are those having 14 or more carbon atoms. Although there is no particular upper limit on number of carbon atoms, the most common number of carbon atoms used within this invention will be 14-24, most preferably from 14-18, although hydrocarbons with up to 36 carbon atoms are also available.
- alkyls are preferred. These can be branched or unbranched, preferably unbranched or having no more than 1 branch per 6 backbone carbon atoms.
- alkyl substituents having at least 8 carbon atoms include octyl, nonyl, decyl, isodecyl, dodecyl, pentadecyl, eicosyl, triacontyl and the like, as well as radicals derived from substantially saturated petroleum fractions, olefin polymers and highly refined white oils or synthetic alkanes .
- hydrocarbyl groups which are suitable include substituted hydrocarbyl groups; that is, groups containing non-hydrocarbon substituents which do not alter the predominantly hydrocarbon character of the group. Examples are halo, nitro, cyano, ether, carbonyl, and sulfonyl groups. Also included are hetero atoms which are atoms other than carbon present within a chain or ring otherwise composed of carbon atoms. Suitable hetero atoms include, for example, nitrogen, oxygen, and sulphur. Further included within the meaning of the hydrocarbyl group are the alkoxy compounds.
- the hydrocarbyl group does not contain any hetero atoms or substituents.
- the phenolic compound may contain more than one hydrocarbyl substituent on its aromatic ring.
- the di- hydrocarbyl phenolic compounds have a long chain hydrocarbyl of 14 or more carbon atoms and a short chain hydrocarbyl of 1-4 carbon atoms attached to the aromatic ring, or both of the hydrocarbyls may be long chain. As noted above, however, preferably greater than 50 mole% of the species contain only one hydrocarbyl substituent.
- the substituted aryl amidopolyamines may contain more than one hydrocarbyl substituent on the aromatic ring of the phenolic compound.
- the dihydrocarbyl substituted aryl amidopolyamines may have a long chain hydrocarbyl of 14 or more carbon atoms and a short chain hydrocarbyl of 1-4 carbon atoms attached to the aromatic ring of the phenolic compound, or both of the hydro- carbyls may be long chain. As noted above, however, preferably greater than 50 mole%.
- the phenols on which the hydrocarbyl and carboxyl groups are situated are aromatic compounds containing at least one, and preferably one, hydroxyl group.
- Examples are phenol, ⁇ - or ⁇ - naphthols, resorcinol, hydroquinone, , 4 ' -dioxydiphenyl, 4 , 4 ' -dioxydiphenyl- ether, 4 , 4 ' -dioxydiphenylsulfone, 4 , 4 ' -dioxydiphenyl- methane, the condensation products of phenol and formaldehyde known as novolacs, and bis (4-hydroxy- phenyl) alkyls or ethers or sulfones optionally substituted with alkyl groups on the aromatic rings. Phenol is preferred.
- a hydrocarbon-based compound of the hydrocarbyl group as mentioned above is reacted with the hydroxyl aromatic compound at a temperature of 50-200 °C in the presence of a suitable catalyst such as aluminium chloride, boron trifluoride or zinc chloride.
- the phenolic compound also contains at least one carboxyl group as a substituent, and preferably only one carboxyl group per aromatic ring.
- the carboxyl group is bonded directly to the aromatic phenolic ring, or indirectly to the ring through an aliphatic chain. Preferred, however, is a carboxyl group bonded directly to the aromatic ring of the phenolic compound at the ortho or para positions to the phenolic hydroxyl group.
- the alkyl esters and anhydrides of the carboxyl substituents are those derived from carboxylic acids containing 0-24 carbon atoms, not counting the carboxylic acid carbon.
- the carboxylic acids from which the substituents are derived include -formic acid (a -carboxy acid) , -acetic acid, -proprionic acid, or
- a particularly preferred carboxyl group is a carboxy acid in view of its high reactivity with amines .
- the phenolic compound containing the carboxyl and the hydrocarbyl groups can be prepared by methods which are known in the art as the "Kolbe-Schmitt reaction, " which comprises reacting a salt, preferably an alkali metal salt, of the hydrocarbyl substituted phenol with carbon dioxide and subsequently acidifying the salt thus obtained.
- the conditions of the carbonation reaction are likewise well known to those skilled in the art. It may be carried out at atmospheric or superatmospheric pressure in a substantially inert, non-polar liquid diluent .
- a particularly preferred phenolic compound is a hydrocarbyl substituted salicyclic acid.
- This phenolic compound is a good building block toward producing a curing agent which has good flow, reactivity, and compatibility with epoxy resins at low cure temperatures in the absence of external accelerators/catalysts, and a good balance of mechanical properties and water, corrosion and humidity resistance properties.
- the phenolic compound used in the invention is a salicyclic acid substituted with a 14-18 linear carbon alkyl group located at the o- or p- position to the phenolic hydroxyl group. The preparation of alkyl substituted salicyclic acids is described in US Patent No. 3,013,868.
- the phenolic compound described above is reacted with a polyamine compound having at least two primary amine groups at an elevated temperature, suitably at a temperature of from 150 °C to 160 °C for a time sufficient to substantially complete the reaction, usually from 4 to 12 hours.
- the ingredients can be mixed together and reacted, but preferably, the phenolic compound should be added to the polyamine compound so as to reduce the possibility of reacting both of the primary amine groups on the polyamine compound with the phenolic compound.
- This reaction may be carried out in the presence of absence of solvents or catalysts, typically in the presence of a solvent and in the absence of a catalyst. If a catalyst is employed, one could use triphenylphosphite .
- reaction temperature rise it is advisable not to let the reaction temperature rise too much above 170 °C for an extended period of time in order to avoid de- carboxylating the phenolic compound and the resultant production of free phenolic compounds in the reaction mixture.
- vacuum may be applied during the course of the reaction or towards the tail end of the reaction.
- At least one primary nitrogen group equivalent of polyamine is reacted per carboxyl group equivalent on the phenolic compound, and more preferably the polyamine is reacted with the phenolic compound at a molar excess, such as at a molar ratio of 1.25:1 or more, in order to react out the all the carboxyl groups to form amide groups wherever carboxyl groups appear on the phenolic compound. While molar ratios of less than 1:1 are tolerable, the object of providing a reactive curing agent at low temperature cure conditions which is storage stable and compatible with epoxy resins is best achieved if an molar equivalent or excess of the poly- amine is used.
- the excess amine if any, should be vacuum distilled off, typically at 20in.Hg to 30in.Hg for 30 to 480 minutes.
- amide groups related to the amide group formed by the reaction between the carboxyl group and the polyamine that are within the meaning of the term amide include the imides and the amidines.
- the phenolic acid described above is reacted with an polyepoxide at an elevated temperature, typically from 140 °C to 180 °C, for a time sufficient to substantially complete the reaction, usually from 1 to 8 hours. It is advisable not to let the reaction temperature rise too much above 170 °C-180 °C for an extended period of time in order to avoid the possibility of de-carboxylating the phenolic compound, which would result in the production of free phenolic compounds in the reaction mixture.
- the reaction can be conducted at any pressure ranging from a partial vacuum to superatmospheric pressure.
- the esteri- fication reaction between the carboxyl group on the phenolic compound and the polyepoxide compound it is preferred to apply a partial vacuum either during the course of the reaction or towards the tail end of the reaction.
- the reaction is substantially completed when free acid can no longer be detected in the composition.
- the ingredients can be mixed together and subsequently reacted, but preferably, the phenolic acid is added to the polyepoxide compound so as to reduce the possibility of reacting both of the oxirane groups on the polyepoxide compound with the phenolic acid.
- the reaction between the polyepoxide compound and the phenolic acid are suitably carried out at molar ratios of at least 1:1, preferably greater than 1:1 such as at least 2:1, and even 3:1 on up. It is desirable to use a molar excess of the polyepoxide compound so that one of the oxirane groups on the polyepoxide compound is free to react with the polyamine compound and does not react with further phenolic acids.
- a stoichiometric amount of the phenolic acid is added to the polyepoxide compound such as at a molar ratio of polyepoxide to phenolic acid of 0.5:1 or less (the stoichiometry proceeding upon the assumption that the phenolic acid has only one functional group, the acid group, and a diepoxide is used) , then both of the oxirane groups will be consumed by the acid group on the phenolic compound. Therefore, a stoichiometric excess of oxirane groups (>0.5:1) is desired to ensure that the substituted aromatic glycidyl ester compound has free oxirane groups available for reaction with the polyamine compound.
- the reaction between the phenolic acid and the polyepoxide compound may be carried out in the presence or absence of solvents or catalysts, typically in the presence of both.
- Suitable solvents include alcohols, ketones, esters, ethers of hydrocarbons. Examples of suitable solvents are butanol, methyl isobutyl ketone, toluene, ethylglycol acetate, xylene, benzyl alcohol, phthalic acid esters of monohydric alcohols, e.g.
- n- butanol amylalcohol, 2-ethylhexanol, nonanol, benzyl alcohol, gamma-butyrolactone, delta-valerolactone, epsilon-caprolactone, lower and higher molecular weight polyols, e.g. glycerol trimethylol-ethane or -propane, ethyleneglycol, and ethoxylated or propoxylated polyhydric alcohols, either individually or in admixture .
- glycerol trimethylol-ethane or -propane ethyleneglycol
- ethoxylated or propoxylated polyhydric alcohols either individually or in admixture .
- a catalyst is employed, one could use a Lewis acid, metal salts, and bases.
- a Lewis acid examples include triethylamine, triethylamine, benzyldimethylamine, tris (dimethylaminomethyl) phenol, dimethylethanolamine, n-methymorpholine, benzyl trimethyl ammonium chloride, ethyl triphenyl phosphonium salts, tetrabutyl phosphonium salts, and stannous salts of carboxylic acids.
- Typical amounts of catalyst used range from 0.1 to 100 ppm.
- the polyepoxide used in the invention is any polyepoxide having an average of 1.5 or more oxirane groups per molecule, preferably 1.7 or more oxirane groups.
- the polyepoxide compounds can be monomeric or polymeric, saturated or unsaturated, aliphatic, cycloaliphatic, aromatic or heteroaromatic and may be substituted, if desired, with other substitutents in addition to the epoxy groups with, for example, hydroxyl groups or halogen atoms such as bromine.
- Suitable polyepoxide compounds are the reaction products of polyphenols and epihalohydrins, polyalcohols and epihalohydrins, amines and epihalohydrins, sulphur containing compounds and epihalohydrins, polycarboxylic acids and epihalohydrins or mixtures thereof.
- Preferred polyepoxide compounds include, but are not limited to, any one of those represented by the formulas : or
- R ⁇ is a divalent aliphatic group, a divalent cyclo- aliphatic group, a divalent aryl group, a polyoxyalkylene group, or a divalent arylaliphatic group
- R1 is independently a hydrogen or a C ⁇ C ⁇ _o alkyl group
- R i s a divalent aliphatic group optionally containing ether or ester group (s) or together with R ⁇ 9 or R ⁇ O form a spiro ring optionally containing heteroatoms
- R1 and R ⁇ O are independently hydrogen or R ⁇ -9 or R20 together with R-L8 form a spiro ring optionally containing heteroatoms such as oxygen.
- R i ' can be a divalent cycloaliphatic group having the formula:
- R ⁇ l and R ⁇ 2 are each independently an alkylene group, or a divalent arylaliphatic group having the formula
- R ⁇ 3 j_ s a n alkylene group wherein R ⁇ 3 j_ s a n alkylene group.
- the epoxy compound is preferably a diglycidyl ether of a dihydric phenol, diglycidyl ether of a hydrogenated dihydric phenol, an aliphatic glycidyl ether, epoxy novolac or a cycloaliphatic epoxy.
- Diglycidyl ethers of dihydric phenols can be produced, for example, by reacting an epihalohydrin with a dihydric phenol in the presence of an alkali.
- suitable dihydric phenols include: 2,2- bis ( 4-hydroxyphenyl ) propane (bisphenol-A); 2,2-bis(4- hydroxy-3-tert-butylphenyl) propane; 1, 1-bis (4- hydroxyphenyl) ethane; 1, 1-bis ( 4-hydroxyphenyl) isobutane; bis (2-hydroxy-l-naphthyl) methane; 1,5- dihydroxynaphthalene; 1, 1-bis (4-hydroxy-3-alkylphenyl) ethane and the like.
- Suitable dihydric phenols can also be obtained from the reaction of phenol with aldehydes such as formaldehyde (bisphenol-F) .
- Diglycidyl ethers of dihydric phenols includes advancement products of the above diglycidyl ethers of dihydric phenols with phenolic compounds such as bisphenol-A, such as those described in U.S. Patent Nos. 3,477,990 and 4,734,468.
- Diglycidyl ethers of hydrogenated dihydric phenols can be produced, for example, by hydrogenation of dihydric phenols followed by glycidation with epihalohydrin in the presence of a Lewis acid catalyst and subsequent formation of the glycidyl ether by reaction with sodium hydroxide.
- suitable dihydric phenols are listed above.
- aliphatic glycidyl ethers can be produced, for example, by reacting an epihalohydrin with an aliphatic diol in the presence of a Lewis acid catalyst followed by conversion of the halohydrin intermediate to the glycidyl ether by reaction with sodium hydroxide.
- a representative formula is:
- p is an integer from 2 to 12, preferably from 2 to 6; and q is an integer from 4 to 24, preferably from 4 to 12.
- Suitable aliphatic glycidyl ethers include for example, diglycidyl ethers of 1,4 butane- diol, neopentyl glycol, cyclohexane dimethanol, hexanediol, polypropylene glycol, and like diols and glycols; and triglycidyl ethers of trimethylol ethane and trimethylol propane.
- Epoxy novolacs can be produced by condensation of formaldehyde and a phenol followed by glycidation by epihalohydrin in the presence of an alkali.
- the phenol can be for example, phenol, cresol, nonylphenol and t-butylphenol.
- Epoxy novolacs include those corresponding to the formula (XII) above.
- Epoxy novolacs generally contain a distribution of compounds with a varying number of glycidated phenoxy- methylene units, r. Generally, the quoted number of units is the number closest to the statistical average, and the peak of the distribution.
- Cycloaliphatic epoxies can be produced by epoxidizing a cycloalkene-containing compound with greater than one olefinic bond with peracetic acid.
- Examples of the preferred cycloaliphatic epoxies include those corresponding to the formula (XIV) above.
- cycloaliphatic epoxies include, for example, 3, 4-epoxycyclo-hexylmethyl- (3, 4-epoxy) - cyclohexane carboxylate, dicycloaliphatic diether diepoxy [2- (3, 4-epoxy) cyclohexyl-5, 5-spiro (3, 4-epoxy) - cyclohexane-m-dioxane] , bis (3, 4-epoxycyclohexyl- methyl) adipate, bis (3, 4-epoxycyclohexyl) adipate and vinylcyclohexene dioxide [4- (1, 2-epoxyethyl) -1, 2- epoxycyclohexane] .
- Cycloaliphatic epoxies include compounds of the formulas :
- the preferred epoxy compounds having a nominal functionality of two or more include, for example, EPON Resins DPL-862, 828, 826, 825, 1001, EPONEX Resin 1510, HELOXY Modifiers 107, 67, 68, and 32 (EPON, EPONEX and HELOXY are trademarks); all available from Shell Chemical Company and Union Carbide Epoxy Resins ERL-4221, -4289, -4299, -4234 and -4206.
- the reaction between the phenolic acid compound and the polyepoxide compound will produce a variety of species depending upon the particular phenolic acid functional sites which undergo reaction.
- the following reaction scheme represents two species produced between phenolic acid - polyepoxide reaction, where all of the carboxylic acid groups on the phenolic acid compound have been reacted:
- R]_ is the hydrocarbyl substituent on the phenolic acid compound, and R7 is the polyepoxide residue .
- the substituted aromatic glycidyl ester composition is made, it is reacted with i) the b) polyamine compound, the d) monoglycidyl capping agent, and the c) reactive surfactant, in the stated sequence; or ii) a pre-reaction product of at least one equivalent of b) polyamine per equivalent of the c) reactive surfactant, followed by reaction onto the substituted glycidyl ester compound, in which case no capping agent is needed.
- the surfactant composition is made in-situ, during the manufacture of the curing agent composition, the surfactant composition can be made by: iii) reacting the reactive surfactant with a stoichio- metric excess of the curing agent composition, where the curing agent composition comprises an end capped substituted aromatic glycidyl ester-amine adduct comprising the reaction product of said a) , e) , c) , and d) ; or iv) pre-reacting the reactive surfactant with the b) polyamine compound, followed by reaction with a molar excess of the substituted aromatic glycidyl ester compounds, followed by reacting at least a molar equivalent amount, preferably a large molar excess, of
- the surfactant composition is made and isolated as such, or made in situ, preferably at least one mole of the polyamine compound is reacted per mole of the substituted aromatic glycidyl esters, and more preferably the polyamine is reacted with the substituted aromatic glycidyl esters at a molar excess, such as at a molar ratio of 1.25:1 or more, more preferably 2:1 or more, in order to react out the all the oxirane groups and provide primary amino group termination.
- the reaction conditions are much like those described above with relation to the phenolic acid and the polyepoxide compound, except that typically no catalysts are needed.
- the temperature can range from 100 °C to 230 °C, with the higher end of the temperature range initiated when vacuum distillation is applied.
- the substituted aromatic glycidyl ester composition is preferably added to the polyamine compound to ensure that the polyamine compound, once reacted, will have a free unreacted primary amine site available for reaction with the monoglycidyl capping agent. Once the amine reaction onto the substituted aromatic glycidyl ester composition is complete, the excess amine, if any, should be vacuum distilled off, typically at 20 in.Hg to 30 in.Hg for 30 to 480 minutes.
- Suitable polyamines are those which have at least two primary amine groups, where one of the primary amine groups is used for reaction with the carboxyl group on phenolic compound.
- a non-limiting example of polyamines useful in the practice of the invention is represented by the formula:
- n is an average of integers between about 0 and 10, preferably between 1 and 4; and X is a divalent branched or unbranched hydrocarbon radical having about 1-18 carbons, one or more aryl or alkaryl groups, or one or more alicyclic groups.
- X is a lower alkylene radical having 1-10, preferably 2-6, carbon atoms.
- alkylene polyamines include methylene polyamines, ethylene polyamines, butylene polyamines, propylene polyamines, pentylene polyamines, hexylene polyamines, heptylene polyamines, etc. The higher homologs of such amines and related aminoalkyl-sub- stituted piperazines are also included.
- polyamines include ethylene diamine, triethylene tetramine, tris (2-aminoethyl) -amine, 1,2- and 1, 3-propylene diamine, trimethylene diamine, 1,2- and 1, 4-butaned ⁇ amme, hexamethylene diamine, deca- methylene diamine, octamethylene diamine, diethylene triamme, t ⁇ ethylene tetramme, di (heptamethylene) - triamme, t ⁇ propylene tetramme, tetraethylene pentamme, trimethylene diamine, pentaethylene hexamme, di (trimethylene) triamme, p- and m-xylylene diamme, methylene dianilme, 2, 4-toluened ⁇ amme, 2,6-toluene- diam e, diam odiphenylmethane, polymethylene polyphenylpolyamme, diam ocyclohexane, lso
- Higher homologs obtained by condensing two or more of the above-illustrated alkylene amines, are also useful. More preferred are those polyamines containing at least one secondary ammo group in addition to the at least two primary ammo groups, and multiple divalent hydrocarbon radicals having 2-8 and preferably from 2-4 carbon atoms. Examples of the preferred polyamines are ethylenediamme, diethylenetriam e, triethylene- tetramme, and tetraethylenepentamine .
- ethylene type polyamines examples of which are mentioned above, are especially useful for reasons of cost and effectiveness.
- Such polyamines are described m detail under the heading "Diammes and Higher Ammes” in Kirk-Othmer, Encyclopedia of Chemical Technology, Second Edition, Vol. 7, pp. 22-39. They are prepared most conveniently by the reaction of an alkylene chloride with ammonia or by reaction of an ethylene lmme with a ring-opening reagent such as ammonia. These reactions result in the production of the somewhat complex mixtures of alkylene polyamines, including cyclic condensation products such as piperazmes. These mixtures are satisfactory in preparing the compositions of this invention.
- Hydroxy polyamines e.g., alkylene polyamines having one or more hydroxyalkyl substituents on the nitrogen atoms, are also useful in preparing amides of this invention.
- Preferred hydroxyalkyl-substituted alkylene polyamines are those in which the hydroxyalkyl group has less than about 10 carbon atoms.
- hydroxyalkyl-substituted polyamines examples include N-(2- hydroxyethyl) -ethylene diamine, N, N ' -bis (2-hydroxy- ethyl) ethylene diamine, monohydroxypropyl-substituted diethylene triamine, dihydroxypropyltetraethylene pentamine and N- (3-hydroxybutyl) tetramethylene diamine.
- Higher homologs obtained by condensation of the above- illustrated hydroxyalkyl-substituted alkylene amines through amino radicals or through hydroxy radicals are likewise useful.
- the c) reactive surfactant useful in the invention is one which contains a functional moiety reactive with secondary amines and a hydrophilic moiety of a nature and length effective to disperse the curing agent in water.
- the surfactant composition has a hydrophilic moiety of a nature and length effective to disperse the curing agent in water using only 1 wt% to 10 wt%, preferably 2 wt% to 6 wt%, more preferably only 2 wt% to 4 wt% of the surfactant composition, based on the weight of curing agent solids, to stably disperse the solids in the water borne curing agent composition at a solids level preferably from 45 wt% or more, more preferably 50 wt% or more, and most preferably 60 wt% or more.
- the surfactants employed to disperse the curing agent of the invention have the ability to stably disperse at least45 wt% solids at surfactant composition levels of 2 to 6 wt% without any noticeable phase separation to the naked eye at 30 days of still storage.
- the average particle size in the aqueous dispersions of the invention are also quite small, on the order of less than 2 ⁇ , preferably 0.5 ⁇ or less. It is desirable to have as low a particle size as possible at as high a solids level as possible to obtain improved coalescence, thereby obtaining optimum film mechanical properties .
- the reactive surfactant molecule contains groups reactive with a secondary amine group.
- a group reactive with secondary amine group is not meant that the reactive surfactant molecule must be reacted onto a secondary amine group, but only that the functional group on the reactive surfactant molecule have sufficient reactivity to react with a secondary amine group.
- included within the reactive surfactant molecules used in the invention are those which have been altered such as by way of pre-reacting the reactive surfactant molecule with a polyamine compound.
- Suitable reactive groups on the reactive surfactant molecule include epoxide, carboxylic acid and anhydrides thereof, and isocyanate functionalities. Any number of the same or independently different types of functional groups reactive with secondary amines may be bonded to the surfactant molecule.
- the surfactant molecule may contain 1, 2, 3, etc. epoxide and/or carboxylic acid groups per surfactant molecule.
- Suitable hydrophilic moieties in the surfactant molecule include, but are not limited to, polyoxyalkylene monool or polyol residues.
- the surfactant preferably has a number average molecular weight within the range of from 1000, preferably from 2000, to 105,000, preferably to 50,000, more typically to 20,000. Generally, the quoted number of units is the whole number closest to the statistical average, and the peak of the distribution.
- Positive real numbers as used herein refer to a number which is positive and includes integers and fractions of integers .
- the depicted sequence of groups is not intended to represent an order or a block structure.
- the above formulas I-III are to be broadly read as representing random structures, block structures, or random-block structures.
- the n units broadly represent a homo or block or random selection.
- the n units may represent n repeating units of oxyethylene groups, a random mixture of oxyethylene and oxypropylene groups, or blocks of oxyethylene and oxypropylene groups in any sequence.
- each of the surfactant molecules contain a polyoxyalkylene moiety.
- the hydrophilic carboxylic acid can be produced through the oxidation of a polyoxyalkylene molecule by any conventional known process, including, but limited to, the processes described in U.S. Patent No. 5,250,727.
- the molecule corresponding to formula II above may be prepared by reacting the hydrophilic carboxylic acid with an epoxy resin, or by reacting the carboxylic acid with an epihalohydrin, followed by dehydrohalogentation, in which case w is 0.
- the molecule corresponding to formula III above may be prepared by reacting a polyoxyalkene monool or polyol with an epoxy resin, or by reacting it with an epihalohydrin followed by dehydrohalogentation, in which case w is 0.
- these surfactant molecules corresponding to formulas I-III contain polyoxyalkylene moieties, the preparation of polyoxyalkene monools and polyols is now described.
- the quoted number of units is the whole number closest to the statistical average, and the peak of the distribution.
- the n units represent oxythylene or oxyethylene and oxypropylene groups
- p is 0, and m is one or two, the number average molecular weight being from at least 1000 to 20,000.
- the hydrophilic polyoxyalkyene molecule may be prepared by reacting an intiator molecule with an alkylene oxide under oxyalkylation conditions well known to those of ordinary skill in the art of polyether polyols, such as, for example, the process disclosed by Wurtz in 1859 and Encyclopedia of Chemical Technology, Vol. 7, pp. 257-262, published by Interscience Publishers, Inc. (1951) or in U.S. Pat. No. 1,922,459. Any suitable alkylene oxide may be used such as ethylene oxide, propylene oxide, butylene oxide, amylene oxide, and mixtures of these oxides.
- the polyoxyalkylene monools and polyols may be prepared from other starting materials such as tetrahydrofuran and alkylene oxide- tetrahydrofuran mixtures; epihalohydrins such as epi- chlorohydrin; as well as aralkylene oxides such as styrene oxide.
- the particular individual or combination of alkylene oxides chosen must be effective to stably disperse the particular species of curing agent in water .
- the alkylene oxides may be added to the initiator, individually, sequentially one after the other to form blocks, in mixture to form a heteric polyether, or blocks of mixed oxyalkylene and homogeneous oxyalkyene groups.
- Suitable homo polyoxyalkylene monools and polyols include polyoxyethylene monool or polyol, and polytetramethylene monool or polyol.
- Suitable block copolymers include, for example, blocks of polyoxy- propylene and polyoxyethylene, poly-1, 2-oxybutylene and polyoxyethylene, poly-1, 4-tetramethylene and polyoxyethylene.
- the blocks of polyoxypropylene or polyoxy- butylene are preferably internal relative to the outermost block of other poloxyalkylenes .
- Other copolymers include the heteric copolymer monools and polyols prepared from blends, optionally with sequential addition, of two or more alkylene oxides.
- the poly- alkylene polyether polyols may be terminated with either primary or secondary hydroxy groups.
- polyoxyalkylene molecules containing ethylene oxide work well, such as those having an EO/PO/EO block structure.
- propylene or butylene oxide it is preferred that the amount of such oxides is no more than 40 mole percent to ensure that the polyoxyalkylene molecule overall is hydrophilic.
- the intiator molecule can be monofunctional or polyfunctional.
- the functionality of the surfactant will nominally be that of the intiator.
- the actual functionality of the surfactant molecule will be some- what less due to the formation of chain terminating points of unsaturation during the oxyalkylation process, especially where propylene oxide is added in significant quantities .
- the initiator molecule examples include the alkanols and low molecular weight polyols having a number average molecular weight of 500 or less, such as alkanols having an average number of carbons ranging from 1 to 32, like methanol, ethanol, propanol, butanol, and the NEODOL alcohols commercially available from Shell Chemical Company (NEODOL is a trademark) , or ethylene glycol, propylene glycol, dipropylene glycol, trimethylene glycol, 1, 2-butanediol, 1, 5-pentanediol, 1, 6-hexanediol, 1, 7-heptanediol, hydroquinone, resorcinol glycerol, glycerine, 1, 1, 1-trimethylol- propane, 1, 1, 1-trimethylolethane, pentaerythritol,
- Preferable initiator molecules include alkanols having an average number of carbons ranging from 1 to 20, trimethylolpropane, ethylene and propylene glycol, glycerine, dipropylene glycol, and 2,2-bis(4- hydroxyphenyl) -propane and blends thereof.
- initiators include aromatic amines such as aniline, N-alkylphenylene-diamines, 2,4'-, 2,2'-, and 4 , ' -methylenedianiline, 2,6- or 2, 4-toluenediamine, vicinal toluenediamines, o-chloro-aniline, p-amino- aniline, 1, 5-diaminonaphthalene, methylene dianiline, the various condensation products of aniline and formaldehyde, and the isomeric diammotoluenes; and aliphatic amines such as mono-, di, and t ⁇ alkanol- ammes, ethylene diamine, propylene diamine, diethylene- triamme, methylamme, t ⁇ isopropanolamme, 1,3-d ⁇ ammo- propane, 1, 3-d ⁇ ammobutane, and 1, 4-d ⁇ ammobutane .
- aromatic amines such as aniline, N-alky
- initiator molecules include polyhydric polythioethers, polyhydroxyl-contammg phosphorus compounds, polyacetals, and aliphatic thiols .
- the molecule may be oxidized as described above to produce a surfactant represented by formula I, and further reacted with an epoxy resm to produce a surfactant corresponding to formula II, or the monool or polyol may be reacted with an epoxy resm to prepare a surfactant molecule corresponding to formula III.
- hydrophilic carboxylic acid can be produced by oxidation of a polyoxyalkylene molecule by any conventional know process, including, but limited to, the processes described in U.S. Patent
- oxygen is added to the polyalkylene glycol in the presence of a free radical (e.g., 2, 2, 6, 6-tetramethyl-l-p ⁇ pe ⁇ dmyloxy) and an inorganic acid (e.g., nitric acid) to produce the carboxylic acid until substantially all of the alcohol groups are oxidized to carboxylic acid groups.
- a free radical e.g., 2, 2, 6, 6-tetramethyl-l-p ⁇ pe ⁇ dmyloxy
- an inorganic acid e.g., nitric acid
- the epoxy-functionality can be introduced by reacting a polyether monool or polyol, or its carboxylic acid derivative, with an epoxy resm having a functionality of at least 1.5 epoxide group per molecule under conditions effective to react the hydroxyl or acid group on the polyoxyalkylene molecule with the epoxide group.
- the mole ratio of the monool, polyol, or carboxylic acid to epoxy resin is within the range of 1:1 to 1:500.
- the monool or polyol may be reacted with a stoichiometric excess of the epoxy resin such that the surfactant composition contains free unreacted epoxy resin molecules.
- the reaction is typically carried out at a temperature from ambient temperature to an elevated temperature sufficient to react the hydroxyl or acid group and the epoxide group preferably within the range of from 90 °C to 150 °C for a time effective to produce the reaction products.
- the progress of the reaction can be monitored and targeted to produce the desired product by measuring the hydroxyl number, acid equivalent weight and/or the epoxy equivalent weight of the reactant mixture.
- the reaction mixture is heated until 95%, preferably until at least 99%, of the original number of equivalents of hydroxyl or acid equivalents is consumed.
- the reaction can proceed at atmospheric pressure.
- the reaction between the hydroxyl or carboxylic acid groups, and the epoxide groups, in the course of making the surfactant molecule is carried out in the presence of a catalyst.
- the catalysts are bases or metal chelates such as, for example, ammonium compounds, phosphonium compounds, tertiary amines, and phosphines.
- Examples of more preferred catalysts include, for example, triphenylphosphonium acid acetate, ethyltriphenyl phosphonium iodide, benzyldimethylamine, triphenylphosphine, tributylamine, aluminium sali- cylates, tetramethylammonium hydroxide and the like.
- the amount of catalyst present is preferably from 0.05 to 2.0 weight percent based on the total weight of the epoxy resin and the polyoxyalkylene molecule.
- the epoxy resins used to make the reactive surfactant can be any reactive epoxy resm having a 1,2-epoxy equivalency (functionality) preferably, on the average, greater than 1.5 epoxide groups per molecule. Any of those described above with respect to making the substituted glycidyl ester compound are suitable for making a reactive surfactant compound.
- the optional d) monoglycidyl, monocarboxylic acid, or monoisocyanate capping agent can be an aliphatic, alicyclic, or aromatic compound attached to the functional group.
- reacting at least a portion of unreacted primary amme hydrogen with the capping agent reduces the chance for carbamate formation from atmospheric moisture reacting with the primary amme hydrogens, normally appearing as a blush on the coating and leading to chain scission.
- some or all of the primary amme groups in the curing agent composition, or in the surfactant composition, if any exist the molecule will have a free secondary amme hydrogen active for reaction with epoxy groups.
- Non-limiting examples of monoglycidyl capping agents which are suitable for use in the invention include: O
- R27 and R28 are the same or different and are a branched or linear alkyl, an alkalicyclic, polyoxyalkyl, or alkenyl group having 2-100 carbon atoms, optionally branched,; and R29 is hydrogen or a branched or unbranched alkyl having 1-18 carbon atoms. There may be more than one type of R29 group attached to the aromatic ring .
- These categories would include the unsaturated epoxy hydrocarbons of butylene, cyclohexene, styrene oxide and the like; epoxy ethers of monovalent alcohols such as methyl, ethyl, butyl, 2-ethylhexyl, dodecyl alcohol and others; epoxides of the alkylene oxide adducts of alcohols having at least 8 carbon atoms by the sequential addition of alkylene oxide to the corresponding alkanol (ROH) , such as those marketed under the NEODOL name; epoxy ethers of monovalent phenols such as phenol, cresol, and other phenols substituted in the o- or p- positions with C ] _-C2i branched or unbranched alkyl.
- ROH alkanol
- aralkyl, alkaryl, or alkoxy groups such as nonylphenol; glycidyl esters of mono-carboxylic acids such as the glycidyl ester of caprylic acid, the glycidyl ester of capric acid, the glycidyl ester of lauric acid, the glycidyl ester of stearic acid, the glycidyl ester of arachidic acid and the glycidyl esters of alpha, alpha-dialkyl monocarboxylic acids described in U.S. Pat. No.
- epoxy esters of unsaturated alcohols or unsaturated carboxylic acids such as the glycidyl ester of neode- canoic acid, epoxidized methyl oleate, epoxidized n- butyl oleate, epoxidized methyl palmitoleate, epoxidized ethyl linoleate and the like; phenyl glycidyl ether; allyl glycidyl ethers, and acetals of glycidaldehyde .
- monoglycidyl capping agents useful to the practice of the invention include alkyl glycidyl ethers with 1-18 linear carbon atoms in the alkyl chain such as butyl glycidyl ether or a mixture of Cg-C ⁇ 4 alkyls, cresyl glycidyl ether, phenyl glycidyl ether, nonylphenylglycidyl ether, p-tert-butylphenyl glycidyl ether, 2-ethylhexyl glycidyl ether, and the glycidyl ester of neodecanoic acid.
- alkyl glycidyl ethers with 1-18 linear carbon atoms in the alkyl chain such as butyl glycidyl ether or a mixture of Cg-C ⁇ 4 alkyls, cresyl glycidyl ether, phenyl glycidyl ether
- the aliphatic based capping agents are usually hydrophobic in character, which tends to improve the coalescence properties of the epoxy-curing agent mixture at low temperatures, and tends to lower the glass transition temperature of the film or coating. The lower glass transition temperature improves the impact strength of the cured film.
- Aromatic based monoglycidyl capping agents have the advantage of rendering the cured film more rigid, chemically resistant, and resistant to stresses at high temperatures. Any one of these types of capping agents may be used, and mixtures thereof are also advantageous to attain an overall balance of mechanical strength and chemical resistance.
- the capping agent is reacted with the substituted glycidyl ester- amine adduct in an amount effective to provide a water borne curing agent composition which is compatible with neat or water borne bisphenol A and bisphenol F type liquid diglycidyl ether epoxy resins as well as epoxidized phenolic novolac resins.
- the monoglycidyl capping agent is reacted with the substituted glycidyl ester-amine adduct at a molar ratio of 0.5:1 to 2:1.
- the surfactant composition, if needed, and water borne curing agent composition can be partially capped with the monoglycidyl capping agent, because even a partial capping will have some effect on blush reduction.
- R_ is greater than 12; c is an integer from 1-4; k is an integer from 0-4. For ease of manufacture, the latter structure is preferred.
- R3 is the residue of an alkyl glycidyl ether having 1-24 branched or unbranched carbon atoms in the alkyl chain, an alkaryl glycidyl ether, an aryl glycidyl ether, an allyl glycidyl ether, an alicyclic alkyl glycidyl ether, or a glycidyl ester of a monocarboxylic acid.
- R3 is the residue of an alkyl glycidyl ether having 2-18 carbon atoms or an alkaryl glycidyl ether wherein the alkyl has 1-24 carbon atoms, and most preferably is the residue of butyl glycidyl ether, cresyl glycidyl ether, phenyl glycidyl ether, nonylphenyl glycidyl ether, p-tert- butyl glycidyl ether, or an alkyl glycidyl ether having 8-16 branched or unbranched alkyl carbon atoms.
- the surfactant composition can be made and isolated as such, or it can be made "in-situ.” There are several methods for making the surfactant composition in situ as described above.
- the amount of reacted surfactant compound in the curing agent composition can range from only 1 wt% to 10 wt%.
- the surfactant composition be combined with the curing agent composition by admixing the surfactant composition with the curing agent composition in an amount calculated to provide 1 wt% to 10 wt% of reacted surfactant compound based on the weight of the curing agent and the surfactant composition, or preferably, the reacted surfactant compound can be combined with the curing agent composition by reacting the reactive surfactant in situ in a stoichiometric excess of the curing agent composition, at any stage of making the curing agent composition beyond the manufacture of the substituted glycidyl ester compound, to obtain a curing agent composition containing from 1 to 10 wt% of the reacted surfactant compound.
- the curing agent composition contain the same substituted glycidyl ester moiety as does the surfactant composition.
- the curing agent composition of the invention can then be mixed with water in amounts necessary to produce the desired level of solids.
- the water borne curing agent of the invention advantageously contains a reacted surfactant having a moiety which is identical in structure to the curing agent it is designed to disperse in water, and also contains a moiety which is a high molecular weight hydrophilic strand adapted for stably dispersing the curing agent in water hydrophilic strand adapted for stably dispersing the curing agent in water.
- the substituted aryl amidopolyamine compound it is preferred to make, in a first step, at least a portion of the substituted aryl amidopolyamine compound, followed by reaction (s) with the capping agent or a mixture of the capping agent and the reactive surfactant. It is more preferred to react all of the substituted phenolic compound with all of the polyamine compound at the desired molar ratio to form the substituted aryl amidopolyamine compound, sequentially followed by reacting onto the substituted aryl amidopolyamine compound the remainder of the reactants necessary to make the surfactant composition or the water borne curing agent composition.
- the reactive surfactant useful in the invention is one which contains a functional moiety reactive with secondary amines and a hydrophilic moiety of a nature and length effective to disperse the curing agent in water.
- the reaction product of the surfactant with the end capped substituted aryl amidopolyamine, along with other unreacted species or by-products, is what is identified herein as the reacted surfactant compound.
- the reacted surfactant has a hydrophilic moiety of a nature and length effective to disperse the curing agent in water using only 1 wt% to 10 wt%, preferably 2 wt% to 6 wt%, more preferably only 2 wt% to 4 wt% of the surfactant composition, based on the weight of curing agent solids, to stably disperse the solids in the water borne curing agent composition at a solids level preferably from 45 wt% or more, more preferably 50 wt% or more, and most preferably 60 wt% or more.
- the reacted surfactants employed to disperse the curing agent of the invention have the ability to stably disperse at least 45 wt% solids at reacted surfactant compound levels of 2 to 6 wt% without any noticeable phase separation to the naked eye after at least 3 days of still storage.
- the average particle size in the aqueous dispersions of the invention are also quite small, on the order of less than 1 ⁇ , preferably 0.5 ⁇ or less, more preferably 0.35 ⁇ or less.
- the surfactant composition of group of embodiments B comprises a reacted surfactant compound represented by one or more of the formulas IX and X wherein R ] _ preferably is a branched or unbranched, substituted or unsubstituted, monovalent hydrocarbyl group having more than 12, more preferably 14 or more; R2 and R4 each independently represent a branched or unbranched, substituted or unsubstituted, divalent hydrocarbyl group preferably having 2-6 carbon atoms, or groups of formula (VII) or (VIII) wherein Rg represents a branched or unbranched, substituted or unsubstituted, divalent hydrocarbyl group having 2-24 carbon atoms; R ⁇ 3 is a branched or unbranched, substituted or unsubstituted, monovalent hydrocarbyl having 1-24 carbon
- R]_3 is the residue of an alkyl glycidyl ether having 1-24 branched or unbranched carbon atoms in the alkyl chain, an alkaryl glycidyl ether, an aryl glycidyl ether, an allyl glycidyl ether, an alicyclic alkyl glycidyl ether, or a glycidyl ester of a monocarboxylic acid.
- R13 is the residue of an alkyl glycidyl ether having 2-18 carbon atoms or an alkaryl glycidyl ether wherein the alkyl has 1-24 carbon atoms, and most preferably is the residue of butyl glycidyl ether, cresyl glycidyl ether, phenyl glycidyl ether, nonyl- phenyl glycidyl ether, p-tert-butyl glycidyl ether, or an alkyl glycidyl ether having 8-16 branched or unbranched alkyl carbon atoms.
- the reactive surfactant molecule contains groups reactive with the secondary amme group on the substituted aryl amidoamme molecule.
- Suitable reactive groups on the surfactant molecule include epoxide, carboxylic acid and anhydrides thereof, and isocyanate functionalities. Any number of the same or independently different types of functional groups reactive with secondary amines may be bonded to the surfactant molecule.
- the surfactant molecule may contain 1, 2, 3, etc. epoxide and/or carboxylic acid groups per surfactant molecule.
- Suitable hydrophilic moieties in the surfactant molecule include, but are not limited to, polyoxyalkylene monool or polyol residues .
- the curing agent composition used is advantageously the reaction product of the a) phenolic compound, the e) polyepoxide compound, the b) polyamine compound, and the d) capping agent, as described above with respect to the surfactant composition, and more preferably, contains all the same reactants as used to make the surfactant composition.
- the curing agent composition used is advantageously the reaction product of a substituted aryl amidopolyamine compound with the capping agent and more preferably, contains all the same reactants as used to make the end-capped substituted aryl amidopolyamine compound for use in the surfactant composition.
- the curing agents of the invention can optionally be mixed with other conventional curing agents.
- the amount of other conventional curing agents admixed will depend upon the requirements placed upon the end product and the efficiencies one desires to achieve. If the end use does not require a product which has high end physical properties and/or it is not important to have lowered processing times, then greater amounts of an inexpensive conventional curing agent can be mixed with the curing agent composition of the invention.
- the amount of the curing agent in the water borne curing agent composition can range in the low end of from 1 to 50 wt% based on the weight of all curing agents, but is preferably from 50 wt% to 100 wt%.
- Conventional curing agents are usually polyamines with at least 2 nitrogen atoms per molecule and at least two reactive amine hydrogen atoms per molecule.
- the nitrogen atoms are linked by divalent hydrocarbyl groups.
- Other hydrocarbyl groups such as aliphatic, cycloaliphatic or aromatic groups may also be singly linked to some of the nitrogen atoms.
- These polyamines contain at least 2 carbon atoms per molecule.
- Preferably polyamines contain about 2 to 6 amine nitrogen atoms per molecule, 2 to 8 amine hydrogen atoms per molecule, and 2 to 50 carbon atoms.
- polyamines useful as conventional curing agents for epoxy resins include aliphatic polyamines such as ethylene diamine, diethylene triamme, triethylene tetramine, tetraethylene pentamine, pentaethylene hexamine, dipropylene triamine, tri- butylene tetramine, hexamethylene diamine, dihexa- methylene triamine, 1,2-propane diamine, 1,3-propane diamine, 1,2-butane diamine, 1,3-butane diamine, 1,4-butane diamine, 1,5-pentane diamine, 1,6-hexane diamine, 2-methyl-l, 5-pentanediamine, 2, 5-dimethyl-2, 5- hexanediamine and the like; cycloaliphatic polyamines such as isophoronediamine, 4 , 4 ' -diaminodicyclo- hexylmethane, methane diamine, 1, 2-diaminocyclohexane
- polyamines include EPI-CURE Curing Agent 3140 (a dimer acid-aliphatic polyamine adduct) , EPI-CURE Curing Agent 3270 (a modified aliphatic polyamine) , EPI-CURE Curing Agent 3274 (a modified aliphatic polyamine), EPI-CURE Curing Agent 3295 (an aliphatic amine adduct) , EPI-CURE Curing Agent 3282 (an aliphatic amine adduct) , EPI-CURE Curing Agent 3055 (an amidopolyamine) , EPI-CURE Curing Agent 3046 (an amidopolyamine) and EPI-CURE Curing Agent 3072 (modified amidoamine) , and EPI-CURE Curing Agent 3483 (an aromatic polyamine) (EPI-CURE is a trademark) .
- EPI-CURE Curing Agent 3140 a dimer acid-aliphatic polyamine adduct
- EPI-CURE Curing Agent 3270 a modified
- the epoxy resin component for reaction with the water borne curing agent composition has at least one 1,2-epoxy group per molecule.
- Mixtures of epoxy compounds having one epoxy functionality and two or more epoxy groups are also suitable.
- the epoxy compounds having two or more epoxy groups per molecule means that the nominal functionality is two or more.
- epoxy resins contain a distribution of compounds with a varying number of 1,2-epoxy equi- valency. The actual average functionality of these epoxy compounds is 1.5 or more. Any of the epoxy compounds mentioned above with respect to the epoxy resin used for reacting onto the polyoxyalkylene monool, polyol, or carboxylic acid can be employed as the epoxy resin component for reaction with the water borne curing agent .
- the preferred epoxy compounds having a nominal functionality of two or more include, for example, EPON Resins DPL-862, 828, 826, 825, 1001, EPONEX Resin 1510, HELOXY Modifiers 107, 67, 68, and 32; all available from Shell Chemical Company and Union Carbide Epoxy Resins ERL-4221, -4289, -4299, -4234 and -4206 (EPON, EPONEX and HELOXY are trademarks) .
- the curing agent composition of the invention may include other additives, such as fillers, elastomers, stabilizers, extenders, plasticizers, accelerators, pigments, reinforcing agents, flow control agents and flame retardants depending on the application.
- additives such as fillers, elastomers, stabilizers, extenders, plasticizers, accelerators, pigments, reinforcing agents, flow control agents and flame retardants depending on the application.
- the curable epoxy resin composition is cured in the absence of catalyst compounds which accelerate the reaction between the curing agent and the epoxy resin, commonly known as accelerators.
- An accelerator can be included, if desired, to increase the cure rate of the epoxy resin-curing agent system beyond that already achieved in its absence.
- Various amine-compatible accelerators can be used as long as they are soluble in the amine curing agents.
- accelerators include metal salts such as, for example, sulfonates, phosphonates, sulphates, tetra- fluoroborates, carboxylates and nitrates of Groups IA, IIA and transition metal series of the Periodic Table (CAS version) , preferably Mg, Ca, Zn and Sn salts, and complexes thereof; inorganic acids such as, for example, HBF4, H2SO , H2NSO3H and H3PO4; carboxylic acids, preferably hydroxy-substituted carboxylic acids such as, for example, salicylic, lactic, glycolic and resorcylic; phenolic compounds such as, for example, phenol, t-butylphenol, nonylphenol and bisphenol A; imidazoles; cyanamide compounds such as dicyandiamide and cyanamide; sulphonamides such as, for example p-toluenesulphon- amide, methanesulphonamide,
- the accelerators are typically present in an amount of from 0.1 weight percent to 10 weight percent, preferably to 5 weight percent, based on the epoxy resin, if used at all.
- the curable epoxy resin component can also contain pigments of the conventional type such as iron oxides, lead oxides, strontium chromate, carbon black, titanium dioxide, talc, barium sulphate, phthalo- cyanine blue and green, cadmium red, iron blue, chromic green, lead silicate, silica, silicates and the like.
- pigments can be added to the polyamine curing agent component or the epoxy resin component prior to mixing them together. Their amounts usually range from 20 to 100 pbw based on the weight of the epoxy resin and the curing agent composition.
- the curable epoxy resin component or the water borne curing agent composition can also contain a filler such as sand, other siliceous materials, iron or other metals. Small amounts of thixotropic agents, colouring agents, inert plasticizers, and levelling agents can also be incorporated in the curable epoxy resin composition if desired.
- These curable flooring compositions can be trowelled, sprayed or brushed on to a floor substrate.
- Re-inforcing agents may be added to either of the components, and include natural and synthetic fibres in the form of woven, mat, monofilament, chopped fibres and the like. Other materials for re-inforcing include glass, ceramics, nylon, rayon, cotton, aramid, graphite and combinations thereof.
- Suitable fillers include inorganic oxides, inorganic carbonates, ceramic micro- spheres, plastic microspheres, glass microspheres, clays, sand, gravel and combinations thereof.
- the fillers can be used in amounts suitably from 0 to 100 pbw of the combined epoxy/curing agent components.
- the curing agent compositions of the invention and the two component compositions utilizing the curing agents compositions can be used in such applications as flooring, casting, crack or defect repair, moulding, adhesives, potting, filament winding, encapsulation, structural and electrical laminates, composites and the like.
- the two component compositions of the invention are mixed and cured, preferably in the absence of external accelerators, in a wide range of temperatures ranging from -25 °C to 100 °C .
- thermosetting powder coating compo- sitions prepared by the various methods known to the powder coating industry: dry blending, melt compounding by two roll mill or extruder and spray drying.
- the process used is the melt compounding process: dry blending solid ingredients in a planetary mixer and then melt blending the admixture in an extruder at a temperature within the range of 80 °C to 130 °C . The extrudate is then cooled and pulverized into a particulate blend.
- thermosetting powder composition can then be applied directly to a substrate of ,e.g., a metal such as steel or aluminum.
- a substrate of e.g., a metal such as steel or aluminum.
- Non-metallic substrates such as plastics and composites can also be used.
- Application can be by electrostatic spraying or by use of a fluidized bed. Electrostatic spraying is the preferred method.
- the coating powder can be applied in a single sweep or in several passes to provide a film thickness after cure of 2.0 to 15.0 mils.
- the substrate can optionally be preheated prior to application of a powder composition to promote uniform and thicker powder deposition.
- the powder-coated substrate is baked, typically at 120 °C, preferably from 150 °C, to 205 °C for a time sufficient to cure the powder coating composition, typically from 1 minute to 60 minutes, preferably from 10 minutes to 30 minutes.
- DIAMINE is a 2 methyl-pentamethylene diamine commercially available as DYTEK-A having a molecular weight of about 119 (DYTEK is a trademark) .
- HELOXY Modifier 62 is a commercial grade of ortho-cresyl glycidyl ether manufactured by Shell Chemical Company, that is produced by treatment of ortho-cresol with epichlorohydrin and sodium hydroxide.
- HELOXY Modifier is a thin liquid having a viscosity at 25 °C of 7 centipoise and an epoxide equivalent weight of 175 to 195.
- SURFACTANT COMPOSITION A is a carboxylated poloxyethylene molecule derived from carboxylating a polyoxyethylene monool having a number average molecular weight of 5000.
- EPOXY RESIN A is a dispersion of an epoxy resin substantially equivalent to EPON 1001 resin having an equivalent weight per epoxide group of 450-550, in water having a functionality of less than 2.
- This example illustrates the synthesis of self emulsifiable water borne curing agent composition containing a surfactant composition made in situ.
- the curing agent is a substituted aromatic glycidated ester- amine adduct end capped with a monoglycidyl ether, stabilized as an oil in water emulsion through a reacted surfactant made in situ by reacting Surfactant A onto a substituted aromatic glycidated ester-amine adduct.
- Stage 1 the substituted aromatic glycidated ester compound is made.
- Stage 2 the remainder of the reactions are described.
- Stage 1 500 grams of EPIKOTE 828 in xylene, which is a bisphenol A based diepoxy resin available from Shell Chemicals Europe (EPIKOTE is a trademark) ; 327 grams of a 63 wt% 3-alkyl substituted salicyclic acid mixture in xylene (corresponding to about 20 mole% per epoxy group) , in which the alkyl group contains from 14 to 18 carbon atoms and the mixture contains less than 15 mole% of C]_4 ⁇ C ⁇ _8 alkyl phenols and less than 5 mole% of dicarboxylic acid species; and 0.15 grams of ethyltri- penylphosphonium iodide were mixed together in a vessel equipped with a condenser.
- EPIKOTE 828 in xylene which is a bisphenol A based diepoxy resin available from Shell Chemicals Europe (EPIKOTE is a trademark) ; 327 grams of a 63 wt% 3-alkyl substituted salicyclic
- the reaction temperature was increased to 175 °C (heating up to 110 ° C in 30 minutes, holding for another 30 minutes at 110 °C and then heating to 175 °C within the next 60 minutes), and holding the temperature at 175 °C for the next 30 minutes, for a total reaction time of 2.5 hours.
- a 4 necked 2 litre round-bottomed glass flask was equipped with a condenser having a water trap, a nitrogen inlet, an acid inlet, and the DIAMINE inlet. The flask was flushed with nitrogen. 357 g of the
- DIAMINE representing about 6 equivalents
- SSAEP representing about
- Epoxy Resin A 150 g of Epoxy Resin A was hand mixed with 102.15 g of the water borne curing agent prepared according to example 1 in the absence of external accelerator compounds, at an equivalent ratio of about 1:1, and allowed to cure at 75 °F and about 70% relative humidity.
- the mixture was drawn down on a Lemeta chart with a 2 mil Bird bar.
- the specular gloss pot life was 4-5 hours based on a 60° angle of incidence.
- the viscosity pot life was in excess of 6 and one-half hours.
- the water borne curing agent composition was compatible with the water borne epoxy resin compo- sition, was self emulsifiable, and coalesced well as a film.
- SSA is about 63 wt% salicyclic acid mono substituted with C1 -C18 alkyl groups dissolved in xylene and containing less than 15 mole% of C ⁇ -C]_g alkyl phenols and less than 5 mole% of dicarboxylic acid species, having an acid value of about 92 mg KOH/g in solution and about 146 mg KOH/g based on the solids .
- TETA is triethylene tetramine commercially available from Union Carbide having a typical amine value of about 1436 mg KOH/g.
- HELOXY Modifier 62 is a commercial grade of ortho-cresyl glycidyl ether manufactured by Shell Chemical Company, that is produced by treatment of ortho-cresol with epichlorohydrin and sodium hydroxide.
- HELOXY Modifier is a thin liquid having a viscosity at 25 °C of about 7 centipoise and an epoxide equivalent weight of about 175 to about 195.
- SURFACTANT COMPOSITION B is a glycidated block copolymer of ethylene oxide/propylene oxide having an internal block of oxyalkylated propylene oxide to make an EO/PO/EO block having about 80% EO and 20% PO, wherein each end of the copolymer is glycidated.
- This glycidated block copolymer is mixed into EPON 828 at a weight ratio of 30/70 wt%, respectively.
- EPON 828 RESIN is a diglycidyl ether liquid epoxy resin commercially available from Shell Chemical Company.
- EPOXY RESIN C is an epoxy phenolic novolak dispersion in water having an average functionality of about 3.6.
- EPOXY RESIN A is a dispersion of an epoxy resin equivalent to EPON 1001 resin having an equivalent weight per epoxide group of about 450-550, in water having a functionality of less than 2.
- EPI-REZ RESIN WD-510 is commercially available from Shell Chemical Company, and is an epoxy resin having a weight per epoxide group of about 190-205 dispersed in water (EPI-REZ is a trademark) .
- Example 3 Example 3
- This example illustrates the synthesis of the substituted aryl amidopolyamine compound based on a substituted salicyclic acid and triethylene tetramine, which is subsequently reacted with a monoglycidyl ether .
- a 4 necked round-bottomed glass flask was equipped with a condenser having a water trap, a nitrogen inlet, an acid inlet, and the TETA inlet.
- the flask was flushed with nitrogen.
- 1529.4 g of SSA was charged to the flask, after which a total of 390.42 grams of TETA was charged over a period of time to the flask, for a total of 1919.8 grams of reaction ingredients.
- the amount of SSA and TETA added were reacted in a ratio of one amine equivalent to one acid equivalent, or a 1:1 mole ratio. During the course of the reaction through completion, approximately 613 grams of water and xylene were distilled off.
- the reaction was again heated to 160 °C for the first two hours, and subsequently warmed to 170 °C over the next 7 hours.
- the reactants were again heated to about 145 °C - 150 °C over a 5 hour period under vacuum at about 20 in.Hg.
- the acid value was measured at about 10.3 mg KOH/g, and the amine value was measured to be about 345.4 mg KOH/g.
- reaction temperature was held at 90-96 °C for the next 30 minutes, after which the final end capped amidopolyamine curing agent was isolated under nitrogen purge using a coarse grade Gardner filter cup.
- the acid and amine values of the final end capped amidopolyamine product were measured to be 7.6 and 246.4 mg KOH/g, respectively.
- This example demonstrates the manufacture of a high solids, water dispersed, self emulsifiable curing agent composition based upon the curing agent prepared in example 3.
- the final end capped amidoamine product of example 3 was reacted with a glycidated surfactant in the following manner. 6.0 grams (about 1.8 grams of reactive surfactant) of Surfactant Composition B was added to 28.2 grams of the end capped amidoamine of example 1 in a 2 ounce glass jar on a heated hot plate under shear. This amount represents about 5.26 wt% of surfactant based on the weight of the solids in the final end capped amidoamine product of example 1. The reaction was allowed to proceed for 90 minutes at this temperature under agitation, and subsequently cooled to room temperature. At room temperature, the product was a tacky opaque solid which was warmed to a liquid and dispersed in 14.66 grams of water to achieve a 70% solids . The level of water was increased to obtain about a 57.6 % solids which was a cream coloured. Its equivalent weight was about 260 g/eq based on solids and 450 g/eq as is, on a calculated basis.
- the thixotropic emulsion was drawn down as a film on a Lenata chart. A clear glossy film was observed after 30-45 minutes. The thixotropic emulsion was stable .
- Example 5 The thixotropic emulsion was drawn down as a film on a Lenata chart. A clear glossy film was observed after 30-45 minutes. The thixotropic emulsion was stable .
- This example demonstrates the manufacture of a cured epoxy film using the water emulsion of example 4 as the water borne curing agent composition, in the absence of external accelerator compounds, and the specular gloss results obtained to indicate level of cure, compatibility, and film coalescence properties.
- the epoxy resin blend produced a semi-glossy clear film in about 15 minutes.
- This example demonstrates the curing ability of epoxy resins with the water borne curing agent composition of example 2, in the absence of external accelerator compounds, and specular gloss obtained thereby.
- 57.6 wt% solids content were mixed together by hand and allowed to cure at 20 °C ⁇ 2 °C and 30 ⁇ 5% RH .
- the amounts grams and types of each ingredient are set forth below in Table 2.
- This example demonstrates the manufacture of an epoxy film from a water borne epoxy resin and a water borne curing agent composition, in the absence of external accelerator compounds.
- the curing agent of example 4 was further diluted with water to yield 55% solids with an equivalent weight of 260 based on solids. 29.98 grams (16.49 grams based on solids) of the curing agent were hand mixed into 20.02 grams (13.01 based on solids) of the epoxy resin to produce about system having about 59% solids. The mixture was allowed to cure, and the specular gloss was measured as in example 5. The results are reported in Table 4 :
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
BR9714105A BR9714105A (en) | 1996-12-31 | 1997-12-30 | Composition of stable water-based curing agent, water-based curing agent, and surfactant composition |
CA002275888A CA2275888A1 (en) | 1996-12-31 | 1997-12-30 | Waterborne curing agent composition, comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures |
JP52963298A JP2001507391A (en) | 1996-12-31 | 1997-12-30 | Aqueous curing agent composition containing a pre-reacted surfactant composition for epoxy resin that is self-curing at or below ambient temperature |
AU58613/98A AU727693B2 (en) | 1996-12-31 | 1997-12-30 | Waterborne curing agent composition, comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures |
EP97954482A EP0951494A1 (en) | 1996-12-31 | 1997-12-30 | Waterborne curing agent composition, comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US3395496P | 1996-12-31 | 1996-12-31 | |
US3461896P | 1996-12-31 | 1996-12-31 | |
US60/034,618 | 1996-12-31 | ||
US60/033,954 | 1996-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998029467A1 true WO1998029467A1 (en) | 1998-07-09 |
Family
ID=26710371
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP1997/007343 WO1998029467A1 (en) | 1996-12-31 | 1997-12-30 | Waterborne curing agent composition, comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0951494A1 (en) |
JP (1) | JP2001507391A (en) |
KR (1) | KR20000062386A (en) |
AU (1) | AU727693B2 (en) |
CA (1) | CA2275888A1 (en) |
TW (1) | TW353674B (en) |
WO (1) | WO1998029467A1 (en) |
ZA (1) | ZA9711650B (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1700874A1 (en) * | 2003-12-16 | 2006-09-13 | Toyo Boseki Kabushiki Kaisha | Curable composition |
US7528183B2 (en) | 2003-12-19 | 2009-05-05 | Air Products And Chemicals, Inc. | Method of preparation of a water based epoxy curing agent |
US8884040B2 (en) | 2008-04-04 | 2014-11-11 | Clariant Finance (Bvi) Limited | Continuous method for producing fatty acid amides |
US8974743B2 (en) | 2009-06-30 | 2015-03-10 | Clariant Finance (Bvi) Limited | Device for continuously carrying out chemical reactions at high temperatures |
US9000197B2 (en) | 2009-09-22 | 2015-04-07 | Clariant Finance (Bvi) Limited | Continuous transesterification method |
US9012536B2 (en) | 2007-08-02 | 2015-04-21 | Allnex Austria Gmbh | Water-borne paints based on epoxy resins |
US9039870B2 (en) | 2006-10-09 | 2015-05-26 | Clariant Finance (Bvi) Limited | Method for producing alkaline (meth)acrylamides |
US9221938B2 (en) | 2010-12-30 | 2015-12-29 | Clariant Finance (Bvi) Limited | Polymers carrying hydroxyl groups and ester groups and method for the production thereof |
US9243116B2 (en) | 2010-12-30 | 2016-01-26 | Clariant International Ltd. | Method for modifying polymers comprising hydroxyl groups |
US9302245B2 (en) | 2009-09-22 | 2016-04-05 | Clariant International Ltd. | Apparatus for continuously carrying out heterogeneously catalyzed chemical reactions at elevated temperatures |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112004002208T5 (en) * | 2003-12-12 | 2006-11-16 | Sanyo Chemical Industries, Ltd. | Slurry coating dispersed in water |
EP1786849B1 (en) * | 2004-06-21 | 2007-10-24 | Huntsman Advanced Materials (Switzerland) GmbH | Polyaminoamide-monoepoxy adducts |
KR101863111B1 (en) * | 2012-07-06 | 2018-06-01 | 한국생산기술연구원 | Novolac-based epoxy compound, preparing method thereof, composition, cured product thereof, and use thereof |
JP6674283B2 (en) * | 2016-02-26 | 2020-04-01 | 日本化薬株式会社 | Epoxy resin composition, cured product thereof, and adhesive using the same |
KR102232340B1 (en) | 2019-11-15 | 2021-03-26 | 한국생산기술연구원 | Composition of alkoxysilyl-functionalized epoxy resin and composite thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3753917A (en) * | 1971-05-26 | 1973-08-21 | Dow Chemical Co | Curing agent for epoxy resins to impart excellent solvent resistance |
EP0545354A1 (en) * | 1991-12-05 | 1993-06-09 | Kansai Paint Co., Ltd. | Aqueous resin dispersions |
WO1995027008A1 (en) * | 1994-03-31 | 1995-10-12 | Henkel Corporation | Wet strength resin composition and methods of making the same |
US5500461A (en) * | 1995-04-19 | 1996-03-19 | Shell Oil Company | Stable waterborne epoxy resin dispersion containing micronized DICY |
EP0717063A2 (en) * | 1994-12-13 | 1996-06-19 | Air Products And Chemicals, Inc. | Amide containing self-emulsifying epoxy curing agent |
-
1997
- 1997-12-15 TW TW086118906A patent/TW353674B/en active
- 1997-12-29 ZA ZA9711650A patent/ZA9711650B/en unknown
- 1997-12-30 CA CA002275888A patent/CA2275888A1/en not_active Abandoned
- 1997-12-30 WO PCT/EP1997/007343 patent/WO1998029467A1/en not_active Application Discontinuation
- 1997-12-30 EP EP97954482A patent/EP0951494A1/en not_active Withdrawn
- 1997-12-30 JP JP52963298A patent/JP2001507391A/en active Pending
- 1997-12-30 AU AU58613/98A patent/AU727693B2/en not_active Ceased
- 1997-12-30 KR KR1019997005953A patent/KR20000062386A/en not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3753917A (en) * | 1971-05-26 | 1973-08-21 | Dow Chemical Co | Curing agent for epoxy resins to impart excellent solvent resistance |
EP0545354A1 (en) * | 1991-12-05 | 1993-06-09 | Kansai Paint Co., Ltd. | Aqueous resin dispersions |
WO1995027008A1 (en) * | 1994-03-31 | 1995-10-12 | Henkel Corporation | Wet strength resin composition and methods of making the same |
EP0717063A2 (en) * | 1994-12-13 | 1996-06-19 | Air Products And Chemicals, Inc. | Amide containing self-emulsifying epoxy curing agent |
US5500461A (en) * | 1995-04-19 | 1996-03-19 | Shell Oil Company | Stable waterborne epoxy resin dispersion containing micronized DICY |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1700874A1 (en) * | 2003-12-16 | 2006-09-13 | Toyo Boseki Kabushiki Kaisha | Curable composition |
EP1700874B1 (en) * | 2003-12-16 | 2011-05-25 | Toyo Boseki Kabushiki Kaisha | Curable composition |
US7528183B2 (en) | 2003-12-19 | 2009-05-05 | Air Products And Chemicals, Inc. | Method of preparation of a water based epoxy curing agent |
US7615584B2 (en) | 2003-12-19 | 2009-11-10 | Air Products And Chemicals, Inc. | Method of preparation of a water based epoxy curing agent |
US9039870B2 (en) | 2006-10-09 | 2015-05-26 | Clariant Finance (Bvi) Limited | Method for producing alkaline (meth)acrylamides |
US9012536B2 (en) | 2007-08-02 | 2015-04-21 | Allnex Austria Gmbh | Water-borne paints based on epoxy resins |
US8884040B2 (en) | 2008-04-04 | 2014-11-11 | Clariant Finance (Bvi) Limited | Continuous method for producing fatty acid amides |
US8974743B2 (en) | 2009-06-30 | 2015-03-10 | Clariant Finance (Bvi) Limited | Device for continuously carrying out chemical reactions at high temperatures |
US9000197B2 (en) | 2009-09-22 | 2015-04-07 | Clariant Finance (Bvi) Limited | Continuous transesterification method |
US9302245B2 (en) | 2009-09-22 | 2016-04-05 | Clariant International Ltd. | Apparatus for continuously carrying out heterogeneously catalyzed chemical reactions at elevated temperatures |
US9221938B2 (en) | 2010-12-30 | 2015-12-29 | Clariant Finance (Bvi) Limited | Polymers carrying hydroxyl groups and ester groups and method for the production thereof |
US9243116B2 (en) | 2010-12-30 | 2016-01-26 | Clariant International Ltd. | Method for modifying polymers comprising hydroxyl groups |
Also Published As
Publication number | Publication date |
---|---|
ZA9711650B (en) | 1998-06-25 |
AU727693B2 (en) | 2000-12-21 |
AU5861398A (en) | 1998-07-31 |
KR20000062386A (en) | 2000-10-25 |
JP2001507391A (en) | 2001-06-05 |
TW353674B (en) | 1999-03-01 |
CA2275888A1 (en) | 1998-07-09 |
EP0951494A1 (en) | 1999-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU727693B2 (en) | Waterborne curing agent composition, comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures | |
US6359037B1 (en) | Polyamine/epoxy-functional amidoamine product with epoxy resin | |
US6127459A (en) | Epoxy resin curing agent-reacting acid-terminated polyalkylene glycol with excess amine-terminated polyamine-epoxy resin adduct | |
EP0717059B1 (en) | Self-emulsifying epoxy curing agent based on the reaction of epoxy resin and polyether polyol | |
EP0697439B1 (en) | Epoxy resin system | |
US6653369B2 (en) | Water dilutable amine curing agents for aqueous two component epoxy resin systems | |
US6160040A (en) | Water borne capped ester containing epoxy amine adduct curing agents compositions for self-curing epoxy resins at ambient or sub-ambient temperatures | |
US6387989B1 (en) | Hardeners for epoxy resins, processes for producing the same and methods of using the same | |
US6410617B1 (en) | Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same | |
US5936046A (en) | Epoxy resin with monoglycidyl-capped aryl amidopolyamine | |
US6180727B1 (en) | Capped ester containing epoxy amine adduct curing agents for curing epoxy resins at ambient or sub-ambient temperatures without external catalysts | |
AU728883B2 (en) | Storage stable compatible curing agent compositions for epoxy resins self curable at sub-ambient temperatures | |
US6395806B1 (en) | Hardeners for epoxy resins, processes for producing the same and methods of using the same | |
US7087684B2 (en) | Self-dispersing, hardenable epoxy resins, processes for producing the same and methods of using the same | |
CN1242023A (en) | Storage stable compatible curing agent compositions for epoxy resins self curable at sub-ambient temperatures | |
US6387988B1 (en) | Epoxy resin hardener from aminopolyalkylene oxide/unsaturated ester, polyepoxide and amine | |
CN1242022A (en) | Waterborne curing agent composition comprising a prereacted surfactant composition, for self-curing epoxy resins at ambient or sub-ambient temperatures | |
MXPA00004427A (en) | Water compatible curing agents for epoxy resins |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 97181108.3 Country of ref document: CN |
|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AU BR CA CN JP KR SG |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): AT BE CH DE DK ES FI FR GB GR IE IT LU MC NL PT SE |
|
DFPE | Request for preliminary examination filed prior to expiration of 19th month from priority date (pct application filed before 20040101) | ||
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1997954482 Country of ref document: EP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 58613/98 Country of ref document: AU |
|
ENP | Entry into the national phase |
Ref document number: 2275888 Country of ref document: CA Ref document number: 2275888 Country of ref document: CA Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 1998 529632 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1019997005953 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 1997954482 Country of ref document: EP |
|
WWP | Wipo information: published in national office |
Ref document number: 1019997005953 Country of ref document: KR |
|
WWG | Wipo information: grant in national office |
Ref document number: 58613/98 Country of ref document: AU |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1997954482 Country of ref document: EP |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 1019997005953 Country of ref document: KR |